CN103839651A - 无触点电力输送装置的磁性片材 - Google Patents

无触点电力输送装置的磁性片材 Download PDF

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Publication number
CN103839651A
CN103839651A CN201310084367.1A CN201310084367A CN103839651A CN 103839651 A CN103839651 A CN 103839651A CN 201310084367 A CN201310084367 A CN 201310084367A CN 103839651 A CN103839651 A CN 103839651A
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CN
China
Prior art keywords
sheet
magnetic material
power transmission
electric power
transmission device
Prior art date
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Pending
Application number
CN201310084367.1A
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English (en)
Chinese (zh)
Inventor
崔刚龙
柳志满
崔东赫
郑昌烈
安成庸
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN103839651A publication Critical patent/CN103839651A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/361—Electric or magnetic shields or screens made of combinations of electrically conductive material and ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/366—Electric or magnetic shields or screens made of ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14—Inductive couplings
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Soft Magnetic Materials (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Hard Magnetic Materials (AREA)
CN201310084367.1A 2012-11-27 2013-03-15 无触点电力输送装置的磁性片材 Pending CN103839651A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120135197A KR20140067660A (ko) 2012-11-27 2012-11-27 무접점 전력 전송 장치의 자성체 시트
KR10-2012-0135197 2012-11-27

Publications (1)

Publication Number Publication Date
CN103839651A true CN103839651A (zh) 2014-06-04

Family

ID=50772754

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310084367.1A Pending CN103839651A (zh) 2012-11-27 2013-03-15 无触点电力输送装置的磁性片材

Country Status (4)

Country Link
US (1) US20140145807A1 (enExample)
JP (1) JP2014107539A (enExample)
KR (1) KR20140067660A (enExample)
CN (1) CN103839651A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105305645A (zh) * 2014-07-08 2016-02-03 三星电机株式会社 用于无线充电的复合板及其制造方法
CN105440581A (zh) * 2014-09-19 2016-03-30 三星电机株式会社 用于无线充电的复合板及其制造方法
CN106535605A (zh) * 2016-12-06 2017-03-22 安科智慧城市技术（中国）有限公司 一种电磁干扰屏蔽装置和电动汽车充电器
CN107335145A (zh) * 2016-04-28 2017-11-10 蓓福株式会社 磁性片材和磁性支撑件
CN109427528A (zh) * 2017-09-04 2019-03-05 中微半导体设备(上海)有限公司 一种铝坡莫合金夹心板及应用其制备的等离子体处理装置
CN110654085A (zh) * 2019-09-28 2020-01-07 南昌大学 一种基于磁性能变化的应变测量芯片及其测量装置和测试方法

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US9515513B2 (en) * 2013-05-13 2016-12-06 Sony Corporation Mobile device and combo coil module
KR20150019252A (ko) * 2013-08-13 2015-02-25 삼성전기주식회사 Nfc 안테나 모듈
US10658870B2 (en) * 2015-05-18 2020-05-19 Amosense Co., Ltd. Combo antenna unit and wireless power receiving module comprising same
JP2018533198A (ja) * 2015-07-20 2018-11-08 アモセンス・カンパニー・リミテッドＡｍｏｓｅｎｓｅ Ｃｏ．， Ｌｔｄ． 磁場遮蔽ユニット
KR102406262B1 (ko) * 2015-07-20 2022-06-10 주식회사 아모센스 무선충전용 차폐유닛
WO2018050239A1 (en) * 2016-09-16 2018-03-22 Epcos Schweiz Gmbh Wireless power transmitter, wireless power transmission system and method for driving a wireless power transmission system
KR102671965B1 (ko) * 2017-02-21 2024-06-05 삼성전기주식회사 자성체 시트 및 전자기기
KR102264959B1 (ko) * 2017-07-28 2021-06-15 한국전자기술연구원 고투자율의 이종복합자성시트 및 그의 제조방법
EP3713045A1 (en) * 2019-03-19 2020-09-23 Koninklijke Philips N.V. Device and method for wireless power transfer and improved foreign object detecion
JP7385174B2 (ja) * 2019-12-11 2023-11-22 Tdk株式会社 磁性シート、および、磁性シートを備えるコイルモジュール、並びに非接触給電装置。
KR102427170B1 (ko) * 2020-09-10 2022-07-29 에스케이씨 주식회사 무선충전 장치 및 이를 포함하는 이동 수단
CN113993365A (zh) * 2021-10-28 2022-01-28 横店集团东磁股份有限公司 一种无线充电用磁屏蔽结构及其制备方法

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JPH03129897A (ja) * 1989-10-16 1991-06-03 Ricoh Res Inst Of Gen Electron 複合電磁シールド材
US20030095027A1 (en) * 2001-06-15 2003-05-22 City University Of Hong Kong Planar printed circuit-board transformers with effective electromagnetic interference (EMI) shielding
US20080021525A1 (en) * 2006-07-17 2008-01-24 Florian Solzbacher In vivo implantable coil assembly
CN101688336A (zh) * 2008-05-02 2010-03-31 迪亚特克斯株式会社 电磁波抑制扁丝和使用了其的电磁波抑制产品以及它们的制造方法
CN102197718A (zh) * 2008-09-04 2011-09-21 3M创新有限公司 抑制电磁干扰的混合片材

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JP3114323B2 (ja) * 1992-01-10 2000-12-04 株式会社村田製作所 積層チップコモンモードチョークコイル
JPH06232587A (ja) * 1993-01-28 1994-08-19 Shin Etsu Polymer Co Ltd 電磁波シールド成形体の製造方法
JP3528455B2 (ja) * 1996-09-09 2004-05-17 Ｎｅｃトーキン株式会社 電磁干渉抑制体
JPH10173392A (ja) * 1996-12-09 1998-06-26 Daido Steel Co Ltd 電磁波遮蔽用シート
JP2006269892A (ja) * 2005-03-25 2006-10-05 Aica Kogyo Co Ltd 電磁波シールド成型品
JP2007149847A (ja) * 2005-11-25 2007-06-14 Tdk Corp 焼結フェライト積層体
JP2010028969A (ja) * 2008-07-17 2010-02-04 Sanyo Electric Co Ltd 充電器
JP5780408B2 (ja) * 2010-06-28 2015-09-16 株式会社メイト 軟磁性樹脂組成物および電磁波吸収体

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03129897A (ja) * 1989-10-16 1991-06-03 Ricoh Res Inst Of Gen Electron 複合電磁シールド材
US20030095027A1 (en) * 2001-06-15 2003-05-22 City University Of Hong Kong Planar printed circuit-board transformers with effective electromagnetic interference (EMI) shielding
US20080021525A1 (en) * 2006-07-17 2008-01-24 Florian Solzbacher In vivo implantable coil assembly
CN101688336A (zh) * 2008-05-02 2010-03-31 迪亚特克斯株式会社 电磁波抑制扁丝和使用了其的电磁波抑制产品以及它们的制造方法
CN102197718A (zh) * 2008-09-04 2011-09-21 3M创新有限公司 抑制电磁干扰的混合片材

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105305645A (zh) * 2014-07-08 2016-02-03 三星电机株式会社 用于无线充电的复合板及其制造方法
CN105305645B (zh) * 2014-07-08 2018-05-01 三星电机株式会社 用于无线充电的复合板及其制造方法
CN105440581A (zh) * 2014-09-19 2016-03-30 三星电机株式会社 用于无线充电的复合板及其制造方法
CN105440581B (zh) * 2014-09-19 2019-03-05 三星电机株式会社 用于无线充电的复合板及其制造方法
CN107335145A (zh) * 2016-04-28 2017-11-10 蓓福株式会社 磁性片材和磁性支撑件
CN106535605A (zh) * 2016-12-06 2017-03-22 安科智慧城市技术（中国）有限公司 一种电磁干扰屏蔽装置和电动汽车充电器
CN109427528A (zh) * 2017-09-04 2019-03-05 中微半导体设备(上海)有限公司 一种铝坡莫合金夹心板及应用其制备的等离子体处理装置
CN109427528B (zh) * 2017-09-04 2021-01-19 中微半导体设备(上海)股份有限公司 一种铝坡莫合金夹心板及应用其制备的等离子体处理装置
CN110654085A (zh) * 2019-09-28 2020-01-07 南昌大学 一种基于磁性能变化的应变测量芯片及其测量装置和测试方法

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US20140145807A1 (en) 2014-05-29
KR20140067660A (ko) 2014-06-05
JP2014107539A (ja) 2014-06-09

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Application publication date: 20140604

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