CN103782367A - Substrate processing apparatus - Google Patents
Substrate processing apparatus Download PDFInfo
- Publication number
- CN103782367A CN103782367A CN201280043147.8A CN201280043147A CN103782367A CN 103782367 A CN103782367 A CN 103782367A CN 201280043147 A CN201280043147 A CN 201280043147A CN 103782367 A CN103782367 A CN 103782367A
- Authority
- CN
- China
- Prior art keywords
- supported
- board treatment
- substrate board
- support
- described body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 63
- 238000001816 cooling Methods 0.000 claims abstract description 35
- 238000010521 absorption reaction Methods 0.000 claims description 16
- 239000007921 spray Substances 0.000 claims description 16
- 238000007599 discharging Methods 0.000 claims description 7
- 230000008676 import Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 abstract description 3
- 230000008439 repair process Effects 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 26
- 230000008020 evaporation Effects 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 7
- 238000000137 annealing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Disclosed is a substrate processing apparatus. The substrate processing apparatus according to the present invention has a cooling means, for forcibly cooling a processed substrate, supported and installed on the outer surface of a main body forming a chamber. Accordingly, the cooling means can easily be installed on the main body, and maintenance and repair are easy.
Description
Technical field
The present invention relates to a kind of substrate board treatment, described substrate board treatment is provided with cooling unit in the outside of the body that forms chamber.
Background technology
Substrate board treatment is applied to the production of flat-panel monitor, and is roughly divided into evaporation (Vapor Deposition) device and annealing (Annealing) device.
Evaporation coating device, as the device that forms the transparency conducting layer, insulating barrier, metal level or the silicon layer that form flat-panel monitor core texture, is divided into the physical vapor evaporation coating device of the mode such as chemical vapor coating device and sputter (Sputtering) of the modes such as low-pressure chemical vapor deposition (LPCVD:Low Pressure Chemical Vapor Deposition) or plasma enhanced chemical vapor deposition (PECVD:Plasma-Enhanced Chemical Vapor Deposition).
Annealing device after vapor-deposited film, improves the characteristic of the film after evaporation on substrate, is the annealing device that the film after evaporation is carried out to crystallization or phase change.
Usually, substrate board treatment is divided into one chip (the Single Substrate Type) substrate board treatment that a substrate is processed and batch-type (Batch Type) substrate board treatment that multiple substrates are processed.Although one chip substrate board treatment is simple in structure, productivity ratio is lower, therefore, and the batch-type substrate-processing apparatus that use in large batch of production more.
Substrate board treatment comprises: body, and its inside is formed with the chamber as processing substrate space; Bracket, is arranged on the inside of described body, for supporting substrate; Multiple heaters, are arranged on the inside of described body, for generation of the required heat of described processing substrate; Cooling unit for the cooling substrate being heat-treated, is discharged after the inside importing refrigerating gas of described body.
In existing substrate board treatment as above, described cooling unit is arranged on the inside of described body.
Therefore, described cooling unit is set on described body more difficult, and has difficulties to being arranged on when described cooling unit on described body keeps in repair.
Summary of the invention
Technical problem
The present invention proposes for the problem that solves prior art as above, and the object of the invention is to provide a kind of substrate board treatment, owing to being arranged on the outside of body for the cooling unit of cooling base, thereby easily arrange, and easily maintenance.
Problem solution
To achieve these goals, the substrate board treatment the present invention relates to comprises: body, be formed with the chamber in the space processed as substrate in inside, and heater, is positioned at the inside of described body, for generation of the required heat of described processing substrate; Cooling unit, is arranged on the outer surface of described body, imports for after the refrigerating gas of the cooling substrate being heat-treated to the inside of described body, is expelled to the outside of described body.
Invention effect
In the substrate board treatment the present invention relates to, for forcing the cooling unit of cooling processed substrate to support and be arranged on the outer surface of the body that forms chamber.Therefore, cooling unit can be set easily on body, and be convenient to keep in repair.
Accompanying drawing explanation
Fig. 1 is the stereogram of the substrate board treatment of one embodiment of the present invention.
Fig. 2 is the stereogram that is illustrated in the cooling unit in Fig. 1.
Fig. 3 is the main position enlarged drawing that is illustrated in the cooling unit in Fig. 2.
Embodiment
Below, with reference to accompanying drawing, specific embodiment of the present invention is elaborated.By these embodiment, those skilled in the art can fully implement the present invention.Although various embodiments of the present invention is different, should not be construed as mutual repulsion.For example, be recorded in given shape, ad hoc structure and the characteristic of this embodiment, do not exceeding on the basis of spirit of the present invention and scope, can embody with the form of other embodiment.And, being interpreted as, position or the setting of other inscape in each disclosed embodiment can be changed in the situation that not exceeding spirit of the present invention and scope.Therefore, detailed description described later is not intended to limit, and scope of the present invention is only defined in all authority requirement and equivalency range thereof.For convenience of explanation, embodiment shown in the drawings likely exaggerates expression to length, area, thickness and form.
Describe the substrate board treatment of one embodiment of the present invention in detail referring to accompanying drawing.
Processing substrate is understood to include: the technique of heating and cooling base; All techniques of the film stipulating for evaporation on substrate; The film of the regulation to evaporation on substrate is annealed, all Technologies for Heating Processing of crystallization or phase change.In addition, the material of substrate is had no particular limits, can be formed by materials such as glass, resin, polymer, silicon wafer or stainless steels.
Fig. 1 is the stereogram of the substrate board treatment of one embodiment of the present invention.
As shown in the figure, the substrate board treatment of present embodiment comprises the body that is substantially straight hexahedron shape 110 that forms outward appearance.The inside of body 110 is formed with the chamber 111 as the processing space of substrate 50, and chamber 111 is formed as the space of sealing.The shape of body 110 is not limited to straight hexahedron shape, can be formed as various shape according to the shape of substrate 50.
The front side of body 110 is formed with opening portion, and described opening portion opens and closes by the door 113 that is arranged on body 110 front sides.Make chamber 111 with under the outside state being communicated with at door capable of being opened 113, by mechanical arm (not shown) etc., the supporting bracket 120 of lift-launch and supporting substrate 50 is supported, so that substrate 50 is loaded into chamber 111.Then close door 113, under the state of sealing chamber 111, substrate 50 is processed.
The inside of body 110 is provided with multiple brackets 130.Supporting bracket 120 supports and is arranged on bracket 130 across interval along above-below direction, and supporting bracket 120 is carried and supporting substrate 50.In addition, be provided with multiple heaters (not shown) between supporting bracket 120 and supporting bracket 120, the plurality of heater is processed required heat for generation of substrate 50.
The substrate 50 processed owing to being loaded into chamber 111 be in the condition of high temperature, could unload from chamber 111 after being therefore only cooled to the temperature of regulation.But, if natural cooling base 50 is to the temperature of regulation, need the long period, therefore force the temperature of cooling base 50 to regulation.
The substrate board treatment of present embodiment is provided with the cooling unit for forcing cooling processed substrate 50.
To this, describe referring to figs. 1 through Fig. 3.Fig. 2 is the stereogram that is illustrated in the cooling unit in Fig. 1.Fig. 3 is the main position enlarged drawing that is illustrated in the cooling unit in Fig. 2.
As shown in the figure, in the left-hand face of body 110, be formed with multiple the first supported holes 115 in the mode lining up rows and columns, in right lateral surface, be formed with respectively multiple the second supported holes 117 to line up rows and columns with the opposed mode of the first supported hole 115.
Described cooling unit is arranged on the outside of body 110, by the refrigerating gases such as nitrogen are flowed into the inside of body 110 and cooling after the interior processed substrate 50 of chamber 111, is expelled to the outside of body 110.Described cooling unit comprises: import unit 160, supported by the left outer surface of body 110, import refrigerating gas to the inside of body 110; Deliverying unit 170, is supported by the right side outer surface of body 110, the inside that is directed into body 110 is expelled to the outside of body 110 with the refrigerating gas of cooling base 50.
Importing unit 160 comprises: ingress pipe 161, supported by the left outer surface of body 110, and enter for cooling gas flow; Exhaust nozzle 163, left end is communicated with ingress pipe 161, and right-hand member inserts the first supported hole 115 and is positioned at the inside of body 110, is expelled to the inside of body 110 from ingress pipe 161 receives refrigerating gas.
Now,, be communicated with and be provided with multiple exhaust nozzles 163 across interval along above-below direction on an ingress pipe 161 across being arranged at intervals with multiple ingress pipes 161 from the front side of body 110 to the direction of rear side.
The left outer surface of body 110 is combined with the first support 165, the first supports 165 supports the lower end of ingress pipe 161.Be specially, on the first support 165, be formed with through hole 165a, the lower end of ingress pipe 161 connects through hole 165a.And, on the outer peripheral face of the lower end of ingress pipe 161, be formed with the bonding pad 161a being combined on the first support 165.Because the first support 165 is combined on the left outer surface of body 110, and ingress pipe 161 is combined on the first support 165 by bonding pad 161a, and therefore, ingress pipe 161 is arranged on the left outer surface of body 110 securely.
Be combined with the first support component 167 that is formed with guiding in channel 167a in inside at the left outer surface of body 110.And the bottom of multiple ingress pipes 161 is supported by the first support component 167 respectively, and is communicated with respectively on guiding in channel 167a.
Because multiple ingress pipes 161 are interconnected by guiding in channel 167a, therefore, in the time that refrigerating gas is injected in the lower end to the first support component 167, refrigerating gas, by guiding in channel 167a, flows in each ingress pipe 161.Therefore, be convenient to inject refrigerating gas.In addition, the first support component 167 being bonded on body 110 due to ingress pipe 161 supports, and therefore ingress pipe 161 is set to more firm.
The left end of exhaust nozzle 163 is communicated with on ingress pipe 161, and right-hand member is inserted in the first supported hole 115.But if ingress pipe 161 is made up of rigid body completely, the tolerance during due to production and assembling, is difficult to exhaust nozzle 163 to be inserted in the first supported hole 115.In order to address this is that, on ingress pipe 161, be formed with pleated portions 161b.Thus, ingress pipe 161 can stretch or bending, has tolerance even if therefore import unit 160, also can easily exhaust nozzle 163 be inserted in the first supported hole 115.
Now, across interval, multiple discharge pipes 171 are set to the direction of rear side from the front side of body 110, on a discharge pipe 171, are communicated with multiple gas absorption sprays 173 are set across interval along above-below direction.
The right side outer surface of body 110 is combined with the second support 175, the second supports 175 supports the lower end of discharge pipe 171.At length say, on the second support 175, be formed with through hole 175a, the lower end of discharge pipe 171 connects through hole 175a.And, on the outer peripheral face of the lower end of discharge pipe 171, be formed with the bonding pad 171a being combined on the second support 175.Because the second support 175 is combined on the right side outer surface of body 110, and discharge pipe 171 is combined on the second support 175, and therefore, discharge pipe 171 is arranged on the right side outer surface of body 110 securely.
The right side outer surface of body 110 is combined with and is formed with second support component 177 of discharging runner 177a in inside.And the bottom of multiple discharge pipes 171 is supported by the second support component 177 respectively, and be communicated with respectively on discharge runner 177a.
Because multiple discharge pipes 171 are interconnected by discharging runner 177a, therefore, the refrigerating gas of discharging from multiple discharge pipes 171 is discharged from by the lower end of the second support component 177.Thus, be convenient to process the refrigerating gas of discharging.In addition, the second support component 177 being bonded on body 110 due to discharge pipe 171 supports, and therefore discharge pipe 171 is set up firmer.
The right-hand member of gas absorption spray 173 is communicated with on discharge pipe 171, and left end is inserted in the second supported hole 117.But if discharge pipe 171 is made up of rigid body completely, the tolerance during due to production and assembling, is difficult to gas absorption spray 173 to be inserted in the second supported hole 117.In order to address this is that, on discharge pipe 171, be formed with pleated portions 171b.Thus, discharge pipe 171 can stretch or bending, even if therefore deliverying unit 170 exists tolerance, also can easily gas absorption spray 173 be inserted in the second supported hole 117.
Because exhaust nozzle 163 and gas absorption spray 173 are positioned at the inside of the body 110 that keeps the condition of high temperature, be therefore likely subject to hot impact and damage.In order to prevent this phenomenon, exhaust nozzle 163 and gas absorption spray 173 are made up of quartz material respectively, and in addition, ingress pipe 161 and discharge pipe 171 are made up of metal material respectively.
But quartz and metal are difficult to mutually combine.Therefore, ingress pipe 161 and exhaust nozzle 163 are interconnected by the tube connector 169 being formed by synthetic resin, and discharge pipe 171 and gas absorption spray 173 are interconnected by the tube connector 179 being formed by synthetic resin.Now, be preferably, tube connector 169,179 is formed by the polytetrafluoroethylene (Polytetrafluoroethylene) of thermal endurance and chemical resistance excellence.
The refrigerating gas of discharging from exhaust nozzle 163 easily flow into body 110 inside.But the refrigerating gas that flow into body 110 inside is not easy to flow into the inside of gas absorption spray 173.Therefore the internal diameter that, is preferably gas absorption spray 173 is greater than the internal diameter of exhaust nozzle 163.
Between exhaust nozzle 163 and the first supported hole 115 and between gas absorption spray 173 and the second supported hole 117, certainly seal by seal member (not shown).
In the substrate board treatment the present invention relates to, support for the cooling unit of forcing cooling processed substrate 50 outer surface that is arranged on the body 110 that forms chamber 111.Therefore, can easily on body 110, cooling unit be set, easily maintenance.
The framework that unaccounted Reference numeral 140 represents for supporting body 110.
The accompanying drawing of above-mentioned embodiments of the invention has omitted detailed lines of outline, so that understand the part that belongs to technological thought of the present invention.And the above embodiments can not limit technological thought of the present invention, it is only used to understand the reference item that is included in the technology item in interest field of the present invention.
Claims (10)
1. a substrate board treatment, is characterized in that, comprising:
Body, is formed with the chamber as processing substrate space in inside,
Heater, is positioned at the inside of described body, for generation of the required heat of described processing substrate;
Cooling unit, is arranged on the outer surface of described body, imports for after the refrigerating gas of cooling treated described substrate to the inside of described body, is expelled to the outside of described body.
2. substrate board treatment according to claim 1, is characterized in that, described cooling unit comprises:
Import unit, supported by a side external surface of described body, import refrigerating gas to the inside of described body;
Deliverying unit, is supported by the opposite side outer surface of described body, the refrigerating gas of inside that is fed to described body is expelled to the outside of described body.
3. substrate board treatment according to claim 2, is characterized in that,
On a side surface of described body, be formed with multiple the first supported holes in the mode lining up rows and columns, insert in described multiple the first supported holes one end of described importing unit,
Be formed with multiple the second supported holes on the opposite side surface of described body, described multiple the second supported holes are opposed with described the first supported hole respectively, and one end of described deliverying unit is inserted in described the second supported hole.
4. substrate board treatment according to claim 3, is characterized in that,
Described importing unit comprises: ingress pipe, is supported by a side external surface of described body, for importing respectively refrigerating gas; Exhaust nozzle, one end is communicated with described ingress pipe, and the other end inserts the inside that is supported in described the first supported hole and is positioned at described body, and receive refrigerating gas and discharge refrigerating gas to the inside of described body from described ingress pipe,
Across being arranged at intervals with multiple described ingress pipes, on a described ingress pipe, be communicated with and be provided with multiple described exhaust nozzles,
Described deliverying unit comprises: discharge pipe, is supported by the opposite side outer surface of described body, for discharging refrigerating gas; Gas absorption spray, the inside that is supported in described the second supported hole and is positioned at described body is inserted in one end, and the other end is positioned at the outside of described body and is communicated with described discharge pipe, and suck and flow into the refrigerating gas of described body interior and be transported to described discharge pipe,
Across being arranged at intervals with multiple described discharge pipes, on a described discharge pipe, be communicated with and be provided with multiple described gas absorption sprays.
5. substrate board treatment according to claim 4, is characterized in that,
Described exhaust nozzle and described gas absorption spray are made up of quartz material respectively,
Described ingress pipe and described discharge pipe are made of metal respectively,
Between described exhaust nozzle and described ingress pipe and described gas absorption spray and described discharge pipe, be interconnected by the tube connector of synthetic resin material respectively.
6. substrate board treatment according to claim 5, is characterized in that,
Described tube connector is made up of polytetrafluoroethylene.
7. substrate board treatment according to claim 4, is characterized in that,
The internal diameter of described gas absorption spray is greater than the internal diameter of described exhaust nozzle.
8. substrate board treatment according to claim 4, is characterized in that,
On described ingress pipe and described discharge pipe, be formed with respectively pleated portions.
9. substrate board treatment according to claim 4, is characterized in that,
On a side external surface of described body and opposite side outer surface, be combined with respectively the first support and the second support,
On described the first support and described the second support, be formed with respectively through hole, described ingress pipe and described discharge pipe connect respectively described through hole,
On described ingress pipe and described discharge pipe, be formed with respectively bonding pad, described bonding pad is combined in respectively on described the first support and described the second support.
10. substrate board treatment according to claim 9, is characterized in that,
On one side external surface of described body and opposite side outer surface, be combined with respectively the first support component and the second support component, the inside of described the first support component and described the second support component is formed with respectively guiding in channel and discharges runner,
The end side of multiple described ingress pipes, respectively by described the first supporting units support, is communicated with described guiding in channel respectively simultaneously,
The end side of multiple described discharge pipes, respectively by described the second supporting units support, is communicated with described discharge runner respectively simultaneously.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2011-0091425 | 2011-09-08 | ||
| KR1020110091425A KR101275496B1 (en) | 2011-09-08 | 2011-09-08 | Apparatus for processing substrate |
| PCT/KR2012/007080 WO2013036018A2 (en) | 2011-09-08 | 2012-09-04 | Substrate processing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103782367A true CN103782367A (en) | 2014-05-07 |
| CN103782367B CN103782367B (en) | 2017-02-08 |
Family
ID=47832697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280043147.8A Active CN103782367B (en) | 2011-09-08 | 2012-09-04 | Substrate processing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101275496B1 (en) |
| CN (1) | CN103782367B (en) |
| TW (1) | TW201330050A (en) |
| WO (1) | WO2013036018A2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101512330B1 (en) * | 2013-06-11 | 2015-04-15 | 주식회사 테라세미콘 | Apparatus for processing substrate |
| KR102401742B1 (en) * | 2015-09-17 | 2022-05-25 | 주성엔지니어링(주) | Chamber cleaning apparatus capable of controlling temperature of activity gas line |
| KR102423268B1 (en) * | 2018-02-20 | 2022-07-21 | 주식회사 원익아이피에스 | Apparatus for processing substrate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050121432A1 (en) * | 2002-02-28 | 2005-06-09 | Takanori Saito | Heat treatment system |
| KR20060076851A (en) * | 2004-12-29 | 2006-07-05 | 주식회사 에이디피엔지니어링 | Plasma processing apparatus |
| JP2007165475A (en) * | 2005-12-12 | 2007-06-28 | Hitachi Kokusai Electric Inc | Substrate treatment equipment |
| CN102051596A (en) * | 2009-11-06 | 2011-05-11 | 三星移动显示器株式会社 | Heating unit and substrate processing apparatus having the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244095A (en) * | 1993-02-12 | 1994-09-02 | Dainippon Screen Mfg Co Ltd | Substrate cooling device |
| JP5015847B2 (en) * | 2008-04-07 | 2012-08-29 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, program, and recording medium |
-
2011
- 2011-09-08 KR KR1020110091425A patent/KR101275496B1/en active IP Right Grant
-
2012
- 2012-09-04 CN CN201280043147.8A patent/CN103782367B/en active Active
- 2012-09-04 WO PCT/KR2012/007080 patent/WO2013036018A2/en active Application Filing
- 2012-09-05 TW TW101132339A patent/TW201330050A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050121432A1 (en) * | 2002-02-28 | 2005-06-09 | Takanori Saito | Heat treatment system |
| KR20060076851A (en) * | 2004-12-29 | 2006-07-05 | 주식회사 에이디피엔지니어링 | Plasma processing apparatus |
| JP2007165475A (en) * | 2005-12-12 | 2007-06-28 | Hitachi Kokusai Electric Inc | Substrate treatment equipment |
| CN102051596A (en) * | 2009-11-06 | 2011-05-11 | 三星移动显示器株式会社 | Heating unit and substrate processing apparatus having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201330050A (en) | 2013-07-16 |
| WO2013036018A3 (en) | 2013-05-02 |
| KR20130027902A (en) | 2013-03-18 |
| WO2013036018A2 (en) | 2013-03-14 |
| KR101275496B1 (en) | 2013-06-17 |
| CN103782367B (en) | 2017-02-08 |
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