CN103733518B - 包括电容性传感器的电极配置的印刷电路板 - Google Patents

包括电容性传感器的电极配置的印刷电路板 Download PDF

Info

Publication number
CN103733518B
CN103733518B CN201280039513.2A CN201280039513A CN103733518B CN 103733518 B CN103733518 B CN 103733518B CN 201280039513 A CN201280039513 A CN 201280039513A CN 103733518 B CN103733518 B CN 103733518B
Authority
CN
China
Prior art keywords
electrode
circuit board
printed circuit
electrodes
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280039513.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN103733518A (zh
Inventor
史蒂芬·伯格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Neo Ron Co Ltd
Original Assignee
Microchip Technology Germany GmbH
Ident Technology AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microchip Technology Germany GmbH, Ident Technology AG filed Critical Microchip Technology Germany GmbH
Publication of CN103733518A publication Critical patent/CN103733518A/zh
Application granted granted Critical
Publication of CN103733518B publication Critical patent/CN103733518B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K17/962—Capacitive touch switches
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K2017/9602—Touch switches characterised by the type or shape of the sensing electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/960755—Constructional details of capacitive touch and proximity switches
    • H03K2217/960765—Details of shielding arrangements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/960755—Constructional details of capacitive touch and proximity switches
    • H03K2217/960775—Emitter-receiver or "fringe" type detection, i.e. one or more field emitting electrodes and corresponding one or more receiving electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN201280039513.2A 2011-06-24 2012-06-20 包括电容性传感器的电极配置的印刷电路板 Expired - Fee Related CN103733518B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102011078077A DE102011078077A1 (de) 2011-06-24 2011-06-24 Leiterplatte mit Elektrodenkonfiguration eines kapazitiven Sensors
DE1020110780777 2011-06-24
PCT/EP2012/061900 WO2012175580A2 (en) 2011-06-24 2012-06-20 Printed circuit board comprising an electrode configuration of an capacitive sensor

Publications (2)

Publication Number Publication Date
CN103733518A CN103733518A (zh) 2014-04-16
CN103733518B true CN103733518B (zh) 2017-11-17

Family

ID=46420125

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280039513.2A Expired - Fee Related CN103733518B (zh) 2011-06-24 2012-06-20 包括电容性传感器的电极配置的印刷电路板

Country Status (8)

Country Link
US (1) US9702902B2 (cg-RX-API-DMAC10.html)
EP (1) EP2724464B1 (cg-RX-API-DMAC10.html)
JP (1) JP6081996B2 (cg-RX-API-DMAC10.html)
KR (1) KR101911842B1 (cg-RX-API-DMAC10.html)
CN (1) CN103733518B (cg-RX-API-DMAC10.html)
DE (1) DE102011078077A1 (cg-RX-API-DMAC10.html)
TW (1) TWI556693B (cg-RX-API-DMAC10.html)
WO (1) WO2012175580A2 (cg-RX-API-DMAC10.html)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009057933B3 (de) * 2009-12-11 2011-02-24 Ident Technology Ag Sensoreinrichtung sowie Verfahren zur Annäherungs- und Berührungsdetektion
DE102009057935B4 (de) * 2009-12-11 2015-07-09 Ident Technology Ag Einrichtung und Verfahren zur Detektion eines Umgreifens eines Handgeräts durch eine Hand
DE102011078077A1 (de) 2011-06-24 2012-12-27 Ident Technology Ag Leiterplatte mit Elektrodenkonfiguration eines kapazitiven Sensors
DE102012109034A1 (de) * 2012-09-25 2014-03-27 Huf Hülsbeck & Fürst Gmbh & Co. Kg Kraftfahrzeugtürgriff mit Sensorelektronik
EP3176546B1 (en) 2014-07-30 2019-02-20 Hitachi Automotive Systems, Ltd. Physical-quantity detection device
DE102014014050B4 (de) * 2014-09-29 2017-08-03 gomtec GmbH Näherungssensoranordnung
US9810314B2 (en) 2015-02-25 2017-11-07 Kongsberg Driveline Systems I, Inc. Rotary shifter assembly
US10108292B2 (en) * 2015-04-22 2018-10-23 Microchip Technology Incorporated Capacitive sensor system with multiple transmit electrodes
DE102015017199B4 (de) 2015-05-21 2025-05-22 Audi Ag Bedienvorrichtung für ein Kraftfahrzeug und Kraftfahrzeug
DE102015006607B4 (de) 2015-05-21 2017-05-18 Audi Ag Bedienvorrichtung für ein Kraftfahrzeug
JP6511963B2 (ja) * 2015-05-28 2019-05-15 アイシン精機株式会社 静電センサ
WO2017085303A1 (de) 2015-11-19 2017-05-26 Saint-Gobain Glass France Alarmscheibenanordnung
KR101972720B1 (ko) * 2015-11-19 2019-08-16 쌩-고벵 글래스 프랑스 경보 창유리 장치
CN105649604B (zh) * 2015-12-30 2019-12-06 中国石油天然气集团公司 一种电极电路内置结构
US10089513B2 (en) * 2016-05-30 2018-10-02 Kyocera Corporation Wiring board for fingerprint sensor
KR20190037281A (ko) 2016-08-02 2019-04-05 쌩-고벵 글래스 프랑스 경보 판유리 조립체
BR112018072278A2 (pt) 2016-08-02 2019-02-12 Saint-Gobain Glass France montagem de painel de alarme
US10285275B2 (en) * 2017-05-25 2019-05-07 Tt Electronics Plc Sensor device having printed circuit board substrate with built-in media channel
EP3629478B1 (de) * 2018-09-26 2022-04-27 Huf Hülsbeck & Fürst GmbH & Co. KG Sensorvorrichtung zur detektion einer aktivierungshandlung bei einem fahrzeug
DE102019209430A1 (de) * 2019-06-28 2020-12-31 Robert Bosch Gmbh Sensoreinrichtung mit kapazitivem Sensor
JP2026048150A (ja) * 2024-09-05 2026-03-17 Smk株式会社 入力装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1847797A (zh) * 1999-04-19 2006-10-18 希克传感器有限公司 电容式位移编码器
US20090161325A1 (en) * 2007-12-20 2009-06-25 Verifone, Inc. Capacitive user-interface switches
CN101873126A (zh) * 2009-04-22 2010-10-27 胡夫·许尔斯贝克和福斯特有限及两合公司 汽车门把手内的传感器电子器件

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT393040B (de) * 1988-03-03 1991-07-25 Setec Messgeraete Gmbh Kapazitiver naeherungsgeber
DE4006119A1 (de) 1990-02-27 1991-08-29 Ines Gmbh Kapazitives wegaufnehmersystem
JP3625530B2 (ja) * 1995-06-12 2005-03-02 ヒューレット・パッカード・カンパニー 位置検出装置及び位置検出方法
US5801340A (en) 1995-06-29 1998-09-01 Invotronics Manufacturing Proximity sensor
US5726581A (en) 1996-03-08 1998-03-10 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration 3-D capaciflector
US5923101A (en) 1997-04-02 1999-07-13 Emerson Electric Company Non-contact key
DE19823190B4 (de) * 1998-04-09 2006-01-05 Siemens Ag Füllstandssensor mit Schwimmer
US6825752B2 (en) 2000-06-13 2004-11-30 Siemens Vdo Automotive Corporation Effortless entry system and method
US6724324B1 (en) 2000-08-21 2004-04-20 Delphi Technologies, Inc. Capacitive proximity sensor
JP4009953B2 (ja) 2003-05-14 2007-11-21 オムロン株式会社 物体検知センサ
DE20307931U1 (de) 2003-05-21 2004-09-23 Sie Sensorik Industrie-Elektronik Gmbh Sensorkopf für einen kapazitiven Annäherungssensor
DE102004023285B3 (de) 2004-05-11 2005-07-07 Metzeler Automotive Profile Systems Gmbh Vorrichtung zum Steuern und Überwachen eines bewegbaren Schliesselements, insbesondere einer motorisch angetriebenen Fensterscheibe, Heckklappe oder Schiebetür eines Kraftfahrzeugs
JP4356570B2 (ja) 2004-09-16 2009-11-04 沖電気工業株式会社 静電容量型距離センサ
TWI287421B (en) 2005-06-27 2007-09-21 Delta Electronics Inc Communication circuit module
DE202006009188U1 (de) 2006-06-12 2007-10-18 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Coburg Einklemmsensor
DE202007016734U1 (de) * 2007-11-30 2009-04-09 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt Einklemmsensor
DE102007058088A1 (de) * 2007-12-03 2009-06-04 Robert Bosch Gmbh Sensor zur tiefenselektiven Ortung dielektrischer Werkstoffe und Verfahren zum Betrieb eines derartigen Sensor
DE102008019178B4 (de) * 2008-04-17 2010-04-08 Preh Gmbh Sensoranordnung mit einem kapazitiven Regensensor und einem Lichtsensor
KR100985844B1 (ko) 2008-10-07 2010-10-08 주식회사 애트랩 근접 센서를 구비하는 휴대 장치
KR101248127B1 (ko) 2008-12-04 2013-04-01 가부시키가이샤후지쿠라 정전 용량 센서
JP5300640B2 (ja) * 2009-07-27 2013-09-25 株式会社ジャパンディスプレイウェスト 静電容量型入力装置および入力装置付き電気光学装置
DE102009057933B3 (de) 2009-12-11 2011-02-24 Ident Technology Ag Sensoreinrichtung sowie Verfahren zur Annäherungs- und Berührungsdetektion
TW201140411A (en) * 2010-01-13 2011-11-16 Alps Electric Co Ltd Capacitive proximity sensor device and electronic device using the same
JP5264800B2 (ja) * 2010-02-23 2013-08-14 パナソニック株式会社 タッチパネル装置
DE102010019841A1 (de) * 2010-05-07 2011-11-10 Ident Technology Ag Leiterplatte für Display und Anzeigemodul mit Display und Leiterplatte
KR101908492B1 (ko) * 2011-04-12 2018-10-17 엘지디스플레이 주식회사 터치 패널 일체형 표시 장치
DE102011075622B4 (de) * 2011-05-10 2023-03-02 Microchip Technology Germany Gmbh Sensor sowie Verfahren zur Detektion einer Anzahl von Objekten
DE102011078077A1 (de) 2011-06-24 2012-12-27 Ident Technology Ag Leiterplatte mit Elektrodenkonfiguration eines kapazitiven Sensors

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1847797A (zh) * 1999-04-19 2006-10-18 希克传感器有限公司 电容式位移编码器
US20090161325A1 (en) * 2007-12-20 2009-06-25 Verifone, Inc. Capacitive user-interface switches
CN101873126A (zh) * 2009-04-22 2010-10-27 胡夫·许尔斯贝克和福斯特有限及两合公司 汽车门把手内的传感器电子器件

Also Published As

Publication number Publication date
US20140139240A1 (en) 2014-05-22
US9702902B2 (en) 2017-07-11
JP2014520401A (ja) 2014-08-21
CN103733518A (zh) 2014-04-16
WO2012175580A2 (en) 2012-12-27
EP2724464B1 (en) 2016-09-14
KR101911842B1 (ko) 2018-10-25
JP6081996B2 (ja) 2017-02-15
WO2012175580A3 (en) 2013-02-21
EP2724464A2 (en) 2014-04-30
TWI556693B (zh) 2016-11-01
DE102011078077A1 (de) 2012-12-27
KR20140040815A (ko) 2014-04-03
TW201316855A (zh) 2013-04-16

Similar Documents

Publication Publication Date Title
CN103733518A (zh) 包括电容性传感器的电极配置的印刷电路板
US9442534B2 (en) Electrode device for a capacitive sensor device for position detection
EP2333648B1 (en) Position detecting device
JP6186081B2 (ja) 電磁気誘導方式の位置感知と静電容量方式の位置感知とを行うタブレット
CN102972100B (zh) 显示器的电路板及具有显示器及电路板的显示器模块
CN107735798B (zh) 一种指纹模组及移动终端
JP2014520401A5 (cg-RX-API-DMAC10.html)
US20150193080A1 (en) Touch pad with antenna
CN104656973A (zh) 坐标输入装置和移动终端
CN106325626B (zh) 触控显示装置及压力触控单元
US20100271049A1 (en) Sensor electronics in a vehicle door handle
JP6096421B2 (ja) タッチスイッチの入力装置
JP6147469B2 (ja) タッチセンサ
US7277817B2 (en) Position sensing device
JP6048641B2 (ja) 静電容量結合方式静電センサー
CN113994307B (zh) 位置检测装置
JP2012174034A (ja) パッド構造、これを備える入力装置及び電子機器

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20160811

Address after: German Ma Ning Ismail

Applicant after: Microchip technology Germany

Address before: Gil bloom

Applicant before: Ident Technology AG

GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20190415

Address after: Dublin, Ireland

Patentee after: Neo Ron Co., Ltd.

Address before: German Ma Ning Ismail

Patentee before: Microchip technology Germany

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20171117

Termination date: 20210620

CF01 Termination of patent right due to non-payment of annual fee