CN105374729A - Protective belt pasting method and protective belt pasting device - Google Patents
Protective belt pasting method and protective belt pasting device Download PDFInfo
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- CN105374729A CN105374729A CN201510478365.XA CN201510478365A CN105374729A CN 105374729 A CN105374729 A CN 105374729A CN 201510478365 A CN201510478365 A CN 201510478365A CN 105374729 A CN105374729 A CN 105374729A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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Abstract
The invention provides a protective belt pasting method and a protective belt pasting device. According to the method, a protective belt is adhered on a semiconductor wafer, which is placed on a maintaining table; a cutter, which is stabbed into the protective belt, is moved along the shape of the semiconductor wafer, and at the same time the protective belt is cut. During the process of cutting, a detector moves along the cutter and detects the quality of cutting. According to the results of examination and the situation of defects in cutting, the protective belt is cut for another time, the protective belt is cut into the shape of the semiconductor wafer, and finally the unnecessary protective belt is peeled off.
Description
Technical field
The present invention relates to boundary belt method of attaching and the boundary belt sticker of the forming surface of the circuit pattern for boundary belt being pasted on semiconductor crystal wafer (following, to be suitably called " wafer ").
Background technology
Implement the stickup of boundary belt in the past as follows.To load and be held in the wafer of chuck table surface supply boundary belt, make Sticking roller move in a rolling manner and boundary belt is pasted on the surface of wafer.Afterwards; by making platform rotate (or making cutting knife advance) under the state making cutting knife thrust boundary belt, thus make cutting knife carry out rotating along the periphery of wafer and boundary belt cut into wafer shape (with reference to Japanese Laid-Open 2004-25438 publication).
Summary of the invention
the problem that invention will solve
But, there is following situation, that is, the initial position of the cutting knife thrust when the cutting of boundary belt and postrotational final position inconsistent and produce non-cutting part.In addition, when carrying out heating and pasting boundary belt, because adhesive creates softening, therefore, the part under also sometimes cutting occurs bonding again.When peeling off part not under the state creating these non-cutting parts, tensile force can act on stickup boundary belt on the wafer surface, thus makes absorption maintain the silicon wafer warpage of this boundary belt, while lifted forcibly by this wafer.Now, following problem can be produced: the small crack produced on wafer because of this tensile force and wafer warpage and grow into crackle, and then make wafer breakage.
The present invention makes, its main purpose is, provide boundary belt method of attaching and the boundary belt sticker that the boundary belt being pasted on semiconductor crystal wafer reliably can be cut into wafer shape in view of such situation.
for the scheme of dealing with problems
The present invention adopts following structure to reach such object.
Namely, a kind of boundary belt method of attaching, this boundary belt method of attaching is used for circuit forming surface boundary belt being pasted on semiconductor crystal wafer, it is characterized in that, described boundary belt method of attaching comprises following operation: adhering processes, in this adhering processes, boundary belt is pasted on by the described semiconductor crystal wafer be positioned in holding station; Cutting action, in this cutting action, makes cutter advance along the profile of described semiconductor crystal wafer, while cut boundary belt; Checking operation, in this inspection operation, checking the cutting of boundary belt is bad by making detector follow this cutter from the rear of cutter in described cutting action; Cutting action again, in this again cutting action, when detecting that in the result according to described inspection cutting is bad, cuts boundary belt again; And stripping process, in this stripping process, the part after the shape of the cut described semiconductor crystal wafer of boundary belt is peeled off.
Adopt the method, in the operation utilizing cutting knife cutting masking tape, utilize detector successively to check the state of cutting part.When utilizing this inspection operation to detect that cutting is bad, again can perform the cutting process of boundary belt, therefore, it is possible to avoid cutting bad.Thus, when peeling off and remove boundary belt not, due to can not to the boundary belt effect tensile force be pasted onto on wafer, therefore, it is possible to avoid the breakage of wafer.
In addition, in the process, preferably, boundary belt is pasted onto on the ring-type platform of semiconductor crystal wafer and trough of belt, this ring-type platform configures in the mode separating predetermined distance with holding station, enter in this groove forcibly by making boundary belt, thus tension force is applied to the part between holding station and ring-type platform of boundary belt, in cutting action, while cutter is thrust the gap between holding station and ring-type platform and makes cutter advance, while cut boundary belt, in described inspection operation, the presence or absence because of the gap produced with the tension force of radial applying of the cutting part of boundary belt is checked.
Adopt the method, the side due to the boundary belt do not wanted after cutting is drawn into the groove of ring-type platform, therefore, it is possible to reliably avoid the boundary belt after cutting bonding more each other.
In addition, preferably, when utilizing inspection operation to detect that cutting is bad, repeating to implement cutting action, until do not detect that cutting is bad, afterwards the part after the shape of the cut semiconductor crystal wafer of boundary belt being peeled off.
In addition, the present invention adopts following structure to reach such object.
Namely, a kind of boundary belt sticker, it is for being pasted on the circuit forming surface of semiconductor crystal wafer by boundary belt, it is characterized in that, described boundary belt sticker has following component: holding station, it is for loading and keeping described semiconductor crystal wafer: labelling machine, and it is for being pasted on described semiconductor crystal wafer by boundary belt; Cutting mechanism, boundary belt is cut into the shape of semiconductor crystal wafer by it for making cutter thrust described boundary belt; Detector, it is followed the movement of described cutter and detects the cutting part of boundary belt; Control part, it has judging part, and this judging part is used for judging according to the cutting of detection signal to the cutting part of boundary belt of described detector is bad; And band recoverer, its partially recycled for after the shape of the cut described semiconductor crystal wafer by boundary belt.
Adopt this structure, cutting can be detected according to the detection signal of detector bad.Thus, described method can preferably be implemented.
In addition, in described structure, preferably, the profile of boundary belt is greater than the profile of semiconductor crystal wafer, and this boundary belt sticker comprises: the ring-type platform of trough of belt, and this ring-type platform configures in the mode separating predetermined distance with holding station; And tension-applying mechanism; it applies tension force for boundary belt being drawn in the groove of ring-type platform to boundary belt, and detector detects the cutting part of boundary belt following this cutter along the rear of semiconductor crystal wafer cutter of movement between holding station and ring-type platform.
Adopt this structure, because the boundary belt do not wanted after cutting is drawn into the groove of ring-type platform, therefore form the gap between boundary belt at cutting part place, the bonding again of boundary belt can be avoided.
the effect of invention
Adopt boundary belt method of attaching of the present invention and boundary belt sticker, the cutting of boundary belt can be avoided bad and only the part do not wanted after the shape of the cut wafer of boundary belt is peeled off.Thus, the breakage that wafer produces when cutting bad can be avoided.
Accompanying drawing explanation
Fig. 1 is the stereogram of the major part representing boundary belt sticker.
Fig. 2 is the front view of boundary belt sticker.
Fig. 3 is the vertical view of chuck table.
Fig. 4 is the partial sectional view of chuck table.
Fig. 5 is the front view of boundary belt cutter sweep.
Fig. 6 is the front view of the sticking placement representing boundary belt.
Fig. 7 is the front view of the sticking placement representing boundary belt.
Fig. 8 is the schematic diagram representing the state cut boundary belt and check.
Fig. 9 is the action specification figure checked boundary belt.
Figure 10 is the front view of the sticking placement representing boundary belt.
Figure 11 is the front view of the sticking placement representing boundary belt.
Embodiment
Hereinafter, with reference to the accompanying drawings of the embodiment of boundary belt stripping off device of the present invention.
Fig. 1 is the integrally-built stereogram representing boundary belt sticker.
As depicted in figs. 1 and 2, this boundary belt sticker comprises wafer supply/recoverer 1, has the wafer conveying mechanism 3 of mechanical arm 2, alignment tool 4, chuck table 5, band supply unit 6, barrier film recoverer 7, application unit 8, boundary belt cutter sweep 9, peels off unit 10 and band recoverer 11 etc.Below, described each structure is described.
Be filled with two box C side by side at wafer supply/recoverer 1, in these two box C, accommodate semiconductor crystal wafer (following, only referred to as " wafer ") W.More wafers W inserts with Wiring pattern supine flat-hand position multilayer and is contained in each box C.
The mechanical arm 2 being located at wafer conveying mechanism 3 is configured to movement of can retreating in the horizontal direction, and entirety can carry out rotary actuation and lifting.Further, the wafer maintaining part 2a in horseshoe-shaped vacuum adsorption type is provided with on the top of mechanical arm 2.Wafer maintaining part 2a is contained in being inserted into multilayer in the gap between the wafer W in box C, keep wafer W from the absorption of the back side (lower surface) of wafer W and pull out adsorbing the wafer W that remains from box C, and by wafer W according to the batch transportation of alignment tool 4, chuck table 5 and wafer supply/recoverer 1 to alignment tool 4, chuck table 5 and wafer supply/recoverer 1.
Alignment tool 4 is for according to be inputted by wafer conveying mechanism 3 and the recess that the periphery of the wafer W loaded is formed, plane of orientation carry out contraposition to this wafer W.
As shown in Figure 3 and Figure 4, chuck table 5 can to coming from wafer conveying mechanism 3 transfer and carrying out vacuum suction with the wafer W after the contraposition posture of regulation mounting.In addition, advance in order to the cutting knife 12 that makes to be located at boundary belt cutter sweep 9 described later carries out rotation along the profile of wafer W and boundary belt T is cut, the upper surface of chuck table 5 being formed cutter and advancing groove 13 and ring component 14.Further, be provided with at platform center when wafer input and output with the absorption maintaining part 5a that the mode of stretching out and bounce back is elevated.In addition, chuck table 5 is equivalent to holding station of the present invention.
The advance inner circumferential footpath of groove 13 of cutter is set to be slightly less than the external diameter of wafer W, loads wafer W to make the peripheral part of wafer W slightly towards the cutter outstanding mode of groove 13 of advancing.
Ring component 14 is formed by the metal such as stainless steel or aluminium can pasting boundary belt T securely.The upper surface of this ring component 14 is set to be in roughly the same height with the surface of the wafer W be positioned in chuck table 5, and the boundary belt T that the external diameter of ring component 14 is set to make to stretch out from wafer W is stuck in the mode of the outer end of crossing ring component 14.
The recess 15 supplying boundary belt T to enter is formed at the upper surface of ring component 14 in the form of a ring.The outer upper surface of this recess 15 has band maintaining part 16 and band support 17.The outer end of boundary belt T can be pasted securely with maintaining part 16 and fix the outer end keeping boundary belt T.With support 17 be formed at recess 15 and cutter advance between groove 13, be the ring-type ridge of little width diametrically, for catching and supporting and protecting band T.The upper surface of this band support 17 is outstanding bending; and be coated with difficult cementitious material, such as fluorine, the sands etc. such as silicon on this upper surface; thus can catch at the height (Japanese: レ ベ Le) identical with crystal column surface and supporting and protecting band T, and can not be bonded together securely with boundary belt T.
In addition, recess 15 is connected with suction device 18 and is connected, thus can apply negative pressure to recess 15.In addition, ring component 14 and suction device 18 form tension-applying mechanism of the present invention.
Adopt this structure, boundary belt T is pasted on the surface of wafer W by carrying out gluing treatment to boundary belt T, the boundary belt T that the periphery from wafer W can also be stretched out is pasted on the upper surface of ring component 14.Now, become following state, that is, boundary belt T is firmly attached the band maintaining part 16 in ring component 14 and is caught by band support 17 and support.
In this condition, by making suction device 18 work, recess 15 is applied to the negative pressure of appropriateness, thus boundary belt T is drawn in recess 15.In this case, the outer end due to boundary belt T is stuck and is held in band maintaining part 16, and therefore, boundary belt T is stretched by towards radial outside.That is, the advance part of groove 13 of cutter that is located at of boundary belt T is tensioned into the state not having fold, fluctuating, cutting knife 12 is thrust this tensioning portion and cutting knife 12 is advanced.Its result, can cut well to band cutting ora terminalis.
Herein, by the rolling-pressing of the Sticking roller 28 in boundary belt adhering processes, thus the part of stretching out to the outside on the fore-and-aft direction of wafer W of boundary belt T is pasted on wafer W to paste better tensioning state on direction at band.On the other hand, in most of the cases, the part of stretching out to the outside on the left and right directions of wafer W of boundary belt T is pasted onto on platform with state lax a little.Under these circumstances, it is desirable that, make the part of stretching out to the outside on the left and right directions of wafer W of boundary belt compare the part tensioning more strongly of stretching out to the outside on the fore-and-aft direction of wafer W of boundary belt mutually.
That is, in recess 15, the groove width t2 of the right position being positioned at band stickup direction (in figure 3 left and right directions) is set be greater than the groove width t1 being positioned at and being with the front and back position pasting direction (in figure 3 left and right directions).In addition, the next door 49 at 4 places that recess 15 is set up in the circumferential is divided into division recess 15a, 15b all around, and is connected with suction device 18 by recess 15 to the mode that the division recess 15b of left and right applies stronger negative pressure with the division recess 15a before and after comparing.Adopt this structure, cutter can be utilized on the complete cycle of wafer W to advance groove 13 by boundary belt T evenly and suitably tensioning cutting boundary belt T.
As depicted in figs. 1 and 2; band supply unit 6 is configured to; utilize feed rolls 20 and guide reel 21 to reel and guide the boundary belt T of the band barrier film s after supply spool 19 is released and this boundary belt T guided to the stripping guide bar 22 of blade-like; utilize and turning back of the tip edges peeling off guide bar 22 barrier film s peeled off, the boundary belt T after having peeled off barrier film s is guided to application unit 8.Feed rolls 20, for clamping between itself and pinch roll 23 and guiding boundary belt T and can be driven by motor 24 and rotate, sends boundary belt T as required forcibly.In addition, supply spool 19 be linked to electromagnetic brake and with electromagnetic brake phase interlock, be applied in the rotational resistance of appropriateness, thus can prevent from releasing too much band.
In barrier film recoverer 7, be provided with the recovery spool 26 that the barrier film s for being stripped down by self-insurance protecting band T batches, this recovery spool 26 can positive and negative rotation by motor 27 drived control.
The Sticking roller 28 that can be changed position by not shown start cylinder is along the vertical direction provided with in application unit 8, application unit 8 is supported to whole unit and can moves horizontally along guide rail 29, and utilizes and driven by motor 30 and the leading screw 31 that carries out positive and negative rotation carries out round screwfeed driving to this application unit 8.
Peeling off in unit 10 outlet roller 33 being provided with stripper roll 32 and being driven by a motor, peel off unit 10 to be supported to whole unit and can to move horizontally along guide rail 29, and utilize and driven by motor 34 and the leading screw 35 that carries out positive and negative rotation carries out round screwfeed driving to this stripping unit 10.
In band recoverer 11, be provided with the recovery spool 36 be driven by a motor, can drive this recovery spool 36 and make it rotate to the direction of batching band T ' not.
The supporting arm 38 that can be rotated around the supercentral longitudinal axis X being positioned at chuck table 5 by driving is equiped with in the bottom of the movable table 37 that can be elevated by driving of boundary belt cutter sweep 9.In addition, being configured to, the knife unit 39 of free end side being located at this supporting arm 38 is provided with point of a knife cutting knife 12 down, by making supporting arm 38 rotate around longitudinal axis X, thus making cutting knife 12 advance along the periphery of wafer W and cut boundary belt T.In addition, boundary belt cutter sweep 9 is equivalent to cutting mechanism of the present invention.Below, detailed structure is represented in Figure 5.
Can by positive and negative rotation driving is carried out to motor 40 and make movable table 37 along the longitudinal track 41 carry out screwfeed lifting.The rotation axis 42 being installed in the free end of this movable table 37 in the mode can rotated around longitudinal axis X to slow down interlock via two bands 44 and the motor 43 be disposed on movable table 37, utilizes the work of motor 43 to make rotation axis 42 along the direction of regulation to slowly run.Further, supporting arm 38 runs through in the mode can carrying out horizontal direction slidable adjustment and is supported on the bottom of the supporting member 45 extended from this rotation axis 42 downwards, by the slidable adjustment of supporting arm 38, can change the distance of cutting knife 12 apart from longitudinal axis X.That is, change can be carried out to the radius of turn of cutting knife 12 accordingly with diameter wafer to regulate.
In addition, the bracket of cutting knife 12 is installed being supported along the mode of the length direction slip movement of supporting arm 38 and be exerted a force to the direction slip close to longitudinal axis X by spring, but detailed structure is not illustrated to this.
The bracket linked with knife unit 39 level is provided with detector 47.This detector 47 is while by rotating the identical track of the track of advancing while detect with or without cut boundary belt T with cutting knife 12.As detector 47, as long as it can judge the component of the cut state of boundary belt T, and be not particularly limited, such as photoelectric sensor, laser sensor and ultrasonic sensor etc. can be used.In addition, the testing result of detector 42 is sent to control part 50.
Next, according to Fig. 2 and Fig. 6 ~ Figure 11, a series of elemental motion for using described embodiment device boundary belt T to be pasted on the surface of wafer W is described.
When send paste instruction time, first, make the mechanical arm 2 of wafer conveying mechanism 3 towards to load and the box C filling in box platform moves.Be inserted into by wafer maintaining part 2a in the gap between the wafer be contained in box C, absorption keeps wafer W and is exported by wafer W from the back side (lower surface) of wafer W to utilize wafer maintaining part 2a.Wafer W after taking-up is handed off on the outstanding sucker of autoregistration platform 4 by mechanical arm 2.
The wafer W that kept by sucker is rotated while to being formed at the recess of periphery of wafer W, plane of orientation detects.According to this testing result, contraposition is carried out to wafer W.Mechanical arm 2 is again utilized to be exported by the wafer W of contraposition and be positioned in chuck table 5.
For the wafer W be positioned in chuck table 5, adsorb under with the state making the supercentral mode being centrally located at chuck table 5 of this wafer W carry out contraposition to this wafer W and keep this wafer W.Now, as shown in Figure 2, application unit 8 is standby in the initial position in left side with stripping unit 10, and in addition, cutting knife 12 initial position up of band cutting mechanism 9 is standby.
Next, as shown in Figure 6, Sticking roller 28 declines and application unit 8 carries out advance movement, and boundary belt T is pressed on wafer W forwards (being right in the drawings) rolling on one side by Sticking roller 28.With this scroll actions mutually linkedly, boundary belt T is pasted onto from left end on the surface of wafer W.
As shown in Figure 7, application unit 8 arrive crossed the terminal position of chuck table 5 time, cutting knife 12 standby is up declined and thrusts boundary belt T at the cutter of chuck table 5 groove 13 place of advancing.
When stopping when making cutting knife 12 drop to the cutting-height position of regulation, supporting arm 38 is rotated along the direction of regulation.Along with this rotation, cutting knife 12 carries out in rotary moving around longitudinal axis X and cuts boundary belt T along wafer profile.In this cutting action, as shown in Figure 8, detector 47 follows cutting knife 12 from the rear of cutting knife 12.
Now, as shown in Figure 9, because the part do not wanted be cut of boundary belt T attracted in recess 15, therefore between band support 17 and wafer W, gap is formed.After formation interval, make detector 47 by the top in this gap, successively cut state is scanned on one side, and detection signal is sent to the control part 50 shown in Fig. 2.
In control part 50, inner judging part 51 is such as utilized to compare the measured values such as the intensity of the light as detection signal and predetermined fiducial value, within prescribed limit at measured value not in fiducial value, it is bad that control part 50 judges to create cutting.
When detecting that cutting is bad, again making cutting knife 12 in rotary moving and carrying out cutting process.In the operation of cutting process again, control part 50 is also monitored with or without cutting bad according to the testing result of detector 47.
When can't detect cutting and being bad, terminate cutting process.Afterwards, cutting knife 12 rises to the position of readiness of top, and it is forwards mobile while batch and peel off the cut remaining band T ' do not wanted from wafer W cutting to peel off unit 10.
As shown in Figure 10, when peeling off unit 10 and arriving the final position of overburden operation, as shown in figure 11, peel off unit 10 and move round about with application unit 8 and turn back to initial position.Now, the band T' do not wanted is taken up on recovery spool 21, and releases the boundary belt T of ormal weight from band supply unit 6.
At the end of band sticking placement, remove the absorption of chuck table 5, afterwards, the wafer W of gluing treatment is held in absorption maintaining part 5a and this wafer W is lifted above platform, also exported by this wafer W by the wafer maintaining part 2a of this wafer W transfer to mechanical arm 2, this wafer W is inserted in the box C of wafer supply/recoverer 1 and reclaims.
Above, complete 1 boundary belt gluing treatment, after, repeat described action successively.
Adopt this structure; boundary belt T is pasted on the surface of wafer W by carrying out gluing treatment to boundary belt T; can also by the bonding partially stretched out from the periphery of wafer W of boundary belt T in the upper surface of ring component 14; thus become following state; that is, boundary belt T is firmly attached the band maintaining part 16 in ring component 14 and is caught by band support 17 and support.
In this condition, by making suction device 18 work, recess 15 is applied to the negative pressure of appropriateness, thus boundary belt T is drawn in recess 15.In this case, the outer end due to boundary belt T is stuck and is held in band maintaining part 16, and therefore, boundary belt T is stretched by towards radial outside, thus, is located at the advance band portion of groove 13 of cutter and is tensioned into the state not having fold, fluctuating.Cutting knife 12 is thrust this tensioning portion and cutting knife 12 is advanced.Its result, can cut well to band cutting ora terminalis.
In addition, because the part do not wanted be cut of boundary belt T is attracted by recess 15, therefore, part not should slide on the surface of the difficult cementability of band support 17 and be drawn into recess 15.Thus, between band support 17 and the outer rim of wafer W, be formed with gap, thereby, it is possible to avoid the part do not wanted by ring component side be cut of boundary belt T ' bonding more each other with the boundary belt T be pasted onto on wafer W.
Further, when utilizing detector 47 to detect that the cutting of boundary belt T is bad, repeat cutting process, until complete the cutting to the bad position of cutting, therefore, it is possible to suppress wafer W because cutting bad and breakage that is that produce.
The present invention can also implement with following such form.
(1) in described embodiment device; also can be configured to; the smooth ring component 14 in surface and chuck table 5 be relatively elevated and separate slight distance (several millimeters), thus making the boundary belt T be cut form gap between ring component 14 and wafer outer rim.
(2) described embodiment also can be implemented with following form: by being fixed the position of cutting knife 12, chuck table 5 is rotated, thus cutting knife 12 is relatively advanced along cutting knife groove 13 of advancing.
Claims (5)
1. a boundary belt method of attaching, this boundary belt method of attaching is used for circuit forming surface boundary belt being pasted on semiconductor crystal wafer, wherein,
Described boundary belt method of attaching comprises following operation:
Adhering processes, in this adhering processes, is pasted on by the described semiconductor crystal wafer be positioned in holding station by boundary belt;
Cutting action, in this cutting action, makes cutter advance along the profile of described semiconductor crystal wafer, while cut boundary belt;
Checking operation, in this inspection operation, checking the cutting of boundary belt is bad by making detector carry out scanning from the rear of cutter in described cutting action;
Cutting action again, in this again cutting action, when detecting that in the result according to described inspection cutting is bad, cuts boundary belt again; And
Stripping process, in this stripping process, peels off the part after the shape of the cut described semiconductor crystal wafer of boundary belt.
2. boundary belt method of attaching according to claim 1, wherein,
In described adhering processes, be pasted onto by boundary belt on the ring-type platform of semiconductor crystal wafer and trough of belt, this ring-type platform configures in the mode separating predetermined distance with holding station,
By making boundary belt enter into forcibly in described groove, thus tension force is applied to the part between holding station and ring-type platform of boundary belt,
In described cutting action, cutter is thrust the gap between holding station and ring-type platform and cutter is advanced, while cut boundary belt,
In described inspection operation, the presence or absence because of the gap produced with the tension force of radial applying of the cutting part of boundary belt is checked.
3. boundary belt method of attaching according to claim 1, wherein,
When utilizing described inspection operation to detect that cutting is bad, repeating to implement cutting action, until do not detect that cutting is bad, afterwards the part after the shape of the cut semiconductor crystal wafer of boundary belt being peeled off.
4. a boundary belt sticker, it is for being pasted on the circuit forming surface of semiconductor crystal wafer by boundary belt, wherein, described boundary belt sticker has following component:
Holding station, it is for loading and keeping described semiconductor crystal wafer:
Labelling machine, it is for being pasted on described semiconductor crystal wafer by boundary belt;
Cutting mechanism, boundary belt is cut into the shape of semiconductor crystal wafer by it for making cutter thrust described boundary belt;
Detector, it is followed the movement of described cutter and detects the cutting part of boundary belt;
Control part, it has judging part, and this judging part is used for judging according to the cutting of detection signal to the cutting part of boundary belt of described detector is bad; And
Band recoverer, its partially recycled for after the shape of the cut described semiconductor crystal wafer by boundary belt.
5. boundary belt sticker according to claim 4, wherein,
The profile of described boundary belt is greater than the profile of semiconductor crystal wafer,
This boundary belt sticker comprises:
The ring-type platform of trough of belt, this ring-type platform configures in the mode separating predetermined distance with holding station; And
Tension-applying mechanism, it applies tension force for boundary belt being drawn in the groove of described ring-type platform to described boundary belt,
Described detector detects the cutting part of boundary belt following this cutter along the rear of semiconductor crystal wafer cutter of movement between holding station and ring-type platform.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014162613A JP2016039298A (en) | 2014-08-08 | 2014-08-08 | Protective tape pasting method and protective tape pasting device |
| JP2014-162613 | 2014-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105374729A true CN105374729A (en) | 2016-03-02 |
Family
ID=55376796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510478365.XA Pending CN105374729A (en) | 2014-08-08 | 2015-08-06 | Protective belt pasting method and protective belt pasting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016039298A (en) |
| KR (1) | KR20160018399A (en) |
| CN (1) | CN105374729A (en) |
| TW (1) | TW201611176A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180065205A (en) * | 2016-12-07 | 2018-06-18 | 크린팩토메이션 주식회사 | Apparatus for mounting top flange on wafer cassette |
| JP6924670B2 (en) * | 2017-10-18 | 2021-08-25 | リンテック株式会社 | Sheet supply device and sheet supply method |
| EP3705862B1 (en) * | 2019-03-05 | 2023-07-05 | Infineon Technologies AG | Method and device for monitoring a dicing tape tension |
| JP6857763B2 (en) * | 2020-03-17 | 2021-04-14 | リンテック株式会社 | Sheet pasting device and pasting method |
-
2014
- 2014-08-08 JP JP2014162613A patent/JP2016039298A/en active Pending
-
2015
- 2015-07-21 TW TW104123499A patent/TW201611176A/en unknown
- 2015-08-05 KR KR1020150110618A patent/KR20160018399A/en unknown
- 2015-08-06 CN CN201510478365.XA patent/CN105374729A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW201611176A (en) | 2016-03-16 |
| JP2016039298A (en) | 2016-03-22 |
| KR20160018399A (en) | 2016-02-17 |
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