CN103791922A - Magnetic sensor chip and manufacturing method thereof - Google Patents
Magnetic sensor chip and manufacturing method thereof Download PDFInfo
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- CN103791922A CN103791922A CN201210419654.9A CN201210419654A CN103791922A CN 103791922 A CN103791922 A CN 103791922A CN 201210419654 A CN201210419654 A CN 201210419654A CN 103791922 A CN103791922 A CN 103791922A
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Abstract
The invention provides a magnetic sensor chip and a manufacturing method thereof. The magnetic sensor chip comprises a substrate, magnetic-sensitive thin-film pairs and thin-film welding discs. The magnetic-sensitive thin-film pairs and the thin-film welding discs are arranged on the surface of the substrate. The magnetic-sensitive thin-film pairs are electrically connected by the thin-film welding discs. The pinning directions of the magnetic-sensitive thin-film pairs are identical, and flowing directions of current in adjacent magnetic-sensitive films are opposite. Difference of the magnetic-sensitive thin-film pairs is reduced by the magnetic sensor chip so that sensitivity and resolution of a magnetic sensor are enhanced.
Description
Technical Field
The invention belongs to the technical field of magnetic sensors, and particularly relates to a magnetic sensor chip and a manufacturing method thereof.
Background
The sensitive unit can be used for sensing magnetic changes caused by changes of magnetic fields, currents, stress strains, temperature, light and the like and causing the magnetic performance of the sensitive unit to change. The magnetic sensor is a device which utilizes the change characteristic of the magnetic property of a sensitive unit, converts the change of the magnetic property into an electric signal, analyzes the electric signal to obtain a corresponding physical quantity, particularly a physical quantity of a weak signal, and is widely applied to the fields of aviation, aerospace, microelectronics, geological prospecting, medical imaging, information acquisition, finance, military and the like.
In the traditional industrial field, the coil type magnetic sensor is a magnetic sensor which is widely applied, but because the coil type magnetic sensor is large in size, low in sensitivity and complex in manufacturing process and difficult to integrate, the coil type magnetic sensor cannot meet the development requirement of the modern society more and more.
For this reason, the related art has made a magnetic sensor using a magnetic induction thin film, that is, a wheatstone bridge circuit is formed using a magnetic induction thin film, and an induced magnetic change is obtained using the wheatstone bridge circuit. The magnetic sensor has the advantages of small volume, high sensitivity, easy integration, quick response, high resolution, high stability and reliability, and wide application prospect.
The magnetic sensors disclosed so far are all composed of magnetic sensitive films which are parallel to each other and have opposite pinning directions, and fig. 1 is a circuit schematic diagram of a conventional magnetic sensor chip. As shown in fig. 1, R1 and R2 denote two magnetic induction films, and an arrow denotes a pinning direction. In the manufacturing process of the magnetic sensor consisting of the magnetic sensitive films with opposite pinning directions, two processes are needed to obtain the magnetic sensitive films with opposite pinning directions. Due to the limitation of processing conditions, the two processing technologies result in poor symmetry of the magnetic sensitive film with opposite pinning directions, which limits the sensitivity and resolution of the magnetic sensor.
FIG. 2 is a graph of hysteresis loops of two magnetic induction films with opposite pinning directions, wherein the abscissa represents the magnetic field in oersted (oe for short); the ordinate represents resistance in ohms (ohm); the thinner lines represent the hysteresis loops of R1 and the thicker lines represent the hysteresis loops of R2. As shown in fig. 2, the hysteresis loops of the two magnetic induction thin films with opposite pinning directions are less symmetrical.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a magnetic sensor chip and a manufacturing method thereof, aiming at the defects existing in the traditional magnetic sensor, and the sensitivity and the resolution are high.
In order to solve the technical problem, the invention provides a magnetic sensor chip which comprises a substrate, a magnetic sensitive film pair and a film bonding pad, wherein the magnetic sensitive film pair and the film bonding pad are arranged on the surface of the substrate, and the magnetic sensitive film pair is electrically connected with the film bonding pad.
The magnetic induction type half-bridge circuit comprises a pair of magnetic sensitive films, a voltage input film bonding pad, a grounding film bonding pad, a signal output film bonding pad and a wire, wherein the first magnetic induction film and the second magnetic induction film are connected into a Wheatstone half-bridge circuit by the aid of the wire, the voltage input film bonding pad, the grounding film bonding pad and the signal output film bonding pad.
The voltage input film bonding pad is arranged at the tail end of the first magnetic induction film, the signal output film bonding pad is arranged at the head end of the first magnetic induction film and the head end of the second magnetic induction film, and the grounding film bonding pad is arranged at the tail end of the second magnetic induction film; or,
the voltage input film bonding pad is arranged at the tail end of the second magnetic induction film, the signal output film bonding pad is arranged at the head end of the first magnetic induction film and the head end of the second magnetic induction film, and the grounding film bonding pad is arranged at the tail end of the first magnetic induction film; or,
the voltage input thin film bonding pad is arranged at the head end of the first magnetic induction film, the signal output thin film bonding pad is arranged at the tail end of the first magnetic induction film and the tail end of the second magnetic induction film, and the grounding thin film bonding pad is arranged at the head end of the second magnetic induction film; or,
the voltage input film bonding pad is arranged at the head end of the second magnetic induction film, the signal output film bonding pad is arranged at the tail end of the first magnetic induction film and the tail end of the second magnetic induction film, and the grounding film bonding pad is arranged at the head end of the first magnetic induction film.
Wherein, including two pairs of mutual parallel arrangement magnetism sensitive film is right, voltage input film pad, ground connection film pad, first signal output film pad, second signal output film pad and wire, utilize the wire with voltage input film pad, ground connection film pad, first signal output film pad, second signal output film pad will two pairs of magnetism sensitive film are right to connect into the Wheatstone full-bridge circuit.
The first signal output thin film bonding pad is arranged at the head end of the first magnetic induction film and the head end of the fourth magnetic induction film, the second signal output thin film bonding pad is arranged at the tail end of the second magnetic induction film and the tail end of the third magnetic induction film, the voltage input thin film bonding pad is arranged at the tail end of the first magnetic induction film and the head end of the second magnetic induction film, and the grounding thin film bonding pad is arranged at the tail end of the fourth magnetic induction film and the head end of the third magnetic induction film; or,
the first signal output film bonding pad is arranged at the head end of the first magnetic induction film and the head end of the fourth magnetic induction film, the second signal output film bonding pad is arranged at the tail end of the second magnetic induction film and the tail end of the third magnetic induction film, the voltage input film bonding pad is arranged at the tail end of the first magnetic induction film, the grounding film bonding pad is arranged at the head end of the third magnetic induction film, and the head end of the second magnetic induction film is electrically connected with the tail end of the fourth magnetic induction film; or,
the first signal output film bonding pad is arranged at the tail end of the first magnetic induction film and the tail end of the fourth magnetic induction film, the second signal output film bonding pad is arranged at the tail end of the second magnetic induction film and the tail end of the third magnetic induction film, the voltage input film bonding pad is arranged at the head end of the first magnetic induction film, the grounding film bonding pad is arranged at the head end of the second magnetic induction film, and the head end of the third magnetic induction film is electrically connected with the head end of the fourth magnetic induction film; or,
the first signal output film bonding pad is arranged at the tail end of the first magnetic induction film and the head end of the third magnetic induction film, the second signal output film bonding pad is arranged at the head end of the second magnetic induction film and the tail end of the fourth induction film, the voltage input film bonding pad is arranged at the head end of the first magnetic induction film, the grounding film bonding pad is arranged at the head end of the fourth induction film, and the tail end of the second magnetic induction film is electrically connected with the tail end of the third magnetic induction film; or,
the first signal output film bonding pad is arranged at the tail end of the first magnetic induction film and the tail end of the fourth magnetic induction film, the second signal output film bonding pad is arranged at the tail end of the second magnetic induction film and the tail end of the third magnetic induction film, the voltage input film bonding pad is arranged at the head end of the first magnetic induction film, the grounding film bonding pad is arranged at the head end of the third magnetic induction film, and the head end of the fourth magnetic induction film is electrically connected with the head end of the second magnetic induction film; or,
the first signal output film bonding pad is arranged at the tail end of the first magnetic induction film and the tail end of the fourth magnetic induction film, the second signal output film bonding pad is arranged at the tail end of the second magnetic induction film and the tail end of the third magnetic induction film, the voltage input film bonding pad is arranged at the head end of the first magnetic induction film, the grounding film bonding pad is arranged at the head end of the second magnetic induction film, and the head end of the fourth magnetic induction film is electrically connected with the head end of the third magnetic induction film; or,
the first signal output film bonding pad is arranged at the tail end of the first magnetic induction film and the tail end of the second magnetic induction film, the second signal output film bonding pad is arranged at the head end of the fourth magnetic induction film and the head end of the third magnetic induction film, the voltage input film bonding pad is arranged at the head end of the first magnetic induction film, the grounding film bonding pad is arranged at the tail end of the third magnetic induction film, and the head end of the second magnetic induction film is electrically connected with the tail end of the fourth magnetic induction film; or,
the first signal output film bonding pad is arranged at the tail end of the first magnetic induction film and the tail end of the fourth magnetic induction film, the second signal output film bonding pad is arranged at the head end of the second magnetic induction film and the head end of the third magnetic induction film, the voltage input film bonding pad is arranged at the head end of the first magnetic induction film, the grounding film bonding pad is arranged at the tail end of the second magnetic induction film, and the head end of the fourth magnetic induction film is electrically connected with the tail end of the third magnetic induction film; or,
first signal output film pad sets up at the tail end of first magnetic induction membrane and the tail end of second magnetic induction membrane, and second signal output film pad sets up at the tail end of fourth magnetic induction membrane and the tail end of third magnetic induction membrane, and voltage input film pad sets up at the head end of first magnetic induction membrane, and ground connection film pad sets up at the head end of third magnetic induction membrane, and in addition, the tail end electric connection of the head end of second magnetic induction membrane and fourth induction membrane.
Wherein the conductive line is disposed on a surface of the substrate.
Wherein, still be equipped with the protective layer, wire and/or the magnetically susceptible thin film pair is covered by the protective layer.
Wherein the conductive line is disposed at an outer side of the substrate.
The magnetic sensitive film comprises a giant magnetoresistance magnetic sensitive film, an anisotropic magnetoresistance magnetic sensitive film, a tunneling effect magnetoresistance magnetic sensitive film, a giant magnetoresistance effect magnetoresistance magnetic sensitive film, a Hall effect film or a giant Hall effect film.
Wherein the magnetic sensitive film is a continuous uninterrupted film.
The magnetic sensitive film comprises a plurality of sections of magnetic sensitive film sections, and any two adjacent sections of the magnetic sensitive film sections are electrically connected by a conductive material.
The magnetic sensor chip is applied to a current sensor, a financial authentication machine, a speed or acceleration sensor or a displacement sensor.
The invention also provides a manufacturing method of the magnetic sensor chip, which comprises the following steps:
obtaining a substrate;
forming a magnetic sensitive film pair with the same pinning direction on the surface of the substrate through one-time process;
and forming a film bonding pad on the surface of the substrate.
And forming magnetically sensitive film pairs with the same pinning direction on the surface of the substrate by a deposition or sputtering process.
And forming a thin film bonding pad on the surface of the substrate, and forming a lead on the surface of the substrate to connect the magnetic sensitive thin film pairs into a Wheatstone bridge circuit.
The magnetic sensor chip provided by the invention is composed of the magnetic sensitive film pairs with the same pinning direction, and the current flow directions in the adjacent magnetic sensitive films are opposite, so that the magnetic sensitive film pairs can be completed in one process, and the magnetic sensitive film pairs with excellent symmetry are formed, namely, the difference of the magnetic sensitive film pairs is reduced, and the sensitivity and the resolution of the magnetic sensor are improved. In addition, the magnetic sensor provided by the invention has the advantages of small volume, thin thickness, high sensitivity, suitability for miniaturization and integration, simple structure and low cost, and meets various development requirements of modern low power consumption, high performance and the like.
According to the manufacturing method of the magnetic sensor chip, the magnetic sensitive film pairs with the same pinning direction are formed through one-step process, and the magnetic sensitive film pairs with excellent symmetry are obtained, so that the difference of the magnetic induction film pairs is eliminated, and the sensitivity and the resolution of the magnetic sensor are improved.
Drawings
FIG. 1 is a schematic circuit diagram of a prior art magnetic sensor chip;
FIG. 2 is a hysteresis loop graph of two magnetic induction films with opposite pinning directions;
FIG. 3a is a diagram of a magnetic sensor chip according to an embodiment of the present invention;
FIG. 3b is a schematic circuit diagram of the magnetic sensor chip shown in FIG. 3 a;
FIG. 4a is a block diagram of a magnetic sensor chip according to another embodiment of the present invention;
FIG. 4b is a schematic circuit diagram of the magnetic sensor chip of FIG. 4 a;
FIG. 5a is a block diagram of a magnetic sensor chip according to another embodiment of the present invention;
FIG. 5b is a schematic circuit diagram of the magnetic sensor chip of FIG. 5 a;
FIG. 6a is a diagram illustrating a magnetic sensor chip according to another embodiment of the present invention;
FIG. 6b is a schematic circuit diagram of the magnetic sensor chip of FIG. 6 a;
FIG. 7a is a diagram illustrating a magnetic sensor chip according to still another embodiment of the present invention;
FIG. 7b is a schematic circuit diagram of the magnetic sensor chip of FIG. 7 a;
FIG. 8a is a diagram illustrating a magnetic sensor chip according to still another embodiment of the present invention;
FIG. 8b is a schematic circuit diagram of the magnetic sensor chip of FIG. 8 a;
FIG. 9a is a block diagram of a magnetic sensor chip according to yet another embodiment of the present invention;
FIG. 9b is a schematic circuit diagram of the magnetic sensor chip of FIG. 9 a;
FIG. 10a is a block diagram of a magnetic sensor chip according to another embodiment of the present invention;
FIG. 10b is a schematic circuit diagram of the magnetic sensor chip shown in FIG. 10a
FIG. 11a is a block diagram of a magnetic sensor chip according to yet another embodiment of the present invention;
FIG. 11b is a schematic circuit diagram of the magnetic sensor chip shown in FIG. 11a
FIG. 12a is a block diagram of a magnetic sensor chip according to yet another embodiment of the present invention;
fig. 12b is a schematic circuit diagram of the magnetic sensor chip shown in fig. 12 a.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the magnetic sensor chip and the manufacturing method thereof provided by the present invention are described in detail below with reference to the accompanying drawings.
The embodiment provides a magnetic sensor chip, which comprises a substrate, a magnetic sensitive film pair and a film bonding pad, wherein the magnetic sensitive film pair and the film bonding pad are arranged on the surface of the substrate, in other words, the substrate is used as a support for supporting the magnetic sensitive film pair and the film bonding pad. The magnetic sensitive film pairs are electrically connected by the film bonding pads, the pinning directions of the magnetic sensitive film pairs are the same, and the current flow directions in the adjacent magnetic sensitive films are opposite. The magnetic sensitive film pair is finished in one process, so that the magnetic sensitive film pair with the same pinning direction can be obtained, the magnetic sensitive film pair has excellent symmetry, and the difference of the magnetic induction film pair can be reduced or even eliminated, so that the sensitivity and the resolution of the magnetic sensor are improved.
In the embodiment, by using the principle that the impedance of the magnetic sensitive film changes along with the change of an external magnetic field, at least one pair of magnetic sensitive films with the same pinning direction are connected to form a Wheatstone bridge circuit and are integrated on the same substrate, and the current flowing through the pair of magnetic sensitive films has opposite flow directions by reasonably arranging the bonding pads, so that the differential output of the pair of magnetic sensitive films is proportional to the change of the external magnetic field, and the change of the external magnetic field is induced and recognized.
Fig. 3a is a structural diagram of a magnetic sensor chip according to an embodiment of the invention. As shown in fig. 3a, the magnetic sensor chip includes a substrate 30, a pair of magnetically sensitive thin films, i.e., a first magnetically sensitive thin film R1 and a second magnetically sensitive thin film R2, and the first magnetically sensitive thin film R1 and the second magnetically sensitive thin film R2 are parallel to each other; three film pads, namely, a voltage input film pad Vcc, a grounding film pad G, a signal output film pad Vout and a lead (not shown in the figure), the voltage input film pad Vcc is disposed at the tail end of the first magnetic induction film R1, the signal output film pad Vout is disposed at the head end of the first magnetic induction film R1 and the head end of the second magnetic induction film R2, or, the head end of the first magnetic induction film R1 and the head end of the second magnetic induction film R2 are electrically connected by the signal output film pad Vout, and the grounding film pad G is disposed at the tail end of the second magnetic induction film R2.
The first magnetic induction film R1 and the second magnetic induction film R2 are connected to form a wheatstone half bridge circuit by means of a wire, a voltage input film pad Vcc, a ground film pad G, and a signal output film pad Vout. In the first magnetic induction film R1, the current i flows from the voltage input thin film pad Vc c to the signal output thin film pad Vout, and flows leftward in fig. 3 a; in the second magnetic induction film R2, the current i flows from the signal output thin film pad Vout to the ground thin film pad G, and flows rightward in fig. 3 a. That is, in the first magnetic induction film R1 and the second magnetic induction film R2, the flow direction of the current i is opposite.
In this embodiment, the wires may be disposed on the surface of the base 30, and preferably, a protective layer is further disposed on the surface of the wires to protect the wires from being worn or short-circuited with other conductors. Moreover, a protective layer may be disposed on the surface of the pair of magnetic induction films, and the function of the protective layer is the same as that of the protective layer disposed on the surface of the conductive wire, which is not described in detail herein. Of course, the wires may also be arranged outside the base. The purpose of the wire is to connect the first magnetic induction film R1 and the second magnetic induction film R2 into a wheatstone half-bridge circuit regardless of whether the wire is provided on the surface or outside the base 30. Therefore, any arrangement of the wires as long as the first magnetic induction films R1 and the second magnetic induction films R2 can be connected to form a wheatstone half-bridge circuit can be used in the present embodiment. It is understood that the conductive lines include at least three conductive lines connected to the voltage input film pad Vcc, the ground film pad G, and the signal output film pad Vout, respectively.
Fig. 3b is a schematic circuit diagram of the magnetic sensor chip shown in fig. 3 b. As shown in fig. 3b, the arrows indicate the pinning directions of the magnetic induction films. The voltage input film pad Vcc can be connected with 5V voltage by a section of conducting wire; the grounding film pad G can be directly grounded or indirectly grounded through another section of conducting wire; the signal output film pad Vout may be connected to the filter circuit through another wire.
It should be noted that the head end and the tail end of the magnetic induction film are relative concepts, and in this embodiment, the left end of the magnetic induction film is defined as the head end, and the right end of the magnetic induction film is defined as the tail end. Hereinafter, the definition about the head end and the tail end of the magnetic induction film is the same.
In this embodiment, the voltage input film pad Vcc, the grounding film pad G, the signal output film pad Vout, and the first magnetic induction film R1 and the second magnetic induction film R2 may also be connected in such a manner that, specifically, the voltage input film pad Vcc is disposed at the tail end of the second magnetic induction film R2, the signal output film pad Vout is disposed at the head end of the first magnetic induction film R1 and the head end of the second magnetic induction film R2, and the grounding film pad G is disposed at the tail end of the first magnetic induction film R1; or, the voltage input film pad Vcc is disposed at the head end of the first magnetic induction film R1, the signal output film pad Vout is disposed at the tail end of the first magnetic induction film R1 and the tail end of the second magnetic induction film R2, and the grounding film pad G is disposed at the head end of the second magnetic induction film R2; alternatively, the voltage input film pad Vcc is provided at the head end of the second magnetic induction film R2, the signal output film pad Vout is provided at the tail end of the first magnetic induction film R1 and the tail end of the second magnetic induction film R2, and the ground film pad G is provided at the head end of the first magnetic induction film R1. Such a connection mode can also produce the same technical effects of the present embodiment.
Fig. 4a is a structural diagram of a magnetic sensor chip according to another embodiment of the present invention. As shown in fig. 4a, in another embodiment, the magnetic sensor chip includes a base 30, two pairs of magnetic sensing film pairs arranged in parallel with each other, and four film pads, the two pairs of magnetic sensing film pairs include a first magnetic induction film R1, a second magnetic induction film R2, a third magnetic induction film R3, and a fourth magnetic induction film R4, and the first magnetic induction film R1 and the fourth magnetic induction film R4 are a pair of magnetic sensing film pairs, and the second magnetic induction film R2 and the third magnetic induction film R3 are a pair of magnetic sensing film pairs; the four film pads are a voltage input film pad Vcc, a ground film pad G, a first signal output film pad V1, a second signal output film pad V2, and a conductive line (not shown).
Wherein, first signal output film pad V1 sets up at the head end of first magnetic induction film R1 and the head end of fourth magnetic induction film R4, and second signal output film pad V2 sets up the tail end of second magnetic induction film R2 and the tail end of third magnetic induction film R3, voltage input film pad Vout sets up the tail end at first magnetic induction film R1 and the head end of second magnetic induction film R2, and ground connection film pad G sets up the tail end at fourth magnetic induction film R4 and the head end of third magnetic induction film R3. Two pairs of magnetically sensitive film pairs are connected into a wheatstone full bridge circuit using wires and a voltage input film pad Vcc, a ground film pad G, a first signal output film pad V1, a second signal output film pad V2.
In the magnetic sensor chip provided in the present embodiment, in the first magnetic induction film R1, the current i flows from the voltage input film pad Vcc to the first signal output film pad V1, and flows leftward in fig. 4 a; in the fourth magnetic induction film R4, the current i flows from the first signal output film pad V1 to the ground film pad G, and flows rightward in fig. 4 a; in the second magnetic induction film R2, the current i flows from the second signal output film pad V2 to the voltage input film pad Vcc, and flows rightward in fig. 3 a; in the third magnetic induction film R3, the current i flows from the second signal output film pad V2 to the ground film pad G, and flows leftward in fig. 4 a.
Fig. 4b is a schematic circuit diagram of the magnetic sensor chip shown in fig. 4a, and as shown in fig. 4b, arrows indicate the pinning directions of the magnetic induction films. In this embodiment, at least four wires are required, and the voltage input film pad Vcc may be connected to a voltage of 5V through one wire; the grounding film pad G can be directly grounded or indirectly grounded through another section of conducting wire; the first signal output film pad V1 and the second signal output film pad V2 may be connected to the filter circuit through one piece of wiring, respectively.
This embodiment has described only one embodiment of connecting the pair of magnetic induction thin films and the thin film pad to a wheatstone full bridge circuit, however, the present invention is not limited thereto, and the pair of magnetic induction thin films and the thin film pad may be arranged in several ways as follows.
Specifically, fig. 5a is a structural diagram of a magnetic sensor chip according to still another embodiment of the present invention, and fig. 5b is a schematic circuit diagram of the magnetic sensor chip shown in fig. 5 a. As shown in fig. 5a and 5b, the first signal output film pad V1 is disposed at the head end of the first magnetic induction film R1 and the head end of the fourth magnetic induction film R4, the second signal output film pad V2 is disposed at the tail end of the second magnetic induction film R2 and the tail end of the third magnetic induction film R3, the voltage input film pad Vcc is disposed at the tail end of the first magnetic induction film R1, the grounding film pad G is disposed at the head end of the third magnetic induction film R3, and the head end of the second magnetic induction film R2 is electrically connected to the tail end of the fourth magnetic induction film R4.
In the first magnetic induction film R1, the current i flows leftward, in the fourth magnetic induction film R4, the current i flows rightward, and in the second magnetic induction film R2, the current i flows rightward; in the third magnetic induction film R3, the current i flows leftward.
Fig. 6a is a structural diagram of a magnetic sensor chip according to still another embodiment of the present invention, and fig. 6b is a schematic circuit diagram of the magnetic sensor chip shown in fig. 6 a. As shown in fig. 6a and 6b, the first signal output film pad V1 is disposed at the tail end of the first magnetic induction film R1 and the tail end of the fourth magnetic induction film R4, the second signal output film pad V2 is disposed at the tail end of the second magnetic induction film R2 and the tail end of the third magnetic induction film R3, the voltage input film pad Vcc is disposed at the head end of the first magnetic induction film R1, the grounding film pad G is disposed at the head end of the second magnetic induction film R2, and the head end of the third magnetic induction film R3 is electrically connected to the head end of the fourth magnetic induction film R4.
In fig. 6a, in the first magnetic induction film R1, the current i flows rightward, in the fourth magnetic induction film R4, the current i flows leftward, and in the second magnetic induction film R2, the current i flows leftward; in the third magnetic induction film R3, the current i flows rightward. Thus, the current flow direction in the first magnetic induction film R1 is opposite to the current flow direction in the second magnetic induction film R2 and the fourth magnetic induction film R4, the current flow direction in the second magnetic induction film R2 is opposite to the current flow direction in the first magnetic induction film R1 and the third magnetic induction film R3, the current flow direction in the third magnetic induction film R3 is opposite to the current flow direction in the second magnetic induction film R2 and the fourth magnetic induction film R4, and the current flow direction in the fourth magnetic induction film R4 is opposite to the current flow direction in the first magnetic induction film R1 and the third magnetic induction film R3.
Fig. 7a is a structural diagram of a magnetic sensor chip according to still another embodiment of the present invention, and fig. 7b is a schematic circuit diagram of the magnetic sensor chip shown in fig. 7 a. As shown in fig. 7a and 7b, the first signal output film pad V1 is disposed at the tail end of the first magnetic induction film R1 and the head end of the third magnetic induction film R3, the second signal output film pad V2 is disposed at the head end of the second magnetic induction film R2 and the tail end of the fourth induction film R4, the voltage input film pad Vcc is disposed at the head end of the first magnetic induction film R1, the grounding film pad G is disposed at the head end of the fourth induction film R4, and the tail end of the second magnetic induction film R2 is electrically connected to the tail end of the third magnetic induction film R3.
In fig. 7a, in the first magnetic induction film R1, the current i flows rightward, in the fourth magnetic induction film R4, the current i flows leftward, and in the second magnetic induction film R2, the current i flows leftward; in the third magnetic induction film R3, the current i flows rightward. That is, the current flow direction in the first magnetic induction film R1 is opposite to the current flow direction in the fourth magnetic induction film R4 and the second magnetic induction film R2, the current flow direction in the second magnetic induction film R2 is opposite to the current flow direction in the first magnetic induction film R1 and the third magnetic induction film R3, the current flow direction in the fourth magnetic induction film R4 is opposite to the current flow direction in the first magnetic induction film R1 and the third magnetic induction film R3, and the current flow direction in the third magnetic induction film R3 is opposite to the current flow direction in the second magnetic induction film R2 and the fourth magnetic induction film R4.
Fig. 8a is a structural diagram of a magnetic sensor chip according to still another embodiment of the present invention, and fig. 8b is a schematic circuit diagram of the magnetic sensor chip shown in fig. 8 a. As shown in fig. 8a and 8b, the first signal output film pad V1 is disposed at the tail end of the first magnetic induction film R1 and the tail end of the fourth magnetic induction film R4, the second signal output film pad V2 is disposed at the tail end of the second magnetic induction film R2 and the tail end of the third magnetic induction film R3, the voltage input film pad Vcc is disposed at the head end of the first magnetic induction film R1, the grounding film pad G is disposed at the head end of the third magnetic induction film R3, and the head end of the fourth magnetic induction film R4 is electrically connected to the head end of the second magnetic induction film R2.
In fig. 8a, in the first magnetic induction film R1, the current i flows rightward, in the fourth magnetic induction film R4, the current i flows leftward, and in the second magnetic induction film R2, the current i flows rightward; in the third magnetic induction film R3, the current i flows leftward.
Fig. 9a is a structural diagram of a magnetic sensor chip according to still another embodiment of the present invention, and fig. 9b is a schematic circuit diagram of the magnetic sensor chip shown in fig. 9 a. As shown in fig. 9a and 9b, the first signal output film pad V1 is disposed at the tail end of the first magnetic induction film R1 and the tail end of the fourth magnetic induction film R4, the second signal output film pad V2 is disposed at the tail end of the second magnetic induction film R2 and the tail end of the third magnetic induction film R3, the voltage input film pad Vcc is disposed at the head end of the first magnetic induction film R1, the grounding film pad G is disposed at the head end of the second magnetic induction film R2, and the head end of the fourth magnetic induction film R4 is electrically connected to the head end of the third magnetic induction film R3.
In fig. 9a, in the first magnetic induction film R1, the current i flows rightward, in the fourth magnetic induction film R4, the current i flows leftward, and in the second magnetic induction film R2, the current i flows leftward; in the third magnetic induction film R3, the current i flows rightward. That is, the current flow direction in the first magnetic induction film R1 is opposite to the current flow direction in the fourth magnetic induction film R4 and the second magnetic induction film R2, the current flow direction in the second magnetic induction film R2 is opposite to the current flow direction in the first magnetic induction film R1 and the third magnetic induction film R3, the current flow direction in the fourth magnetic induction film R4 is opposite to the current flow direction in the first magnetic induction film R1 and the third magnetic induction film R3, and the current flow direction in the third magnetic induction film R3 is opposite to the current flow direction in the second magnetic induction film R2 and the fourth magnetic induction film R4.
Fig. 10a is a structural diagram of a magnetic sensor chip according to another embodiment of the present invention, and fig. 10b is a schematic circuit diagram of the magnetic sensor chip shown in fig. 10 a. As shown in fig. 10a and 10b, the first signal output film pad V1 is disposed at the tail end of the first magnetic induction film R1 and the tail end of the second magnetic induction film R2, the second signal output film pad V2 is disposed at the head end of the fourth magnetic induction film R4 and the head end of the third magnetic induction film R3, the voltage input film pad Vcc is disposed at the head end of the first magnetic induction film R1, the grounding film pad G is disposed at the tail end of the third magnetic induction film R3, and the head end of the second magnetic induction film R2 is electrically connected to the tail end of the fourth magnetic induction film R4.
In fig. 10a, in the first magnetic induction film R1, the current i flows rightward, in the fourth magnetic induction film R4, the current i flows leftward, and in the second magnetic induction film R2, the current i flows leftward; in the third magnetic induction film R3, the current i flows rightward. That is, the current flow direction in the first magnetic induction film R1 is opposite to the current flow direction in the fourth magnetic induction film R4 and the second magnetic induction film R2, the current flow direction in the second magnetic induction film R2 is opposite to the current flow direction in the first magnetic induction film R1 and the third magnetic induction film R3, the current flow direction in the fourth magnetic induction film R4 is opposite to the current flow direction in the first magnetic induction film R1 and the third magnetic induction film R3, and the current flow direction in the third magnetic induction film R3 is opposite to the current flow direction in the second magnetic induction film R2 and the fourth magnetic induction film R4.
Fig. 11a is a structural diagram of a magnetic sensor chip according to still another embodiment of the present invention, and fig. 11b is a schematic circuit diagram of the magnetic sensor chip shown in fig. 11 a. As shown in fig. 11a and 11b, the first signal output film pad V1 is disposed at the tail end of the first magnetic induction film R1 and the tail end of the fourth magnetic induction film R4, the second signal output film pad V2 is disposed at the head end of the second magnetic induction film R2 and the head end of the third magnetic induction film R3, the voltage input film pad Vcc is disposed at the head end of the first magnetic induction film R1, the grounding film pad G is disposed at the tail end of the second magnetic induction film R2, and the head end of the fourth magnetic induction film R4 is electrically connected to the tail end of the third magnetic induction film R3.
In fig. 11a, in the first magnetic induction film R1, the current i flows rightward, in the fourth magnetic induction film R4, the current i flows leftward, and in the second magnetic induction film R2, the current i flows rightward; in the third magnetic induction film R3, the current i flows leftward.
Fig. 12a is a structural diagram of a magnetic sensor chip according to still another embodiment of the present invention, and fig. 12b is a schematic circuit diagram of the magnetic sensor chip shown in fig. 12 a. As shown in fig. 12a and 12b, the first signal output film pad V1 is disposed at the tail end of the first magnetic induction film R1 and the tail end of the second magnetic induction film R2, the second signal output film pad V2 is disposed at the tail end of the fourth magnetic induction film R4 and the tail end of the third magnetic induction film R3, the voltage input film pad Vcc is disposed at the head end of the first magnetic induction film R1, the grounding film pad G is disposed at the head end of the third magnetic induction film R3, and the head end of the second magnetic induction film R2 is electrically connected to the tail end of the fourth magnetic induction film R4.
In fig. 12a, in the first magnetic induction film R1, the current i flows rightward, in the fourth magnetic induction film R4, the current i flows leftward, and in the second magnetic induction film R2, the current i flows leftward; in the third magnetic induction film R3, the current i flows leftward.
In the above embodiments, the magnetic sensitive film used in the magnetic sensor chip may be a giant magnetoresistance magnetic sensitive film, an anisotropic magnetoresistance magnetic sensitive film, a tunneling effect magnetoresistance magnetic sensitive film, a giant magnetoresistance effect magnetoresistance magnetic sensitive film, a hall effect film, or a giant hall effect film.
Each of the magnetic sensitive films may be a continuous, uninterrupted film, such as a first magnetic induction film R1, a second magnetic induction film R2, and the like, which are provided as a continuous, uninterrupted film. Of course, the magnetic sensitive film may also be composed of a plurality of sections of magnetic sensitive film, and any two adjacent sections of magnetic sensitive film are electrically connected by the conductive material.
The magnetic sensor chip provided by the embodiment can be used in the fields of current sensors or finance, such as currency detectors or counterfeit detectors for identifying the authenticity of valuable bills, or magnetic sensors for sensing magnetic changes, such as various speed or acceleration sensors, displacement sensors and the like.
The magnetic sensor chip provided by the embodiment is composed of the magnetic sensitive film pairs with the same pinning direction, and the current flow directions of the adjacent magnetic sensitive films are opposite, so that the magnetic sensitive film pairs can be completed in one process, and the magnetic sensitive film pairs with excellent symmetry are formed, namely, the difference of the magnetic sensitive film pairs is eliminated, and the sensitivity and the resolution of the magnetic sensor are improved. In addition, the magnetic sensor provided by the invention has the advantages of small volume, thin thickness, high sensitivity, suitability for miniaturization and integration, simple structure and low cost, and meets various development requirements of modern low power consumption, high performance and the like.
The embodiment also provides a manufacturing method of the magnetic sensor chip, which comprises the following steps:
in step S1, a substrate is acquired.
The substrate may be a rigid substrate material or a flexible substrate material, such as a resin material or a semiconductor material such as silicon.
Step S2, forming magnetically sensitive thin film pairs with the same pinning direction on the substrate surface by one process.
In the embodiment, the magnetically sensitive film pairs with the same pinning direction are formed on the surface of the substrate through a deposition or sputtering process. The magnetic sensitive film pairs may be a pair of magnetic sensitive film pairs or two pairs of magnetic sensitive film pairs, and the arrangement manner of the magnetic sensitive film pairs is as described above, which is not described herein again.
Step S3, forming a thin film pad on the surface of the substrate.
A thin film bonding pad is formed on the surface of the substrate, and the thin film bonding pad can be made of conductive materials such as copper.
In step S3, a wire may be formed at the same time as the thin film pad to connect the magnetically sensitive thin film pairs into a wheatstone bridge circuit. Of course, as described above, the wires may also be provided on the outer side of the substrate.
In the manufacturing method of the magnetic sensor chip provided by the embodiment, the pair of magnetic sensitive films with the same pinning direction is formed through one process, and the pair of magnetic sensitive films with excellent symmetry is obtained, so that the difference of the pair of magnetic sensitive films is eliminated, and the sensitivity and the resolution of the magnetic sensor are further improved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (15)
1. The utility model provides a magnetic sensor chip, includes base plate, magnetism sensitive film to and film pad, magnetism sensitive film to with the film pad sets up the surface of base plate, magnetism sensitive film to by film pad electric connection, its characterized in that, the pinning direction that magnetism sensitive film is right is the same, and is adjacent moreover the flow direction of the interior electric current of magnetism sensitive film is opposite.
2. The magnetic sensor chip of claim 1, comprising a pair of said magnetically sensitive thin films, a voltage input thin film pad, a ground thin film pad, a signal output thin film pad, and a wire, wherein said first and second magnetic induction films are connected into a wheatstone half-bridge circuit by said wire, said voltage input thin film pad, said ground thin film pad, and said signal output thin film pad.
3. The magnetic sensor chip according to claim 2, wherein the voltage input film pad is disposed at a tail end of the first magnetic induction film, the signal output film pad is disposed at a head end of the first magnetic induction film and a head end of the second magnetic induction film, and the ground film pad is disposed at a tail end of the second magnetic induction film; or,
the voltage input film bonding pad is arranged at the tail end of the second magnetic induction film, the signal output film bonding pad is arranged at the head end of the first magnetic induction film and the head end of the second magnetic induction film, and the grounding film bonding pad is arranged at the tail end of the first magnetic induction film; or,
the voltage input thin film bonding pad is arranged at the head end of the first magnetic induction film, the signal output thin film bonding pad is arranged at the tail end of the first magnetic induction film and the tail end of the second magnetic induction film, and the grounding thin film bonding pad is arranged at the head end of the second magnetic induction film; or,
the voltage input film bonding pad is arranged at the head end of the second magnetic induction film, the signal output film bonding pad is arranged at the tail end of the first magnetic induction film and the tail end of the second magnetic induction film, and the grounding film bonding pad is arranged at the head end of the first magnetic induction film.
4. The magnetic sensor chip of claim 1, comprising two pairs of said magnetically sensitive thin film pairs arranged in parallel with each other, a voltage input thin film pad, a ground thin film pad, a first signal output thin film pad, a second signal output thin film pad, and a wire, wherein said two pairs of magnetically sensitive thin film pairs are connected to form a Wheatstone full bridge circuit using said wire and said voltage input thin film pad, ground thin film pad, first signal output thin film pad, second signal output thin film pad.
5. The magnetic sensor chip according to claim 4, wherein a first signal output thin film pad is provided at a head end of the first magnetic induction film and a head end of a fourth magnetic induction film, a second signal output thin film pad is provided at a tail end of the second magnetic induction film and a tail end of a third magnetic induction film, a voltage input thin film pad is provided at a tail end of the first magnetic induction film and a head end of a second magnetic induction film, and a ground thin film pad is provided at a tail end of the fourth magnetic induction film and a head end of a third magnetic induction film; or,
the first signal output film bonding pad is arranged at the head end of the first magnetic induction film and the head end of the fourth magnetic induction film, the second signal output film bonding pad is arranged at the tail end of the second magnetic induction film and the tail end of the third magnetic induction film, the voltage input film bonding pad is arranged at the tail end of the first magnetic induction film, the grounding film bonding pad is arranged at the head end of the third magnetic induction film, and the head end of the second magnetic induction film is electrically connected with the tail end of the fourth magnetic induction film; or,
the first signal output film bonding pad is arranged at the tail end of the first magnetic induction film and the tail end of the fourth magnetic induction film, the second signal output film bonding pad is arranged at the tail end of the second magnetic induction film and the tail end of the third magnetic induction film, the voltage input film bonding pad is arranged at the head end of the first magnetic induction film, the grounding film bonding pad is arranged at the head end of the second magnetic induction film, and the head end of the third magnetic induction film is electrically connected with the head end of the fourth magnetic induction film; or,
the first signal output film bonding pad is arranged at the tail end of the first magnetic induction film and the head end of the third magnetic induction film, the second signal output film bonding pad is arranged at the head end of the second magnetic induction film and the tail end of the fourth induction film, the voltage input film bonding pad is arranged at the head end of the first magnetic induction film, the grounding film bonding pad is arranged at the head end of the fourth induction film, and the tail end of the second magnetic induction film is electrically connected with the tail end of the third magnetic induction film; or,
the first signal output film bonding pad is arranged at the tail end of the first magnetic induction film and the tail end of the fourth magnetic induction film, the second signal output film bonding pad is arranged at the tail end of the second magnetic induction film and the tail end of the third magnetic induction film, the voltage input film bonding pad is arranged at the head end of the first magnetic induction film, the grounding film bonding pad is arranged at the head end of the third magnetic induction film, and the head end of the fourth magnetic induction film is electrically connected with the head end of the second magnetic induction film; or,
the first signal output film bonding pad is arranged at the tail end of the first magnetic induction film and the tail end of the fourth magnetic induction film, the second signal output film bonding pad is arranged at the tail end of the second magnetic induction film and the tail end of the third magnetic induction film, the voltage input film bonding pad is arranged at the head end of the first magnetic induction film, the grounding film bonding pad is arranged at the head end of the second magnetic induction film, and the head end of the fourth magnetic induction film is electrically connected with the head end of the third magnetic induction film; or,
the first signal output film bonding pad is arranged at the tail end of the first magnetic induction film and the tail end of the second magnetic induction film, the second signal output film bonding pad is arranged at the head end of the fourth magnetic induction film and the head end of the third magnetic induction film, the voltage input film bonding pad is arranged at the head end of the first magnetic induction film, the grounding film bonding pad is arranged at the tail end of the third magnetic induction film, and the head end of the second magnetic induction film is electrically connected with the tail end of the fourth magnetic induction film; or,
the first signal output film bonding pad is arranged at the tail end of the first magnetic induction film and the tail end of the fourth magnetic induction film, the second signal output film bonding pad is arranged at the head end of the second magnetic induction film and the head end of the third magnetic induction film, the voltage input film bonding pad is arranged at the head end of the first magnetic induction film, the grounding film bonding pad is arranged at the tail end of the second magnetic induction film, and the head end of the fourth magnetic induction film is electrically connected with the tail end of the third magnetic induction film; or,
first signal output film pad sets up at the tail end of first magnetic induction membrane and the tail end of second magnetic induction membrane, and second signal output film pad sets up at the tail end of fourth magnetic induction membrane and the tail end of third magnetic induction membrane, and voltage input film pad sets up at the head end of first magnetic induction membrane, and ground connection film pad sets up at the head end of third magnetic induction membrane, and in addition, the tail end electric connection of the head end of second magnetic induction membrane and fourth induction membrane.
6. The magnetic sensor chip according to claim 2 or 4, wherein the conductive line is disposed on a surface of the substrate.
7. Magnetic sensor chip according to claim 6, characterized in that a protective layer is provided, said pair of wires and/or said magnetically sensitive thin film being covered by said protective layer.
8. The magnetic sensor chip according to claim 2 or 4, wherein the conductive line is arranged outside the substrate.
9. The magnetic sensor chip of claim 1, wherein the magneto-sensitive film comprises a giant magneto-resistive magneto-sensitive film, an anisotropic magneto-resistive magneto-sensitive film, a tunneling magneto-resistive magneto-sensitive film, a giant magneto-resistive magneto-sensitive film, a hall effect film, or a giant hall effect film.
10. The magnetic sensor chip of claim 1, wherein the magnetically sensitive film is a continuous, uninterrupted film.
11. The magnetic sensor chip of claim 1, wherein the magnetically sensitive film comprises a plurality of segments of magnetically sensitive film, and any two adjacent segments of the magnetically sensitive film are electrically connected by a conductive material.
12. The magnetic sensor chip of claim 1, wherein the magnetic sensor chip is applied to a current sensor, a financial authentication machine, a speed or acceleration sensor, or a displacement sensor.
13. A method of fabricating a magnetic sensor chip, comprising:
obtaining a substrate;
forming a magnetic sensitive film pair with the same pinning direction on the surface of the substrate through one-time process;
and forming a film bonding pad on the surface of the substrate.
14. The method of claim 13, wherein the pair of magnetically sensitive thin films with the same pinning direction are formed on the surface of the substrate by a deposition or sputtering process.
15. The method of claim 13, wherein the thin film pads are formed on the surface of the substrate and conductive traces are formed on the surface of the substrate to connect the magnetically sensitive thin film pairs into a wheatstone bridge circuit.
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Application publication date: 20140514 |