HK1198152A1 - 接合構件製造方法 - Google Patents

接合構件製造方法

Info

Publication number
HK1198152A1
HK1198152A1 HK14111677.1A HK14111677A HK1198152A1 HK 1198152 A1 HK1198152 A1 HK 1198152A1 HK 14111677 A HK14111677 A HK 14111677A HK 1198152 A1 HK1198152 A1 HK 1198152A1
Authority
HK
Hong Kong
Prior art keywords
bonded member
manufacturing bonded
manufacturing
bonded
Prior art date
Application number
HK14111677.1A
Other languages
English (en)
Inventor
鈴木隆之
中村昌寬
小梶英之
長濱正伸
稻谷孝祐
Original Assignee
歐利生電氣株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歐利生電氣株式會社 filed Critical 歐利生電氣株式會社
Publication of HK1198152A1 publication Critical patent/HK1198152A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Optical Record Carriers (AREA)
HK14111677.1A 2012-12-07 2014-11-19 接合構件製造方法 HK1198152A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012268246A JP5393869B1 (ja) 2012-12-07 2012-12-07 接合部材製造方法

Publications (1)

Publication Number Publication Date
HK1198152A1 true HK1198152A1 (zh) 2015-03-13

Family

ID=50112277

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14111677.1A HK1198152A1 (zh) 2012-12-07 2014-11-19 接合構件製造方法

Country Status (4)

Country Link
US (1) US20140158291A1 (zh)
JP (1) JP5393869B1 (zh)
CN (1) CN103862816B (zh)
HK (1) HK1198152A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101591797B1 (ko) * 2014-06-16 2016-02-04 안성룡 전기장을 이용한 패널 합착장치
JP6602703B2 (ja) * 2016-03-16 2019-11-06 株式会社ディスコ 保護部材形成装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5759332A (en) * 1995-05-22 1998-06-02 Pioneer Electronic Corporation Process of reproducing optical discs and optical discs produced by the same
JP3684775B2 (ja) * 1997-07-23 2005-08-17 ソニー株式会社 光学記録媒体の製造方法及びその製造装置
TW459225B (en) * 1999-02-01 2001-10-11 Origin Electric Bonding system and method
US20080216952A1 (en) * 2007-03-06 2008-09-11 Cheng Uei Precision Industry Co., Ltd. Adhesive Method Of Optical Components
CN101816026A (zh) * 2007-10-22 2010-08-25 夏普株式会社 显示装置及其制造方法
JP5460418B2 (ja) * 2010-03-29 2014-04-02 オリジン電気株式会社 接合部材の製造方法及び接合部材製造装置
JP5558993B2 (ja) * 2010-09-29 2014-07-23 芝浦メカトロニクス株式会社 接着剤供給装置及び接着剤供給方法
US8608896B2 (en) * 2011-09-13 2013-12-17 Apple Inc. Liquid adhesive lamination for precision adhesive control

Also Published As

Publication number Publication date
JP2014114348A (ja) 2014-06-26
JP5393869B1 (ja) 2014-01-22
US20140158291A1 (en) 2014-06-12
CN103862816B (zh) 2016-03-16
CN103862816A (zh) 2014-06-18

Similar Documents

Publication Publication Date Title
EP2782224A4 (en) COIL METHOD
GB201212937D0 (en) Method
GB201212932D0 (en) Method
GB201220940D0 (en) Method P
EP2808889A4 (en) METHOD FOR MANUFACTURING SILICON WAFER ON BONDED INSULATION
GB201213636D0 (en) Method
GB201212934D0 (en) Method
GB201210858D0 (en) Method
SG11201406661YA (en) Method for manufacturing bonded wafer
EP2940778A4 (en) PROCESS FOR PRODUCING SOLID ELECTROLYTE OF SULFIDE
EP2682217A4 (en) METHOD FOR MANUFACTURING SLIDING ELEMENT
EP2894032A4 (en) METHOD FOR PRODUCING A LAMINATE
EP2825808A4 (en) ADHESIVE METHODS DETAILS CONNECTORS FOR COMPOSITE STRUCTURES
GB201218570D0 (en) Method
GB201202198D0 (en) Method
EP2894659A4 (en) METHOD FOR MANUFACTURING A DEVICE
EP2786827A4 (en) RELATED COMPONENT
GB2503426B (en) Bonding method
GB201211393D0 (en) Method
HK1198152A1 (zh) 接合構件製造方法
HK1197213A1 (zh) 接合構件製造方法和接合構件製造裝置
GB201222737D0 (en) Method
EP2879161A4 (en) METHOD FOR MANUFACTURING A SENSOR
EP2879180A4 (en) METHOD FOR PRODUCING A SENSOR
GB201217688D0 (en) Method