CN103681434A - Protective belt stripping method, protective belt stripping device and stripping belt for the protective strip stripping device - Google Patents
Protective belt stripping method, protective belt stripping device and stripping belt for the protective strip stripping device Download PDFInfo
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- CN103681434A CN103681434A CN201310385401.9A CN201310385401A CN103681434A CN 103681434 A CN103681434 A CN 103681434A CN 201310385401 A CN201310385401 A CN 201310385401A CN 103681434 A CN103681434 A CN 103681434A
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- band
- boundary belt
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- peeling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/68395—Separation by peeling using peeling wheel
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
The present invention provides a protective belt stripping method, a protective belt stripping device and a stripping belt for the protective strip stripping device. After a wafer with the protective belt is divided into chips, the chips which are held in an annular frame by means of an adhibiting belt are heated, thereby coiling the protective tape with the chip shape to a cylinder shape along a same axial direction, so that the protective tape is stripped from the chips. The stripping belt is pressed by an adhibiting roller and furthermore the stripping belt is at least adhibited to a chip distribution area at least. The stripping belt is provided with a bonding layer of which the bonding performance of the part adhibited to the chip distribution area is higher than that of the part which opposes the peripheral area of the wafer. Through stripping the stripping belt, the protective belt which is coiled to the cylinder and the stripping belt are integrally stripped and removed from the chip.
Description
Technical field
The present invention relates to a kind of to after keeping being pasted with the semiconductor crystal wafer of the state of the boundary belt that surface protection uses and having carried out cutting (ダ イ シ Application グ) and process, by peel off band paste on this boundary belt and peel off remove boundary belt stripping means, boundary belt stripping off device and this boundary belt stripping off device of this boundary belt used peel off band.
Background technology
For the semiconductor wafer by (hereinafter, appropriately referred to as "wafer") is formed into small pieces (chips) made of e.g. CMOS (Complementary, metal, oxide, semiconductor complementary metal oxide semiconductor) sensor such items are, in the hope until the chip to be installed on the substrate, can prevent dust from adhering to the chip, the chip contamination and damage the chip.Therefore, keep being pasted with under the state that just sticks on the boundary belt on crystal column surface before carrying out grinding back surface, wafer is carried out to cutting process.Then, by peeling off to be with to paste by cutting belt, paste on the boundary belt on the chip that is held in ring frame, peel off this boundary belt (with reference to No. 209073 communiques of TOHKEMY 2003 –).
In addition, be implemented as follows method: the boundary belt that is rolled into along the same axis tubular to keep being heated still sticks under the lip-deep state of this wafer, and wafer is carried out to cutting process.After having carried out cutting, the chip that is held in ring frame to pasting by cutting belt heats, and peels off boundary belt.Then, will peel off band pastes on boundary belt and peels off and remove this boundary belt (with reference to No. 129607 communiques of TOHKEMY 2010 –) from chip.
In the stripping means of boundary belt in the past, can produce problem as follows.
That is, will peel off band while pasting on boundary belt, make Sticking roller peel off with on from one end side direction other end side roll of ring frame.Owing to having downward power in this Sticking roller effect, so can produce roller, fall between ring frame and wafer, peel off the adhesive surface of band and the adhesive surface of cutting belt bonding and cannot peel off the such problem peel off band of removing.
Specifically, by heating, peel off band, make this peel off the chip that band is bonded in securely after cutting and peel off the boundary belt into tubular, in peel off the operation of removing this boundary belt on each chip, this peels off band need to have the stronger adhesiveness that can not come off.Owing to uploading the boundary belt that is equipped with tubular at chip, so the gap from this paste position to chip increases, can this peel off while being with in stickup, the adhesive surface that band is peeled off in inhibition contacts with chip.
But, sometimes because Sticking roller falls down or peel off belt sag during operation, and make the adhesive surface of cutting belt bonding with the adhesive surface of peeling off band.In this case, because two bonding planes are bonded together securely, so can not peel off removal boundary belt from chip.When under this state, band is peeled off in pulling forcibly, because bonding force is greater than drag force, so also can there is cutting belt fracture, or have excessive drag force and make chip distortion being clamped in effect on the chip of peeling off between band and cutting belt, then or make the problem of chip breakage.
In addition, when peeling off band and also contact with ring frame or bond on ring frame, want to peel off from this ring frame that to peel off band be very difficult, workability obviously declines.In addition, when peeling off in the situation of peeling off band from ring frame by force, may occur overexerting and make to peel off band and form new contacting with the part beyond ring frame, and then form and can not peel off the state that band is peeled off in removal.
Summary of the invention
The present invention makes in view of situation as described above; object is, provide a kind of can by the boundary belt that is divided into chip form by cutting process from chip peel off accurately boundary belt stripping means, boundary belt stripping off device and this boundary belt stripping off device of removal used peel off band.
So, the present invention adopts structure as follows, to reach object as described above.
That is, a kind of boundary belt stripping means, this boundary belt stripping means is the method that the semiconductor crystal wafer that is held in ring frame from the adhesive tape by supporting use peels off boundary belt,
Said method comprises following operation:
The 1st stripping process, semiconductor crystal wafer with above-mentioned boundary belt is being divided into after chip, to be held in this chip of ring frame by above-mentioned adhesive tape, heat, thereby make the boundary belt of chip form be rolled into along the same axis tubular, and the part of this boundary belt is peeled off from chip;
Paste operation, utilize stickup member to press and peel off band, this is peeled off to band and at least paste chip distribution region, this peels off the adhesive layer that adhesiveness that band has a part of pasting to this chip distribution region is stronger than the adhesiveness of the part of facing mutually with the outer regions of above-mentioned semiconductor crystal wafer;
The 2nd stripping process, by peeling off the above-mentioned band of peeling off, makes to be rolled into the boundary belt of tubular and this and peels off band and from chip, peel off removal integratedly.
Adopt the method, peel off the adhesive layer that adhesiveness that band has a part of pasting to chip distribution region is stronger than the adhesiveness of the part of facing mutually with the outer regions of semiconductor crystal wafer.In other words, to this outer regions, implemented to make viscosity lower than low adhesion process, non-adhesion process or the release processing of the viscosity with chip distribution region.Thereby, peel off band not can and the adhesive surface exposing between wafer and ring frame of adhesive tape (cutting belt) bonding.Even occur bonding, due to the bonding force of peeling off band a little less than, so also easily self-adhesion crossed belt peel off this and peel off band.In addition, even if it is bonding with ring frame to peel off band, also can easily peels off this and peel off band.
That is, can not occur because peeling off the mistake of peeling off that band and the close contact of adhesive tape produce.In addition, owing to can successfully peeling off and peel off band from ring frame, so also can improve operating efficiency.
In addition, in said method, also can by peeling off, be with the shape that is cut to band shape or ring frame in advance.
For example, peeling off band for banded in the situation that, preferably after having carried out the 2nd stripping process, the band of peeling off becoming one with boundary belt is being rolled to recovery.
Adopt the method, can not make to stick on peel off with on a plurality of boundary belts ground that is scattered, these boundary belts are packaged into tubular.
In addition, for example can utilize in the following manner the band of peeling off of ring frame shape.
This boundary belt stripping means also has cut-out operation, by peeling off band, is pasting and superimposed the peeling off with after on ring frame of above-mentioned ring frame, utilize to cut off member and be cut into this and peel off the shape with ring frame peeling off band,
In pasting operation, by sticking on the band of peeling off of peeling off with on ring frame, paste on boundary belt,
In the 2nd stripping process, along with the carrying out peeling off with the recovery of ring frame, make boundary belt and peel off band from chip, to peel off integratedly,
This boundary belt stripping means also has the 3rd stripping process, by peeling off band, together with boundary belt, from above-mentioned the peeling off with ring frame of reclaiming, peels off removal.
Or, in pasting operation, by be pasted with cut in advance peel off with the shape of ring frame peel off band this peel off with ring frame and be superimposed on above-mentioned ring frame, this peeled off to be with paste on boundary belt,
In the 2nd stripping process, along with the carrying out peeling off with the recovery of ring frame, make boundary belt and peel off band from chip, to peel off integratedly,
This boundary belt stripping means has the 3rd stripping process, peels off band and from above-mentioned the peeling off with ring frame being recovered to, peels off removal together with boundary belt.
Adopt the method, owing to making to peel off with ring frame, overlap on ring frame, so can form from the adhesive surface of the adhesive tape of supporting use to the gap of peeling off band.Thereby, can avoid reliably peeling off the bonding of band and adhesive tape.
In addition, in above-mentioned each method, preferably, in pasting operation, the direction of the clot of self-insurance protecting band is pasted and is peeled off band.
Adopt the method, boundary belt is heated and on chip, becomes tubular.That is to say, by pasting consistent with the clot direction of boundary belt to pressing of moving direction that member carries out, so peel off band, be easy to occur strain.Thereby; can suppress as direction that the clot direction of strain intersects moves and will peel off stress being with while pasting on boundary belt, that peel off obstinately boundary belt from being difficult for occurring with boundary belt making to paste member, thereby can avoid scuffing, the damage because boundary belt causes chip.
In addition, the present invention adopts structure as follows, to reach object as described above.
A boundary belt stripping off device, the semiconductor crystal wafer that this boundary belt stripping off device is held in ring frame from the adhesive tape by supporting use peels off boundary belt,
Said apparatus comprises following structure:
Keep platform, the semiconductor crystal wafer with above-mentioned boundary belt is being divided into after chip, this maintenance platform keeps be held in this chip and this ring frame of ring frame by above-mentioned adhesive tape;
Heater, it is for heating the chip on above-mentioned maintenance platform;
Band supply unit, it is for supply with the banded band of peeling off to ring frame and chip distribution region, and this peels off the adhesive layer that adhesiveness that band has a part of pasting to chip distribution region is stronger than the adhesiveness of the part of facing mutually with the outer regions of above-mentioned semiconductor crystal wafer;
Labelling machine, its make Sticking roller above-mentioned peel off with on roll and this is peeled off to band paste and peel off with ring frame and be subject to heater heating and be rolled into along the same axis tubular but part is also pasted on the boundary belt of chip;
Mechanism for stripping, its for from chip, peel off be pasted with above-mentioned boundary belt and with above-mentioned boundary belt integrated peel off band;
Band recoverer, it is rolled the band of peeling off after above-mentioned peeling off reclaim.
Adopt this structure; band shape peeled off to band while pasting on boundary belt; due to the adhesiveness of peeling off the part that band and outer regions semiconductor crystal wafer face mutually than the adhesiveness in chip distribution region a little less than; or peel off the part of facing mutually with outer regions semiconductor crystal wafer band and do not there is adhesiveness, so peel off the adhesive surface exposing of the adhesive tape of band and supporting use between semiconductor crystal wafer and ring frame, be difficult for bonding.Thereby, even if adhesive tape is with bondingly with peeling off, also can easily peels off and peel off band.
In addition, due to by with boundary belt become one peel off band roll recovery, so the boundary belt of the tubular of can packing.Thereby, can prevent that the boundary belt being stripped from is scattered.
In addition, the present invention adopts structure as follows, to reach object as described above.
That is, a kind of boundary belt stripping off device, the semiconductor crystal wafer that this boundary belt stripping off device is held in ring frame from the adhesive tape by supporting use peels off boundary belt, it is characterized in that,
Said apparatus comprises following structure:
Keep platform, the semiconductor crystal wafer with above-mentioned boundary belt is being divided into after chip, this maintenance platform is to being held in this chip, this ring frame of ring frame and keeping with superimposed the peeling off with ring frame of this ring frame by above-mentioned adhesive tape;
Heater, it is for heating the chip on above-mentioned maintenance platform;
Band supply unit, it is for supplying with the banded band of peeling off to peeling off with ring frame, and this peels off the adhesive layer that adhesiveness that band has a part of pasting to chip distribution region is stronger than the adhesiveness of the part of facing mutually with the outer regions of above-mentioned semiconductor crystal wafer;
Labelling machine, its make Sticking roller above-mentioned peel off with on roll and this is peeled off to band paste and peel off with ring frame and be subject to heater heating and be rolled into along the same axis tubular but part is also pasted on the boundary belt of chip;
Shut-off mechanism, it utilizes cut-out member to cut into the above-mentioned shape of peeling off with ring frame by peeling off band;
For reclaiming the above-mentioned band recoverer of peeling off band after cut-out;
Mechanism for stripping, its for make chip and above-mentioned peel off with on pasted peeling off with ring frame of boundary belt and carried out relatively lifting, thereby from chip, peel off boundary belt;
For reclaiming from above-mentioned peeling off with ring frame the band recoverer of peeling off band.
In addition, the present invention adopts structure as follows, to reach object as described above.
That is, a kind of boundary belt stripping off device, the semiconductor crystal wafer that this boundary belt stripping off device is held in ring frame from the adhesive tape by supporting use peels off boundary belt, it is characterized in that,
Said apparatus comprises following structure:
Keep platform, the semiconductor crystal wafer with above-mentioned boundary belt is being divided into after chip, this maintenance platform keeps be held in this chip and this ring frame of ring frame by above-mentioned adhesive tape;
Heater, it is for heating the chip on above-mentioned maintenance platform;
Conveying mechanism, it is for peeling off peeling off with ring frame of band and load the ring frame on above-mentioned maintenance platform being pasted with in advance, and this peels off the adhesive layer that adhesiveness that band has a part of pasting to chip distribution region is stronger than the adhesiveness of the part of facing mutually with the outer regions of above-mentioned semiconductor crystal wafer;
Labelling machine, its make Sticking roller above-mentioned peel off with on roll and this is peeled off to band paste and peel off with ring frame and be subject to heater heating and be rolled into along the same axis tubular but part is also pasted on the boundary belt of chip;
Mechanism for stripping, its for make chip and above-mentioned peel off with on pasted peeling off with ring frame of boundary belt and carried out relatively lifting, thereby from chip, peel off boundary belt;
Band recoverer, it reclaims and peels off band from above-mentioned peeling off with ring frame.
Adopt above-mentioned two structures, overlapping owing to making to peel off with ring frame and ring frame, will peel off to be with and paste this and peel off with on ring frame and paste on boundary belt, so can form the adhesive surface of adhesive tape from supporting use to the gap of peeling off band.Thereby, can avoid reliably adhesive tape and peel off the bonding of band.
Accompanying drawing explanation
For the present invention is described, illustrates and think at present preferred several form, but wish to be interpreted as that the present invention is not limited to structure and countermeasure as illustrated.
Fig. 1 is the stereogram of the installing rack after cutting process.
Fig. 2 is the cutaway view of boundary belt.
Fig. 3 means the stereogram of the boundary belt of peeling off from chip by heating.
Fig. 4 is the upward view of peeling off band.
Fig. 5 is the cutaway view of peeling off band and installing rack.
Fig. 6 is the vertical view of boundary belt stripping off device.
Fig. 7 is the front view of boundary belt stripping off device.
Fig. 8～Figure 11 means the schematic diagram of peeling off action of boundary belt.
Figure 12 means the schematic diagram of peeling off action of the boundary belt of variation.
Figure 13～Figure 19 means the schematic diagram of peeling off action of the boundary belt of variation.
Figure 20～Figure 21 means in advance the band of peeling off of variation is pasted to the schematic diagram of peeling off with the action on ring frame.
Figure 22～Figure 23 is the cutaway view of peeling off band of variation.
Embodiment
Below, with reference to the accompanying drawings of one embodiment of the invention.
boundary belt
Boundary belt is for protecting being formed on the lip-deep circuit face of semiconductor crystal wafer (being designated hereinafter simply as " wafer ").Thereby, before carrying out grinding back surface operation, boundary belt is sticked on crystal column surface.Then, from grinding back surface operation, till the processing of cutting action finishes, on the chip after wafer and cutting, be all pasted with boundary belt PT.That is, as shown in Figure 1, boundary belt PT is cut to the shape identical with chip 1 on installing rack MF.
In addition, for example as shown in Figure 2, boundary belt PT comprises at least along a direction of principal axis having inotropic shrinkage rete 2 and for retraining the restraint layer 3 of the contraction of this shrinkage rete 2.This boundary belt PT is configured to: this boundary belt PT is subject to the stimulation that becomes the factor of shrinkage because being heated etc., and this boundary belt PT can peel off from wafer on spontaneous ground.; boundary belt PT is being subject to becoming after the stimulation of the factor of shrinkage, this boundary belt PT from an end to a spontaneously clot of direction, or the spontaneously clot to center from contrary both ends; be formed with as shown in Figure 3 the clot body of 1 or 2 tubular, and peel off from chip 1.In addition, boundary belt PT is becoming the moment of clot body, and adhesiveness does not disappear completely, so the part of this boundary belt PT sticks on chip 1.
peel off band
Peel off and be with the boundary belt PT that becomes tubular for being pasted on after cutting action by heating on each chip 1 to peel off this boundary belt PT.
As shown in Figure 4 and Figure 5, peel off and with Ts, on base material 4, be formed with the different adhesive layer of bonding force 5,6.That is, as shown in Figure 4, base material 4 forms than the adhesive tape DT(cutting belt by supporting use) that wafer is bonded to ring frame f profile upper and the installing rack MF that forms is wide.This base material 4 can be individual sheet or band shape.In addition, in the situation that utilized the circular band of cutting in advance with adhesive layer 6, by base material 4 as carrier band.
The material of base material 4 is not particularly limited, and can use common material.Such as except the polyolefin substrates such as the polyester base materials such as PETG, PEN, polyethylene, polypropylene, can also use at least a kind of single or multiple lift base material that above material forms in these materials such as polyvinyl chloride base material, ethylene-vinyl acetate acrylate base material, polyimide base material, polyamide substrate, metal, paper.Particularly; the retractility of polyolefin substrate, polyvinyl chloride base material and ethylene-vinyl acetate acrylate base material is high; so in the situation that boundary belt is to play the state of volume from clot adhesive tape and because of heat treatment; when when stickup, this peels off band; this peels off the shape that band is easy to follow clot body; and then can further improve adhesiveness, from this starting point, preferably use said polyolefins base material, polyvinyl chloride base material and ethylene-vinyl acetate acrylate base material.
The material of adhesive layer 5 can adopt take the known adhesive that acrylic resin, natural rubber, synthetic rubber and organic silicon rubber be main component.
In addition, the size of preferred adhesive layer 6 is more than or equal to the size of wafer profile.That is, from chip 1, peeling off in the operation of boundary belt PT, boundary belt PT becomes tubular, and it peels off be then again adhered to chip 1 completely from chip 1 sometimes.When the time comes, boundary belt PT sometimes rolls a little and makes towards departing from original position with position, and again bonds on chip 1.When in the situation that there is this phenomenon near the periphery in chip distribution region 7, boundary belt PT exposes a little from this chip distribution region 7 sometimes.Thereby preferably adhesive layer 6 is compared large several millimeters with the wafer profile that is equivalent to chip distribution region.
Here, the bonding force of adhesive layer 6 is so long as enough bonding forces of the boundary belt PT of peelable removal tubular and adhesiveness or stickiness (タ ッ Network, viscosity).For example, in the situation that pasting on stainless steel (SUS304), in peel angle, be that 180 °, peeling rate are that 300mm/ divides, the bonding force under room temperature atmosphere condition is more than 2.5N/20mm.More than bonding force under above-mentioned condition is preferably 3.5N/20mm, more preferably more than 7.0N/20mm.
When bonding force is during lower than 2.5N/20mm, cannot keep the boundary belt PT peeling off from chip 1 and make to understand this boundary belt PT dropping.
Viscosity need to meet and can peel off bonding when being with Ts and keep boundary belt PT pasting to boundary belt PT.When utilizing probe measurement viscosity, viscosity is 250kN/m
2above, be preferably 300kN/m
2above, 350kN/m more preferably
2above.In viscosity lower than 250kN/m
2situation under, be difficult at moment bonding maintenance boundary belt PT.
In addition, according to this viscosity of following conditioned measurement.Preparation peels off that band Ts pastes on the glass slide of 75mm * 20mm and the structure obtaining by what have an adhesive layer identical with the present invention 6.In addition, for peeling off band Ts, prepare two-sided tape (No.5610 of Nitto Denko Corp's system) to paste on this glass slide, then will peel off that substrate surface with Ts pastes on this two-sided tape and the structure obtaining.
Evaluating apparatus is tack meter (rhesca of Co., Ltd. system, TAC – II).The condition of this evaluating apparatus and setting etc. are: the material of probe is SUS304, and the diameter of probe is 5mm, and probe press-in speed is that 30mm/ divides, and on probe, pulling rate degree is that 30mm/ divides, and adding compressive load is 100gf, and be 3 seconds pressing time, and measurement temperature is 23 ℃.
The maximum load of measurement when drawing the probe contacting with the surface of adhesive layer 6 on vertical under this condition, obtains the mean value of n=10, as probe tack value.
In addition, for bonding maintenance is reliably deformed into the boundary belt of tubular, wish that adhesive layer 6 is out of shape to follow the mode of the shape of boundary belt PT.Therefore,, in order to realize this distortion, make the value of thickness * Young's modulus of adhesive layer 65 * 10
-3n/m～3 * 10
3in the scope of N/m, preferably 1.5 * 10
-2n/m～2.3 * 10
3in the scope of N/m, more preferably 3 * 10
-2n/m～1.5 * 10
3in the scope of N/m.
In the value of the thickness * Young's modulus of adhesive layer 6 lower than 5 * 10
-3in the situation of N/m, the distortion of adhesive layer 6 becomes excessive, and adhesive layer 6 also contacts with the chip surface of the below of boundary belt PT, possibly cannot only reclaim boundary belt PT.
When the value of the thickness * Young's modulus of adhesive layer 6 is greater than 3 * 10
3during N/m, the distortion of adhesive layer 6 is insufficient, and adhesive layer 6 is low with the adaptation of boundary belt PT, can not peel off well and remove boundary belt PT.
The thickness of adhesive layer 6 is in the scope of 5 μ m～2000 μ m, preferably in the scope of 15 μ m～1500 μ m, more preferably in the scope of 30 μ m～1000 μ m.In addition, the Young's modulus of the adhesive of this adhesive layer 6 (under the atmosphere of 23 ℃, pull speed 50mm/ and divide) is in the scope of 0.001MPa～1.5MPa.
In addition, with following conditioned measurement Young's modulus.Take measurement mechanism as the Tan Xilun universal testing machine (orientec of Co., Ltd. system, RTC – 1150A), pulling speed is that 50mm/ divides, spacing jig from for 10mm, to measure temperature be under the condition of 23 ℃ of atmosphere, 6 of the adhesive layers of 50mm * 50mm are become to bar-shaped and have obtained sample.The condition that the sample chuck spacing of take is 10mm is installed, and the speed of dividing with 50mm/ pulls, thereby has obtained the relevant measured value of stress-distortion.When being deformed into 0.2% and 0.45% this two values, obtain stress, obtain Young's modulus.Same sample is carried out to 5 these measurements repeatedly, adopt its mean value.
boundary belt stripping off device
The boundary belt stripping off device of the present embodiment is carrying out after cutting process to being pasted with the wafer W of the state of above-mentioned boundary belt PT; above-mentioned peeling off with Ts pasted on the chip distribution region 7 distributing by the bonding a plurality of chips 1 that are held in ring frame f of adhesive tape DT that support use as illustrated in fig. 1, then peel off this and peel off band Ts.
Fig. 6 relates to an embodiment of this invention, means the integrally-built vertical view of boundary belt stripping off device, and Fig. 7 is the integrally-built front view of this boundary belt stripping off device.
Boundary belt stripping off device comprises maintenance platform 10, band supply unit 11, pastes unit 12, peels off unit 13, is with recoverer 14 and optical pickocff 15 etc.
Keep platform 10 to keep installing rack MF for adsorbing.In addition, keep platform 10 to be configured to can utilizing driving mechanism make this maintenances platform 10 along the guide rail 16 of laying in the mounting position of installing rack MF and peel off and come and go movement between the paste position with Ts.In addition, in keeping platform 10, be embedded with heater 17.In addition, heater 17 is equivalent to heater of the present invention.
That with supply unit 11, to stripper roll 19 guiding, from supply spool 18, emits continuously as shown in Figure 7, is with Ts with peeling off of release liners s.Stripper roll 19 rollings guide partitions s, peel off this release liners s and guide this release liners s to release liners recoverer 20 from peeling off band Ts.Thereby, with supply unit 11, be configured to the band Ts that peels off that has peeled off release liners s is directed to stickup unit 12.
Release liners recoverer 20 has for will certainly peeling off the rolled-up recovery spool 21 of the release liners s peeling off with Ts, by motor, this release liners recoverer 20 is rotated to drive and controls.
On stickup unit 12, Sticking roller 23 is installed, and can utilizes the actuators such as start cylinder to make this Sticking roller 23 with respect to movable frame 22 liftings, this movable frame 22 is installed on movable table.In addition, stickup unit 12 is supported to integral body and can moves horizontally along guide rail 24, and 26 pairs of these stickup unit 12 of lead screw shaft that utilization is carried out positive and negative rotation driving by motor 25 come and go leading screw feeding driving.In addition, paste unit 12 and be equivalent to labelling machine of the present invention.
Stripper roll 27 is installed peeling off on unit 13.In addition, this is peeled off unit 13 and is supported to integral body and can moves horizontally along guide rail 24, and utilize by motor 30 carry out positive and negative rotation driving 31 pairs of lead screw shaft this peel off unit 13 and come and go leading screw feeding driving.The downstream of peeling off unit 13 at this has outlet roller 28 and the pinch roll 29 being driven by a motor.In addition, peel off unit 13 and be equivalent to mechanism for stripping of the present invention.
With recoverer 14, by being pasted with the band Ts that peels off that is stripped from boundary belt PT that unit 13 peels off, twisting on spool 32 and reclaim.
Next, the action of a circulation of above-described embodiment device is described according to Fig. 7～Figure 11.
Utilize the conveying mechanism 33 shown in Fig. 6 that the installing rack MF carrying out after cutting process is loaded on the maintenance platform 10 that is positioned at mounting position.Absorption is keeping the maintenance platform 10 of installing rack MF to move to paste position.Now, as shown in Figure 7, paste unit 12 and peel off the initial position that unit 13 is positioned at left side.
When keeping platform 10 to arrive paste position, make heater 17 work, boundary belt PT is rolled into tubular and boundary belt PT is peeled off from chip 1.Now, at the position contacting with chip 1 at boundary belt PT center, this boundary belt PT part sticks on chip 1.
When the heat treated of utilizing heater 17 to carry out finishes, make start cylinder working and pinch roll 29 is declined, utilize this pinch roll 29 and outlet roller 28 to control and peel off band Ts.
Then, as shown in Figure 8, Sticking roller 23 declines, and pastes unit 12 movement of advancing.Along with moving of Sticking roller 23, press and peel off band Ts.Thereby it is upper that adhesive layer 5 is adhered to ring frame f, and be pasted on gradually chip distribution region 7.
As shown in Figure 9, when stickup unit 12 has arrived the end position that surpasses maintenance platform 10, peel off unit 13 and start working.That is to say, remove by 29 pairs of pinch rolls peel off with Ts, carry out control, make to peel off unit 13 integrated movings to the end position of overburden operation.Now, the part of the adhesive layer 5 a little less than ring frame f release adhesive easily.The part of the adhesive layer 6 that adhesiveness is strong and boundary belt PT close contact, so can continue to peel off this boundary belt PT from chip 1.
As shown in figure 10, when peeling off unit 13, arrived while exceeding the end position that keeps platform 10, band recoverer 14 will be peeled off band Ts and roll recovery, and carry supply unit 11 and emit continuously peeling off of specific length and be with Ts.Meanwhile, peel off unit 13 and turn back to as shown in figure 11 initial position with stickup unit 12.
In addition, keep platform 10 to move to mounting position from paste position.Then, take out of the installing rack MF that carries out overprotection band lift-off processing.
So far complete the action of a circulation of embodiment device, will repeatedly carry out identical action until reach regulation sheet number afterwards.
Adopt above-described embodiment device, the adhesiveness of peeling off the adhesive layer 5 of facing mutually with the region with 7 outsides, chip distribution region of Ts is than a little less than pasting the adhesiveness of adhesive layer 6 in chip distribution region 7.Even if peel off with the adhesive surface exposing between the outer circumferential chip distribution region 7 from chip distribution region 7 of Ts and adhesive tape DT and ring frame f, contact, also can not bond together securely.Thereby, can self-adhesion crossed belt DT easily peel off this and peel off band Ts.In addition, the part due to adhesive layer 5 also sticks on ring frame f, so also can easily peel off this adhesive layer 5 from this ring frame f.Thereby, neither can peel off mistake, can improve again the operating efficiency of lift-off processing.
In addition, the part due to the adhesive layer 5 a little less than adhesiveness sticks on ring frame f, so also can easily peel off this adhesive layer 5 from this ring frame f.
In addition, also can utilize execution mode as follows to implement the present invention.
(1) in above-described embodiment device, as shown in figure 12, for example also can by ring frame f identical with this ring frame f with shape peel off with ring frame 40 overlapping and paste and to peel off band Ts.That is, shown in Figure 13, to paste and to peel off band Ts across peeling off by the mode of ring frame 40 and boundary belt PT.When having completed gluing treatment, as shown in figure 14, certainly peel off with ring frame 40 and will peel off and be with Ts to peel off.Then, as shown in figure 15, make boundary belt PT and this peel off band Ts and from chip 1, peel off and the rolled-up band recoverer 14 that is recovered to integratedly.
In addition, as another execution mode, also can, after pasting boundary belt PT with Ts and use on ring frame 40 with overlapping the peeling off of ring frame f peeling off, on peeling off with ring frame 40, will peel off band Ts and cut into circle.Then, boundary belt PT is peeled off to recovery together with peeling off with ring frame 40.
In the situation that wanting to realize this stripping means, for example, can adopt the structure of mounting strap shut-off mechanism on above-described embodiment device.That is, as shown in figure 16, dispose can lifting above paste position band shut-off mechanism 45.
With shut-off mechanism 45, in the front end bottom of the arm from the supporting of movable table upper cantilever, by the supporting arm 46 radially extending, have knife unit 47, above-mentioned movable table can be along vertical frame lifting.Knife unit 47 is provided with cutter 48 that can dally, point of a knife dise knife down.
Thereby, the in the situation that of this variation device, peeling off after band Ts to have pasted across the mode in ring frame f and chip distribution region 7, knife unit 47 is dropped to can allow cutter 48 press to peel off the height cutting off with Ts.Under this state, as shown in figure 17, cutter 48 is circled round on peeling off with ring frame 40 and cut off peel off band Ts.
When completing the cut-out of peeling off with Ts, make knife unit 47 turn back to the position of readiness of top, make to peel off unit 13 work.Identical with above-mentioned variation, when peel off unit 13 arrive shown in Figure 18 exceed the end position that keeps platform 10 time, band recoverer 14 will be peeled off and be with Ts to roll recovery, and carry supply unit 11 and emit continuously peeling off of specific length and be with Ts.Meanwhile, peel off unit 13 and turn back to as shown in figure 19 initial position with stickup unit 12.
In addition, keep platform 10 to move to mounting position from paste position.In mounting position, when having taken out of overlapping with ring frame f and also having pasted the peeling off of state of peeling off with Ts and using after ring frame 40, taken out of the installing rack MF of boundary belt lift-off processing.
In addition, in other operations etc., from peeling off to peel off to remove to peel off with ring frame 40, be with Ts, then this peeled off with ring frame 40 and is recycled.
(2) as above-mentioned variation, utilizing peel off with ring frame 40 in the situation that, also can, pasting this with Ts and peel off with under the state on ring frame 40 peeling off in advance, make to peel off with ring frame 40 superimposed with ring frame f.For pasting and peel off the operation with Ts to peeling off with ring frame 40, can utilize other devices to paste banded peeling off band Ts and will peel off band Ts on this peels off with ring frame 40 and cut into circle.Or also can be with Ts to paste peeling off of the pre-cut type of circle peels off with on ring frame 40.
That is, as shown in Figure 20 and Figure 21, utilize edge member 50 that carrier band 4 is turned back, the band Ts that peels off being formed on prescribed distance on this carrier band is peeled off.Utilizing Sticking roller 51 to press this peels off and with the front end of Ts, this is peeled off to band Ts and paste and peel off with on ring frame 40.Then, synchronously make to keep platform to move with making to peel off the speed of peeling off from carrier band 4 with Ts, and gradually this is peeled off to band Ts and paste and peel off with on ring frame 40.
(3), in above-mentioned variation, peel off adhesive layer 6 with Ts and can be ultraviolet hardening or be heated foaming and intumescing and the adhesive that makes bonding force reduce or disappear.By utilizing this to peel off band Ts, can after peeling off boundary belt PT, adhesive layer 5 be heated or irradiation ultraviolet radiation, thereby the bonding force of adhesive layer 5 is disappeared, and easily peel off to remove from ring frame f, peel off band Ts.Thereby, can easily to peeling off with ring frame 40, carry out regeneration.
(4) part of peeling off with the adhesive layer 5 of Ts of the various embodiments described above also can not have adhesive.That is, as shown in figure 22, at the periphery of adhesive layer 6, keep the state of the back exposure of base material 1.
(5) as shown in figure 23, can be also the thin thickness with the part of the Thickness Ratio adhesive layer 6 of the part of the adhesive layer 5 of Ts of peeling off of the various embodiments described above.Adopt this structure, can to peeling off band Ts, be formed with gap from the adhesive surface of the adhesive tape DT in the outside in chip distribution region 7.Thereby, will peel off band Ts while pasting on boundary belt PT, can avoid more exactly adhesive tape DT and peel off bonding with Ts.
Thought of the present invention can not departed from or constitutionally is implemented the present invention with other embodiment, thereby the description that shows as protection range of the present invention is not above description, and should be with reference to appending claims.
Claims (10)
1. a boundary belt stripping means, this boundary belt stripping means is the method that the semiconductor crystal wafer that is held in ring frame from the adhesive tape by supporting use peels off boundary belt, it is characterized in that,
Said method comprises following operation:
The 1st stripping process, semiconductor crystal wafer with above-mentioned boundary belt is being divided into after chip, to be held in this chip of ring frame by above-mentioned adhesive tape, heat, thereby make the boundary belt of chip form be rolled into along the same axis tubular, and the part of this boundary belt is peeled off from chip;
Paste operation, utilize stickup member to press and peel off band, this is peeled off to band and at least paste chip distribution region, this peels off the adhesive layer that adhesiveness that band has a part of pasting to this chip distribution region is stronger than the adhesiveness of the part of facing mutually with the outer regions of above-mentioned semiconductor crystal wafer;
The 2nd stripping process, by peeling off the above-mentioned band of peeling off, makes to be rolled into the boundary belt of tubular and this and peels off band and from chip, peel off removal integratedly.
2. boundary belt stripping means according to claim 1, wherein,
The above-mentioned band of peeling off is banded,
After having carried out above-mentioned the 2nd stripping process, by with above-mentioned boundary belt become one peel off band roll and reclaim.
3. boundary belt stripping means according to claim 1, wherein,
This boundary belt stripping means also has cut-out operation, by peeling off band, is pasting and superimposed the peeling off with after on ring frame of above-mentioned ring frame, utilize to cut off member and be cut into this and peel off the shape with ring frame peeling off band,
In above-mentioned stickup operation, by sticking on the band of peeling off of peeling off with on ring frame, paste on boundary belt,
In above-mentioned the 2nd stripping process, along with above-mentioned the carrying out peeling off with the recovery of ring frame, make boundary belt and peel off band from chip, to peel off integratedly,
This boundary belt stripping means also has the 3rd stripping process, peels off band and from above-mentioned the peeling off with ring frame of reclaiming, peels off removal together with boundary belt.
4. boundary belt stripping means according to claim 1, wherein,
In above-mentioned stickup operation, by be pasted with cut in advance peel off with the shape of ring frame peel off band this peel off with ring frame and be superimposed on above-mentioned ring frame, this is peeled off to band and pastes on boundary belt,
In above-mentioned the 2nd stripping process, along with the carrying out peeling off with the recovery of ring frame, make boundary belt and peel off band from chip, to peel off integratedly,
This boundary belt stripping means has the 3rd stripping process, peels off band and from above-mentioned the peeling off with ring frame being recovered to, peels off removal together with boundary belt.
5. boundary belt stripping means according to claim 1, wherein,
In above-mentioned stickup operation, the clot direction of self-insurance protecting band is pasted and is peeled off band.
6. a boundary belt stripping off device, the semiconductor crystal wafer that this boundary belt stripping off device is held in ring frame from the adhesive tape by supporting use peels off boundary belt, it is characterized in that,
Said apparatus comprises following structure:
Keep platform, the semiconductor crystal wafer with above-mentioned boundary belt is being divided into after chip, this maintenance platform keeps be held in this chip and this ring frame of ring frame by above-mentioned adhesive tape;
Heater, it is for heating the chip on above-mentioned maintenance platform;
Band supply unit, it is for supply with the banded band of peeling off to ring frame and chip distribution region, and this peels off the adhesive layer that adhesiveness that band has a part of pasting to chip distribution region is stronger than the adhesiveness of the part of facing mutually with the outer regions of above-mentioned semiconductor crystal wafer;
Labelling machine, its make Sticking roller above-mentioned peel off with on roll and this is peeled off to band paste and peel off with ring frame and be subject to heater heating and be rolled into along the same axis tubular but part is also pasted on the boundary belt of chip;
Mechanism for stripping, its for from chip, peel off be pasted with above-mentioned boundary belt and with above-mentioned boundary belt integrated peel off band;
Band recoverer, it is rolled the band of peeling off after above-mentioned peeling off reclaim.
7. a boundary belt stripping off device, the semiconductor crystal wafer that this boundary belt stripping off device is held in ring frame from the adhesive tape by supporting use peels off boundary belt, it is characterized in that,
Said apparatus comprises following structure:
Keep platform, the semiconductor crystal wafer with above-mentioned boundary belt is being divided into after chip, this maintenance platform is to being held in this chip, this ring frame of ring frame and keeping with superimposed the peeling off with ring frame of this ring frame by above-mentioned adhesive tape;
Heater, it is for heating the chip on above-mentioned maintenance platform;
Band supply unit, it is for supplying with the banded band of peeling off to peeling off with ring frame, and this peels off the adhesive layer that adhesiveness that band has a part of pasting to chip distribution region is stronger than the adhesiveness of the part of facing mutually with the outer regions of above-mentioned semiconductor crystal wafer;
Labelling machine, its make Sticking roller above-mentioned peel off with on roll and this is peeled off to band paste and peel off with ring frame and be subject to heater heating and be rolled into along the same axis tubular but part is also pasted on the boundary belt of chip;
Shut-off mechanism, it utilizes cut-out member to cut into the above-mentioned shape of peeling off with ring frame by peeling off band;
For reclaiming the above-mentioned band recoverer of peeling off band after cut-out;
Mechanism for stripping, its for make chip and above-mentioned peel off with on pasted peeling off with ring frame of boundary belt and carried out relatively lifting, thereby from chip, peel off boundary belt;
For reclaiming from above-mentioned peeling off with ring frame the band recoverer of peeling off band.
8. a boundary belt stripping off device, the semiconductor crystal wafer that this boundary belt stripping off device is held in ring frame from the adhesive tape by supporting use peels off boundary belt, it is characterized in that,
Said apparatus comprises following structure:
Keep platform, the semiconductor crystal wafer with above-mentioned boundary belt is being divided into after chip, this maintenance platform keeps be held in this chip and this ring frame of ring frame by above-mentioned adhesive tape;
Heater, it is for heating the chip on above-mentioned maintenance platform;
Conveying mechanism, it is for peeling off peeling off with ring frame of band and load the ring frame on above-mentioned maintenance platform being pasted with in advance, and this peels off the adhesive layer that adhesiveness that band has a part of pasting to chip distribution region is stronger than the adhesiveness of the part of facing mutually with the outer regions of above-mentioned semiconductor crystal wafer;
Labelling machine, its make Sticking roller above-mentioned peel off with on roll and this is peeled off to band paste and peel off with ring frame and be subject to heater heating and be rolled into along the same axis tubular but part is also pasted on the boundary belt of chip;
Mechanism for stripping, its for make chip and above-mentioned peel off with on pasted peeling off with ring frame of boundary belt and carried out relatively lifting, thereby from chip, peel off boundary belt;
Band recoverer, it reclaims and peels off band from above-mentioned peeling off with ring frame.
9. peel off a band, in the boundary belt stripping means in claim 1～5 described in any one, use this to peel off band, it is characterized in that,
This shape of peeling off band is larger than the shape of above-mentioned semiconductor crystal wafer, and this peels off the adhesive layer that adhesiveness that band has a part of pasting to chip distribution region is stronger than the adhesiveness of the part of facing mutually with the outer regions of this semiconductor crystal wafer.
10. the band of peeling off according to claim 9, wherein,
The thickness of adhesive layer that this is peeled off to the part of pasting to chip distribution region of band forms thicklyer than the part of facing mutually with the outer regions of above-mentioned semiconductor crystal wafer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-188883 | 2012-08-29 | ||
| JP2012188883A JP2014049485A (en) | 2012-08-29 | 2012-08-29 | Protective tape exfoliation method, protective tape exfoliation device, and exfoliation tape used for protective tape exfoliation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103681434A true CN103681434A (en) | 2014-03-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310385401.9A Pending CN103681434A (en) | 2012-08-29 | 2013-08-29 | Protective belt stripping method, protective belt stripping device and stripping belt for the protective strip stripping device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2014049485A (en) |
| KR (1) | KR20140029229A (en) |
| CN (1) | CN103681434A (en) |
| TW (1) | TW201417158A (en) |
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|---|---|---|---|---|
| KR102440739B1 (en) * | 2020-05-25 | 2022-09-07 | (주) 엔지온 | An apparatus for manufacturing semiconductor with a chip-level delamination of protection film |
| KR102440741B1 (en) * | 2020-05-25 | 2022-09-07 | (주) 엔지온 | Method for controlling an apparatus for manufacturing semiconductor with a chip-level delamination of protection film |
| CN115380368A (en) * | 2020-05-25 | 2022-11-22 | 恩基恩株式会社 | Semiconductor chip layering device and control method thereof |
| KR102456864B1 (en) * | 2020-08-18 | 2022-10-21 | (주) 엔지온 | An apparatus for manufacturing semiconductor with a chip-level delamination of protection film |
| TWI810862B (en) * | 2022-03-24 | 2023-08-01 | 南茂科技股份有限公司 | Workpiece carrier |
-
2012
- 2012-08-29 JP JP2012188883A patent/JP2014049485A/en active Pending
-
2013
- 2013-08-16 TW TW102129539A patent/TW201417158A/en unknown
- 2013-08-26 KR KR1020130100902A patent/KR20140029229A/en not_active Application Discontinuation
- 2013-08-29 CN CN201310385401.9A patent/CN103681434A/en active Pending
Also Published As
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| TW201417158A (en) | 2014-05-01 |
| KR20140029229A (en) | 2014-03-10 |
| JP2014049485A (en) | 2014-03-17 |
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Application publication date: 20140326 |