CN103862816A - 接合构件制造方法 - Google Patents
接合构件制造方法 Download PDFInfo
- Publication number
- CN103862816A CN103862816A CN201310646376.5A CN201310646376A CN103862816A CN 103862816 A CN103862816 A CN 103862816A CN 201310646376 A CN201310646376 A CN 201310646376A CN 103862816 A CN103862816 A CN 103862816A
- Authority
- CN
- China
- Prior art keywords
- bonding agent
- overlay film
- mentioned
- extension
- members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 239000007767 bonding agent Substances 0.000 claims description 195
- 239000007788 liquid Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 abstract description 12
- 230000001070 adhesive effect Effects 0.000 abstract description 12
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 208000026817 47,XYY syndrome Diseases 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
Abstract
Description
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012268246A JP5393869B1 (ja) | 2012-12-07 | 2012-12-07 | 接合部材製造方法 |
JP2012-268246 | 2012-12-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103862816A true CN103862816A (zh) | 2014-06-18 |
CN103862816B CN103862816B (zh) | 2016-03-16 |
Family
ID=50112277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310646376.5A Active CN103862816B (zh) | 2012-12-07 | 2013-12-04 | 接合构件制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20140158291A1 (zh) |
JP (1) | JP5393869B1 (zh) |
CN (1) | CN103862816B (zh) |
HK (1) | HK1198152A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101591797B1 (ko) * | 2014-06-16 | 2016-02-04 | 안성룡 | 전기장을 이용한 패널 합착장치 |
JP6602703B2 (ja) * | 2016-03-16 | 2019-11-06 | 株式会社ディスコ | 保護部材形成装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1139734A (ja) * | 1997-07-23 | 1999-02-12 | Sony Corp | 光学記録媒体の製造方法 |
CN1264115A (zh) * | 1999-02-01 | 2000-08-23 | 欧利生电气株式会社 | 粘接系统及粘接方法 |
CN102205303A (zh) * | 2010-03-29 | 2011-10-05 | 欧利生电气株式会社 | 接合部件的制造方法以及接合部件制造装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5759332A (en) * | 1995-05-22 | 1998-06-02 | Pioneer Electronic Corporation | Process of reproducing optical discs and optical discs produced by the same |
US20080216952A1 (en) * | 2007-03-06 | 2008-09-11 | Cheng Uei Precision Industry Co., Ltd. | Adhesive Method Of Optical Components |
CN101816026A (zh) * | 2007-10-22 | 2010-08-25 | 夏普株式会社 | 显示装置及其制造方法 |
JP5558993B2 (ja) * | 2010-09-29 | 2014-07-23 | 芝浦メカトロニクス株式会社 | 接着剤供給装置及び接着剤供給方法 |
US8608896B2 (en) * | 2011-09-13 | 2013-12-17 | Apple Inc. | Liquid adhesive lamination for precision adhesive control |
-
2012
- 2012-12-07 JP JP2012268246A patent/JP5393869B1/ja active Active
-
2013
- 2013-11-15 US US14/081,698 patent/US20140158291A1/en not_active Abandoned
- 2013-12-04 CN CN201310646376.5A patent/CN103862816B/zh active Active
-
2014
- 2014-11-19 HK HK14111677.1A patent/HK1198152A1/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1139734A (ja) * | 1997-07-23 | 1999-02-12 | Sony Corp | 光学記録媒体の製造方法 |
CN1264115A (zh) * | 1999-02-01 | 2000-08-23 | 欧利生电气株式会社 | 粘接系统及粘接方法 |
CN102205303A (zh) * | 2010-03-29 | 2011-10-05 | 欧利生电气株式会社 | 接合部件的制造方法以及接合部件制造装置 |
Also Published As
Publication number | Publication date |
---|---|
CN103862816B (zh) | 2016-03-16 |
JP2014114348A (ja) | 2014-06-26 |
HK1198152A1 (zh) | 2015-03-13 |
US20140158291A1 (en) | 2014-06-12 |
JP5393869B1 (ja) | 2014-01-22 |
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REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1198152 Country of ref document: HK |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: Saitama Prefecture, Japan Patentee after: Olisen Electrical Co., Ltd. Address before: Tokyo, Japan, Japan Patentee before: Olisen Electrical Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Saitama Prefecture, Japan Patentee after: Olison Company Address before: Saitama Prefecture, Japan Patentee before: Olisen Electrical Co., Ltd. |