JP6180742B2 - Tape sticking method and tape sticking device - Google Patents

Description

  The present invention relates to a method for adhering an adhesive tape to a plate-shaped workpiece and a tape adhering apparatus that enables the implementation of this method.

  A plate-like workpiece such as a semiconductor device wafer having a grid-like cutting line formed on its surface is divided into individual chips by cutting along the cutting line using a cutting device. Used in electrical equipment.

  As a cutting device for cutting a plate-like workpiece, there are a dicing device and a laser device provided with a blade. When a plate work is divided into individual chips using a dicing machine or laser device, the cutting width of the blade passing through the cutting line is narrowed to increase the area that can be used as a device, and power consumption In order to suppress this, it is required to thin the chip.

  In addition, when the plate-like workpiece is divided into individual chips, a dicing device is used to prevent chipping between the surface of the plate-like workpiece cut along the cutting line and the grinding surface (back surface) of the plate-like workpiece. Then, after forming a cutting groove by cutting the blade from one side (front surface) side of the plate-like workpiece to about half the thickness of the plate-like workpiece, grinding is performed from the other surface (back side) of the plate-like workpiece. The plate-like workpiece is divided into individual chips by thinning and exposing the cutting grooves from the back side. When a plate work is divided into individual chips using a laser device, the laser beam is focused inside the plate work to form a cutting line, and then thinned by grinding from the back side of the wafer. The plate workpiece is divided into individual chips.

  Further, when the plate-like work is divided into individual chips, the plate-like work is arranged in an open area at the center of the annular frame in order to prevent the chips from falling apart. An adhesive tape is attached to each other (for example, see Patent Document 1 and Patent Document 2 below).

JP 2011-236024 A JP 2002-334852 A

  As described above, after being divided into individual chips by grinding the back surface of the plate-like workpiece, the front and back sides of the plate-like workpiece are reversed to pick up the individual chips in the next step. Need to face up. At this time, there is a case where adjacent chips are in contact with each other because there is not a sufficient space between the plurality of individually divided chips. In particular, when a plate-like workpiece is divided into individual chips after laser beam irradiation, there is a problem that the chips are in contact with each other and damaged because the distance between adjacent chips is extremely narrow. Therefore, it is necessary for the annular frame to support the plate-shaped workpiece with the adjacent chips separated from each other.

  The present invention has been made in view of the above circumstances, and supports the plate-like workpiece on the frame while separating the individual chips divided along the cutting line so that adjacent chips do not come into contact with each other. In particular, there is a problem to be solved by the present invention.

In the present invention, a plurality of chips are attached to the protective tape by attaching a protective tape to one surface of the plate-like workpiece and cutting along a cutting line formed on the other surface side of the plate-like workpiece. The first work set is configured and arranged in an annular shape and has an opening area on the inner peripheral side, and the first work set is disposed with the protective tape side down in the opening area. And an adhesive tape adhering step for forming a second work set by adhering an adhesive tape to the upper surface of the first work set, and after the adhesive tape adhering step, the protective tape is attached to the plate-like workpiece. A protective tape peeling step for forming a third work set by peeling from one surface, wherein the pressure-sensitive adhesive tape used in the pressure-sensitive adhesive tape sticking step is heat-shrinkable. Has, after the adhesive tape attaching step, before the protective tape peeling step, the chip spaced that is heat shrink pressure sensitive adhesive tape by heat applied to the adhesive tape in the opening area increase the distance between the tip Perform the process.

  In the chip separation step, it is desirable to apply heat only to the area between the inner periphery of the annular frame and the outer periphery of the plate-like workpiece.

  Furthermore, the present invention provides a support table that supports the annular frame and supports a plate-like workpiece at the same height as the annular frame in the opening area, a plate-like workpiece supported by the support table, and the annular frame. Adhesive tape adhering means for forming the second work set in which a plate-like work is adhered to the adhesive tape in the opening area inside the annular frame by adhering the adhesive tape, and the adhesive tape It is the tape sticking apparatus comprised including the heat provision means to give heat, and enables said tape sticking method.

  In the tape adhering method according to the present invention, by carrying out the adhesive tape adhering step, the first work set composed of the plate-like work and the protective tape is arranged in the opening area of the annular frame with the protective tape side facing down. Then, an adhesive tape having heat shrinkability is attached to the annular frame and the first work set to form a second work set, and then a chip separation step is performed to form the second work set. Since the pressure-sensitive adhesive tape is thermally shrunk by applying heat to the surface, the distance between the chips can be widened and the adjacent chips can be separated. Therefore, in order to peel the protective tape from the plate-shaped workpiece in the next protective tape peeling step, even if the front and back of the second work set are reversed, adjacent chips do not come into contact with each other and are not damaged.

  In the chip separation step, heat is applied only to the area between the inner periphery of the annular frame and the outer periphery of the plate-like workpiece, and therefore the portion of the adhesive tape where the annular frame and the plate-like workpiece are not attached The portion where the plate-like workpiece is adhered is pulled by the contraction of the substrate, and the interval between the chips is widened so that adjacent chips can be reliably separated.

  Furthermore, the tape sticking apparatus according to the present invention includes a support table that supports the annular frame and supports the plate-like workpiece at the same height as the annular frame, a plate-like workpiece supported by the support table, and the annular frame. A chip separation step is performed because the tape adhering method is configured to include the adhering tape adhering means for adhering the adhesive tape to form a work set and the heat applying means for applying heat to the adhesive tape. In addition, since the adhesive tape is thermally contracted by applying heat to the adhesive tape, the distance between the chips is widened so that adjacent chips can be separated. Therefore, it is possible to prevent adjacent chips from coming into contact with each other when the work set is reversed in order to perform the post-holding tape peeling step after the chip separation step.

It is a top view which shows the structure of a tape sticking apparatus. It is sectional drawing which shows the structure of a support table and an adhesive tape sticking means. It is sectional drawing which shows the structure of the 1st example of a heat provision means. It is sectional drawing which shows the structure of the 2nd example of a heat provision means. It is sectional drawing which shows an adhesive tape sticking process. It is sectional drawing which shows a chip separation process. It is sectional drawing which shows a protective tape peeling process.

  A tape sticking device 10 shown in FIG. 1 has a device base 10a extending in the Y-axis direction, and is processed together with a frame 2 formed in an annular shape and having an opening area A1 on the inner peripheral side at the center of the device base 10a. A first support table 40 for supporting an object and a second support table 60 for supporting a workpiece together with the frame 2 are disposed. A load cassette 11 that accommodates the workpiece and an unload cassette 12 that accommodates the workpiece together with the frame 2 are disposed at the front in the Y-axis direction of the apparatus base 10a.

  Between the load cassette 11 and the first support table 40, a loading robot 20 that takes out the workpiece from the load cassette 11 and loads the workpiece onto the first support table 40 is disposed. The carry-in robot 20 includes a hand 21 that holds a workpiece, a rotating unit 22 that rotates the hand 21, and an arm unit 23 that moves the hand 21 to a desired position.

  In the vicinity of the first support table 40 and the second support table 60, a transfer robot 30 for transferring the workpiece supported together with the frame 2 on the first support table 40 to the second support table 60 is disposed. Has been. The transfer robot 30 has a plurality of suction portions 31 that suck the frame 2, a rotation portion 32 that rotates the suction portion 31 about a horizontal rotation axis, and a suction portion 31 that is centered on a fulcrum shaft 34. And an arm portion 33 that is moved to the position.

  A pair of guide portions 14 are connected to the unload cassette 12. An unload unit 13 that pulls the frame 2 along the pair of guide portions 14 in the Y-axis direction and loads the workpiece into the unload cassette 12 together with the frame 2 is disposed in front of the unload cassette 12. .

  As shown in FIG. 2, the first support table 40 includes a workpiece suction portion 41 that sucks and holds a plate-like workpiece W that is a workpiece, a frame suction portion 42 that sucks and holds the frame 2, and a workpiece suction portion 41. And a suction source 43 communicating with the frame suction part 42 and supported by the moving base 44 from below. When the suction source 43 is operated, the first support table 40 can support the frame 2 at the frame suction portion 42 and can support the workpiece at the same height as the frame 2 at the workpiece suction portion 41.

  As shown in FIGS. 1 and 2, the apparatus base 10a is provided with first moving means 15 for moving the first support table 40 in the Y-axis direction. The first moving means 15 includes a ball screw 15a extending in the Y-axis direction, a pair of guide rails 15b extending in parallel with the ball screw 15a, and a motor 15c connected to one end of the ball screw 15a. One surface of the moving base 44 shown in FIG. 2 is in sliding contact with the pair of guide rails 15 b, and a ball screw 15 c is screwed into a female screw formed at the center of the moving base 44. The first support table 40 can be moved horizontally in the Y-axis direction by being driven by the motor 15c and rotating the ball screw 15a. In addition, illustration of the guide rail 15b is abbreviate | omitted in FIG.

  On the movement path (Y-axis direction) of the first support table 40, the adhesive tape 4 is attached to the work piece supported by the first support table 40 and the frame 2, so that the inner side of the frame 2 An adhesive tape adhering means 50 for adhering a workpiece to the adhesive tape 4 in the opening area A1 is disposed. The adhesive tape attaching means 50 includes a first roll part 51 in which the adhesive tape 4 to which the tape protective sheet 5 is attached is wound in a roll shape, and a second roll part 52 in which the tape protective sheet 5 is wound in a roll shape. A feed roller 53a and a feed roller 53b for feeding the adhesive tape 4 with the tape protective sheet 5 attached downward from the first roll portion 51, and a pressure roller for attaching the adhesive tape 4 to the workpiece while pressing the adhesive tape 4 54, a peeling roller 55 for peeling the tape protection sheet 5 from the adhesive tape 4, and a drawing roller 56 for drawing the tape protection sheet 5 into the second roll portion 52.

  The second support table 60 shown in FIG. 3 communicates with the workpiece suction portion 61 that sucks and holds the workpiece, the frame suction portion 62 that sucks and holds the frame 2, and the workpiece suction portion 61 and the frame suction portion 62. A suction source 64 and supported from below by a moving base 63. The apparatus base 10a shown in FIG. 1 is provided with second moving means 16 for moving the second support table 60 in the Y-axis direction. The second moving means 16 has the same configuration as the first moving means 15, and includes a ball screw 16a extending in the Y-axis direction, a pair of guide rails 16b extending parallel to the ball screw 16a, and one end of the ball screw 16a. Connected motor 16c. The second support table 60 can be moved horizontally in the Y-axis direction by driving the motor 16c and rotating the ball screw 16a.

  As shown in FIG. 3, heat application means 70 for applying heat to the adhesive tape 4 shown in FIG. 2 is disposed inside the second support table 60. The heat applying means 70 includes a ring-shaped heater 71, a power source 72 connected to the heater 71, and a control unit 73 that controls switching of the power source 72 between on and off. When the power source 72 is switched from OFF to ON by the control unit 73, the heater 71 in the second support table 60 is heated to a predetermined temperature, and heat can be applied upward.

  The means for applying heat is not limited to the heat applying means 70. For example, as shown in FIG. 4, a heat applying unit 80 having a configuration substantially similar to the heat applying unit 70 may be disposed inside the transfer robot 30. In other words, the heat application unit 80 includes a ring-shaped heater 81, a power source 82 connected to the heater 81, and a control unit 83 that controls switching of the power source 82 between on and off. Then, when the suction unit 31 suctions and holds the frame 2 shown in FIG. 2 by the operation of the suction source 35 connected to the suction unit 31, when the power source 82 is switched from OFF to ON by the control unit 83, the transfer robot 30. The heater 81 inside is heated at a predetermined temperature, and heat can be applied downward.

  A protective tape peeling means 90 is disposed on the movement path (Y-axis direction) of the second support table 60. The protective tape peeling means 90 has the peeling part 91, and can peel the protective tape stuck to one surface of the workpiece.

  Below, the operation example of the tape sticking apparatus 10 is demonstrated. The plate-like workpiece W shown in FIG. 2 is an example of a workpiece and is not particularly limited. The plate-like workpiece W is preliminarily cut into a plurality of chips C along a cutting line formed on the plate-like workpiece W while the protective tape 3 is adhered to one surface. A space S having a slight width is formed. The plate-like workpiece W in a state of being cut into a plurality of chips C with the protective tape 3 attached is used as the first workpiece set 1, and the first workpiece set 1 is added to the load cassette 11 shown in FIG. Are housed. Then, the carry-in means 20 takes out the first work set 1 from the load cassette 11 and carries it into the first support table 40. The frame 2 is placed on the first support table 40 in advance. The protective tape 3 is not specifically limited, For example, a dicing tape can be used.

(1) Adhesive tape sticking step As shown in FIG. 5A, the carry-in robot 20 places the frame 2 on the first support table 40 with the protective tape 3 side constituting the first work set 1 facing down. It arrange | positions in opening area A1. After that, the work suction unit 41 sucks the protective tape 3 side by the operation of the suction source 43, and supports the first work set 1 on the first support table 40 by sucking the frame 2 in the frame suction unit 42. .

  The first moving means 15 moves the first support table 40 in the Y1 direction, for example, by rotating the ball screw 15a, and moves it below the adhesive tape adhering means 50 shown in FIG. Next, when the adhesive tape adhering means 50 is operated, the feed roller 53a and the feed roller 53b are rotated, and the adhesive tape 4 to which the tape protection sheet 5 is adhered from the first roll portion 51 is moved downward. Send out downward. At this time, the pulling roller 56 rotates to pull the tape protection sheet 5 on the peeling roller 55 and peel the tape protection sheet 5 from the adhesive tape 4.

  As shown in FIG. 5 (b), the first moving means 15 moves the first support table 40 in the Y2 direction, for example, while pressing the pressure-sensitive adhesive tape 4 fed downward by the pressing roller 54, the frame 2. The second work set 7 shown in FIG. 5C is formed by sticking the adhesive tape 4 on the upper surfaces of the first work set 1 and the first work set 1. The adhesive tape 4 has heat shrinkability, and for example, a tape manufactured by Nitto Denko (EM-760, D-174A) or a tape manufactured by Lintec (LE4003) can be used.

(2) Chip Separation Step After performing the adhesive tape sticking step, the second work set 7 is transferred to the second support table 60 by the transfer robot 30 as shown in FIG. Next, the operation of the suction source 64 sucks the frame 2 in the frame suction part 62 and sucks the protective tape 3 side in the work suction part 61, thereby bringing the second work set 7 in the second support table 60. To support. At this time, a limited area A2 that is an annular space is formed between the inner periphery 2a of the frame 2 and the outer periphery 1a of the plate-like workpiece W. Thereby, one surface of the adhesive tape 4 is positioned above the heater 71 through the limited area A2.

  Next, the heat applying means 70 switches the power source 72 from OFF to ON under the control of the control unit 73, and the heater 71 heats the second work set 7 by limiting to the limited area A2 at a predetermined temperature. Heat is applied to a portion of the pressure-sensitive adhesive tape 4 to which the frame 2 and the plate-like workpiece W are not attached.

  When heat is applied to the pressure-sensitive adhesive tape 4, the heated portion expands in the radial direction due to thermal contraction, and the plate-like workpiece W adhered to the pressure-sensitive adhesive tape 4 is also stretched in the same direction. The interval S between the plurality of adjacent chips C increases. As a result, as shown in FIG. 6B, a plurality of adjacent chips C are separated from each other, and a gap 9 is formed. At this time, since the protective tape 3 is stuck on the plate-like workpiece W on the surface opposite to the surface on which the adhesive tape 4 is stuck, the positions of the plurality of chips C do not shift.

  When the heat applying unit 80 having the configuration shown in FIG. 4 is used in the chip separation step, the second work set 7 is attached to the second support table 60 by the conveyance robot 30 by adsorbing the frame 2 at the adsorption unit 31. In the process of transporting, the portion of the adhesive tape 4 where the frame 2 and the plate-like workpiece W are not attached can be heated.

(3) Protection tape peeling process After implementing a chip | tip separation | spacing process, the protection tape 3 is peeled from the plate-shaped workpiece W, as shown in FIG. First, the transport robot 30 shown in FIG. 7A reverses the front and back of the second work set 7 so that the adhesive tape 4 side faces downward and the protective tape 3 side adhered to the plate-like workpiece W faces upward. In this manner, the second work set 7 is arranged on the second support table 60. At this time, since the chip interval is widened in the chip separation step, adjacent chips do not contact each other.

  As shown in FIG. 7B, the second work set 7 is peeled off while the second support table 60 is moved in, for example, the Y1 direction by the rotation of the ball screw 16a in the second moving means 16. It is moved below the means 90. The protective tape peeling means 90 sticks the peeling tape 6 clamped by the peeling part 91 to the peripheral part of the protective tape 3, and raises the peeling part 91, moving the 2nd support table 60 to Y1 direction. Then, as shown in FIG. 7C, the protective tape 3 can be completely peeled from the plate-like workpiece W. In this way, the third work set 8 configured to be supported by the frame 2 in a state where the individual chips C are separated by the gap 9 is formed. The third work set 8 is pulled to the front side in the Y-axis direction by the unload unit 13 shown in FIG. Thereafter, the individual chips C are picked up in the next step.

  As described above, the tape adhering device 10 includes the first support table 40 that supports the first work set 1 and the frame 2 including the plate-like work W and the protective tape 3, and the first support table 40. An adhesive tape adhering means 50 for adhering the adhesive tape 4 to the frame 2 and the first work set 1 that are supported on the base material to form a second work set 7; and a heat applying means 7 for applying heat to the adhesive tape 4 Therefore, the pressure-sensitive adhesive tape 4 is thermally contracted by performing a chip separation step after the pressure-sensitive adhesive tape attaching step and applying heat to the pressure-sensitive adhesive tape 4 constituting the second work set 7. The gap S between the chips C is widened to form the gap 9, and the adjacent chips C can be separated. Therefore, even if the second work set 7 is reversed in order to perform the next protective tape peeling step, adjacent chips do not come into contact with each other.

  In the chip separation step, heat is applied only in the limited area A2 between the inner diameter 2a of the frame 2 and the outer diameter 1a of the plate-like workpiece W. Therefore, the frame 2 and the plate-like workpiece of the adhesive tape 4 are used. The portion where W is not adhered is thermally contracted, the portion where the chip C is adhered is extended, the space S between the chips C is widened to form a gap 9, and the adjacent chips C are reliably separated. Can do.

1: First work set 2: Frame 2a: Inner diameter 3: Protection tape 4: Adhesive tape 5: Tape protection sheet 6: Peeling tape 7: Second work set 8: Third work set 9: Gap 10: Tape Sticking device 10a: device base 11: load cassette 12: unload cassette 13: unload unit 14: guide unit 15: first moving means 15a: ball screw 15b: guide rail 15c: motor 16: second moving means 16a : Ball screw 16b: Guide rail 16c: Motor
20: carry-in robot 21: hand 22: rotating unit 23: arm unit 30: transport robot 31: suction unit 32: rotating unit 33 arm unit 34: fulcrum shaft 35: suction source 40: first support table 41: workpiece suction Part 42: Frame suction part 43: Suction source 44: Moving base 50: Adhesive tape attaching means 51: First roll part 52: Second roll part 53a, 53b: Feed roller 54: Press roller 55: Peeling roller 56: Pull-in roller 60: Second support table 61: Work suction unit 62: Frame suction unit 63: Moving base 64: Suction source 70: Heat application unit 71: Heater 72: Power supply 73: Control unit 80: Heat application unit 81: Heater 82: Power supply 83: Control unit 90: Protection tape peeling means 91: Peeling part W: Plate-like work Wa: Outer diameter C: Chip S: Interval

Claims (3)

A plurality of chips are attached to the protective tape by attaching a protective tape to one surface of the plate-like workpiece and cutting along a cutting line formed on the other surface side of the plate-like workpiece. The first work set is configured to be arranged in an annular shape and has an opening area on the inner peripheral side thereof, and is arranged with the protective tape side of the first work set facing down. Adhering the adhesive tape to the upper surface of the first work set to form a second work set, and after the adhesive tape adhering step, attach the protective tape to one of the plate-like works. A protective tape peeling step for forming a third work set by peeling from the surface of the tape, and a tape attaching method comprising:
The pressure-sensitive adhesive tape used in the pressure-sensitive adhesive tape attaching step has heat shrinkability,
After the adhesive tape attaching step, before the protective tape peeling step, a chip separation step is performed in which the adhesive tape is thermally contracted by applying heat to the adhesive tape in the opening area to widen the interval between the chips. How to stick tape.   The tape sticking method according to claim 1, wherein in the chip separation step, heat is applied only in an area between the inner periphery of the annular frame and the outer periphery of the plate-like workpiece. A support table that supports the annular frame and supports a plate-like workpiece at the same height as the annular frame in the opening area;
The second workpiece in which the plate-like workpiece is stuck to the adhesive tape in the opening area inside the annular frame by sticking the adhesive tape to the plate-like workpiece supported by the support table and the annular frame. Adhesive tape attaching means for forming a work set of
A tape sticking device comprising a heat applying means for applying heat to the pressure-sensitive adhesive tape and enabling the tape sticking method according to claim 1 or 2.

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