CN203561014U - External heat pipe heat exchange type semiconductor refrigerator - Google Patents
External heat pipe heat exchange type semiconductor refrigerator Download PDFInfo
- Publication number
- CN203561014U CN203561014U CN201320726815.9U CN201320726815U CN203561014U CN 203561014 U CN203561014 U CN 203561014U CN 201320726815 U CN201320726815 U CN 201320726815U CN 203561014 U CN203561014 U CN 203561014U
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- CN
- China
- Prior art keywords
- heat pipe
- outer heat
- chilling plate
- evaporator
- semiconductor chilling
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Abstract
The utility model discloses an external heat pipe heat exchange type semiconductor refrigerator which is mainly composed of a semiconductor chilling plate, an indoor heat exchanger, an external heat pipe evaporator, an external heat pipe condenser, an indoor fan, a fan of the external heat pipe condenser, a gas guide pipe, a liquid guide pipe and a control circuit. The indoor fan is mounted on the indoor heat exchanger which is in close contact with the chilling face of the semiconductor chilling plate, the heating face of the semiconductor chilling plate is in close contact with the external heat pipe evaporator, the external heat pipe evaporator and the external heat pipe condenser are connected through the gas guide pipe and the liquid guide pipe to form a gravity heat pipe system, useless energy of the heating face of the semiconductor chilling plate is transmitted out through a gravity heat pipe heat transfer technology, the semiconductor chilling plate is used for replacing compressed refrigerant for chilling, and the semiconductor chilling plate is safe, reliable and free of environmental pollution.
Description
Technical field
The utility model belongs to cold and hot energy transporting technical field, relates to a kind of outer heat pipe exchanging type semiconductor cooling device of heat pipe heat exchanging system and semiconductor semiconductor chilling plate being combined to carry out cold and hot energy transporting.
Background technology
For regulating and controlling the air-conditioning system chief component of environment temperature, be indoor heat exchanger and outdoor heat exchanger at present, this air-conditioning system can realize by the highly energy-consuming of compressor in indoor heat exchanger the temperature adjusting to condensing agent, thereby indirectly change indoor environment temperature, this air-conditioning system does not accomplish well to save the energy, thereby the unnecessary waste that causes electric energy, operation costs are high, and refrigerant external leakage often occur to environment in using.
Summary of the invention
The problem existing for solving prior art, the utility model provide a kind of simple in structure, implement easily, the outer heat pipe exchanging type semiconductor cooling devices of energy-saving and emission-reduction, by semiconductor chilling plate refrigeration and gravity assisted heat pipe heat transfer technology, dispel the heat, thereby realize good refrigeration, reduce energy waste simultaneously and improve environment-friendly quality.
The utility model technical solution problem adopts following technical scheme:
An outer heat pipe exchanging type semiconductor cooling device, comprises blower fan, wireway, catheter and the control circuit of semiconductor chilling plate, indoor heat exchanger, outer heat pipe evaporator, outer heat pipe condenser, indoor fan, outer heat pipe condenser; Described indoor fan is arranged on indoor heat exchanger, and indoor heat exchanger is with the chill surface phase close contact of semiconductor chilling plate; The face that heats of described semiconductor chilling plate is with outer heat pipe evaporator phase close contact; Described outer heat pipe evaporator is direct-cooling type microchannel flat metal tube; Described outer heat pipe evaporator and outer heat pipe condenser are connected as one and are formed a gravity assisted heat pipe system by wireway and catheter, outer heat pipe condenser outside heat pipe evaporator have a difference in height top; In the gravity assisted heat pipe that described outer heat pipe evaporator and outer heat pipe condenser form, be filled with refrigeration working medium, outer heat pipe condenser contacts with low-temperature receiver, and the useless energy that by gravity assisted heat pipe heat transfer technology, semiconductor chilling plate is heated to face like this transfers out.
The above outer heat pipe evaporator is the good direct-cooling type aluminum micro-channel of thermal diffusivity flat metal tube.
The above outer heat pipe evaporator is the good direct-cooling type copper of thermal diffusivity microchannel flat metal tube.
The microchannel bore of the direct-cooling type microchannel flat metal tube of the above outer heat pipe evaporator is square.
The microchannel bore of the direct-cooling type microchannel flat metal tube of the above outer heat pipe evaporator is circular.
The above control circuit is connected with the blower fan of semiconductor chilling plate, indoor fan and outer heat pipe condenser.
The utility model compared with prior art, is used semiconductor chilling plate to replace compressed refrigerant refrigeration, without any need for cold-producing medium, cost-saving during use, and safe and reliable non-environmental-pollution; The heat that semiconductor chilling plate is produced dispels the heat via heat transfer technology of heat pipe, increased area of dissipation, thereby realize good heat radiating, the job stability that guarantees semiconductor chilling plate, this outer heat pipe exchanging type semiconductor cooling device can be applied to the heat radiation temperature control in the fields such as base station, machine room and large electric appliances equipment.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of outer heat pipe evaporator of the present utility model.
In figure: (1) semiconductor chilling plate; (2) indoor heat exchanger; (3) outer heat pipe evaporator; (4) outer heat pipe condenser; (5) indoor fan; (6) blower fan of outer heat pipe condenser.
The specific embodiment
The structural representation of of the present utility model outer heat pipe exchanging type semiconductor cooling device as shown in Figure 1, comprises blower fan (6), wireway, catheter and the control circuit of semiconductor chilling plate (1), indoor heat exchanger (2), outer heat pipe evaporator (3), outer heat pipe condenser (4), indoor fan (5), outer heat pipe condenser; It is upper that described indoor fan (5) is arranged on indoor heat exchanger (2), the chill surface phase close contact of the same semiconductor chilling plate of indoor heat exchanger (2) (1); The face that heats of described semiconductor chilling plate (1) is with outer heat pipe evaporator (3) phase close contact; Described outer heat pipe evaporator (3) is the flat metal tube of direct-cooling type microchannel; Described outer heat pipe evaporator (3) and outer heat pipe condenser (4) are connected as one and are formed a gravity assisted heat pipe system by wireway and catheter, outer heat pipe condenser (4) outside heat pipe evaporator (3) have a difference in height top; In the gravity assisted heat pipe that described outer heat pipe evaporator (3) and outer heat pipe condenser (4) form, be filled with refrigeration working medium, outer heat pipe condenser (4) contacts with low-temperature receiver, and the useless energy that by gravity assisted heat pipe heat transfer technology, semiconductor chilling plate (1) is heated to face like this transfers out.
Operation principle of the present utility model is such: when outer heat pipe exchanging type semiconductor cooling device work, control circuit is semiconductor chilling plate (1), the blower fan (6) of indoor fan (5) and outer heat pipe condenser is carried suitable electric current, semiconductor chilling plate (1) by indoor heat exchanger (2) continuously from draw heat in room, and heat is passed on outer heat pipe evaporator (3), liquid refrigeration working medium in outer heat pipe evaporator (3), absorb heat and be evaporated to gas, the gaseous state refrigeration working medium that evaporation forms enters into outer heat pipe condenser (4) by wireway, outer heat pipe condenser (4) contacts with outdoor cold source, and be condensed into liquid, and emit heat, the liquid-working-medium that condensation forms enters outer heat pipe evaporator (3) by catheter under the effect of gravity, the useless heat that so endlessly semiconductor chilling plate (1) is heated to face transfers out, in room, temperature reduces, reach the object of refrigeration, because outer heat pipe evaporator (3) is direct-cooling type micro-channel heat exchanger, can with the face that the heats phase close contact of semiconductor chilling plate (1), increased the area of dissipation of the face that heats of semiconductor chilling plate (1), improved the heat exchange coefficient of the face that heats of outer heat pipe evaporator (3) and semiconductor chilling plate (1), adding outer heat pipe evaporator (3) and outer heat pipe condenser (4) is connected as one and is formed a gravity assisted heat pipe system and have very high heat transfer efficiency by wireway and catheter, can take away expeditiously the heat of outer heat pipe evaporator (3), fully reduce the temperature difference between indoor heat exchanger (2) and outer heat pipe evaporator (3), improved greatly the refrigerating efficiency of semiconductor chilling plate (1).
Claims (6)
1. an outer heat pipe exchanging type semiconductor cooling device, it is characterized in that, comprise blower fan (6), wireway, catheter and the control circuit of semiconductor chilling plate (1), indoor heat exchanger (2), outer heat pipe evaporator (3), outer heat pipe condenser (4), indoor fan (5), outer heat pipe condenser; It is upper that described indoor fan (5) is arranged on indoor heat exchanger (2), the chill surface phase close contact of the same semiconductor chilling plate of indoor heat exchanger (2) (1); The face that heats of described semiconductor chilling plate (1) is with outer heat pipe evaporator (3) phase close contact; Described outer heat pipe evaporator (3) is direct-cooling type microchannel flat metal tube; Described outer heat pipe evaporator (3) and outer heat pipe condenser (4) are connected as one and are formed a gravity assisted heat pipe system by wireway and catheter, outer heat pipe condenser (4) outside heat pipe evaporator (3) have a difference in height top; In the gravity assisted heat pipe that described outer heat pipe evaporator (3) and outer heat pipe condenser (4) form, be filled with refrigeration working medium, outer heat pipe condenser (4) contacts with low-temperature receiver, and the useless energy that by gravity assisted heat pipe heat transfer technology, semiconductor chilling plate (1) is heated to face like this transfers out.
2. a kind of outer heat pipe exchanging type semiconductor cooling device according to claim 1, is characterized in that, described outer heat pipe evaporator (3) is the good direct-cooling type aluminum micro-channel of thermal diffusivity flat metal tube.
3. a kind of outer heat pipe exchanging type semiconductor cooling device according to claim 1, is characterized in that, described outer heat pipe evaporator (3) is the good direct-cooling type copper of thermal diffusivity microchannel flat metal tube.
4. a kind of outer heat pipe exchanging type semiconductor cooling device according to claim 1, is characterized in that, the microchannel bore of the direct-cooling type microchannel flat metal tube of described outer heat pipe evaporator (3) is square.
5. a kind of outer heat pipe exchanging type semiconductor cooling device according to claim 1, is characterized in that, the microchannel bore of the direct-cooling type microchannel flat metal tube of described outer heat pipe evaporator (3) is circular.
6. a kind of outer heat pipe exchanging type semiconductor cooling device according to claim 1, is further characterized in that, described control circuit is connected with the blower fan (6) of semiconductor chilling plate (1), indoor fan (5) and outer heat pipe condenser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320726815.9U CN203561014U (en) | 2013-11-18 | 2013-11-18 | External heat pipe heat exchange type semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320726815.9U CN203561014U (en) | 2013-11-18 | 2013-11-18 | External heat pipe heat exchange type semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203561014U true CN203561014U (en) | 2014-04-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320726815.9U Expired - Fee Related CN203561014U (en) | 2013-11-18 | 2013-11-18 | External heat pipe heat exchange type semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203561014U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103542479A (en) * | 2013-11-18 | 2014-01-29 | 北京德能恒信科技有限公司 | Outer heat pipe heat exchanging type semiconductor refrigerating device |
| WO2024002183A1 (en) * | 2022-06-29 | 2024-01-04 | 莱尔德热系统(深圳)有限公司 | Heat exchange system for semiconductor cooling sheet |
-
2013
- 2013-11-18 CN CN201320726815.9U patent/CN203561014U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103542479A (en) * | 2013-11-18 | 2014-01-29 | 北京德能恒信科技有限公司 | Outer heat pipe heat exchanging type semiconductor refrigerating device |
| CN103542479B (en) * | 2013-11-18 | 2017-01-11 | 北京丰联奥睿科技有限公司 | Outer heat pipe heat exchanging type semiconductor refrigerating device |
| WO2024002183A1 (en) * | 2022-06-29 | 2024-01-04 | 莱尔德热系统(深圳)有限公司 | Heat exchange system for semiconductor cooling sheet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140423 Termination date: 20161118 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |