CN105714246A - Method for manufacturing mask plate assembly for evaporation of OLED - Google Patents
Method for manufacturing mask plate assembly for evaporation of OLED Download PDFInfo
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- CN105714246A CN105714246A CN201610198879.4A CN201610198879A CN105714246A CN 105714246 A CN105714246 A CN 105714246A CN 201610198879 A CN201610198879 A CN 201610198879A CN 105714246 A CN105714246 A CN 105714246A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a method for manufacturing a mask plate assembly for evaporation of an OLED. The method comprises the following steps of: S1, a step of manufacturing a mask supporting layer; S2, a step of manufacturing a mask layer; and S3, a step of assembling the mask plate assembly, wherein the mask plate assembly manufactured by virtue of the method comprises at least one mask unit, and each mask unit is composed of two layers of structures including the mask layer and the mask supporting layer. By reasonably arranging the two layers of structures including the mask layer and the mask supporting layer of each mask unit, the mask plate assembly provided by the invention has a relatively high position precision, deposition of an organic material on the surface of a follow-up OLED substrate can be better satisfied, and the quality of an OLED product is effectively improved.
Description
Technical field
The invention belongs to display floater and make industry, be specifically related to a kind of evaporation mask plate assembly making method being applied in OLED display panel manufacturing process.
Background technology
Due to organic electroluminescent LED (OrganicLight-EmittingDiode, OLED) it is provided simultaneously with self-luminous, do not need that backlight, contrast are high, thickness is thin, visual angle is wide, response speed is fast, can be used for flexibility panel, use that temperature range is wide, construct and the excellent specific property such as processing procedure is simpler, it is believed that be the emerging application technology of follow-on flat-panel screens.
In OLED production process, a most important link is to be deposited with on substrate by organic layer according to the requirement driving matrix, forms crucial luminescence display unit.OLED luminescent material is a kind of solid material, and the development of its high accuracy paint-on technique is the key of restriction OLED commercialization.Completing this work at present, the main method adopting vacuum moulding machine or vacuum thermal evaporation (VTE), it is to will be located in the organic molecule mild heat (evaporation) in vacuum cavity so that these molecules condense upon on the substrate that temperature is relatively low in the form of a film.Need the precision mask board component adapted with OLED luminescence display unit precision as medium in this course.
Fig. 1 show the evaporation schematic diagram of OLED luminescent material, evaporation mask plate assembly 2 is fixed on plummer 3, mask plate 2 be provided above substrate 1 to be deposited, organic material vapor deposition source 4 in heating, vacuum chamber, the organic material being heated deposits ad-hoc location on substrate 1 by the through hole on mask plate component 2.Fig. 2 show the structural representation of existing vaporization coating template, and mask plate is by mask frame 22 and is arranged on mask frame 22 some mask unit 21 and collectively forms, and it is prepared by certain technique that mask unit 21 is generally invar sheets.The making schematic diagram that Fig. 3 show in prior art evaporation mask plate, is welded on mask frame 22 in certain sequence by the mask unit 21 tightened by external agency's (not shown).The structural scheme of mechanism that Fig. 4 show in prior art mask unit 21, mask unit 21 comprises evaporation district 211 and non-evaporation district 212, concrete (Fig. 5 show in Fig. 4 a region enlarged diagram) as shown in Figure 5, evaporation district 211 is made up of via-hole array, and non-evaporation district 212 is without through-hole structure；On the length direction (i.e. X-direction shown in relative Fig. 4) of mask unit 21, what the two ends of mask unit 21 extended is provided with outside bare terminal end 210, and outside bare terminal end 210 can pass through half groove carved and be connected with the non-evaporation district 212 of mask unit.Fig. 6 show the cross section enlarged diagram of the outside bare terminal end of mask plate and junction, mask unit non-evaporation district, outside bare terminal end 210 is connected by half groove 200 carved with the non-evaporation district 212 of mask plate, in actual application, outside bare terminal end 210, groove 200, mask plate non-evaporation district 212 are one-body molded, groove 200 can be formed by the mode such as etch process, laser cutting parameter, and the degree of depth of groove can be adjusted according to practical application.
The above mask plate component is when assembling, draw by certain rule outside bare terminal end 210 in two ends by outer clamping mechanisms (not shown) clamping mask unit mask unit 21 is stretched tight, mask unit 21 through hole that is flat and that constitute evaporation district 211 that stretches tight is made to be in specific position, then mask unit 21 is fixed by welding on mask frame 22, the outside bare terminal end 210(at each mask unit 21 two ends is removed in some prior aries finally by external force, the non-evaporation district of the outside bare terminal end at mask unit two ends and mask unit is directly connected to, it is absent from the sunk area at half quarter, so, then removed the outside bare terminal end at mask unit two ends by the mode of cut or machine cuts).
But, above prior art there is also a unavoidable technical problem, owing to the evaporation region 211 in mask unit 21 and non-evaporation district 212 have diverse structure (as shown in Figure 5, evaporation region 211 is via-hole array structure, non-evaporation district 212 is non through hole array structure), mask unit 21 is drawn under (stretching tight to draw to make plate face produce certain deformation) in stretching tight of external agency, the physics discontinuity in Shang Ge region, its surface, therefore the deformation in each region has certain difference, it is difficult to control to so that mask unit is deposited with the lead to the hole site precision being respectively used for depositing organic material in district 211.And reality is in the manufacturing process of OLED display, the vapor deposition accuracy of organic material determines the quality of final products, in consideration of it, industry is unanimously devoted to a kind of mask plate component with comparatively excellent positional precision of design.
Summary of the invention
In view of this, the invention provides a kind of OLED evaporation mask plate assembly making method, the mask plate component made by the present invention can effectively overcome problem above, and the positional precision of evaporation district through hole on effective raising mask plate, its concrete technical scheme is as follows.
A kind of OLED evaporation mask plate assembly making method, it comprises the following steps:
S1: mask support layer making step, makes surface and has the mask support layer of array hole graph area, and described array hole graph area is made up of continuous little aperture array；
S2: mask layer making step, it is coated with on mask support layer one surface completed or overlays one layer of organic photosensitive material, and form mask layer by exposure, developing process, described mask layer is provided with some mask open districts, described mask open district is formed by via-hole array, and described mask layer and described mask support layer collectively form mask unit；
S3: mask assembly number of assembling steps, tightens mask unit and is fixed on mask frame by certain rule after evening up, and forms mask plate component；
Adopting the mask plate component made by the present invention to comprise least one set mask unit, what described mask layer was fitted is arranged on mask support layer upper surface, and described mask unit is fixed on described mask frame by mask support layer；Described mask support layer is provided with the array hole graph area that continuous little opening is constituted；On described mask support floor, the coverage in array hole pattern district can be completely covered the mask open district on described mask layer, and the mask open district on described mask layer and array hole pattern district intersection on described mask support floor constitute mask plate evaporation district；Being deposited with inside district at described mask plate, the through hole constituting described mask layer mask open district is collectively forming evaporation passage with the little opening constituting described mask support floor array hole graph area.
Further, the size of described mask layer mask open district inner via hole is not more than on described mask support floor array hole graph area the size of little opening.
Further, described mask layer mask open district inner via hole be smaller in size than on described mask support floor array hole graph area the size of little opening, and the through hole in each mask open district is in the little open interior in respective array hole pattern district.
Further, in described mask assembly number of assembling steps S3, first permanent mask board component reticle mask unit, then the mask unit that alternately fixing both sides are adjacent successively.
The mask unit constituting the present invention is made up of double-layer structure, mask layer and mask support layer: wherein, the organic material vapor deposition region of the some mask open area definition mask plate components on mask layer, mask support layer is as the carrier of mask layer, and the through hole within mask layer mask open district is collectively forming the evaporation passage of organic material with the little opening on mask support floor array hole graph area.The positional precision of evaporation passage is together decided on by the little opening on mask support layer and the through hole on mask layer.
In the present invention, mask layer is directly against being attached on mask support layer, mask support layer stretched tight by external force draw that mode tightens be fixed on mask frame (i.e. mask unit when being fixed on mask frame, require over external force undertaken stretching tight drawing by mask support layer two ends), stretching tight in this external force is pulled through in journey, the deformation maintenance of mask layer is consistent with mask support layer, therefore stretches tight and draw the positional precision of little opening on rear mask support layer to determine by the deformation of mask support layer with the positional precision of through hole on mask layer.In other words, the positional precision of mask plate component evaporation passage depends primarily on the positional precision of little opening on mask support layer.
Mask support layer of the present invention is provided with the array hole graph area that the little opening of continuous print is constituted, owing to the little opening on mask support layer is continuous print array structure (namely large range of on mask support laminate face be set to little hatch frame), mask support layer is stretched tight draw time, on plate face, the physics force environment of each little opening is closer to, so that each regional deformation in mask support laminate face has relative uniformity.Based on this, engineering staff can be relatively easy to when designing mask plate supporting layer structure and realize aperture position compensation, thus producing the mask support layer that ensure that higher position precision is higher.
Further, on the length direction of described mask support layer, on described mask support floor, the region shape in array hole pattern district to be rectangle, two ends be dove-tail form or both ends are shrinkage type.
Further, the mask layer constituting described mask plate component mask unit is polymer composite, and described mask support layer is metal material.
Further, the mask layer constituting described mask plate component mask unit is made up of high-molecular photosensitive material, and described mask support layer is invar material.
In invention, adopt polymer composite to make mask layer and have the advantage that polymer composite has the feature of light weight, mask support layer will not be brought bigger load by it, reduces the overall sag of chain of mask unit, thus the precision offset reduced in use procedure；Macromolecular material is easily formed membranous type material, namely the thin film with thinner thickness is formed, the material thickness restriction to opening size can be reduced (for ensureing later stage evaporating quality, mask unit upper shed needs to meet certain " flakiness ratio ", namely opening size can not determine value less than a certain with the ratio of sheet thickness size, the ratio such as, requiring opening size and sheet thickness size in some prior aries have to be larger than 1), thus forming the through-hole structure that opening size is less on mask layer, and then the via-hole array that density is bigger can be formed, better to adapt to the high-resolution evaporation requirement of OLED.
Further, the mask support layer constituting described mask unit is to combine to make by one or more technique in laser technology, electroforming process, etch process to be formed；The mask layer constituting described mask unit is to make formation by the mode exposed, developing process combines.
Further, in described S3 step, the mask support layer constituting described mask plate component mask unit is directly anchored on described mask frame by laser welding process.
Further, the mask support layer two ends constituting described mask unit have the outside bare terminal end for clamping, and described outside bare terminal end is to extend to form at mask support layer two ends on the length direction of described mask unit.
Further, the outside bare terminal end at described mask support layer two ends is connected by groove with described mask support layer two ends, and the groove on described mask support layer is by etching or cut formation.
Further, further comprising the steps of after described S3 step:
S4: outside bare terminal end removal step, is removed by machinery or the mode of laser ablation removes the outside bare terminal end at described mask support layer two ends.
According in this patent background technology to described in prior art, the mask unit structure of prior art composition mask assembly is difficult to improve further the positional precision of mask evaporation district inner via hole, thus the positional precision of vapor deposition organic material on follow-up oled substrate is brought limitation.Above technical scheme mask unit provided by the present invention is made up of double-layer structure, the array hole graph area regional area of the mask open district of mask layer and mask support floor collectively forms mask plate evaporation district, reasonably design can effectively improve the positional precision of the mask plate component mask plate evaporation district inner via hole of composition, thus preparing the OLED product of excellent performance.
Aspect and advantage that the present invention adds will part provide in the following description, and part will become apparent from the description below, or is recognized by the practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or the additional aspect of the present invention and advantage will be apparent from easy to understand from the following description of the accompanying drawings of embodiments, wherein:
Fig. 1 show the evaporation schematic diagram of OLED luminescent material；
Fig. 2 show the structural representation of existing vaporization coating template；
The making schematic diagram that Fig. 3 show in prior art evaporation mask plate；
The structural scheme of mechanism that Fig. 4 show in prior art mask unit 21；
Fig. 5 show in Fig. 4 a region enlarged diagram；
Fig. 6 show the cross section enlarged diagram of the outside bare terminal end of mask plate and junction, mask unit non-evaporation district；
Fig. 7 show a kind of package assembly schematic diagram of present invention high accuracy evaporation mask plate assembly；
Fig. 8 show mask plate component Making programme schematic diagram；
Fig. 9 show the supporting layer floor map constituting mask unit of the present invention；
The enlarged diagram that Figure 10 show in Fig. 9 b region；
Figure 11 show the mask layer one floor map constituting mask unit of the present invention；
The enlarged diagram that Figure 12 show in Figure 11 c region；
Figure 13 show the close-up schematic view (schematic diagram that namely structure shown in Figure 10 and Figure 12 fits together) of mask unit；
Figure 14 show the close-up schematic view in cross section shown in Fig. 8；
Figure 15 show another embodiment floor map of supporting layer of the present invention；
Figure 16 show the third different embodiment floor map of supporting layer of the present invention.
In Fig. 1,1 is substrate to be deposited, and 2 is mask plate component, and 21 is mask unit, and 22 is mask frame, and 3 is plummer, and 4 is organic material vapor deposition source；
In Fig. 4,200 is groove, and 210 is outside bare terminal end, and 211 is non-evaporation district for evaporation district 211,212；
In Fig. 7,71 is mask layer, and 72 is supporting layer, and 73 is mask frame, 1. 2. 3. 4. 5. 6. 7. 8. 9. represents the erection sequence of corresponding mask unit respectively；；
In Fig. 8,711 is mask open district, and 712 is mask blocked area, and 721 is supporting layer array hole graph area, and 722 is the non-open region of supporting layer, and 80 are deposited with district for mask plate；
In Fig. 9,701 is groove, and 720 is outside bare terminal end, and 7200 is clamping end, and b is region to be amplified；
In Figure 10,7210 is the little opening constituting supporting layer array hole graph area 721
In Figure 11, c is region to be amplified；
In Figure 12,7110 is the through hole constituting mask open district 711；
Figure 15, in 16,7211 is the end of array hole graph area 721.
Detailed description of the invention
Being described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of same or like function from start to finish.The embodiment described below with reference to accompanying drawing is illustrative of, and is only used for explaining the present invention, and is not construed as limiting the claims.
In describing the invention, it will be appreciated that, term " on ", D score, " end ", " top ", "front", "rear", " interior ", " outward ", " horizontal stroke ", the orientation of the instruction such as " erecting " or position relationship be based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than instruction or hint indication device or element must have specific orientation, with specific azimuth configuration and operation, be therefore not considered as limiting the invention.
Fig. 7 show a kind of package assembly schematic diagram of present invention high accuracy evaporation composite mask board component；Fig. 8 show mask plate component Making programme schematic diagram.
In the present embodiment, a kind of OLED evaporation uses compound mask plate assembly making method, and it comprises the following steps:
S1: mask support layer making step, makes surface and has the mask support layer 72 of array hole graph area 721, and array hole graph area 721 is made up of continuous little opening 7210 array；
S2: mask layer making step, it is coated with on mask support layer 72 1 surface completed or overlays one layer of organic photosensitive material, and form mask layer 71 by exposure, developing process, mask layer 71 is provided with some mask open districts 711, mask open district 711 is formed by through hole 7110 array, and mask layer 71 and mask support layer 72 collectively form mask unit；
S3: mask assembly number of assembling steps, tightens mask unit and is fixed on mask frame 73 by certain rule after evening up, and forms mask plate component；
Mask plate component after assembling includes mask frame 73 and the least one set mask unit being arranged on described mask frame, and specifically in the present embodiment, mask unit is 9 groups.Mask unit is by mask support layer 72 and is arranged on the mask layer 71 above mask support layer 72 and constitutes, mask layer 71 laminating be arranged on mask support layer 72 upper surface, mask unit is fixed on mask frame 73 by mask support layer 72；Being provided with some mask open districts 711 on mask layer 71, mask open 711 district is formed by through hole 7110 array, specifically in the present embodiment, mask layer 71 is provided with 6 mask open districts 711；Mask support layer 72 is provided with the array hole graph area 721 that continuous little opening 7210 is constituted；On mask support floor 72, the coverage in array hole pattern district 721 can be completely covered the mask open district 711 on mask layer 71, and the mask open district 711 on mask layer 71 and array hole pattern district 721 intersection on mask support floor 72 constitute mask plate evaporation district 80；Being deposited with inside district 80 at mask plate, the through hole 7110 constituting mask layer 71 mask open district 711 is collectively forming evaporation passage with the little opening 7210 constituting mask support floor 72 array hole graph area 721.There is inside each mask plate evaporation district a series of mask passage (with reference to Figure 14, follow-up doing further is launched).
In certain embodiments, the mask unit constituting mask assembly can also only have one group, and namely mask unit is made up of a piece of complete mask layer 71 and a piece of complete mask support layer 72；In further embodiments, the quantity of mask unit is many groups, but is not limited to 9 groups, and its particular number suitably adjusts according to the size of mask plate component.
It addition, in certain embodiments, the quantity in the mask open district on mask layer 71 is not limited to 6, and its particular number and position distribution can appropriately adjust all in accordance with actual requirement.
Fig. 8 show in Fig. 7 mask unit along the schematic cross-section in A-A ' direction, its displaying is mask layer 71, mask support layer 72, mask frame 73 cross section structure that constitutes mask plate component, array hole graph area 721 has bigger coverage, it is possible to be completely covered in mask open district 711 on mask layer 71.When organic material is deposited with, organic material first passes through the little opening 7210 being in mask plate evaporation district 80 on mask support floor 72, then through the through hole 7110 in the mask open district 711 on mask layer 71, is deposited on the ad-hoc location on substrate.
In one embodiment of this invention, little opening 7210 size uniform constituting mask support layer 72 array hole graph area 721 is consistent.Fig. 9 show the floor map of mask support layer 72 of the present invention, the enlarged diagram that Figure 10 show in Fig. 9 b region, as shown in the figure, on mask support floor 72, array hole pattern district 721 is made up of the little aperture array of a series of size uniforms that (shape of concrete opening can be circular, rectangle and other polygons, figure does not show one by one), both sides, array hole graph area 721 are the non-open region 722 of supporting layer.In the present embodiment, the little opening 7210 in forming array hole pattern district 721 is uniformly equidistantly distributed on the array hole graph area 721 of mask support floor 72；Certainly, as the deformation of the present embodiment, the distribution mode (such as the size of little opening, adjacent spacing) of the little opening 7210 mask support floor 72 being in mask plate evaporation district 80 (not shown) different from the distribution mode of the little opening 7210 being in outside mask plate evaporation district 80.
Figure 11 show the floor map of mask layer 71 of the present invention, the enlarged diagram that Figure 12 show in Figure 11 c region.Being provided with 6 mask open districts arranged according to certain rules 711 on mask layer 71 and be arranged on the mask blocked area 712 of periphery, mask open district 711, mask open district 711 is formed by through hole 7110 array.When concrete structure designs, in the mask open district 711 on mask layer 71, the position of through hole 7110, size, number needs the factor such as position, deposition region to be deposited, size and area to adapt with on substrate.
Figure 13 show the close-up schematic view of mask unit, partial structurtes (direction of observation: from mask support layer 72 to mask layer 71) that mask layer 71 fits together with mask support layer 72 that what it was shown is；Figure 14 show the close-up schematic view in cross section shown in Fig. 8.In conjunction with Figure 13, Figure 14, the mask unit dependency structure of the present invention is made described further below: the little opening in the local in array hole pattern district 721 on mask support floor 72 is formed by the mask blocked area 712 of mask layer 71 to be blocked (in prevention evaporation process, organic material passes through), and each through hole 7110 in mask open district 711 is in the internal corresponding little opening 7210 in mask plate evaporation district 80 and collectively forms mask passage with array hole graph area 721.
In a particular embodiment of the present invention, the size of mask layer 71 mask open district 711 inner via hole 7110 is not more than on mask support floor 72 array hole graph area 721 size of little opening 7210.As shown in Figure 13, Figure 14, mask layer 71 mask open district 711 inner via hole 7110 be smaller in size than on mask support floor 72 array hole graph area 721 size of little opening 7210, and the through hole 7110 in each mask open district 711 to be in the little opening 7210 in respective array hole pattern district 721 internal, namely constituting the through hole 7110 of same mask passage, to be in little opening 7210 internal.
The mask unit constituting the present invention is made up of double-layer structure, mask layer 71 and mask support layer 72: wherein, some mask open districts 711 on mask layer 71 limit the organic material vapor deposition region of mask plate component, mask support layer 72 is as the carrier of mask layer 71, and the through hole 7110 within mask layer 71 mask open district 711 and the little opening 7210 on mask support floor 72 array hole graph area 721 are collectively forming the evaporation passage of organic material.The positional precision of evaporation passage is together decided on by the little opening 7210 on mask support layer 72 and the through hole 7110 on mask layer 71.
In the present invention, mask layer 71 is directly against being attached on mask support layer 72, mask support layer 72 stretched tight by external force draw that mode tightens be fixed on mask frame 73 (i.e. mask unit when being fixed on mask frame 73, require over external force undertaken stretching tight drawing by mask support layer 72 two ends), stretching tight in this external force is pulled through in journey, the deformation maintenance of mask layer 71 is consistent with mask support layer 72, therefore stretches tight and draw the positional precision of little opening 7210 on rear mask support layer 72 to determine by the deformation of mask support layer 72 with the positional precision of through hole 7110 on mask layer 71.In other words, the positional precision of mask plate component evaporation passage depends primarily on the positional precision of little opening 7210 on mask support layer 72.
Mask support layer 72 of the present invention is provided with the array hole graph area 721 that the little opening 7210 of continuous print is constituted, owing to the little opening 7210 on mask support layer 72 is continuous print array structure (namely large range of on mask support layer 72 plate face be provided with little opening 7210), mask support layer 72 is stretched tight draw time, on plate face, the physics force environment of each little opening is closer to, so that each regional deformation in mask support layer 72 plate face has relative uniformity.Based on this, engineering staff can be relatively easy to when designing mask plate supporting layer 72 structure and realize the compensation of little aperture position, thus producing the mask support layer that ensure that higher aperture position precision is higher.
As one embodiment of the invention, constituting the region shape in array hole pattern district 721 on mask support floor 72 is rectangle, as it is shown in figure 9, namely array hole graph area 721 is to be obtained by rectangular array by little opening 7210.
As another embodiment of the present invention, on the length direction of mask support layer 72, on mask support floor 72, the both ends 7211 in array hole pattern district 721 are dove-tail form, as shown in figure 14.In other embodiment, on the length direction of mask support layer 72, on mask support floor 72, the both ends 7211 in array hole pattern district 721 are shrinkage type, as shown in figure 15.Array hole graph area 721 is combined by dove-tail form or shrinkage type mode with non-open region 722, enable to when adopting external force that mask support layer 72 stretched tight to draw, on mask support floor 72, each regional deformation mode in array hole pattern district 721 reaches unanimity, and concrete model is not made to show at this.
Specifically constituting structure as mask unit of the present invention, the mask layer 71 constituting mask plate component mask unit is polymer composite, and mask support layer 72 is metal material.
In more specifically embodiment, the mask layer 71 constituting mask plate component mask unit is made up of high-molecular photosensitive material, mask support layer 72 is made up of the invar material that the coefficient of expansion is less, and the mask frame 73 constituting mask plate component is also made up of the material identical with mask support layer 72.Certainly as the extension of the present embodiment, the making material constituting mask unit of the present invention is not limited to above material.
In the present invention, adopt polymer composite to make mask layer and have the advantage that polymer composite has the feature of light weight, mask support layer will not be brought bigger load by it, reduces the overall sag of chain of mask unit, thus the precision offset reduced in use procedure；Macromolecular material is easily formed membranous type material, namely the thin film with thinner thickness is formed, the material thickness restriction to opening size can be reduced (for ensureing later stage evaporating quality, mask unit upper shed needs to meet certain " flakiness ratio ", namely opening size can not determine value less than a certain with the ratio of sheet thickness size, the ratio such as, requiring opening size and sheet thickness size in some prior aries have to be larger than 1), thus forming the through-hole structure that opening size is less on mask layer, and then the via-hole array that density is bigger can be formed, better to adapt to the high-resolution evaporation requirement of OLED.
As some embodiments of the present invention, the mask support layer 72 constituting mask plate component mask unit is made up of metal material, and it combines to make especially by one or more technique in laser technology, electroforming process, etch process and is formed.Will for it is easily understood that laser technology be by laser cutting parameter at metal sheet surface excision forming；Namely electroforming process forms mask support layer on a substrate by the mode of electroformed deposit；Etch process is the technique being formed certain openings by chemical etching process on metal sheet surface；It is adopt above several techniques to carry out reasonable disposition to realize the making of mask support layer 72 that kinds of processes combines, for instance first passes through electroforming process and realizes the making of metal sheet, then adopts etch process to carry out the final molding of opening figure.In some more specifically embodiment, mask support layer 72 is made up of the invar material that the coefficient of expansion is less, the mask frame constituting mask plate component is also made up of identical material, owing to invar material has comparatively excellent thermal coefficient of expansion, its temperature influence in follow-up organic material evaporation process is less.Certainly as the extension of the present embodiment, the making material constituting mask support layer of the present invention is not limited to metal material, and the method for making mask support layer is also not limited to above specifically enumerate technique.
Further extension as above example, constitute mask plate component mask unit of the present invention and by laser welding process, mask support layer 72 is fixed on mask frame 73, being specifically welded and fixed in process the welding organizing mask unit, there is certain order more, it is usually according to first reticle mask element solder being fixed on mask frame 73, then the mask unit away from centre position is welded successively, specifically in mask assembly number of assembling steps S3 of the present invention, first permanent mask board component reticle mask unit, then the mask unit that alternately fixing both sides are adjacent successively.With reference to Fig. 7,1. 2. 3. 4. 5. 6. 7. 8. 9. represent the erection sequence of corresponding mask unit respectively, namely in the present embodiment according to being first fixed on mask frame 73 by reticle mask unit, then fix the mask unit away from centre position successively.Time in actual installation process, in advance mask frame 73 both sides (namely for the both sides of permanent mask unit) can be applied certain pressure, and carry out discharging (or progressively release in fixation procedure) after having fixed, better to improve in mask unit the positional precision of little opening in mask plate evaporation district 80.
As above one more specifically embodiment, the mask support layer 72 constituting mask plate component mask unit is to be directly anchored on mask frame 73 by laser welding process.The mask plate component of the present invention can also assemble otherwise, such as adopt gluing, the mode such as be mechanically fixed, it would however also be possible to employ other assembling sequence assembles.
The concrete assembling mode of mask plate component disclosed above is only in order to show the feasibility of the present invention, not as limitation of the present invention, the mask plate component of the present invention can also assemble otherwise, such as adopt gluing, the mode such as be mechanically fixed, it would however also be possible to employ other assembling sequence assembles.
Additionally, the following is supplementing further above example of the present invention, as shown in Fig. 9 (or Figure 15, Figure 16), mask support layer 72 two ends constituting mask unit of the present invention have the outside bare terminal end 720 for clamping, outside bare terminal end 720 is to extend to form at mask support layer 72 two ends, and outside bare terminal end 720 is typically provided with multiple due to the clamping end 7200 of clamping.In one specific embodiment, the outside bare terminal end 720 at mask support layer 72 two ends open region 722 non-with the supporting layer at mask open layer two ends is connected by groove 701, and groove 701 can Tong Bu with the little opening 7210 in array hole pattern district 721 on mask support floor 72 be formed.Concrete, groove 701 can pass through to etch or cut formation.In other specific embodiments, groove 701 can not also be had between outside bare terminal end 720 and the non-open region 722 of supporting layer at mask open layer two ends at mask open layer 72 two ends, it is so designed that in follow-up mask plate assembling process, it is necessary to adopt the mode of mechanically cutting or cut to remove the outside bare terminal end 720 at mask open layer 72 two ends.
According in this patent background technology to described in prior art, the mask unit structure of prior art composition mask assembly is difficult to improve further the positional precision of mask evaporation district inner via hole, thus the positional precision of vapor deposition organic material on follow-up oled substrate is brought limitation.Above technical scheme mask unit provided by the present invention is made up of double-layer structure, the array hole graph area regional area of the mask open district of mask layer and mask support floor collectively forms mask plate evaporation district, reasonably design can effectively improve the positional precision of the mask plate component mask plate evaporation district inner via hole of composition, thus preparing the OLED product of excellent performance.
It addition, further comprising the steps of after the S3 step of the present invention:
S4: outside bare terminal end removal step, is removed by machinery or the mode of laser ablation removes the outside bare terminal end at described mask support layer two ends, thus obtaining complete mask plate component
In the present invention, any concrete component, structure or feature mentioning that " embodiment ", " embodiment ", " illustrative examples " etc. mean in conjunction with this embodiment describes is contained at least one embodiment of the present invention.It is not necessarily referring to identical embodiment this specification this schematic representation everywhere.And, when describing concrete component, structure or feature in conjunction with any embodiment, to advocate, the embodiment in conjunction with other realizes within the scope that such component, structure or feature all fall within those skilled in the art.
Although the specific embodiment of the present invention is described in detail by the multiple illustrative examples with reference to the present invention, it must be understood that, those skilled in the art can be designed that multiple other improvement and embodiment, these improve and embodiment will drop within spirit and scope.Specifically, within aforementioned open, accompanying drawing and scope of the claims, it is possible to make rational modification and improvement in the layout of parts and/or sub-combination layout, without departing from the spirit of the present invention.Except modification and the improvement of parts and/or layout aspect, its scope is defined by the appended claims and the equivalents thereof.
Claims (10)
1. an OLED evaporation mask plate assembly making method, it comprises the following steps:
S1: mask support layer making step, makes surface and has the mask support layer of array hole graph area, and described array hole graph area is made up of continuous little aperture array；
S2: mask layer making step, it is coated with on mask support layer one surface completed or overlays one layer of organic photosensitive material, and form mask layer by exposure, developing process, described mask layer is provided with some mask open districts, described mask open district is formed by via-hole array, and described mask layer and described mask support layer collectively form mask unit；
S3: mask assembly number of assembling steps, tightens mask unit and is fixed on mask frame by certain rule after evening up, and forms mask plate component；
It is characterized in that, described mask plate component comprises least one set mask unit, and what described mask layer was fitted is arranged on mask support layer upper surface, and described mask unit is fixed on described mask frame by mask support layer；Described mask support layer is provided with the array hole graph area that continuous little opening is constituted；On described mask support floor, the coverage in array hole pattern district can be completely covered the mask open district on described mask layer, and the mask open district on described mask layer and array hole pattern district intersection on described mask support floor constitute mask plate evaporation district；Being deposited with inside district at described mask plate, the through hole constituting described mask layer mask open district is collectively forming evaporation passage with the little opening constituting described mask support floor array hole graph area.
2. OLED evaporation mask plate assembly making method according to claim 1, it is characterised in that the size of described mask layer mask open district inner via hole is not more than on described mask support floor array hole graph area the size of little opening.
3. OLED evaporation mask plate assembly making method according to claim 2, it is characterized in that, described mask layer mask open district inner via hole be smaller in size than on described mask support floor array hole graph area the size of little opening, and the through hole in each mask open district is in the little open interior in respective array hole pattern district.
4. OLED evaporation mask plate assembly making method according to claim 1, it is characterized in that, mask support layer in described S1 step is made up of metal material, and it combines to make by one or more technique in laser technology, electroforming process, etch process and is formed.
5. the OLED evaporation mask plate assembly making method according to claim 1,2 or 3, it is characterised in that in described mask assembly number of assembling steps S3, first permanent mask board component reticle mask unit, then the mask unit that alternately fixing both sides are adjacent successively.
6. the OLED evaporation mask plate assembly making method according to claim 1,2 or 3, it is characterized in that, on the length direction of described mask support layer, on described mask support floor, the region shape in array hole pattern district to be rectangle, two ends be dove-tail form or both ends are shrinkage type.
7. the OLED evaporation mask plate assembly making method according to claim 1,2,3 or 4, it is characterized in that, in described S3 step, the mask support layer constituting described mask plate component mask unit is directly anchored on described mask frame by laser welding process.
8. OLED evaporation mask plate assembly making method according to claim 1, it is characterized in that, the mask support layer two ends constituting described mask unit have the outside bare terminal end for clamping, and described outside bare terminal end is to extend to form at mask support layer two ends on the length direction of described mask unit.
9. OLED evaporation mask plate assembly making method according to claim 7, it is characterized in that, the outside bare terminal end at described mask support layer two ends is connected by groove with described mask support layer two ends, and the groove on described mask support layer is by etching or cut formation.
10. the OLED evaporation mask plate assembly making method according to claim 7,8 or 9, it is characterised in that further comprising the steps of after described S3 step:
S4: outside bare terminal end removal step, is removed by machinery or the mode of laser ablation removes the outside bare terminal end at described mask support layer two ends.
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| CN201610198879.4A CN105714246A (en) | 2016-04-01 | 2016-04-01 | Method for manufacturing mask plate assembly for evaporation of OLED |
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