CN103673172B - A kind of heat pipe heat-exchange-type semiconductor refrigeration device - Google Patents
A kind of heat pipe heat-exchange-type semiconductor refrigeration device Download PDFInfo
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- CN103673172B CN103673172B CN201310575927.3A CN201310575927A CN103673172B CN 103673172 B CN103673172 B CN 103673172B CN 201310575927 A CN201310575927 A CN 201310575927A CN 103673172 B CN103673172 B CN 103673172B
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Abstract
The invention discloses a kind of heat pipe heat-exchange-type semiconductor refrigeration devices, mainly by semiconductor chilling plate, outer heat pipe evaporator, outer heat pipe condenser, interior heat pipe evaporator, interior heat pipe condenser, the wind turbine of outer heat pipe condenser, the wind turbine of interior heat pipe evaporator, gas-guide tube, catheter and control circuit；On outer heat pipe condenser, outer heat pipe evaporator is mutually in close contact the assembling of the outer heat pipe condenser with the heating face of semiconductor chilling plate；On interior heat pipe evaporator, interior heat pipe condenser is mutually in close contact the assembling of the interior heat pipe evaporator with the heating face of semiconductor chilling plate；Semiconductor refrigerating face is increased by gravity assisted heat pipe heat transfer technology in this way and heats the heat dissipation area in face, indirectly changes indoor environment temperature, and the useless energy in semiconductor chilling plate heating face is transferred out；Replace compression chiller refrigeration, safe and reliable non-environmental-pollution using semiconductor chilling plate.
Description
Technical field
The invention belongs to cold and hot energy transporting technical fields, are related to a kind of by heat pipe heat exchanging system and semiconductor semiconductor system
The cold heat pipe heat-exchange-type semiconductor refrigeration device for being combined to carry out cold and hot energy transporting.
Background technology
Air-conditioning system currently used for Regulate Environment temperature is mainly organized as indoor heat exchanger and outdoor heat exchanger, this
Kind air-conditioning system can realize the temperature regulation and control to condensing agent by the highly energy-consuming of compressor in indoor heat exchanger, between
The change indoor environment temperature connect, this air-conditioning system do not accomplish well it is energy saving, so as to cause the meaningless of electric energy
Waste, operation costs are high, and refrigerant external leakage often occurs in and pollutes the environment.
Invention content
In order to solve the problems existing in the prior art, the present invention provide it is a kind of it is simple in structure, implement to be easy, the heat of energy-saving and emission-reduction
Pipe heat exchanging type semiconductor refrigerating plant is radiated with semiconductor chilling plate refrigeration and gravity assisted heat pipe heat transfer technology, to realize
Good refrigeration, while reducing energy waste and improving environment-friendly quality.
The present invention solves technical problem and adopts the following technical scheme that：
A kind of heat pipe heat-exchange-type semiconductor refrigeration device, including the condensation of semiconductor chilling plate, outer heat pipe evaporator, outer heat pipe
Device, interior heat pipe evaporator, the wind turbine of interior heat pipe evaporator, the wind turbine of outer heat pipe condenser, gas-guide tube, is led at interior heat pipe condenser
Liquid pipe and control circuit；On outer heat pipe condenser, outer heat pipe evaporator is same partly to lead the assembling of the outer heat pipe condenser
The heating face of body cooling piece is mutually in close contact；The assembling of the interior heat pipe evaporator is on interior heat pipe evaporator, interior heat pipe
Condenser is mutually in close contact with the chill surface of semiconductor chilling plate；The structure phase of the outer heat pipe evaporator and interior heat pipe condenser
Together, all it is direct-cooling type microchannel flat metal tube；The outer heat pipe condenser is identical with the structure of interior heat pipe condenser, is all direct-cooled
Decline channel metal flat tube；The interior heat pipe condenser is connected as one group with interior heat pipe evaporator by gas-guide tube and catheter
At an interior gravity assisted heat pipe system, and interior heat pipe condenser, on the top of interior heat pipe evaporator, certain therebetween there are one high
Degree is poor；Outer heat pipe condenser is connected as one one outer gravity assisted heat pipe of composition with outer heat pipe evaporator by gas-guide tube and catheter
System, and outer heat pipe condenser, on the top of outer heat pipe evaporator, certain therebetween there are one differences in height；The outer gravity heat
Guard system is interior filled with refrigeration working medium with interior gravity assisted heat pipe system, increases semiconductor refrigerating by gravity assisted heat pipe heat transfer technology in this way
The heat dissipation area in face and heating face, indirectly changes indoor environment temperature.
Outer heat pipe evaporator described above and interior heat pipe condenser are the preferable direct-cooling type aluminum micro-channel flat tubes of thermal diffusivity.
Outer heat pipe evaporator described above and interior heat pipe condenser are the preferable direct-cooling type copper micro-channel flats of thermal diffusivity.
The microchannel bore of outer heat pipe evaporator described above and the flat metal tube of interior heat pipe condenser is rectangular.
The microchannel bore of outer heat pipe evaporator described above and the flat metal tube of interior heat pipe condenser is circular.
Control circuit described above and semiconductor chilling plate, the wind turbine of the wind turbine and interior heat pipe evaporator of outer heat pipe condenser
It is connected.
Compared with prior art, the present invention replacing compression chiller refrigeration, when use not to need using semiconductor chilling plate
Any refrigerant, it is cost-effective, and safe and reliable non-environmental-pollution；The energy that the chill surface of semiconductor chilling plate is generated via
Heat transfer technology of heat pipe is sent to the room for needing to radiate, and the useless energy that the heating face face of semiconductor chilling plate generates is passed via heat pipe
Thermal technology radiates, and increases semiconductor chilling plate heat dissipation area in this way, to realize good heat radiating, ensures semiconductor refrigerating
The job stability of piece, and remotely transferring is realized, this outer heat pipe heat-exchange-type semiconductor refrigeration device can be applied to
The heat dissipation temperature control in the fields such as base station, computer room and large electric appliances equipment.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
Fig. 2 is the structural schematic diagram of the direct-cooling type microchannel flat metal tube of the present invention.
In figure：(1) semiconductor chilling plate；(2) outer heat pipe evaporator；(3) interior heat pipe condenser；(4) interior heat pipe evaporator；
(5) outer heat pipe condenser；(6) wind turbine of interior heat pipe evaporator；(7) wind turbine of outer heat pipe condenser.
Specific implementation mode
The structural schematic diagram of the heat pipe heat-exchange-type semiconductor refrigeration device of the present invention as shown in Figure 1, including semiconductor system
Cold (1), outer heat pipe evaporator (2), outer heat pipe condenser (5), interior heat pipe condenser (3), interior heat pipe condenser (4), interior heat
The wind turbine (6) of pipe evaporator, wind turbine (7), gas-guide tube, catheter and the control circuit of outer heat pipe condenser；The outer heat pipe cold
The wind turbine (7) of condenser is mounted on outer heat pipe condenser (5), the heating face of the same semiconductor chilling plate of outer heat pipe evaporator (2) (1)
Mutually it is in close contact；The wind turbine (6) of the interior heat pipe evaporator is mounted on interior heat pipe evaporator (4), and interior heat pipe condenser (3) is same
The chill surface of semiconductor chilling plate (1) is mutually in close contact；The structure of the outer heat pipe evaporator (2) and interior heat pipe condenser (3)
It is identical, all it is direct-cooling type microchannel flat metal tube；The outer heat pipe condenser (5) is identical with the structure of interior heat pipe condenser (3),
All it is direct-cooling type microchannel flat metal tube；The interior heat pipe condenser (3) passes through gas-guide tube and drain with interior heat pipe evaporator (4)
Pipe is connected as one one interior gravity assisted heat pipe system of composition, and interior heat pipe condenser (3) is on the top of interior heat pipe evaporator (4),
It is therebetween certain that there are one differences in height；Outer heat pipe condenser (5) is connected with outer heat pipe evaporator (2) by gas-guide tube and catheter
It is connected in one one outer gravity assisted heat pipe system of composition, and outer heat pipe condenser (5) is in the top of outer heat pipe evaporator (2), the two
Between certain there are one differences in height；The outer gravity assisted heat pipe system is interior filled with refrigeration working medium with interior gravity assisted heat pipe system, logical in this way
Gravity heat transfer technology of heat pipe is crossed to increase semiconductor refrigerating face and heat the heat dissipation area in face, indirectly changes indoor environment temperature
Degree.
The operation principle of the present invention is such:When heat pipe heat-exchange-type semiconductor refrigeration device works, control circuit is
The wind turbine (6) of semiconductor chilling plate (1), the wind turbine (7) of outer heat pipe condenser and interior heat pipe evaporator conveys suitable electric current；
The air flowing of Indoor Thermal is driven to carry out heat exchange with interior heat pipe evaporator (4) in the wind turbine (6) of interior heat pipe evaporator, it is interior in this way
The liquid refrigeration working medium of heat pipe evaporator (4) absorbs heat and is evaporated to gas, evaporates the gaseous refrigerant working medium of formation by leading
Tracheae enters interior heat pipe condenser (3), and interior heat pipe condenser (3) and the chill surface of semiconductor chilling plate (1) are mutually in close contact,
Refrigeration working medium in interior heat pipe condenser (3) is condensed into liquid, and releases heat, condenses the liquid-working-medium of formation in gravity
Under the action of by catheter enter interior heat pipe evaporator (4)；Semiconductor chilling plate (1) passes through interior heat pipe condenser (3) in this way
The continuously draw heat out of room, and heat is passed on outer heat pipe evaporator (2) and is radiated, outer heat pipe evaporator
(2) the liquid refrigeration working medium in absorbs heat and is evaporated to gas, and the gaseous refrigerant working medium for evaporating formation is entered by gas-guide tube
To outer heat pipe condenser (5), outer heat pipe condenser (5) contacts with outdoor cold source, and is condensed into liquid, and releases heat, condensation
The liquid-working-medium of formation enters outer heat pipe evaporator (2) by catheter under gravity, so endlessly
Indoor thermal energy is transferred out, temperature in room is reduced, achievees the purpose that refrigeration；Due to outer heat pipe evaporator (2) with it is interior
Heat pipe condenser (3) is direct-cooling type microchannel flat metal tube, can respectively with the heating face of semiconductor chilling plate (1) and chill surface
It is mutually in close contact, increases the heat dissipation area in the heating face and chill surface of semiconductor chilling plate (1), improve semiconductor chilling plate
(1) with the heat exchange coefficient of outer heat pipe evaporator (2) and interior heat pipe condenser (3), gravity assisted heat pipe system is added with very high
Heat transfer efficiency, can expeditiously take away useless heat, fully reduce in heat pipe condenser (3) and outer heat pipe evaporator
(2) temperature difference between greatly improves the refrigerating efficiency of semiconductor chilling plate (1).
Claims (6)
1. a kind of heat pipe heat-exchange-type semiconductor refrigeration device, which is characterized in that evaporated including semiconductor chilling plate (1), outer heat pipe
Device (2), outer heat pipe condenser (5), interior heat pipe condenser (3), interior heat pipe evaporator (4), interior heat pipe evaporator wind turbine (6),
Wind turbine (7), gas-guide tube, catheter and the control circuit of outer heat pipe condenser；The wind turbine (7) of the outer heat pipe condenser is mounted on
On outer heat pipe condenser (5), the heating face of the same semiconductor chilling plate of outer heat pipe evaporator (2) (1) is mutually in close contact；The interior heat
The wind turbine (6) of pipe evaporator is mounted on interior heat pipe evaporator (4), the system of the same semiconductor chilling plate of interior heat pipe condenser (3) (1)
Huyashi-chuuka (cold chinese-style noodles) is mutually in close contact；The outer heat pipe evaporator (2) is identical as the structure of interior heat pipe condenser (3), be all it is direct-cooled decline it is logical
Road flat metal tube；The outer heat pipe condenser (5) is identical with the structure of interior heat pipe condenser (3), is all direct-cooling type microchannel gold
Belong to flat tube；The interior heat pipe condenser (3) is connected as one composition one with interior heat pipe evaporator (4) by gas-guide tube and catheter
A interior gravity assisted heat pipe system, and interior heat pipe condenser (3) is on the top of interior heat pipe evaporator (4), it is certain therebetween there are one
Difference in height；Outer heat pipe condenser (5) is connected as one by gas-guide tube and catheter outside composition one with outer heat pipe evaporator (2)
Gravity assisted heat pipe system, and outer heat pipe condenser (5), on the top of outer heat pipe evaporator (2), certain therebetween there are one height
Difference；The outer gravity assisted heat pipe system is interior filled with refrigeration working medium with interior gravity assisted heat pipe system, passes through gravity assisted heat pipe heat transfer technology in this way
Come increase semiconductor refrigerating face and heat face heat dissipation area, indirectly change indoor environment temperature.
2. a kind of heat pipe heat-exchange-type semiconductor refrigeration device according to claim 1, which is characterized in that the outer heat pipe steams
It is the preferable direct-cooling type aluminum micro-channel flat tube of thermal diffusivity that device (2), which is sent out, with interior heat pipe condenser (3).
3. a kind of heat pipe heat-exchange-type semiconductor refrigeration device according to claim 1, which is characterized in that the outer heat pipe steams
It is the preferable direct-cooling type copper micro-channel flat of thermal diffusivity that device (2), which is sent out, with interior heat pipe condenser (3).
4. a kind of heat pipe heat-exchange-type semiconductor refrigeration device according to claim 1, which is characterized in that the outer heat pipe steams
It is rectangular to send out device (2) and the microchannel bore of the flat metal tube of interior heat pipe condenser (3).
5. a kind of heat pipe heat-exchange-type semiconductor refrigeration device according to claim 1, which is characterized in that the outer heat pipe steams
It is circular to send out device (2) and the microchannel bore of the flat metal tube of interior heat pipe condenser (3).
6. a kind of heat pipe heat-exchange-type semiconductor refrigeration device according to claim 1, it is further characterized in that, the control electricity
Road is connected with the wind turbine (6) of semiconductor chilling plate (1), the wind turbine (7) of outer heat pipe condenser and interior heat pipe evaporator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310575927.3A CN103673172B (en) | 2013-11-18 | 2013-11-18 | A kind of heat pipe heat-exchange-type semiconductor refrigeration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310575927.3A CN103673172B (en) | 2013-11-18 | 2013-11-18 | A kind of heat pipe heat-exchange-type semiconductor refrigeration device |
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| CN103673172A CN103673172A (en) | 2014-03-26 |
| CN103673172B true CN103673172B (en) | 2018-08-10 |
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Families Citing this family (5)
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| CN106196706B (en) * | 2016-08-05 | 2019-02-12 | 吴小峰 | Semiconductor overlay cryogenic energy stores refrigerating plant and its working method |
| CN108488891A (en) * | 2018-02-02 | 2018-09-04 | 清华大学 | A kind of flat-plate heat pipe heating end of combination semiconductor |
| CN110749140A (en) * | 2019-09-20 | 2020-02-04 | 邓明星 | Multifunctional semiconductor thermoelectric refrigerator temperature regulator |
| CN110701934A (en) * | 2019-10-23 | 2020-01-17 | 山东兆瓦热能科技有限公司 | Cold subassembly is led to low thermal resistance semiconductor cooler |
| CN113531830B (en) * | 2021-07-09 | 2023-02-17 | 青岛海尔空调器有限总公司 | Method and device for controlling air conditioner and air conditioner |
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| CN2708195Y (en) * | 2004-05-19 | 2005-07-06 | 广东科龙电器股份有限公司 | A semiconductor refrigerating system |
| CN2708196Y (en) * | 2004-05-19 | 2005-07-06 | 广东科龙电器股份有限公司 | Semiconductor refrigerating system |
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| KR101063248B1 (en) * | 2011-06-03 | 2011-09-07 | (주)동양테크놀로지 | Waste heat recovery system using separated heat-pipe |
| CN103307683A (en) * | 2013-07-04 | 2013-09-18 | 北京德能恒信科技有限公司 | Hot pipe and air conditioner all-in-one machine |
| CN203561016U (en) * | 2013-11-18 | 2014-04-23 | 北京德能恒信科技有限公司 | Heat pipe heat exchange type semiconductor refrigeration device |
Family Cites Families (1)
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| US7448222B2 (en) * | 2003-12-15 | 2008-11-11 | Bormann Ronald M | Thermoelectric refrigeration system |
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| CN2708195Y (en) * | 2004-05-19 | 2005-07-06 | 广东科龙电器股份有限公司 | A semiconductor refrigerating system |
| CN2708196Y (en) * | 2004-05-19 | 2005-07-06 | 广东科龙电器股份有限公司 | Semiconductor refrigerating system |
| CN101344344A (en) * | 2008-08-25 | 2009-01-14 | 南京大学 | Heat pipe semiconductor refrigeration and cold accumulation system |
| KR101063248B1 (en) * | 2011-06-03 | 2011-09-07 | (주)동양테크놀로지 | Waste heat recovery system using separated heat-pipe |
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| CN103673172A (en) | 2014-03-26 |
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