KR101663529B1 - a cleaning device and method for semiconductor package. - Google Patents

a cleaning device and method for semiconductor package. Download PDF

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Publication number
KR101663529B1
KR101663529B1 KR1020160023539A KR20160023539A KR101663529B1 KR 101663529 B1 KR101663529 B1 KR 101663529B1 KR 1020160023539 A KR1020160023539 A KR 1020160023539A KR 20160023539 A KR20160023539 A KR 20160023539A KR 101663529 B1 KR101663529 B1 KR 101663529B1
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KR
South Korea
Prior art keywords
brush
semiconductor package
cleaning
substrate
unit
Prior art date
Application number
KR1020160023539A
Other languages
Korean (ko)
Inventor
이규호
Original Assignee
(주) 에스에스피
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Priority to KR1020160023539A priority Critical patent/KR101663529B1/en
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Publication of KR101663529B1 publication Critical patent/KR101663529B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • B08B1/002—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02076—Cleaning after the substrates have been singulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention relates to a cleaning device for removing filamentary burrs in a semiconductor package, which comprises a brush part for cleaning a plurality of semiconductor packages arranged in a line in a row at the same time, And a suction unit provided at the rear of the brush unit and sucking the air and the removed filament bur.

Description

Semiconductor package cleaning apparatus and cleaning method.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package cleaning apparatus and a cleaning method, and more particularly, to a semiconductor package cleaning apparatus and a cleaning method for removing filament burrs generated in a material separation process after a sputtering process.

In the semiconductor package manufacturing process, the sputtering process proceeds because of the electromagnetic shielding coating. In the sputtering process, the material is placed on a substrate such as H-BAM, and the material is separated after coating.

In the process of separating the material as described above, the separation of the semiconductor material is performed while the substrate is being pressed, and the substrate is repeatedly depressed to cause damage to the substrate. Such damage is left on the side of the material in the form of burrs, without completely separating the coating layer during the separation of the material.

Such a burr forms a linear shape such as a filament. If the filament bur is left on the material, a short circuit is generated in the process of energizing, resulting in a final defective product.

An example of related prior patent invention is Korean Patent No. 10-0622107.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor package cleaning apparatus capable of effectively removing filament burrs remaining in a semiconductor package to solve the above-described problems.

According to an aspect of the present invention, there is provided a cleaning apparatus for removing a filament bur of a semiconductor package mounted on a substrate, the cleaning apparatus including a substrate on which a semiconductor package is mounted, Wherein the brush part includes a plurality of brush bundles arranged in a transport direction of the substrate, and the brush bundles on both sides of the brush bundle are formed so that the lower end surface is higher than other brush bundles on the inner side.

The first cleaning unit includes a first cleaning unit to which the brush unit is mounted and a second cleaning unit that is disposed behind the substrate in the transport direction. The second cleaning unit has a suction port for sucking the air and the filament bur, And an air injection portion facing the center side is provided on both sides of the suction port.

The at least one brush disposed on the inner side of the plurality of brushes has a height equal to a height of the substrate on which the long side semiconductor package is mounted and a bottom side thereof coincide with the top surface of the semiconductor package in a state in which the brush bundle on the edge is seated. .

A semiconductor package cleaning apparatus according to an embodiment of the present invention relates to a cleaning apparatus for removing filament burrs in a semiconductor package, comprising: a brush unit that is provided in a row and cleans a plurality of semiconductor packages aligned in a row at the same time; And a suction unit provided at the rear of the brush unit for sucking the air and the removed filament bur.

The brush unit is fixed to the fixed plate and repeatedly moves in the left and right direction with a predetermined pitch. The fixed plate includes an elliptical groove, and a cam is provided inside the elliptical shape, In the left and right direction.

Further, the cam is driven by a cam drive motor, and is linearly moved in a vertical direction by a vertical drive motor.

The brush section, the air jetting section, the suction section, and the fixing plate are arranged in two or more in the front-rear direction to simultaneously clean two or more semiconductor package rows.

The cleaning device according to an embodiment of the present invention is not only effective in cleaning but also can prevent the imperfect cleaning due to poor positioning due to the mounting of the floating semiconductor package on the substrate and cleansing by providing the brush portion in a convex arcuate shape. can do.

Meanwhile, the cleaning device according to an embodiment of the present invention can perform the close removal operation of the filament burr through the left and right driving of the brush provided in a row, and the air injection part and the suction part are provided to increase the removal efficiency, It is possible to prevent the burrs from being accumulated to cause secondary contamination in advance.

In addition, by driving the cam, it is possible to implement a precise pitch drive with a simple structure and to secure durability.

On the other hand, it is possible to improve the working speed by providing two or more washing units at the same time, and it is possible to separate and manage the filament burrs by dividing the loading unit into the first loading unit and the second loading unit by providing the flying vision have.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows a semiconductor package cleaning apparatus according to an embodiment of the present invention. FIG. 1 (a) is a front view and FIG. 1 (b) is a plan view.
2 is a perspective view showing a cleaning part of a semiconductor package cleaning apparatus according to an embodiment of the present invention.
3 is a front view showing a first cleaning unit and a second cleaning unit of the cleaning unit according to an embodiment of the present invention.
4 is a schematic view showing a cleaning process of the first cleaning unit and the second cleaning unit according to an embodiment of the present invention.
5 is an excerpt showing a brush part of a first cleaning unit according to an embodiment of the present invention.
6 is a conceptual diagram showing an air jetting section and a suction section of a second cleaning unit according to an embodiment of the present invention.
FIGS. 7 and 8 correspond to enlarged excerpts of the lower side of the washing unit according to an embodiment of the present invention.
9 is an excerpt showing a fixing plate and a brush connecting portion according to an embodiment of the present invention.
FIG. 10 is a conceptual view showing a cam movement of a fixed plate according to an embodiment of the present invention.
11 is a conceptual diagram illustrating a brush part, an air jet part, and a suction part according to an embodiment of the present invention.
12 is a conceptual diagram showing the heat of a semiconductor package according to an embodiment of the present invention.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. It should be noted that, in adding reference numerals to the constituent elements of the drawings, the same constituent elements are denoted by the same reference symbols as possible even if they are shown in different drawings. In the following description of the embodiments of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the difference that the embodiments of the present invention are not conclusive.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; may be "connected,""coupled," or "connected. &Quot;

First, FIG. 1 shows a semiconductor package cleaning apparatus according to an embodiment of the present invention, wherein (a) is a front view and (b) is a plan view.

As shown in FIG. 1, the semiconductor package cleaning apparatus of the present invention includes a loading unit 100 on which a substrate to be cleaned is loaded. Here, as shown in FIG. 12, the substrate includes various types in which a plurality of semiconductor packages to be cleaned are seated in rows and columns. In Fig. 12, the portion indicated by the dotted line constitutes a row to be cleaned.

And is transferred to the cleaning unit 200 through the loading unit 100, and a cleaning process is performed in full in the cleaning unit 200.

2, the cleaning part 200 removes the filament bur from the semiconductor package by moving the brush from side to side and moving the substrate on which the semiconductor package is placed by relative movement and friction thereof.

As shown in FIG. 3, the cleaning unit 200 according to an embodiment of the present invention can be divided into a first cleaning unit 210 and a second cleaning unit 220.

The first cleaning unit 210 and the second cleaning unit 220 are respectively provided in a form capable of reciprocating linearly in the up-and-down direction and the left-right direction, and the up-down movement and the left-right movement will be described later.

4 shows the moving substrate and the brush portion 213 provided in the first cleaning unit 210 and the air spraying portion 214a and the suction portion 214b provided in the second cleaning unit 220. FIG.

As shown in Fig. 4, the substrate is moved from the left side of the drawing reference to the right side, and a relative movement such as the brush portion 213 sweeps the substrate is generated.

First, after the brush part 213 provided in the first cleaning unit 210 sweeps the substrate and the semiconductor package provided on the substrate, the air spray part 214a provided in the second cleaning unit 220 injects air, And at the same time, the suction portion 214b sucks the filament bur. In Fig. 4, the portion indicated by the dotted line is for indicating the relative movement of the three-way valve. That is, one first cleaning unit and a second cleaning unit are provided, but in some cases, two or more first cleaning units and second cleaning units may be provided to further enhance the cleaning effect.

FIG. 5 is an enlarged view of a brush unit according to an embodiment of the present invention.

As shown in FIG. 5, the lower end surface of the brush portion 213 according to an embodiment of the present invention preferably has an arcuate shape whose central portion is convex downward.

As shown in FIG. 5, it is preferable that the fine brush strands are formed into bundles b1 to b8, and at least three bundles are provided.

5, the brush bundles b1 to b8 are arranged at predetermined intervals along the transfer direction of the substrate, but on the other hand, when considering the movement in the lateral direction, the brush bundles b1 to b8 are arranged at predetermined intervals in the left- To form a convex arcuate shape.

More specifically, the bundles b1 and b8 on both side edges are preferably formed on the upper side with respect to the bundle provided on the inner side.

The bundles (b1, b8) at both edges serve to seat some semiconductor packages on the bottom surface of the substrate while sweeping them when the semiconductor packages are not properly seated on the bottom surface of the substrate.

When the cleaning is incomplete, the substrate is moved to the right after the substrate is moved to the left side and can be re-cleaned. Therefore, not only the bundle b8 on the right edge but also the bundle b1 on the left edge, b7), the lower end face is preferably formed on the upper side.

On the other hand, it is preferable that the bundles b2 to b7 provided on the inner side sequentially extend the lower end face downward. For example, in the case of the left and right second bundles (b2, b7), the bottom surface extends downward compared with the bundles b1 and b8 of the two sides, . This is advantageous in that, in the case where it is not completely fixed by the bundles (b1, b8) at both sides, it is possible to perform not only the seating but also the primary cleaning.

Finally, the bundles b3 to b6 provided on the center side preferably have the lower end surface coinciding with the bottom surface of the substrate with respect to the cleaned state. It is desirable that the brush can enter the bottom surface of the substrate on which the semiconductor package is mounted because the possibility of filament burrs being generated at each corner of the semiconductor package is high.

On the other hand, referring to FIG. 5, it can be considered that the bottom edges of the bundles b1 and b8 of the edges are slightly higher than the top surface of the semiconductor package, Corresponds to L1 in Fig. The lower end face of the bundle (b2, b7) formed at the second time can be considered to coincide with the upper face of the semiconductor package, and corresponds to L2 in Fig. On the other hand, the bundles b3 to b6 provided on the center side can be considered to match the bottom surface of the substrate with the bottom surface of the substrate, and correspond to L3 in Fig.

The brush part according to the present invention may be variously modified within a category having a downward convex arcuate shape.

The brush bundles b1 to b8 may have the same length as shown in FIG. 5, but it is advantageous in terms of brush maintenance and maintenance to form an arcuate shape with different mounting positions.

On the other hand, Fig. 6 shows an air jetting section and a suction section. Referring to FIG. 4, when the brush part 213 first removes the filament bur by friction, the removed filament bur is completely removed by the air spray part 214a and the suction part 214b.

If only the suction is performed, it is preferable that the semiconductor package is sucked together and separated from the substrate.

On the other hand, it can be seen that the filament bur is more completely released from the semiconductor package by blowing air by the air jetting section 214a, and the suction is performed by the suction section 214b, thereby further enhancing the cleaning effect. In addition, the suction portion is provided at the center, and two air jet portions 214b directed to the center side are provided on both sides of the suction portion, so that a path through which the air injected from both sides is collected and sucked into the center portion is formed, It is possible to prevent flying.

7, 8, 11, and 12, the cleaning part 200 according to an exemplary embodiment of the present invention includes a brush part 200 for cleaning a plurality of semiconductor packages aligned in a line, (251, 252), air blowing parts (253, 254) provided in front of the brush parts (251, 252) and distributing air to the semiconductor package, And suction portions 255 and 256 for sucking air and removed filament bur, respectively.

That is, this means that the first cleaning unit and the second cleaning unit are formed in the same manner, and the first cleaning unit and the second cleaning unit are provided with brush portions 251 and 252 as well as air jet portions 253 and 254, (255, 256) are provided.

If only the brush portions 251 and 252 are included, the removed filament burrs are cumulatively accumulated. Therefore, the removed filament burrs are recalled through the air injecting portions 253 and 254 and finally the air and the removed filament burrs And the cleaning is completed by suction.
11, the jetting port 259 of the air jetting section 253 is inclined rearward toward the brush section 251 at a predetermined angle (toward the lower left of FIG. 11) It is conceivable that the suction port 257 of the brush part 255 is inclined forward at a predetermined angle toward the brush part 251 (toward the right lower side of FIG. 11).

The brushes 251 and 252 are moved to the left and right at a constant pitch for cleaning and are fixed to the fixing plate and the brush connecting portion as shown in FIG.

The fixed plate includes elliptical grooves 283 and 284 and cams 285 and 286 are provided inside the elliptical shape so that the fixed plate is linearly repeated in the left and right direction by the rotational motion of the cams 285 and 286 It is exercised.

10 shows the movement of the cams 285 and 286 in detail, and the rectangles formed by the respective dotted lines represent the linear motion of the fixed plate according to the positions of the cams 285 and 286. [ Since the can is sandwiched between the elliptical grooves 283 and 284, when the cams 285 and 286 are oriented upward or downward with reference to FIG. 10, the fixing plate performs linear motion toward the upward direction or downward.

The cams 285 and 286 are driven by the cam driving units 221 and 222 including the cam driving motor. The cam drivers 221 and 222 can be seen in FIG. Meanwhile, as shown in FIG. 2, the fixed plate is linearly moved in the vertical direction by the up and down driving units 211 and 212 including the up and down driving motor.

The brush portions 251 and 252 are moved upward after the cleaning operation is completed for one semiconductor package row, and the next heat is moved downward while being positioned at the cleaning position to perform cleaning.

The upper and lower driving motors move the upper and lower driving pins 271 in the vertical direction and the upper and lower driving pins 271 are connected to the guide plates to drive the upper and lower guide parts 261 and 262 and the guide plate in the vertical direction.

Meanwhile, the above-described left-right drive and up-down drive will be applied not only to the embodiment according to Figs. 7 and 8 but also to the embodiment according to Fig. 3 to Fig.

As shown in FIG. 2, the cleaner 200 includes a fixed shaft 240 extending upward, and a vertical driving motor is fixed to the fixed shaft 240. Upper and lower guide portions 261 and 262 are provided on the side surfaces of the upper and lower driving portions 211 and 212 to guide the up and down movement in a state of being restrained by the upper and lower driving portions 211 and 212.

The upper and lower driving parts 211 and 212 are connected to a guide plate, and the guide plate is moved up and down as a result.

The above-mentioned fixing plates 281 and 282 are provided below the guide plate, and the fixing plates 281 and 282 are moved in the left-right direction with respect to the guide plate.

The above-mentioned cam driving unit is fixed to the guide plate and includes the elliptical grooves 283 and 284 formed in the fixing plates 281 and 282 and the motion of the cams 285 and 286 connected to the cam driving motors of the cam driving units 221 and 222 The fixing plates 281 and 282 are moved in the left and right directions at a constant pitch.

The brush portions 251 and 252, the air jet portions 255 and 256 and the suction portions 253 and 254 and the fixing plates 281 and 282 are arranged in two or more in the forward and backward directions, It may be considered to clean at the same time. As shown in FIG. 2, two or more upper and lower driving units 211 and 212 and cam driving units 221 and 222 may be provided.

On the other hand, when cleaning is completed in the cleaning part 200 as described above, the cleaning part 200 is passed through the vision inspection part 300 as shown in FIG.

The vision inspection unit 300 checks whether the filament burr is removed or not, and it is preferable that the vision inspection unit 300 is formed in a form of a plastic vision to improve a working speed.

When the inspection is completed in the vision inspection unit 300, the substrate on which the filament bur has been completely removed is loaded on the first loading unit 400, and the substrate on which the filament bur has not been completely removed is loaded on the second loading unit 500, Or discarded.

On the other hand, the substrate on which the filament burr has not been completely removed after the vision inspection can be transported to the cleaning unit again in the opposite direction of the transfer line. Even after the process, the substrate with incomplete cleaning is loaded on the second loading unit 500 It is again washed or discarded. In FIG. 1, the first stacking units 400 are relatively arranged in the order of process, but the order may be changed.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. That is, within the scope of the present invention, all of the components may be selectively coupled to one or more of them. Furthermore, the terms "comprises", "comprising", or "having" described above mean that a component can be implanted unless otherwise specifically stated, But should be construed as including other elements. All terms, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used terms, such as predefined terms, should be interpreted to be consistent with the contextual meanings of the related art, and are not to be construed as ideal or overly formal, unless expressly defined to the contrary.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100: loading section
200: The three governments
300:
400: first loading section
500: second loading section
210: First cleaning unit
220: Second cleaning unit
213: Brush part
214a:
214b:
211, and 212:
221 and 222:
231, 232: fixed hub
240: fixed shaft
251, 252: Brush part
253, 254:
255, 256: air injection part
261, 262: upper and lower guide portions
263, 264: guide plate
271: Up and down drive pin
281, 282: Fixing plate
283, 283: Oval groove
285, 286: Cam
291, 292: right and left guide rails
P: semiconductor package
B: Brush part
b1, b2, b3, b4, b5, b6, b7, b8: Brush bundle

Claims (5)

1. A cleaning apparatus for removing filament burrs of a semiconductor package mounted on a substrate,
A substrate on which a semiconductor package is mounted, and a brush portion for sweeping an upper surface of the semiconductor package,
The brush unit includes a plurality of brush bundles arranged at predetermined intervals, and the brush bundles on both side edges are formed with a lower end surface higher than other brush bundles on the inner side.
A first cleaning unit to which the brush unit is mounted; And
And a second cleaning unit provided behind the substrate in the conveying direction,
Wherein the second cleaning unit is provided with a suction port for sucking air and filament burs in a central portion thereof and an air jet portion directed to the center side on both sides of the suction port. delete The method according to claim 1,
Wherein at least one brush provided on the inner side of the plurality of brushes has a height equal to a height of the substrate on which the lower end face temporarily holds the semiconductor package and a height of the bristle bundle on the edge matches the height of the upper surface of the semiconductor package, The semiconductor package cleaning device. 1. A cleaning apparatus for removing filament burrs in a semiconductor package,
1. A semiconductor device comprising: a brush unit arranged in a row to simultaneously clean a plurality of semiconductor packages arranged in a line;
An air jet portion provided at the front of the brush portion and distributing air to the semiconductor package; And
And a suction unit provided at the rear of the brush unit and sucking the air and the removed filament bur,
Wherein the air inlet portion of the air injection portion has a shape inclined rearward toward the brush portion by a predetermined angle and the suction port of the suction portion is inclined forward at a predetermined angle toward the brush portion,
Wherein the brush portion includes a plurality of brush bundles arranged at predetermined intervals, and the brush bundles on both side edges are formed so that the lower end surface is higher than other brush bundles on the inner side. The method according to claim 1 or 4,
The brush part is fixed to the fixing plate and repeatedly moves in the left and right direction with a predetermined pitch,
Wherein the fixing plate includes an elliptical groove, and a cam is provided in the inside of the elliptical shape, and the fixed plate is linearly repetitively moved in the left and right direction by the rotational motion of the cam.
KR1020160023539A 2016-02-26 2016-02-26 a cleaning device and method for semiconductor package. KR101663529B1 (en)

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KR1020160023539A KR101663529B1 (en) 2016-02-26 2016-02-26 a cleaning device and method for semiconductor package.

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Application Number Priority Date Filing Date Title
KR1020160023539A KR101663529B1 (en) 2016-02-26 2016-02-26 a cleaning device and method for semiconductor package.

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114551277A (en) * 2020-11-19 2022-05-27 细美事有限公司 Semiconductor strip cutting and classifying equipment, packaging body drying device and carrying device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090009977U (en) * 2008-03-28 2009-10-01 주식회사 하이닉스반도체 Cleaning equipment for fabricating semiconductor pakage
JP2013099413A (en) * 2011-11-08 2013-05-23 Toray Monofilament Co Ltd Bristle material for washing brush and washing brush

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090009977U (en) * 2008-03-28 2009-10-01 주식회사 하이닉스반도체 Cleaning equipment for fabricating semiconductor pakage
JP2013099413A (en) * 2011-11-08 2013-05-23 Toray Monofilament Co Ltd Bristle material for washing brush and washing brush

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114551277A (en) * 2020-11-19 2022-05-27 细美事有限公司 Semiconductor strip cutting and classifying equipment, packaging body drying device and carrying device

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