CN103542479B - Outer heat pipe heat exchanging type semiconductor refrigerating device - Google Patents
Outer heat pipe heat exchanging type semiconductor refrigerating device Download PDFInfo
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- CN103542479B CN103542479B CN201310575880.0A CN201310575880A CN103542479B CN 103542479 B CN103542479 B CN 103542479B CN 201310575880 A CN201310575880 A CN 201310575880A CN 103542479 B CN103542479 B CN 103542479B
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Abstract
The invention discloses an outer heat pipe heat exchanging type semiconductor refrigerating device which mainly comprises a semiconductor refrigerating sheet, an indoor heat exchanger, an outer heat pipe evaporator, an outer heat pipe condenser, an indoor fan, a fan of the outer heat pipe condenser, an air guiding pipe, a liquid guiding pipe and a control circuit. The indoor fan is installed on the indoor heat exchanger, the indoor heat exchanger is in close contact with the refrigerating face of the semiconductor refrigerating sheet, the heating face of the semiconductor refrigerating sheet is in close contact with the outer heat pipe evaporator, the outer heat pipe evaporator is connected with the outer heat pipe condenser through the air guiding pipe and the liquid guiding pipe to form a gravity heat pipe system, useless energy of the heating face of the semiconductor refrigerating sheet is transmitted out through the gravity heat pipe heat transmission technology, compressed refrigerating fluid is replaced through the semiconductor refrigerating sheet for refrigerating, and the outer heat pipe heat exchanging type semiconductor refrigerating device is safe, reliable and free of environmental pollution.
Description
Technical field
The invention belongs to cold and hot energy transporting technical field, relate to a kind of outer heat pipe heat-exchange-type semiconductor refrigeration device that heat pipe heat exchanging system and quasiconductor semiconductor chilling plate are combined to carry out cold and hot energy transporting.
Background technology
The air conditioning system being currently used for Regulate Environment temperature mainly comprises as indoor heat exchanger and outdoor heat exchanger, this air conditioning system can realize the temperature adjusting to condensing agent by the highly energy-consuming of compressor in indoor heat exchanger, thus indirectly change indoor environment temperature, this air conditioning system does not accomplish well to save the energy, thus cause the unnecessary waste of electric energy, operation costs remain high, and often occur refrigerant external leakage to environment in use.
Summary of the invention
For solving the problem that prior art exists, the present invention provides a kind of simple in construction, implements easy, the outer heat pipe heat-exchange-type semiconductor refrigeration device of energy-saving and emission-reduction, dispel the heat by semiconductor chilling plate refrigeration and gravity assisted heat pipe heat transfer technology, thus realize good refrigeration, reduce energy waste simultaneously and improve environment-friendly quality.
The present invention solves technical problem and adopts the following technical scheme that
A kind of outer heat pipe heat-exchange-type semiconductor refrigeration device, including semiconductor chilling plate, indoor heat exchanger, outer heat pipe evaporator, outer heat pipe condenser, indoor fan, the blower fan of outer heat pipe condenser, airway, catheter and control circuit；Described indoor fan is arranged on indoor heat exchanger, and indoor heat exchanger is in close contact mutually with the chill surface of semiconductor chilling plate；The face that heats of described semiconductor chilling plate is in close contact mutually with outer heat pipe evaporator；Described outer heat pipe evaporator is direct-cooling type microchannel flat metal tube；Described outer heat pipe evaporator and outer heat pipe condenser are connected as one by airway and catheter and form a gravity assisted heat pipe system, outer heat pipe condenser heat pipe evaporator outside have a difference in height top；Described outer heat pipe evaporator is filled with refrigeration working medium in the gravity assisted heat pipe of outer heat pipe condenser composition, and outer heat pipe condenser contacts with low-temperature receiver, and the useless energy so by gravity assisted heat pipe heat transfer technology, semiconductor chilling plate being heated face transfers out.
The above outer heat pipe evaporator is thermal diffusivity preferable direct-cooling type aluminum micro-channel flat metal tube.
The above outer heat pipe evaporator is thermal diffusivity preferable direct-cooling type copper microchannel flat metal tube.
The microchannel bore of the direct-cooling type microchannel flat metal tube of the above outer heat pipe evaporator is square.
The microchannel bore of the direct-cooling type microchannel flat metal tube of the above outer heat pipe evaporator is circular.
The above control circuit is connected with the blower fan of semiconductor chilling plate, indoor fan and outer heat pipe condenser.
The present invention compared with prior art, uses semiconductor chilling plate to replace compression chiller refrigeration, need not any cold-producing medium during use, cost-effective, and safe and reliable non-environmental-pollution；The heat that semiconductor chilling plate produces is dispelled the heat via heat transfer technology of heat pipe, increase area of dissipation, thus realize good heat radiating, ensureing the job stability of semiconductor chilling plate, this outer heat pipe heat-exchange-type semiconductor refrigeration device can apply to the heat radiation temperature control in the fields such as base station, machine room and large electric appliances equipment.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention.
Fig. 2 is the structural representation of the outer heat pipe evaporator of the present invention.
In figure: (1) semiconductor chilling plate；(2) indoor heat exchanger；(3) outer heat pipe evaporator；(4) outer heat pipe condenser；(5) indoor fan；(6) blower fan of outer heat pipe condenser.
Detailed description of the invention
The structural representation of the outer heat pipe heat-exchange-type semiconductor refrigeration device of the present invention as shown in Figure 1, including semiconductor chilling plate (1), indoor heat exchanger (2), outer heat pipe evaporator (3), outer heat pipe condenser (4), indoor fan (5), blower fan (6), airway, catheter and the control circuit of outer heat pipe condenser；Described indoor fan (5) is arranged on indoor heat exchanger (2), and the chill surface of indoor heat exchanger (2) same to semiconductor chilling plate (1) is in close contact mutually；The face that heats of described semiconductor chilling plate (1) is in close contact mutually with outer heat pipe evaporator (3)；Described outer heat pipe evaporator (3) is the flat metal tube of direct-cooling type microchannel；Described outer heat pipe evaporator (3) and outer heat pipe condenser (4) are connected as one by airway and catheter and form a gravity assisted heat pipe system, outer heat pipe condenser (4) heat pipe evaporator outside (3) have a difference in height top；It is filled with refrigeration working medium in the gravity assisted heat pipe that described outer heat pipe evaporator (3) and outer heat pipe condenser (4) form, outer heat pipe condenser (4) contacts with low-temperature receiver, and the useless energy so by gravity assisted heat pipe heat transfer technology, semiconductor chilling plate (1) being heated face transfers out.
nullThe operation principle of the present invention is such that when outer heat pipe heat-exchange-type semiconductor refrigeration device works，Control circuit is semiconductor chilling plate (1)、The blower fan (6) of indoor fan (5) and outer heat pipe condenser carries suitable electric current，Semiconductor chilling plate (1) passes through indoor heat exchanger (2) draw heat in room continuously，And heat is passed on outer heat pipe evaporator (3)，Liquid refrigeration working medium in outer heat pipe evaporator (3)，Absorb heat and be evaporated to gas，The gaseous refrigerant working medium that evaporation is formed enters into outer heat pipe condenser (4) by airway，Outer heat pipe condenser (4) contacts with outdoor cold source，And it is condensed into liquid，And release heat，The liquid-working-medium that condensation is formed enters outer heat pipe evaporator (3) by catheter under gravity，The most endlessly semiconductor chilling plate (1) is heated the useless Heat transmission in face to go out，In room, temperature reduces，Reach the purpose of refrigeration；Owing to outer heat pipe evaporator (3) is direct-cooling type micro-channel heat exchanger, can be in close contact mutually with the face that heats of semiconductor chilling plate (1), increase the area of dissipation in the face that heats of semiconductor chilling plate (1), improve the heat exchange coefficient of outer heat pipe evaporator (3) and the face that heats of semiconductor chilling plate (1), add outer heat pipe evaporator (3) and outer heat pipe condenser (4) to be connected as one by airway and catheter and form a gravity assisted heat pipe system there is the highest heat transfer efficiency, the heat of outer heat pipe evaporator (3) can be taken away expeditiously, fully reduce the temperature difference between indoor heat exchanger (2) and outer heat pipe evaporator (3), greatly improve the refrigerating efficiency of semiconductor chilling plate (1).
Claims (6)
1. an outer heat pipe heat-exchange-type semiconductor refrigeration device, it is characterized in that, including semiconductor chilling plate (1), indoor heat exchanger (2), outer heat pipe evaporator (3), outer heat pipe condenser (4), indoor fan (5), blower fan (6), airway, catheter and the control circuit of outer heat pipe condenser；Described indoor fan (5) is arranged on indoor heat exchanger (2), and the chill surface of indoor heat exchanger (2) same to semiconductor chilling plate (1) is in close contact mutually；The face that heats of described semiconductor chilling plate (1) is in close contact mutually with outer heat pipe evaporator (3)；Described outer heat pipe evaporator (3) is direct-cooling type microchannel flat metal tube；Described outer heat pipe evaporator (3) and outer heat pipe condenser (4) are connected as one by airway and catheter and form a gravity assisted heat pipe system, outer heat pipe condenser (4) heat pipe evaporator outside (3) have a difference in height top；It is filled with refrigeration working medium in the gravity assisted heat pipe that described outer heat pipe evaporator (3) and outer heat pipe condenser (4) form, outer heat pipe condenser (4) contacts with low-temperature receiver, and the useless energy so by gravity assisted heat pipe heat transfer technology, semiconductor chilling plate (1) being heated face transfers out.
The outer heat pipe heat-exchange-type semiconductor refrigeration device of one the most according to claim 1, it is characterised in that described outer heat pipe evaporator (3) is direct-cooling type aluminum micro-channel flat metal tube.
The outer heat pipe heat-exchange-type semiconductor refrigeration device of one the most according to claim 1, it is characterised in that described outer heat pipe evaporator (3) is direct-cooling type copper microchannel flat metal tube.
The outer heat pipe heat-exchange-type semiconductor refrigeration device of one the most according to claim 1, it is characterised in that the microchannel bore of the direct-cooling type microchannel flat metal tube of described outer heat pipe evaporator (3) is square.
The outer heat pipe heat-exchange-type semiconductor refrigeration device of one the most according to claim 1, it is characterised in that the microchannel bore of the direct-cooling type microchannel flat metal tube of described outer heat pipe evaporator (3) is circular.
The outer heat pipe heat-exchange-type semiconductor refrigeration device of one the most according to claim 1, is further characterized in that, described control circuit is connected with the blower fan (6) of semiconductor chilling plate (1), indoor fan (5) and outer heat pipe condenser.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310575880.0A CN103542479B (en) | 2013-11-18 | 2013-11-18 | Outer heat pipe heat exchanging type semiconductor refrigerating device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310575880.0A CN103542479B (en) | 2013-11-18 | 2013-11-18 | Outer heat pipe heat exchanging type semiconductor refrigerating device |
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| CN103542479A CN103542479A (en) | 2014-01-29 |
| CN103542479B true CN103542479B (en) | 2017-01-11 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103838336A (en) * | 2014-02-20 | 2014-06-04 | 北京德能恒信科技有限公司 | Novel server cooling cabinet |
| CN106679245A (en) * | 2016-07-08 | 2017-05-17 | 长沙麦融高科股份有限公司 | Double-temperature mixed cold source air conditioner system based on heat pipe heat conduction |
| CN108168142A (en) * | 2018-03-06 | 2018-06-15 | 北京中热能源科技有限公司 | A kind of heat pipe-type semiconductor heat-exchange system |
| CN108168143A (en) * | 2018-03-06 | 2018-06-15 | 北京中热能源科技有限公司 | A kind of semiconductor heat exchanger |
| CN109944678B (en) * | 2019-03-12 | 2020-06-19 | 温州市骐邦环保科技有限公司 | Novel radiator's radiator unit |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2708195Y (en) * | 2004-05-19 | 2005-07-06 | 广东科龙电器股份有限公司 | A semiconductor refrigerating system |
| CN2830991Y (en) * | 2005-09-10 | 2006-10-25 | 海尔集团公司 | Refrigerator set with gravity thermal tube type radiator |
| CN101344344A (en) * | 2008-08-25 | 2009-01-14 | 南京大学 | Heat pipe semiconductor refrigeration and cold accumulation system |
| CN202195733U (en) * | 2011-08-05 | 2012-04-18 | 王永刚 | Heat pipe exchanger having auxiliary cooling function |
| CN203561014U (en) * | 2013-11-18 | 2014-04-23 | 北京德能恒信科技有限公司 | External heat pipe heat exchange type semiconductor refrigerator |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7448222B2 (en) * | 2003-12-15 | 2008-11-11 | Bormann Ronald M | Thermoelectric refrigeration system |
| KR101063248B1 (en) * | 2011-06-03 | 2011-09-07 | (주)동양테크놀로지 | Waste heat recovery system using separated heat-pipe |
-
2013
- 2013-11-18 CN CN201310575880.0A patent/CN103542479B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2708195Y (en) * | 2004-05-19 | 2005-07-06 | 广东科龙电器股份有限公司 | A semiconductor refrigerating system |
| CN2830991Y (en) * | 2005-09-10 | 2006-10-25 | 海尔集团公司 | Refrigerator set with gravity thermal tube type radiator |
| CN101344344A (en) * | 2008-08-25 | 2009-01-14 | 南京大学 | Heat pipe semiconductor refrigeration and cold accumulation system |
| CN202195733U (en) * | 2011-08-05 | 2012-04-18 | 王永刚 | Heat pipe exchanger having auxiliary cooling function |
| CN203561014U (en) * | 2013-11-18 | 2014-04-23 | 北京德能恒信科技有限公司 | External heat pipe heat exchange type semiconductor refrigerator |
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| CN103542479A (en) | 2014-01-29 |
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