CN105821373A - Mask plate assembly for high-precision evaporation - Google Patents
Mask plate assembly for high-precision evaporation Download PDFInfo
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- CN105821373A CN105821373A CN201610198887.9A CN201610198887A CN105821373A CN 105821373 A CN105821373 A CN 105821373A CN 201610198887 A CN201610198887 A CN 201610198887A CN 105821373 A CN105821373 A CN 105821373A
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- evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a mask plate assembly for high-precision evaporation. The mask plate assembly comprises a mask frame and at least one set of mask units arranged on the mask frame. Each mask unit is formed by two layers of structures including a mask appearance layer and a mask opening layer; and through the reasonable arrangement of the structure of the two layers of structures including the mask appearance layers and the mask opening layers, the mask plate assembly can have the higher position precision, deposition of follow-up OLED substrate surface organic materials can be well achieved, and the quality of OLED products is effectively improved.
Description
Technical field
The invention belongs to display floater and make industry, be specifically related to a kind of evaporation mask plate assembly being applied in OLED display panel manufacturing process.
Background technology
Due to organic electroluminescent LED (OrganicLight-EmittingDiode, OLED) it is provided simultaneously with self-luminous, it is not required to the excellent specific properties such as backlight, contrast is high, thickness is thin, visual angle is wide, response speed is fast, can be used for flexibility panel, use that temperature range is wide, construct and processing procedure is simpler it is considered to be the emerging application technology of follow-on flat-panel screens.
In OLED production process, a most important link is to be deposited with on substrate according to the requirement driving matrix by organic layer, forms crucial luminescence display unit.OLED luminescent material is a kind of solid material, and the development of its high accuracy paint-on technique is the key of restriction OLED commercialization.Completing this work at present, main employing vacuum moulding machine or the method for vacuum thermal evaporation (VTE), it is to will be located in the organic molecule mild heat (evaporation) in vacuum cavity so that these molecules condense upon on the substrate that temperature is relatively low in the form of a film.Need the precision mask board component adapted with OLED luminescence display unit precision as medium in this course.
Fig. 1 show the evaporation schematic diagram of OLED luminescent material, evaporation mask plate assembly 2 is fixed on plummer 3, mask plate 2 be provided above substrate 1 to be deposited, organic material vapor deposition source 4 in heating, vacuum chamber, the organic material being heated deposits ad-hoc location on substrate 1 by the through hole on mask plate component 2.Fig. 2 show the structural representation of existing vaporization coating template, and mask plate is by mask frame 22 and is arranged on some mask unit 21 on mask frame 22 and collectively forms, and mask unit 21 generally invar sheets is prepared by certain technique.Fig. 3 show the making schematic diagram of evaporation mask plate in prior art, the mask unit 21 tightened by external agency's (not shown) is welded in certain sequence on mask frame 22.Fig. 4 show the structural scheme of mechanism of mask unit 21 in prior art, mask unit 21 comprises evaporation district 211 and non-evaporation district 212, concrete evaporation district 211 is made up of via-hole array the most as shown in Figure 5 (Fig. 5 show a region enlarged diagram in Fig. 4), and non-evaporation district 212 is without through-hole structure；On the length direction (i.e. relative to X-direction shown in Fig. 4) of mask unit 21, what the two ends of mask unit 21 extended is provided with outside bare terminal end 210, and outside bare terminal end 210 can be connected with the non-evaporation district 212 of mask unit by half groove carved.Fig. 6 show the cross section enlarged diagram of the outside bare terminal end of mask plate and junction, mask unit non-evaporation district, outside bare terminal end 210 evaporation non-with mask plate district 212 is connected by half groove 200 carved, in actual application, outside bare terminal end 210, groove 200, mask plate non-evaporation district 212 are one-body molded, groove 200 can be formed by the mode such as etch process, laser cutting parameter, and the degree of depth of groove can be adjusted according to reality application.
The above mask plate component is when assembling, drawn by the outside bare terminal end 210 in two ends of outer clamping mechanisms (not shown) clamping mask unit mask unit 21 is stretched tight by certain rule, mask unit 21 through hole that is flat and that constitute evaporation district 211 that stretches tight is made to be in specific position, then mask unit 21 is fixed by welding on mask frame 22, the outside bare terminal end 210(at each mask unit 21 two ends is removed in some prior aries finally by external force, the outside bare terminal end at mask unit two ends is directly connected to the non-evaporation district of mask unit, there is not the sunk area at half quarter, so, by the way of cut or machine cuts, then remove the outside bare terminal end at mask unit two ends).
But, above prior art there is also a unavoidable technical problem, owing to the evaporation region 211 in mask unit 21 and non-evaporation district 212 have diverse structure (as shown in Figure 5, evaporation region 211 is via-hole array structure, non-evaporation district 212 is non through hole array structure), mask unit 21 is under (stretching tight to draw to make plate face produce certain deformation) is drawn in stretching tight of external agency, the physics discontinuity in Shang Ge region, its surface, therefore the deformation in each region has certain difference, so that the lead to the hole site precision being respectively used for depositing organic material in mask unit in evaporation district 211 is difficult to control to.And reality is in the manufacturing process of OLED display, the vapor deposition accuracy of organic material determines the quality of final products, in consideration of it, industry is unanimously devoted to design a kind of mask plate component with more excellent positional precision.
Summary of the invention
In view of this, the invention provides a kind of high accuracy evaporation mask plate assembly, the mask plate component of the present invention can effectively overcome problem above, and effective raising mask plate is deposited with the positional precision of district's through hole, and its concrete technical scheme is as follows.
A kind of high accuracy evaporation mask plate assembly, it includes mask frame and the least one set mask unit being arranged on described mask frame, described mask unit is made up of mask profile layer, mask open layer double-layer structure, described mask profile layer is fixed on mask frame, and what described mask open laminating closed is arranged on mask profile layer upper surface；It is provided with some profile openings on described mask profile layer, the array hole graph area that the little opening of continuous print is constituted it is provided with on described mask open layer, on described mask open floor, the coverage in array hole pattern district can be completely covered the profile opening on described mask profile floor, and the profile opening on described mask profile floor and array hole pattern district intersection on described mask open floor constitute mask plate evaporation district.
The mask unit constituting the present invention is made up of double-layer structure, mask profile layer and mask open layer: wherein, and mask profile layer provides profile opening, limits the organic material vapor deposition region of mask plate component；Being arranged on the mask open layer above mask profile layer and be provided with the array hole graph area that the little opening of continuous print array is constituted, the little opening that array hole graph area is in profile open interior constitutes the mask plate evaporation district through hole for vapor deposition organic material.Owing to the little opening on mask open layer is continuous print array structure (i.e. large range of on mask open laminate face be set to through-hole structure), mask open layer is stretched tight draw time, on plate face, the physics force environment of each little opening is closer to, so that each regional deformation in mask open laminate face has relative uniformity.Based on this, engineering staff can be relatively easy to realize aperture position and compensate when designing mask plate opening Rotating fields, thus produces the mask assembly that positional precision is higher.
Further, described mask open layer is constituted the described little opening size uniformity of described array hole graph area.
Further, on the length direction of mask open layer, on described mask open floor, the region shape in array hole pattern district is that rectangle, two ends are dove-tail form or two ends are shrinkage type.
Further, in described mask plate evaporation district, the little opening of array on described mask open layer is complete through-hole structure.
Further, constitute the mask profile layer of described mask plate component mask unit, mask open layer is made up of identical metal material.
Further, constitute the mask profile layer of described mask plate component mask unit, mask open layer is made by invar material.
Further, constitute the mask profile layer of described mask plate component mask unit, mask open layer is to combine to make by one or more technique in laser technology, electroforming process, etch process to be formed.
Further, the mask profile layer constituting described mask plate component mask unit is fixed on described mask frame by laser welding process, and the mask open layer constituting described mask unit is fixed on described mask profile layer by laser welding process.
Further, constituting the mask profile layer of described mask unit, mask open layer two ends are respectively provided with the outside bare terminal end for clamping, described outside bare terminal end is to extend formation at mask profile layer, mask open layer two ends on the length direction of described mask unit.
Further, described mask profile layer, the outside bare terminal end at mask open layer two ends are connected by groove with described mask profile layer, mask open layer two ends respectively.
According in this patent background technology to described in prior art, prior art constitutes the mask unit structure of mask assembly and is difficult to improve further the positional precision of mask evaporation district inner via hole, thus the positional precision of vapor deposition organic material on follow-up oled substrate is brought limitation.Above technical scheme mask unit provided by the present invention is made up of double-layer structure, the profile opening of mask profile floor and the little aperture array of mask open floor collectively form mask plate evaporation district, reasonably design the positional precision of the mask plate component mask plate evaporation district inner via hole that can effectively improve composition, thus prepare the OLED product of excellent performance.
Aspect and advantage that the present invention adds will part be given in the following description, and part will become apparent from the description below, or is recognized by the practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or the additional aspect of the present invention and advantage will be apparent from easy to understand from the following description of the accompanying drawings of embodiments, wherein:
Fig. 1 show the evaporation schematic diagram of OLED luminescent material；
Fig. 2 show the structural representation of existing vaporization coating template；
Fig. 3 show the making schematic diagram of evaporation mask plate in prior art；
Fig. 4 show the structural scheme of mechanism of mask unit 21 in prior art；
Fig. 5 show a region enlarged diagram in Fig. 4；
Fig. 6 show the cross section enlarged diagram of the outside bare terminal end of mask plate and junction, mask unit non-evaporation district；
Fig. 7 show a kind of package assembly schematic diagram of present invention high accuracy evaporation mask plate assembly；
Fig. 8 show in Fig. 7 mask unit along the schematic cross-section in A-A ' direction；
Fig. 9 show a kind of floor map of mask open layer of the present invention；
Figure 10 show the enlarged diagram in b region in Fig. 9；
Figure 11 show a kind of floor map of mask profile layer of the present invention；
Figure 12 show the close-up schematic view of mask unit；
Figure 13 show another embodiment floor map of mask open layer of the present invention；
Figure 14 show the third different embodiment floor map of mask open layer of the present invention.
In Fig. 1,1 is substrate to be deposited, and 2 is mask plate component, and 21 is mask unit, and 22 is mask frame, and 3 is plummer, and 4 is organic material vapor deposition source；
In Fig. 4,200 is groove, and 210 is outside bare terminal end, and 211 is evaporation district 211, and 212 is non-evaporation district；
In Fig. 7,71 is mask profile layer, and 72 is mask open layer, and 73 is mask frame；
In Fig. 8,711 is profile opening, and 712 is profile masked area, and 721 is array hole graph area, and 722 is non-open region, and 80 are deposited with district for mask plate；
In Fig. 9,701 is groove, and 720 is outside bare terminal end, and 7200 is clamping end, and b is region to be amplified；
In Figure 11,700 is groove, and 710 is outside bare terminal end；
In Figure 13,7210 is the end of array hole graph area 721.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, and the most same or similar label represents same or similar element or has the element of same or like function.The embodiment described below with reference to accompanying drawing is exemplary, is only used for explaining the present invention, and is not construed as limiting the claims.
In describing the invention, it will be appreciated that, term " on ", D score, " end ", " top ", "front", "rear", " interior ", " outward ", " horizontal ", the orientation of the instruction such as " erecting " or position relationship be based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than instruction or hint indication device or element must have specific orientation, with specific azimuth configuration and operation, be therefore not considered as limiting the invention.
Being illustrated in figure 7 a kind of package assembly schematic diagram of present invention high accuracy evaporation mask plate assembly, the mask plate component after assembling includes mask frame 73 and the many groups mask unit being arranged on mask frame 73, and specifically in the present embodiment, mask unit is 9 groups.Mask unit is made up of mask profile layer 71, mask open layer 72 double-layer structure, and mask profile layer 71 is fixed on mask frame 73, and what mask open layer 72 was fitted is arranged on mask profile layer 71 upper surface；Some profile openings 711 it are provided with on mask profile layer 71, the most in the present embodiment, 6 profile openings 711 it are provided with on mask profile layer 71, the array hole graph area 721 that the little opening of continuous print is constituted it is provided with on mask open layer 72, on mask open floor 72, the coverage in array hole pattern district 721 can be completely covered the profile opening 711 on mask profile floor 71, and the profile opening 711 on mask profile floor 71 and array hole pattern district 721 intersection on mask open floor 72 constitute mask plate evaporation district 80.
In certain embodiments, the mask unit constituting mask assembly can also only have one group, i.e. mask unit is made up of a piece of complete mask profile layer 71 and a piece of complete mask open layer 72；In further embodiments, the quantity of mask unit is many groups, but is not limited to 9 groups, and its particular number suitably adjusts according to the size of mask plate component.
It addition, in certain embodiments, the quantity of the profile opening on mask profile layer 71 is not limited to 6, and its particular number and position distribution can appropriately adjust all in accordance with actual requirement.
Fig. 8 show in Fig. 7 mask unit along the schematic cross-section in A-A ' direction, what it was shown is mask profile layer 71, mask open layer 72, mask frame 73 constitute the cross section structure of mask plate component, array hole graph area 721 has bigger coverage, it is possible to be completely covered by profile opening 711 on mask profile layer 71.When evaporation, organic material first passes through the profile opening 711 on mask profile layer 71, then by the little opening being in mask plate evaporation district 80 on mask open floor 72, the ad-hoc location being deposited on substrate.
In one embodiment of this invention, the little opening size uniformity of array hole graph area 721 described in mask open layer 72 is constituted.Fig. 9 show the floor map of mask open layer 72 of the present invention, Figure 10 show the enlarged diagram in b region in Fig. 9, as shown in the figure, on mask open floor 72, array hole pattern district 721 is made up of the little aperture array of a series of size uniforms that (shape of concrete opening can be circular, rectangle and other polygons, figure is shown the most one by one), both sides, array hole graph area 721 are non-open region 722.In the present embodiment, the little opening in forming array hole pattern district 721 is the most equidistantly distributed on the array hole graph area 721 of mask open floor 72；Certainly, as the deformation of the present embodiment, mask open floor 72 is in the distribution mode (such as size, the adjacent spacing of little opening) of the little opening in mask plate evaporation district 80 and the different (not shown) of distribution mode of the little opening being in outside mask plate evaporation district 80.
Figure 11 show the floor map of mask profile layer 71 of the present invention, mask profile layer 71 is provided with 6 profile openings arranged according to certain rules 711 and is arranged on the profile masked area 712 of periphery, profile open region 711.When concrete structure designs, the position of profile opening on mask profile layer 71, size dimension need that position, deposition region to be deposited and size adapt with on substrate.
In the present invention, mask profile layer 71 provides the organic material vapor deposition region that profile opening 711, profile opening 711 limit mask plate component；It is provided with the array hole graph area 721 that the little opening of continuous print array is constituted on mask open layer 72, array hole graph area 721 is in the little opening within profile opening 711 and constitutes the mask plate evaporation district 80 through hole for vapor deposition organic material.In the application, organic material deposition position on substrate has strict requirements, and the deposition position of organic material is to be determined by the position of the little opening 721 in mask plate component evaporation region 80.Owing to the little opening on mask open layer 72 is continuous print array structure (i.e. large range of on mask open layer 72 plate face be set to through-hole structure), mask open layer 72 is stretched tight draw time, on plate face, the physics force environment of each little opening is closer to, so that each regional deformation above mask open layer 72 plate has relative uniformity.Based on this, engineering staff can be relatively easy to realize aperture position and compensate when designing mask plate opening Rotating fields, thus produces the mask assembly that positional precision is higher.
Figure 12 show the close-up schematic view of mask unit, partial structurtes that mask profile layer 71 fits together with mask open layer 72 that what it was shown is, the little opening in local in array hole pattern district 721 on mask open floor 72 is formed and blocks by the profile masked area 712 of mask profile floor 71, and profile opening 711 and the array hole graph area 721 of mask profile floor 71 is in the little opening within profile opening 711 and collectively forms mask plate evaporation district 80.In the present embodiment, inside mask plate evaporation district 80, the little opening of array on mask open layer 71 is complete through-hole structure, as it can be seen, the little edge of opening line on edge line and the mask open layer 72 of i.e. mask profile layer 71 profile opening 711 is without cross point.
As one embodiment of the invention, constituting the region shape in array hole pattern district 721 on mask open floor 72 is rectangle, as it is shown in figure 9, i.e. array hole graph area 721 is to be obtained by rectangular array by little opening.
As another embodiment of the present invention, on the length direction of mask open layer 72, on mask open floor 72, the both ends 7210 in array hole pattern district 721 are dove-tail form, as shown in figure 13.In other embodiment, on the length direction of mask open layer 72, on mask open floor 72, the both ends 7210 in array hole pattern district 721 are shrinkage type, as shown in figure 14.Array hole graph area 721 is combined by dove-tail form or shrinkage type mode with non-open region 722, enable to when using external force that mask open layer 72 stretched tight to draw, on mask open floor 72, each regional deformation mode in array hole pattern district 721 reaches unanimity, and concrete model is not made at this to show.
As some embodiments of the present invention, the composition mask profile layer 71 of mask plate component mask unit, mask open layer 72 are made up of identical metal material.In some more specifically embodiment, it is constituted by the invar material that the coefficient of expansion is less, and the mask frame constituting mask plate component is also made up of identical material.Certainly as the extension of the present embodiment, the making material constituting mask unit of the present invention is not limited to metal material.
It addition, the composition mask profile layer 71 of mask plate component mask unit of the present invention, mask open layer 72 are to combine to make by one or more technique in laser technology, electroforming process, etch process to be formed.
Further extension as above example, the mask profile layer 71 constituting mask plate component mask unit of the present invention is fixed on mask frame 73 by laser welding process, and the mask open layer 72 constituting mask unit is fixed on described mask profile layer by laser welding process.During being specifically welded and fixed, the welding of many group mask unit has certain order, is usually according to first reticle mask element solder being fixed on mask frame 73, welds the mask unit away from centre position the most successively；It is of course also possible to be first weldingly fixed on mask frame 73 by whole mask profile layers 71, by certain rule, mask open layer 72 is being welded and fixed mask profile layer 71 surface.
The concrete assembling mode of mask plate component disclosed above is only in order to show the feasibility of the present invention, not as limitation of the present invention, the mask plate component of the present invention can also assemble otherwise, such as use gluing, the mode such as be mechanically fixed, it would however also be possible to employ other assembling sequence assembles.
Additionally, the following is supplementing further above example of the present invention, as shown in Fig. 9 (or Figure 13, Figure 14), mask open layer 72 two ends constituting mask unit of the present invention have the outside bare terminal end 720 for clamping, outside bare terminal end 720 is to extend at mask open layer 72 two ends to be formed, and outside bare terminal end 720 is typically provided with multiple due to the clamping end 7200 of clamping.Typically, the outside bare terminal end 720 at mask open layer 72 two ends is connected by groove 701 with the non-open region 722 at mask open layer two ends.In certain embodiments, groove 701 can not also be had between outside bare terminal end 720 and the non-open region 722 at mask open layer two ends at mask open layer 72 two ends, it is so designed that in follow-up mask plate assembling process, needs the outside bare terminal end 720 using the mode of mechanically cutting or cut to remove mask open layer 72 two ends.
Identical with mask open layer 72 structure design, as shown in figure 11, mask profile layer 71 two ends constituting mask unit of the present invention have the outside bare terminal end 710 for clamping, outside bare terminal end 710 is to extend at mask profile layer 71 two ends to be formed, and outside bare terminal end 710 is typically provided with multiple due to the clamping end of clamping.Typically, the outside bare terminal end 710 at mask profile layer 71 two ends is connected by groove 700 with the profile masked area 712 at mask profile layer 71 two ends.
According in this patent background technology to described in prior art, prior art constitutes the mask unit structure of mask assembly and is difficult to improve further the positional precision of mask evaporation district inner via hole, thus the positional precision of vapor deposition organic material on follow-up oled substrate is brought limitation.Above technical scheme mask unit provided by the present invention is made up of double-layer structure, the profile opening of mask profile floor and the little aperture array of mask open floor collectively form mask plate evaporation district, reasonably design the positional precision of the mask plate component mask plate evaporation district inner via hole that can effectively improve composition, thus prepare the OLED product of excellent performance.
In the present invention, any mention that " embodiment ", " embodiment ", " illustrative examples " etc. mean to combine concrete component, structure or feature that this embodiment describes and be contained at least one embodiment of the present invention.In this specification, this schematic representation everywhere is not necessarily referring to identical embodiment.And, when combining any embodiment and describing concrete component, structure or feature, advocated, realize such component, structure or feature in conjunction with other embodiment and all fall within the scope of those skilled in the art.
Although the detailed description of the invention of the present invention is described in detail by the multiple illustrative examples with reference to the present invention, it must be understood that, those skilled in the art can be designed that multiple other improvement and embodiment, these improve and embodiment will fall within spirit and scope.Specifically, within the scope of aforementioned disclosure, accompanying drawing and claim, rational modification and improvement can be made in terms of the layout of parts and/or sub-combination layout, without departing from the spirit of the present invention.Except the modification in terms of parts and/or layout and improvement, its scope is defined by the appended claims and the equivalents thereof.
Claims (10)
1. a high accuracy evaporation mask plate assembly, it includes mask frame and the least one set mask unit being arranged on described mask frame, it is characterized in that, described mask unit is made up of mask profile layer, mask open layer double-layer structure, described mask profile layer is fixed on mask frame, and what described mask open laminating closed is arranged on mask profile layer upper surface；It is provided with some profile openings on described mask profile layer, the array hole graph area that the little opening of continuous print is constituted it is provided with on described mask open layer, on described mask open floor, the coverage in array hole pattern district can be completely covered the profile opening on described mask profile floor, and the profile opening on described mask profile floor and array hole pattern district intersection on described mask open floor constitute mask plate evaporation district.
High accuracy evaporation mask plate assembly the most according to claim 1, it is characterised in that constitute the described little opening size uniformity of described array hole graph area on described mask open layer.
High accuracy evaporation mask plate assembly the most according to claim 1, it is characterised in that on the length direction of described mask open layer, on described mask open floor, the region shape in array hole pattern district is that rectangle, two ends are dove-tail form or both ends are shrinkage type.
4. according to the high accuracy evaporation mask plate assembly described in claim 1,2 or 3, it is characterised in that in described mask plate evaporation district, the little opening of array on described mask open layer is complete through-hole structure.
High accuracy evaporation mask plate assembly the most according to claim 1, it is characterised in that constitute the mask profile layer of described mask plate component mask unit, mask open layer is made up of identical metal material.
High accuracy evaporation mask plate assembly the most according to claim 5, it is characterised in that constitute the mask profile layer of described mask plate component mask unit, mask open layer is made by invar material.
7. according to the high accuracy evaporation mask plate assembly described in claim 1,2,3 or 5, it is characterized in that, constitute the mask profile layer of described mask plate component mask unit, mask open layer is to combine to make by one or more technique in laser technology, electroforming process, etch process to be formed.
8. according to the high accuracy evaporation mask plate assembly described in claim 1,2,3,5 or 7, it is characterized in that, the mask profile layer constituting described mask plate component mask unit is fixed on described mask frame by laser welding process, and the mask open layer constituting described mask unit is fixed on described mask profile layer by laser welding process.
High accuracy evaporation mask plate assembly the most according to claim 1, it is characterized in that, constitute the mask profile layer of described mask unit, mask open layer two ends are respectively provided with the outside bare terminal end for clamping, and described outside bare terminal end is to extend formed at mask profile layer, mask open layer two ends on the length direction of described mask unit.
High accuracy evaporation mask plate assembly the most according to claim 9, it is characterised in that described mask profile layer, the outside bare terminal end at mask open layer two ends are connected by groove with described mask profile layer, mask open layer two ends respectively.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610198887.9A CN105821373A (en) | 2016-04-01 | 2016-04-01 | Mask plate assembly for high-precision evaporation |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610198887.9A CN105821373A (en) | 2016-04-01 | 2016-04-01 | Mask plate assembly for high-precision evaporation |
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| CN105821373A true CN105821373A (en) | 2016-08-03 |
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| CN201610198887.9A Pending CN105821373A (en) | 2016-04-01 | 2016-04-01 | Mask plate assembly for high-precision evaporation |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106399934A (en) * | 2016-10-14 | 2017-02-15 | 深圳市华星光电技术有限公司 | Evaporation mask plate for special-shaped OLED (organic light emitting diode) product |
| CN107653435A (en) * | 2017-10-25 | 2018-02-02 | 信利（惠州）智能显示有限公司 | Mask device and its mask assembly, mask plate |
| WO2018120382A1 (en) * | 2016-12-28 | 2018-07-05 | 武汉华星光电技术有限公司 | Fine mask plate and manufacturing method thereof |
| CN108559947A (en) * | 2018-05-14 | 2018-09-21 | 昆山国显光电有限公司 | Mask plate, mask assembly and mask board manufacturing method |
| CN109252136A (en) * | 2017-07-12 | 2019-01-22 | 林义溢 | Multi-layer shield |
| WO2019064420A1 (en) * | 2017-09-28 | 2019-04-04 | シャープ株式会社 | Vapor deposition mask and vapor deposition mask manufacturing method |
| WO2019146017A1 (en) * | 2018-01-24 | 2019-08-01 | シャープ株式会社 | Vapor deposition mask and vapor deposition mask manufacturing method |
| CN110506342A (en) * | 2017-04-07 | 2019-11-26 | 创造未来有限公司 | Fine metal mask manufacture method |
| WO2021098304A1 (en) * | 2019-11-21 | 2021-05-27 | 昆山国显光电有限公司 | Mask, evaporation system, and mask preparation method |
| CN114293170A (en) * | 2020-10-07 | 2022-04-08 | 韩商则舒穆公司 | Mask manufacturing method and mask |
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| CN114293170B (en) * | 2020-10-07 | 2024-04-23 | 晓山公司 | Mask manufacturing method and mask |
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