200920503 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種清潔裝置，尤指一種適用於晶片粉 塵清潔裝置，用以清潔附著於晶片上的粉塵。 5 【先前技術】 一般而言，完成封裝後的晶片，會於晶片的表面上標 〇 著此類型的晶片所專屬的字元，以方便辨識出產的公司、 晶片名稱、種類…等。 1〇 其中之一種標著方式是以雷射光波照射於晶片的上表 面，以雷射光波所產生的熱量將晶片的表面上的塑膠表層 予以光刻而得’在光刻的同時受到雷射光波熱量所蒸發的 塑膠表層其後會產生細微的顆粒，會沉積覆蓋於晶片的表 面而生成一層粉塵。 15 通常疋以人工方式將晶片的表面而生成一層粉塵拂 y 除，而在粉塵的清除過程中，若作業員施力不當，通常會 ^成B曰片盒中的晶片散出於外，而有造成晶片損壞之風險。 因此’亟待一種晶片粉塵清潔裝置的發明以改善以人 力清潔方式所衍生的相關問題。 20 【發明内容】 本發明為一種晶片粉塵清潔裝置，其包括一底板、一 上板、一滑塊、一傳動機構 '及一驅動器。底板上鑽有複 數個通孔。複數組立柱穿設於底板的複數個通孔。上板係 200920503 組設於複數組立柱上，卜 係滑設於上板之滑軌上，面固設有一滑軌。滑塊 .. ⑺塊包括有一承載板其上組設有 機IS:傳動機構係組設於承載板上。驅動器係與傳動 於一曰t般用以促使清潔刷於滑軌上左右滑移以清潔附著 ；曰曰片盤上承載晶片的粉塵。 其中，傳動機構包括—偏心輪、及一連桿’偏心輪可 ^設於驅動器上，並與驅動器連動，此驅動器可為一馬達， ”可為直流馬達、交流馬達或其等效作用之驅動器，連桿 ::端：合件分別樞設於偏心輪、及滑塊之承載板上；除 =之外的傳動機構’亦可以等效的往復機連 動以使清潔刷於滑軌上左右滑移。 動益連 上、；=壓：，其係組設於底板上，並於底板與上板間 之Jr 壓缸係指一油壓缸、汽壓缸或其他等效 15 Ο 直立壓此直立魔缸可於晶片盤進人清潔刷之前 板與上板抬起，以利晶片盤進人清潔區域，在晶片入 Μ區域❹將底板與上板放下使清潔刷進行 片的清潔工作。 A麗上日日 -集塵器’集塵器架設於上板之上方，其 :片二罩之•以便於將清潔刷所清潔出 日日乃上的粉塵抽出集令。 實施方式】 °月，閱圖1，其係為本發明一較佳實施例機台之立 20 200920503 圖。如圖1所示，其為—種晶片粉塵清潔機台！，其上組設 有刀盤益12、一集盤器13、一晶片粉塵清潔裝置2、及- 集塵器3。位於分盤器12上的為-晶片盤U，分盤器12會將 置於”上的曰曰片盤14一盤接著一盤地分別輸送到晶片粉塵 /月潔裝置2以進行晶片上粉塵的清潔工作，在進行清潔工作 期間以再集塵器3將粉塵抽取集中，清潔完成後再將晶片盤 14輸送至集盤器13再一盤接著一盤地集中，㈣即可完成 晶片的清潔工作。200920503 IX. Description of the Invention: [Technical Field] The present invention relates to a cleaning device, and more particularly to a wafer dust cleaning device for cleaning dust attached to a wafer. 5 [Prior Art] Generally, after the packaged wafer is finished, the characters of this type of wafer are marked on the surface of the wafer to facilitate identification of the company, wafer name, type, etc. 1) One of the marking methods is to irradiate the upper surface of the wafer with laser light waves, and photolithographically irradiate the surface of the wafer with the heat generated by the laser light to obtain 'laser light while lithography. The surface of the plastic that evaporates from the heat of the waves then produces fine particles that deposit on the surface of the wafer to form a layer of dust. 15 Usually, the surface of the wafer is artificially generated to form a layer of dust 拂 y, and in the process of dust removal, if the operator does not apply force, the wafer in the B cassette is usually scattered outside. There is a risk of damage to the wafer. Therefore, the invention of a wafer dust cleaning device is urgently needed to improve the problems associated with the human cleaning method. 20 SUMMARY OF THE INVENTION The present invention is a wafer dust cleaning apparatus including a bottom plate, an upper plate, a slider, a transmission mechanism, and a driver. A plurality of through holes are drilled into the bottom plate. The complex array of columns is threaded through a plurality of through holes in the bottom plate. The upper plate system 200920503 is set on the complex array column, which is slid on the slide rail of the upper plate, and a slide rail is fixed on the surface. Slider: The (7) block includes a carrier plate on which the machine IS is mounted: the transmission mechanism is assembled on the carrier plate. The driver and the drive are used to cause the cleaning brush to slide left and right on the slide rail to clean and attach; the wafer disk carries the dust of the wafer. Wherein, the transmission mechanism comprises an eccentric wheel and a connecting rod 'eccentric wheel can be arranged on the drive and interlocked with the drive, the drive can be a motor," can be a DC motor, an AC motor or an equivalent drive thereof , connecting rod:: end: the fittings are respectively pivoted on the eccentric wheel and the bearing plate of the slider; the transmission mechanism other than = can also be equivalent to the reciprocating machine linkage to make the cleaning brush slide on the sliding rail Move. Connected,; = pressure:, the system is set on the bottom plate, and the Jr pressure cylinder between the bottom plate and the upper plate refers to a hydraulic cylinder, a steam pressure cylinder or other equivalent 15 直 upright pressure The upright magic cylinder can be lifted before the wafer tray enters the cleaning brush, so that the wafer tray enters the cleaning area, and the bottom plate and the upper plate are lowered in the wafer insertion area to clean the sheet. The Lishang-Dust Collector's dust collector is erected above the upper plate, and it is: the second cover of the cover is used to facilitate the dusting of the cleaning brush to remove the dust on the day. Embodiments] ° month, 1 is a stand of a machine according to a preferred embodiment of the present invention. 20 200920503 As shown in Fig. 1, it is a kind of wafer dust cleaning machine! The upper group is provided with a cutter head 12, a disk set 13, a wafer dust cleaning device 2, and a dust collector 3. On the disc 12 is a wafer disc U, and the disc sub-distributor 12 transports the discs 14 placed on the disc to the wafer dust/removal device 2 for dust cleaning on the wafer. Working, during the cleaning work, the dust is collected by the re-duster 3, and after the cleaning is completed, the wafer tray 14 is transported to the tray 13 and then concentrated one by one, and (4) the wafer cleaning operation is completed.
10 1510 15
凊參閱圖2，其係本發明一較佳實施例之立體圖，如圖所 示，其為晶片粉塵清潔裝置2，包括有一底板21 '複數組立 柱22、一上板23、一滑塊24、一傳動機構25、及一驅動器 26。底板21鑽有四個通孔211，四根立柱22穿設於底板21的 四個通孔211。上板23係組設於四根立柱22上，再於上板23 之下表面固設有一滑軌231。 滑塊24係滑設於上板23之滑軌231上，滑塊24之下表面 固設有一承載板241，又於承載板241上組設一清潔刷242， 於本例中，清潔刷242係指一靜電毛刷。傳動機構25係組設 於承載板241上，驅動器26係組設上板23上並與傳動機構25 連動。 2〇 如圖2，傳動機構25包括一偏心輪251、及一連桿252， 偏心輪25 1係組設於驅動器26上，並與驅動器26連動，於本 例中，驅動器26係指一馬達。連桿252之二端結合件253,254 分別樞設於偏心輪251、及滑塊之承載板241上’於本例 中’滑塊24之清潔刷242於滑軌231左右滑移’其係相對於 200920503 阳片盤14呈正交之往復運動以清潔附著於晶片盤上承載晶 片的粉塵。 «月參閱圖3，其係本發明一較佳實施例之剖視圖。一直 立C缸27係組設於底板2丨上，於本例中，直立壓缸27係指 5 油壓虹，此直立壓缸27包括複數個組設孔271，複數個組 没才干274、一伸縮軸心272、一固設件273。複數個組設桿274 複數個組設孔271將直立壓缸27固設於晶片粉塵清潔 H 機σ 1之—固定板15上。再透過固設件273將伸縮軸心272固 設於底板21上。 1〇 田直立壓缸27將伸縮軸心272作伸縮之上、下運動時可 帶動底板21與上板23相對於晶片粉塵清潔機台i作上、下滑 移運動如此，®晶片盤14進入清潔刷242之前此直立壓缸 27可於將底板21與上板23抬起，以利晶片盤μ進入清潔區 域、，在晶片盤u進入清潔區域後再將底板21與上板23放下 15使清潔刷242進行晶片盤上晶片的清潔工作。 如圖3所不，集塵器架設於上板23之上方。集塵器設有 / -集塵罩3卜集塵罩31設於清潔刷242之四周，以便於將清 潔刷所清潔出晶片上的粉塵抽出集中。 上述實施例僅係為了方便說明而舉例而已，本發明所 20主張之權利範圍自應以申請專利範圍所述為準，而非僅限 於上述實施例。 【圖式簡單說明】 圖1係本發明一較佳實施例機台之立體圖。 200920503 圖2係本發明—較佳實施例之立體圖。 圖3係本發明一較佳實施例之剖視圖。 【主要元件符號說明】 晶片粉塵清潔機台1 承載板11 分盤器12 集盤器13 晶片盤14 固定板15 晶片粉塵清潔襞置2 底板21 通孔211 立柱22 上板23 滑軌231 滑塊24 承載板241 清潔刷242 傳動機構25 偏心輪251 連桿252 結合件253,254 驅動器26 直立壓缸27 組設孔271 伸縮軸心2 7 2 固設件273 組設桿274 集塵器3 集塵罩31 ϋ 92 is a perspective view of a preferred embodiment of the present invention, as shown in the drawing, which is a wafer dust cleaning device 2, comprising a bottom plate 21' complex array column 22, an upper plate 23, a slider 24, A transmission mechanism 25 and a driver 26. The bottom plate 21 is drilled with four through holes 211, and the four uprights 22 are bored through the four through holes 211 of the bottom plate 21. The upper plate 23 is assembled on the four columns 22, and a slide rail 231 is fixed on the lower surface of the upper plate 23. The slider 24 is slidably disposed on the slide rail 231 of the upper plate 23. A lower surface of the slider 24 is fixed with a carrier plate 241, and a cleaning brush 242 is disposed on the carrier plate 241. In this example, the cleaning brush 242 is provided. Refers to an electrostatic brush. The transmission mechanism 25 is assembled on the carrier plate 241, and the driver 26 is assembled on the upper plate 23 and interlocked with the transmission mechanism 25. 2, the transmission mechanism 25 includes an eccentric wheel 251, and a connecting rod 252. The eccentric wheel 25 1 is assembled on the driver 26 and is coupled with the driver 26. In this example, the driver 26 is a motor. . The two end joints 253, 254 of the connecting rod 252 are respectively pivoted on the eccentric wheel 251 and the bearing plate 241 of the slider. In this example, the cleaning brush 242 of the slider 24 slides to the left and right of the sliding rail 231. 200920503 The positive disc 14 is reciprocating orthogonally to clean the dust adhering to the wafer on the wafer disc. «Month Referring to Figure 3, a cross-sectional view of a preferred embodiment of the present invention. The standing C cylinder 27 series is set on the bottom plate 2, in this example, the vertical cylinder 27 is referred to as 5 oil pressure rainbow, and the vertical pressure cylinder 27 includes a plurality of grouping holes 271, and the plurality of groups are not capable of 274. A telescopic shaft 272 and a fixing member 273. A plurality of sets of rods 274 are provided in a plurality of sets of holes 271 to fix the upright cylinders 27 to the fixed plate 15 of the wafer dust cleaning machine σ 1 . The telescopic shaft 272 is fixed to the bottom plate 21 through the fixing member 273. 1 The Putian vertical cylinder 27 expands and contracts the telescopic shaft 272. When the lower movement moves, the bottom plate 21 and the upper plate 23 can be moved up and down relative to the wafer dust cleaning machine i. Thus, the wafer disc 14 enters. Before the cleaning brush 242, the upright cylinder 27 can lift the bottom plate 21 and the upper plate 23 to facilitate the wafer disk μ to enter the cleaning area, and then lower the bottom plate 21 and the upper plate 23 after the wafer disk u enters the cleaning area. The cleaning brush 242 performs cleaning of the wafer on the wafer tray. As shown in FIG. 3, the dust collector is mounted above the upper plate 23. The dust collector is provided with a dust collecting cover 3 and a dust collecting cover 31 is disposed around the cleaning brush 242 to facilitate the concentration of the dust on the wafer cleaned by the cleaning brush. The above-described embodiments are merely examples for convenience of description, and the scope of the claims of the present invention is determined by the scope of the claims, and is not limited to the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a machine in accordance with a preferred embodiment of the present invention. 200920503 Figure 2 is a perspective view of the preferred embodiment of the invention. Figure 3 is a cross-sectional view of a preferred embodiment of the present invention. [Description of main component symbols] Wafer cleaning machine 1 Carrier plate 11 Dispenser 12 Dumper 13 Wafer tray 14 Fixing plate 15 Wafer cleaning device 2 Base plate 21 Through hole 211 Column 22 Upper plate 23 Slide rail 231 Slider 24 Carrier plate 241 Cleaning brush 242 Transmission mechanism 25 Eccentric wheel 251 Connecting rod 252 Joint member 253, 254 Actuator 26 Vertical cylinder 27 Set hole 271 Telescopic shaft 2 7 2 Fixing member 273 Set rod 274 Dust collector 3 Dust cover 31 ϋ 9