CN103871907A - 一种超薄基板的制作工艺 - Google Patents
一种超薄基板的制作工艺 Download PDFInfo
- Publication number
- CN103871907A CN103871907A CN201410117826.6A CN201410117826A CN103871907A CN 103871907 A CN103871907 A CN 103871907A CN 201410117826 A CN201410117826 A CN 201410117826A CN 103871907 A CN103871907 A CN 103871907A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- foil layer
- layer
- composite copper
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 117
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000005516 engineering process Methods 0.000 title abstract description 10
- 239000010410 layer Substances 0.000 claims description 290
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 253
- 239000011889 copper foil Substances 0.000 claims description 245
- 239000002131 composite material Substances 0.000 claims description 153
- 239000012790 adhesive layer Substances 0.000 claims description 80
- 238000003825 pressing Methods 0.000 claims description 72
- 239000011230 binding agent Substances 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 13
- 239000012043 crude product Substances 0.000 claims description 10
- 239000011265 semifinished product Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- -1 On f Substances 0.000 claims 1
- 238000003475 lamination Methods 0.000 abstract description 2
- 230000008602 contraction Effects 0.000 abstract 1
- 238000005553 drilling Methods 0.000 abstract 1
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000002344 surface layer Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 19
- 239000000047 product Substances 0.000 description 6
- 230000006378 damage Effects 0.000 description 4
- 239000000654 additive Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410117826.6A CN103871907B (zh) | 2014-03-26 | 2014-03-26 | 一种超薄基板的制作工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410117826.6A CN103871907B (zh) | 2014-03-26 | 2014-03-26 | 一种超薄基板的制作工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103871907A true CN103871907A (zh) | 2014-06-18 |
CN103871907B CN103871907B (zh) | 2017-04-12 |
Family
ID=50910320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410117826.6A Active CN103871907B (zh) | 2014-03-26 | 2014-03-26 | 一种超薄基板的制作工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103871907B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017066924A1 (en) * | 2015-10-20 | 2017-04-27 | Schott Glass Technologies (Suzhou) Co. Ltd. | Method for post-processing of bonded article |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001342450A (ja) * | 2000-05-30 | 2001-12-14 | Kyocera Corp | 接着材およびこれを用いた電子部品 |
US20030136577A1 (en) * | 2002-01-24 | 2003-07-24 | Fujitsu Limited | Circuit board and method for fabricating the same, and electronic device |
US6759318B1 (en) * | 2003-04-15 | 2004-07-06 | Kinsus Interconnect Technology Corp. | Translation pad flip chip (TPFC) method for improving micro bump pitch IC substrate structure and manufacturing process |
CN101466208A (zh) * | 2007-12-19 | 2009-06-24 | 新光电气工业株式会社 | 配线基板以及制造配线基板的方法 |
CN101567356A (zh) * | 2008-04-23 | 2009-10-28 | 全懋精密科技股份有限公司 | 电路板结构及其制造方法 |
-
2014
- 2014-03-26 CN CN201410117826.6A patent/CN103871907B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001342450A (ja) * | 2000-05-30 | 2001-12-14 | Kyocera Corp | 接着材およびこれを用いた電子部品 |
US20030136577A1 (en) * | 2002-01-24 | 2003-07-24 | Fujitsu Limited | Circuit board and method for fabricating the same, and electronic device |
US6759318B1 (en) * | 2003-04-15 | 2004-07-06 | Kinsus Interconnect Technology Corp. | Translation pad flip chip (TPFC) method for improving micro bump pitch IC substrate structure and manufacturing process |
CN101466208A (zh) * | 2007-12-19 | 2009-06-24 | 新光电气工业株式会社 | 配线基板以及制造配线基板的方法 |
CN101567356A (zh) * | 2008-04-23 | 2009-10-28 | 全懋精密科技股份有限公司 | 电路板结构及其制造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017066924A1 (en) * | 2015-10-20 | 2017-04-27 | Schott Glass Technologies (Suzhou) Co. Ltd. | Method for post-processing of bonded article |
Also Published As
Publication number | Publication date |
---|---|
CN103871907B (zh) | 2017-04-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180130 Address after: 101400 Beijing city Huairou District Yanqi Yanqi Economic Development Zone South four Street No. 25 Building No. 3 hospital No. 307 Patentee after: Beijing Zhongke micro Intellectual Property Service Co., Ltd. Address before: 214135 Jiangsu New District of Wuxi City Linghu Road No. 200 China Sensor Network International Innovation Park building D1 Patentee before: National Center for Advanced Packaging Co., Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200108 Address after: Room 706, building B, tefa information port, No. 2, Kefeng Road, high tech Zone, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Zhongke four hop Technology Co., Ltd. Address before: 101400 Beijing city Huairou District Yanqi Yanqi Economic Development Zone South four Street No. 25 Building No. 3 hospital No. 307 Patentee before: Beijing Zhongke micro Intellectual Property Service Co., Ltd. |