CN103668049A - Mask plate assembly for use in vapor deposition of large-sized OLED (Organic Light Emitting Diode) - Google Patents

Mask plate assembly for use in vapor deposition of large-sized OLED (Organic Light Emitting Diode) Download PDF

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Publication number
CN103668049A
CN103668049A CN201210329228.6A CN201210329228A CN103668049A CN 103668049 A CN103668049 A CN 103668049A CN 201210329228 A CN201210329228 A CN 201210329228A CN 103668049 A CN103668049 A CN 103668049A
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China
Prior art keywords
mask
large size
support portion
mask plate
equal
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Pending
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CN201210329228.6A
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Chinese (zh)
Inventor
魏志凌
高小平
张炜平
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Kunshan Power Stencil Co Ltd
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Kunshan Power Stencil Co Ltd
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Priority to CN201210329228.6A priority Critical patent/CN103668049A/en
Priority to PCT/CN2013/082039 priority patent/WO2014036894A1/en
Priority to TW102216760U priority patent/TWM474257U/en
Priority to TW102132120A priority patent/TWI500785B/en
Publication of CN103668049A publication Critical patent/CN103668049A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention discloses a mask plate assembly for use in vapor deposition of a large-sized OLED (Organic Light Emitting Diode). The mask plate assembly comprises a mask outer frame, a mask part and a support part, wherein the mask part is connected with the support part fixed on the mask outer frame; the support part comprises N (more than or equal to 2) support part units; each support part unit consists of support bars; the mask part is provided with mask openings; the mask part units do not block the mask openings; the mask openings construct a mask pattern region on the mask part. According to the mask plate assembly for use in vapor deposition of the large-sized OLED, which is disclosed by the invention, the problems of reduction in accuracy, low yield and the like caused by dropping of the plate surface of a mask main body and the problem of dislocation of an existing mask part assembled by a plurality of mask units can be solved, the accuracy and quality of a product are improved effectively, and the yield is increased.

Description

A kind of large size OLED evaporation mask plate component
Technical field
The present invention relates to electronic printing field, relate in particular to a kind of large size OLED evaporation mask plate component.
Background technology
Due to organic electroluminescent LED (Organic Light-Emitting Diode, OLED) owing to possessing luminous simultaneously, do not need that backlight, contrast gradient are high, thin thickness, visual angle is wide, speed of response is fast, can be used for flexibility panel, use temperature scope is wide, the characteristic of structure and the excellence such as processing procedure is simpler, is considered to the emerging utilisation technology of follow-on flat-panel screens.
In OLED production process, a most important link is that organic layer is applied in basic unit according to the requirement of driving matrix, forms crucial luminescence display unit.OLED is a kind of solid material, and the development of its high precision paint-on technique is the key of restriction OLED commercialization.Complete at present this work, mainly adopt the method for vacuum moulding machine or vacuum thermal evaporation (VTE), it is to be positioned at the organic molecule mild heat (evaporation) of vacuum cavity, and these molecules are condensed upon in the basic unit that temperature is lower with the form of film.Need in this course the high-accuracy mask plate adapting with OLED luminescence display unit precision as medium.
Mask plate consists of mask portion and mask housing, is the structural representation of traditional small size mask plate shown in Fig. 1, and it comprises integrated mask portion 11 and for the mask housing 12 of the moulding mask portion 11 that is fixed as one.In practical application area, people wish to produce larger sized mask plate, thereby meet the manufacture demand of volume production and large size OLED display screen, but make large size mask plate, can have following problem: the mask portion of large face width is because the weight of itself there will be serious sagging.For addressing this problem, people are designed to a plurality of mask unit by mask portion and assemble, as shown in Figure 2, mask portion consists of several mask unit 20, mask unit is by the 200 permanent mask housings of two ends, because mask unit is to fix by the fixing mode in two ends, once deviation appears in adjacent two mask portion fixation procedure, very easily produce each other certain position skew, thereby on the yield of OLED product, be difficult to further raising.
Summary of the invention
In view of this, need to overcome at least one in above-mentioned defect of the prior art.The invention provides a kind of composite mask plate.
Described a kind of large size OLED evaporation mask plate component, comprises mask housing, mask portion and support portion, wherein, described mask portion be connected with the described support portion that is fixed on described mask housing; Described support portion comprises that N is more than or equal to unit, 2 support portions; Unit, described support portion consists of described support bar, in described mask portion, has mask open, and unit, described support portion can not block described mask open, and described mask open forms the mask pattern district in described mask portion.
According in this patent background technology to described in prior art, if make large size mask plate, the mask main body of its metal mold can have larger linear quality, thereby it is sagging to cause mask main board face to produce, and according to large size OLED evaporation mask plate component provided by the invention, mask portion is fitted in support section, and support portion can first accurately be located, again mask portion is fitted on support portion, so can provide to sagging mask main body the anchorage force of direct laminating, reduce or make up mask main board face and produce sagging situation, and avoided in this patent background technology problem that the existing mask portion being assembled by a plurality of mask unit is occurred, as shown in Figure 2, be that mask unit is to fix by the fixing mode in two ends, once there is deviation in adjacent two mask portion fixation procedure, very easily produce each other certain position skew, thereby on the yield of OLED product, be difficult to further raising, the large size OLED evaporation that this patent provides can effectively improve the precision of product with mask plate component, quality, and improve good article rate.
In addition, according to composite mask plate disclosed by the invention, also there is following additional technical feature:
According to embodiments of the invention, described mask portion has Yi Ge mask pattern district at least.
According to embodiments of the invention, in described mask portion, arbitrary described mask open is placed between two adjacent described support bars of described support portion, the spacing of adjacent described support bar be described mask open spacing M doubly, described M is more than or equal to 1 and be positive integer.
According to some embodiments of the present invention, described support bar is evenly arranged.
According to embodiments of the invention, described support portion adopts the alloy material with magnetic property.
Preferably, described support portion adopts Invar alloy material.
According to embodiments of the invention, that described mask portion adopts is wear-resisting, high temperature resistant, acid and alkali-resistance and and described supporting layer between have the material of good adhesion.
Preferably, described mask portion adopts the polymerization macromolecule material of stable performance.
According to embodiments of the invention, described support portion thickness is more than or equal to 20 μ m, is less than or equal to 60 μ m.
According to some embodiments of the present invention, described support portion thickness is 20 μ m or 30 μ m or 40 μ m or 50 μ m or 60 μ m.
According to embodiments of the invention, described mask portion thickness is more than or equal to 2 μ m, is less than or equal to 20 μ m.
According to some embodiments of the present invention, described mask portion thickness is 2 μ m or 6 μ m or 10 or 14 μ m or 18 μ m or 20 μ m.
According to one embodiment of present invention, described mask portion thickness is 6 μ m, and described support portion thickness is 30 μ m.
According to embodiments of the invention, described mask open spacing is more than or equal to 30 μ m and is less than or equal to 200 μ m.
Preferably, described mask open spacing is more than or equal to 50 μ m and is less than or equal to 100 μ m.
According to one embodiment of present invention, described mask open spacing is 75 μ m.
According to embodiments of the invention, form between unit, adjacent described support portion, described support portion and can fit or exist certain support portion unit interval.
Preferably, it is characterized in that, described support portion unit interval is m times of described mask open spacing, and m is not less than zero integer.
According to large size OLED evaporation mask plate component provided by the invention, described support portion can support described mask portion, described support portion is fixed on mask frame, and described mask portion is fixed on described support portion, make described mask portion location positioning each other, so relatively make up, can make and meet high precision, the mask plate that large size OLED screen evaporation is used.
With respect to traditional masks plate, can make higher PPI(and be Pixels per inch represented be pixel (pixel) number that per inch has) OLED display screen (open amount that in composite mask plate main body, per inch has is corresponding with the PPI of OLED display screen).For example: when the open centre spacing of traditional masks plate is 150um, the PPI=2.54cm/150um ≈ 169 that it is corresponding; And when in the present invention, two between centers d1 that form the support bar 3220 of mask support portions are 150um (as Fig. 6), large size OLED evaporation is PPI=2.54cm/d3=2.54cm/75um ≈ 339 with the actual PPI of mask plate main body, the OLED screen making is thus also 339PPI, so by the limit 300PPI that surmounts human eye and can see.
The formation material of traditional masks plate is metal alloy, in the present invention using metal alloy compositions as supporting layer, region corresponding with mask pattern on it is compared with traditional masks plate, interior metal material reduces in a large number, although increase the mask layer that organic materials forms, but its quality is relatively light, thereby the oeverall quality of composite mask plate is reduced.When the tension force with identical is fixed on housing by composite mask plate, the inside sag of chain of composite mask plate also will weaken.
The aspect that the present invention is additional and advantage in the following description part provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become from the following description of the accompanying drawings of embodiments and obviously and easily understand, wherein:
It shown in Fig. 1, is the structural representation of traditional small size mask plate;
It shown in Fig. 2, is the mask portion schematic diagram that several mask unit form;
Shown in Fig. 3, be the front schematic view of mask plate for large size OLED evaporation of the present invention,
The schematic cross-section of A-A direction in Fig. 4 corresponding diagram 3,
Fig. 5 is the reverse side schematic diagram of mask plate for large size OLED evaporation of the present invention;
Fig. 6 is 50 structural representations that amplify in Fig. 5.
Wherein, in Fig. 1,11 is mask portion, and 12 is the mask housing for the moulding mask portion 11 that is fixed as one;
In Fig. 2,20 is mask unit, 200 two ends that are mask unit;
In Fig. 3,30 is that mask housing, 31 is mask portion;
In Fig. 4,32 is support portion, and 320 is unit, support portion, and h1 is mask portion thickness, and h2 is support portion thickness;
In Fig. 5,50 for treating amplifier section;
In Fig. 6,3200 is support bar, and 310 is mask open, and d1 is support bar spacing, and d2 is support unit spacing, and d3 is mask open spacing. ?
Embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Below by the embodiment being described with reference to the drawings, be exemplary, only for explaining the present invention, and can not be interpreted as limitation of the present invention.
In description of the invention, it will be appreciated that, term " on ", orientation or the position relationship of the indication such as D score, " end ", " top ", 'fornt', 'back', " interior ", " outward ", " horizontal stroke ", " erecting " be based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, rather than indicate or imply that the device of indication or element must have specific orientation, with specific orientation, construct and operation, therefore can not be interpreted as limitation of the present invention.
In description of the invention, it should be noted that, unless otherwise clearly defined and limited, term " connection ", " connection ", " being connected ", " connection " should be interpreted broadly, and for example, can be to be fixedly connected with, connecting integratedly, can be also to removably connect; It can be the connection of two element internals; Can be to be directly connected, also can indirectly be connected by intermediary, for the ordinary skill in the art, can particular case understand above-mentioned term concrete meaning in the present invention.
Inventive concept of the present invention is as follows, because existing mask stretches tight in network technology, there will be the sagging problem of large size mask plate producing large size panel, when size is larger, to the precision of product, quality, all can make a big impact, and reduces good article rate simultaneously.Large size OLED evaporation provided by the invention with mask plate component by large size OLED evaporation is carried out to the improvement on material structure with the mask layer in mask plate component, reduce its original support function, only there is pattern function, add independent support portion to increase the integral rigidity of mask plate component for large size OLED evaporation, by the lighter material of the materials'use integral body of mask portion and support portion, its overall weight is alleviated, also slowed down the possible sag of chain of mask plate component for large size OLED evaporation, mask portion on simultaneously fitting after accurate fixed support portion, make its location more accurate, thereby making to manufacture more large size panel is more prone to realize.
Describing below with reference to accompanying drawings mask frame of the present invention and corresponding mask assembly thereof, is wherein the structural representation of traditional small size mask plate shown in Fig. 1; It shown in Fig. 2, is the mask portion schematic diagram that several mask unit form; Shown in Fig. 3, be the front schematic view of mask plate for large size OLED evaporation of the present invention, Fig. 5 is the reverse side schematic diagram of mask plate for large size OLED evaporation of the present invention.
According to embodiments of the invention, a kind of large size OLED evaporation mask plate component, as shown in Fig. 3-Fig. 6, described a kind of large size OLED evaporation mask plate component, comprise mask housing 30, mask portion 31 and support portion 32, wherein, described mask portion 31 be connected with the described support portion 32 that is fixed on described mask housing 30; Described support portion 32 comprises that N is more than or equal to unit, 2 support portions 320; Unit, described support portion 320 consists of described support bar 3200, in described mask portion 31, has mask open 310, and unit, described support portion 320 can not block described mask open 310, and described mask open 310 forms the mask pattern district in described mask portion.
According to embodiments of the invention, described mask portion 31 has Yi Ge mask pattern district at least.
According to embodiments of the invention, in described mask portion 31, arbitrary described mask open 310 is placed between two described support bars 3200 that unit, described support portion 320 is adjacent, the M that adjacent described support bar spacing d1 is described mask open spacing d3 doubly, described M is more than or equal to 1 and for positive integer, as shown in Figure 6.
According to some embodiments of the present invention, described support bar 3200 is evenly arranged.
According to embodiments of the invention, described support portion 32 adopts the alloy material with magnetic property.
Preferably, described support portion 32 adopts Invar alloy material.
According to embodiments of the invention, that described mask portion 31 adopts is wear-resisting, high temperature resistant, acid and alkali-resistance and and described supporting layer between have the material of good adhesion.
Preferably, described mask portion 31 adopts the polymerization macromolecule material of stable performances.
According to embodiments of the invention, described support portion thickness h 2 is more than or equal to 20 μ m, is less than or equal to 60 μ m, as shown in Figure 4.
According to some embodiments of the present invention, described support portion thickness h 2 is 20 μ m or 30 μ m or 40 μ m or 50 μ m or 60 μ m, as shown in Figure 4.
According to embodiments of the invention, described mask portion thickness h 1 is more than or equal to 2 μ m, is less than or equal to 20 μ m, as shown in Figure 4.
According to some embodiments of the present invention, described mask portion thickness h 1 is 2 μ m or 6 μ m or 10 or 14 μ m or 18 μ m or 20 μ m, as shown in Figure 4.
According to one embodiment of present invention, described mask portion thickness h 1 is 6 μ m, and described support portion thickness h 2 is 30 μ m, as shown in Figure 4.
According to embodiments of the invention, described mask open spacing d3 is more than or equal to 30 μ m and is less than or equal to 200 μ m, as shown in Figure 6.
Preferably, described mask open spacing d3 is more than or equal to 50 μ m and is less than or equal to 100 μ m, as shown in Figure 6.
According to one embodiment of present invention, described mask open spacing d3 is 75 μ m, as shown in Figure 6.
According to embodiments of the invention, form between unit, adjacent described support portion, described support portion 32 320 and can fit or exist certain support portion unit interval d2, as shown in Figure 6.
Preferably, it is characterized in that, doubly, m is not less than zero integer to the m that described support portion unit interval d2 is described mask open spacing d3, as shown in Figure 6.
The open area consisting of support bar 3200 is arranged in opening 310 matrix area in the unit, support portion 320 that forms support portion 32, as shown in Figure 6, support bar 3200 positions of the open area forming do not overlap with opening 310 positions in mask portion 31, as preferably, described support bar 3200 is evenly arranged, and in the spacing d1 of 3200 of adjacent two support bars and mask portion 31, the spacing d3 of 310 of adjacent two row openings has following relation: d1=n*d3(n=1,2,3,4 ...).
Further, as shown in Figure 6, form between adjacent two unit, support portion, mask support portion and have certain spacing, as preferably, its spacing d2 and d3 have following relation: d2=n*d3(n=0,1,2,3,4 ...).
Concrete member, structure or feature that any mentioning " embodiment ", " embodiment ", " illustrative examples " etc. mean to describe in conjunction with this embodiment are contained at least one embodiment of the present invention.In this schematic statement everywhere of this specification sheets, not necessarily refer to identical embodiment.And, when describing concrete member, structure or feature in conjunction with any embodiment, advocate, within realizing in conjunction with other embodiment the scope that such member, structure or feature all drop on those skilled in the art.
Although the specific embodiment of the present invention is described in detail with reference to a plurality of illustrative examples of the present invention, but it must be understood that, those skilled in the art can design multiple other improvement and embodiment, and these improve and within embodiment will drop on spirit and scope.Particularly, within the scope of aforementioned open, accompanying drawing and claim, can aspect the layout of component and/or subordinate composite configuration, make rational modification and improvement, and can not depart from spirit of the present invention.Except modification and the improvement of component and/or layout aspect, its scope is limited by claims and equivalent thereof.

Claims (15)

1. a large size OLED evaporation mask plate component, comprises mask housing 30, mask portion 31 and mask support portion 32, it is characterized in that, described mask portion be connected with the described mask support portion that is fixed on described mask housing; Described mask support portion comprises that N is more than or equal to unit, 2 support portions; Unit, described support portion consists of described support bar, in described mask portion, has mask open, and unit, described support portion can not block described mask open, and described opening forms mask pattern district.
2. large size OLED evaporation mask plate component according to claim 1, is characterized in that, described mask portion has Yi Ge mask pattern district at least.
3. large size OLED evaporation mask plate component according to claim 1, it is characterized in that, in described mask portion, arbitrary described mask open is placed between two adjacent described support bars of described support portion, the spacing of adjacent described support bar be described mask open spacing M doubly, described M is more than or equal to 1 and be positive integer.
4. large size OLED evaporation mask plate component according to claim 1, is characterized in that, described support portion adopts the alloy material with magnetic property.
5. large size OLED evaporation mask plate component according to claim 4, is characterized in that, described support portion adopts Invar alloy material.
6. large size OLED evaporation mask plate component according to claim 1, is characterized in that, that described mask portion adopts is wear-resisting, high temperature resistant, acid and alkali-resistance and and described supporting layer between have the material of good adhesion.
7. large size OLED evaporation mask plate component according to claim 6, is characterized in that, described mask portion adopts the polymerization macromolecule material of stable performance.
8. large size OLED evaporation mask plate component according to claim 1, is characterized in that, described support portion thickness is more than or equal to 20 μ m, is less than or equal to 60 μ m.
9. large size OLED evaporation mask plate component according to claim 8, is characterized in that, described support portion thickness is 20 μ m or 30 μ m or 40 μ m or 50 μ m or 60 μ m.
10. large size OLED evaporation mask plate component according to claim 1, is characterized in that, described mask portion thickness is more than or equal to 2 μ m, is less than or equal to 20 μ m.
11. large size OLED evaporation mask plate components according to claim 10, is characterized in that, described mask portion thickness is 2 μ m or 6 μ m or 10 or 14 μ m or 18 μ m or 20 μ m.
12. large size OLED evaporation mask plate components according to claim 1, is characterized in that, described mask open spacing is more than or equal to 30 μ m and is less than or equal to 200 μ m.
13. large size OLED evaporation mask plate components according to claim 12, is characterized in that, described mask open spacing is more than or equal to 50 μ m and is less than or equal to 100 μ m.
14. large size OLED evaporation mask plate components according to claim 1, is characterized in that, form between unit, adjacent described support portion, described support portion and can fit tightly or exist certain support portion unit interval.
15. large size OLED evaporation mask plate components according to claim 1, is characterized in that, described support portion unit interval is m times of described mask open spacing, and m is not less than zero integer.
CN201210329228.6A 2012-09-07 2012-09-07 Mask plate assembly for use in vapor deposition of large-sized OLED (Organic Light Emitting Diode) Pending CN103668049A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201210329228.6A CN103668049A (en) 2012-09-07 2012-09-07 Mask plate assembly for use in vapor deposition of large-sized OLED (Organic Light Emitting Diode)
PCT/CN2013/082039 WO2014036894A1 (en) 2012-09-07 2013-08-22 Mask plate assembly for evaporating large-size oled
TW102216760U TWM474257U (en) 2012-09-07 2013-09-06 Mask plate component for large-size OLED evaporation
TW102132120A TWI500785B (en) 2012-09-07 2013-09-06 Mask plate component for large-size oled evaporation

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Application Number Priority Date Filing Date Title
CN201210329228.6A CN103668049A (en) 2012-09-07 2012-09-07 Mask plate assembly for use in vapor deposition of large-sized OLED (Organic Light Emitting Diode)

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TW (2) TWI500785B (en)
WO (1) WO2014036894A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105839052A (en) * 2016-06-17 2016-08-10 京东方科技集团股份有限公司 Mask board and assembling method of mask board
WO2017032248A1 (en) * 2015-08-22 2017-03-02 昆山允升吉光电科技有限公司 Small-opening mask plate for evaporation
CN106637073A (en) * 2016-10-14 2017-05-10 深圳市华星光电技术有限公司 Vacuum evaporation device
CN108269755A (en) * 2018-01-26 2018-07-10 武汉华星光电半导体显示技术有限公司 Mask plate and mask plate component
CN108796433A (en) * 2017-04-27 2018-11-13 京东方科技集团股份有限公司 Mask sheet, mask plate and its assemble method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102435236B1 (en) * 2020-10-07 2022-08-24 주식회사 효산 Producing method of mask and mask

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1378408A (en) * 2001-01-31 2002-11-06 东丽株式会社 Combined mask, method and equipment for producing organic electroluminescent device using said mask
US20030221613A1 (en) * 2002-05-31 2003-12-04 Samsung Nec Mobile Display Co., Ltd. Mask for evaporation, mask frame assembly including the mask for evaporation, and methods of manufacturing the mask and the mask frame assembly
JP2008255449A (en) * 2007-04-09 2008-10-23 Kyushu Hitachi Maxell Ltd Vapor deposition mask and manufacturing method thereof
CN202913044U (en) * 2012-09-07 2013-05-01 昆山允升吉光电科技有限公司 Mask plate assembly for evaporation of large-size OLED

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW545081B (en) * 2002-08-16 2003-08-01 Lightronik Technology Inc Bilayer metal shadow mask structure and fabrication process
KR101117645B1 (en) * 2009-02-05 2012-03-05 삼성모바일디스플레이주식회사 Mask Assembly and Deposition Apparatus using the same for Flat Panel Display
KR101030030B1 (en) * 2009-12-11 2011-04-20 삼성모바일디스플레이주식회사 Mask assembly
TWI410512B (en) * 2010-11-17 2013-10-01 Hon Hai Prec Ind Co Ltd Sputtering device
KR101837624B1 (en) * 2011-05-06 2018-03-13 삼성디스플레이 주식회사 Mask frame assembly for thin film deposition and the manufacturing method thereof
KR101295354B1 (en) * 2011-08-19 2013-08-12 (주)한 송 Mask frame assembly for evaporation and pssivation for manufacturing White OLED panel, manufacturing method and apparatus thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1378408A (en) * 2001-01-31 2002-11-06 东丽株式会社 Combined mask, method and equipment for producing organic electroluminescent device using said mask
US20030221613A1 (en) * 2002-05-31 2003-12-04 Samsung Nec Mobile Display Co., Ltd. Mask for evaporation, mask frame assembly including the mask for evaporation, and methods of manufacturing the mask and the mask frame assembly
JP2008255449A (en) * 2007-04-09 2008-10-23 Kyushu Hitachi Maxell Ltd Vapor deposition mask and manufacturing method thereof
CN202913044U (en) * 2012-09-07 2013-05-01 昆山允升吉光电科技有限公司 Mask plate assembly for evaporation of large-size OLED

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WO2017032248A1 (en) * 2015-08-22 2017-03-02 昆山允升吉光电科技有限公司 Small-opening mask plate for evaporation
CN105839052A (en) * 2016-06-17 2016-08-10 京东方科技集团股份有限公司 Mask board and assembling method of mask board
WO2017215286A1 (en) * 2016-06-17 2017-12-21 京东方科技集团股份有限公司 Mask plate and assembly method for mask plate
US10982314B2 (en) 2016-06-17 2021-04-20 Boe Technology Group Co., Ltd. Mask plate assembly capable of preventing wrinkle and assembly method thereof
CN106637073A (en) * 2016-10-14 2017-05-10 深圳市华星光电技术有限公司 Vacuum evaporation device
WO2018068389A1 (en) * 2016-10-14 2018-04-19 深圳市华星光电技术有限公司 Vacuum evaporation apparatus
CN108796433A (en) * 2017-04-27 2018-11-13 京东方科技集团股份有限公司 Mask sheet, mask plate and its assemble method
CN108796433B (en) * 2017-04-27 2024-01-30 京东方科技集团股份有限公司 Mask sheet, mask sheet and method of assembling the same
CN108269755A (en) * 2018-01-26 2018-07-10 武汉华星光电半导体显示技术有限公司 Mask plate and mask plate component
CN108269755B (en) * 2018-01-26 2020-08-04 武汉华星光电半导体显示技术有限公司 Mask plate assembly

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