HK1198152A1 - Method for manufacturing bonded member - Google Patents

Method for manufacturing bonded member

Info

Publication number
HK1198152A1
HK1198152A1 HK14111677.1A HK14111677A HK1198152A1 HK 1198152 A1 HK1198152 A1 HK 1198152A1 HK 14111677 A HK14111677 A HK 14111677A HK 1198152 A1 HK1198152 A1 HK 1198152A1
Authority
HK
Hong Kong
Prior art keywords
bonded member
manufacturing bonded
manufacturing
bonded
Prior art date
Application number
HK14111677.1A
Other languages
Chinese (zh)
Inventor
鈴木隆之
中村昌寬
小梶英之
長濱正伸
稻谷孝祐
Original Assignee
歐利生電氣株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歐利生電氣株式會社 filed Critical 歐利生電氣株式會社
Publication of HK1198152A1 publication Critical patent/HK1198152A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
HK14111677.1A 2012-12-07 2014-11-19 Method for manufacturing bonded member HK1198152A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012268246A JP5393869B1 (en) 2012-12-07 2012-12-07 Joining member manufacturing method

Publications (1)

Publication Number Publication Date
HK1198152A1 true HK1198152A1 (en) 2015-03-13

Family

ID=50112277

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14111677.1A HK1198152A1 (en) 2012-12-07 2014-11-19 Method for manufacturing bonded member

Country Status (4)

Country Link
US (1) US20140158291A1 (en)
JP (1) JP5393869B1 (en)
CN (1) CN103862816B (en)
HK (1) HK1198152A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101591797B1 (en) * 2014-06-16 2016-02-04 안성룡 The apparatus for attaching the panels using the electric field
JP6602703B2 (en) * 2016-03-16 2019-11-06 株式会社ディスコ Protective member forming device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5759332A (en) * 1995-05-22 1998-06-02 Pioneer Electronic Corporation Process of reproducing optical discs and optical discs produced by the same
JP3684775B2 (en) * 1997-07-23 2005-08-17 ソニー株式会社 Optical recording medium manufacturing method and manufacturing apparatus therefor
TW459225B (en) * 1999-02-01 2001-10-11 Origin Electric Bonding system and method
US20080216952A1 (en) * 2007-03-06 2008-09-11 Cheng Uei Precision Industry Co., Ltd. Adhesive Method Of Optical Components
WO2009054168A1 (en) * 2007-10-22 2009-04-30 Sharp Kabushiki Kaisha Display device and method for production thereof
JP5460418B2 (en) * 2010-03-29 2014-04-02 オリジン電気株式会社 Bonding member manufacturing method and bonding member manufacturing apparatus
JP5558993B2 (en) * 2010-09-29 2014-07-23 芝浦メカトロニクス株式会社 Adhesive supply device and adhesive supply method
US8608896B2 (en) * 2011-09-13 2013-12-17 Apple Inc. Liquid adhesive lamination for precision adhesive control

Also Published As

Publication number Publication date
CN103862816A (en) 2014-06-18
US20140158291A1 (en) 2014-06-12
JP5393869B1 (en) 2014-01-22
CN103862816B (en) 2016-03-16
JP2014114348A (en) 2014-06-26

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