TWM474257U - Mask plate component for large-size OLED evaporation - Google Patents

Abstract

A mask plate component for large-size OLED evaporation is provided, including a mask outer frame, a mask portion, and a mask support, wherein, the mask portion is connected with the mask support fixed to the mask outer frame; the mask support including multiple support units composed of support strips. The mask portion is provided with a mask opening thereon to compose a mask pattern area. The support unit does not block the mask opening. The invention is capable of solving problems such as reduced accuracy, low yield etc. due to sagged plate surface of a mask body, and the problem of displacement due to the current mask portion assembled by multiple mask units, to improve product quality effectively.

Description

Mask module for large size OLED evaporation

This creation is about the field of electronic printing, and more specifically, a mask assembly for large-size OLED evaporation.

Since the Organic Light-Emitting Diode (OLED) has self-luminous light, it does not require a backlight, has high contrast, thin thickness, wide viewing angle, fast response speed, can be used for flexible panels, and has a wide temperature range. The excellent characteristics of construction and manufacturing procedures are considered to be the next generation of flat panel display emerging application technologies.

One of the most important aspects of the OLED production process is to apply the organic layer to the substrate in accordance with the requirements of the driving matrix to form a key light-emitting display unit. OLED is a solid material, and the development of high-precision coating technology is the key to restricting the productization of OLED. At present, this work is mainly carried out by vacuum deposition or vacuum thermal evaporation (VTE), in which the organic molecules in the vacuum chamber are slightly heated (evaporated), so that these molecules are condensed in the form of a film at a lower temperature base. on. In this process, a high-precision mask module that is compatible with the accuracy of the OLED light-emitting display unit is required as a medium.

The mask plate is composed of a mask portion and a mask outer frame. FIG. 1 is a schematic structural view of a conventional small-size mask plate, which comprises an integrally formed mask portion 11 and a fixed integral mask portion. 11 mask outer frame 12. In practical applications, people hope to produce masks of larger size to meet the manufacturing needs of mass production and large-size OLED display screens. However, the production of large-size masks will have the following problems: the cover of large-size areas The membrane portion may be severely drooped due to its own weight. In order to solve this problem, the mask portion is designed to be assembled by a plurality of mask units. As shown in FIG. 2, the mask portion is composed of a plurality of mask units 20, and the mask unit 20 is passed through both ends. The fixing structure 200 is fixed on the outer frame of the mask. Since the mask unit 20 is fixed by fixing both ends, once the deviation between the two adjacent mask portions is fixed, a certain positional deviation is easily generated between the two. As a result, the yield of OLED products is difficult to further improve.

In view of this, the purpose of the present invention is to propose a mask module for large-size OLED evaporation to solve various defects in the prior art.

In order to achieve the above and other objects, the present invention provides a mask module for a large-sized OLED evaporation, including a mask frame, a mask portion, and a mask support portion, wherein the mask portion is fixed to the mask portion The mask support portion of the mask frame is connected; the mask support portion includes N or more than two support portion units; the support portion unit is composed of the support strip, and the mask portion has a mask opening, the support portion unit The mask opening is not obscured, and the mask opening constitutes a mask pattern area.

In an embodiment of the present invention, the mask portion has at least one mask pattern region.

In an embodiment of the present invention, any one of the mask openings on the mask portion is disposed between two adjacent support strips in the support portion, and the distance between the adjacent support strips is the mask opening. M times the pitch, the M is greater than or equal to 1 and is a positive integer.

In an embodiment of the present invention, the support portion is made of an alloy material having magnetic properties. Preferably, the support portion is made of Invar material.

In an embodiment of the present invention, the mask portion is made of a material that is resistant to abrasion, high temperature, acid and alkali, and has good adhesion to the support layer. Preferably, the mask portion is made of a polymer polymer material having stable properties.

In an embodiment of the present invention, the thickness of the support portion is in the range of 20 μm or more and 60 μm or less. Preferably, the thickness of the support portion is 20 μm, or 30 μm, or 40 μm, or 50 μm, or 60 μm.

In an embodiment of the present invention, the thickness of the mask portion is in the range of 2 μm or more and 20 μm or less. Preferably, the thickness of the mask portion is 2 μm, or 6 μm, or 10 μm, or 14 μm, or 18 μm, or 20 μm.

In an embodiment of the present invention, the mask opening pitch is 30 μm or more and 200 μm or less. Preferably, the mask opening pitch is 50 μm or more and 100 μm or less.

In an embodiment of the present invention, the support portion is configured to be in close contact with the support portion unit or to have a certain support portion unit spacing.

In an embodiment of the present invention, the support unit spacing may be m times the pitch of the mask opening, and m is an integer not less than zero.

Based on the above, according to the mask module assembly for large-size OLED evaporation provided by the present invention, the support portion can support the mask portion, the support portion is fixed on the mask frame, and the mask portion is fixed to the support portion. In the above, the position of the mask portions is determined relative to each other, so that the masks for high-precision, large-size OLED screen vapor deposition can be produced.

Compared to the conventional mask, an OLED display screen with a higher PPI (the number of pixels per inch represented by Pixels per inch) can be produced (each layer of the composite mask body is owned by each inch). The number of openings corresponds to the PPI of the OLED display screen). For example, when the distance between the center of the opening of the mask is 150 um, the corresponding PPI is 2.54 cm/150 um 169; and when the center distance d1 of the two supporting strips 3220 constituting the mask supporting portion is 150 um in the present creation (Figure 6), the actual PPI of the mask body for large-size OLED evaporation is PPI=2.54cm/d3=2.54cm/75um≈339, and the OLED screen thus produced is also 339PPI, which will surpass people. The limit of 300 PPI can be seen by the eye.

The material of the conventional mask is made of metal alloy. In this creation, the metal alloy material is used as the support layer, and the area corresponding to the mask pattern is reduced compared with the conventional mask, and the internal metal material is greatly reduced, although organic is added. The material constitutes a mask layer, but its quality is relatively light, resulting in a reduction in the overall quality of the composite mask. When the composite mask is fixed to the outer frame with the same tension, the internal sag of the composite mask will also decrease.

In order to make the above features and advantages of the present invention more comprehensible, the following embodiments are described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily appreciate other advantages and functions of the present invention from the disclosure of the present disclosure. The present invention can also be implemented or applied by various other specific embodiments. The details of the present specification can also be modified and changed without departing from the spirit and scope of the present invention.

It is to be understood that the structure, the proportions, the size and the like in the drawings are only used in conjunction with the disclosure of the specification for the understanding and reading of those skilled in the art, and are not intended to limit the creation. The qualifications of the implementation are not technically meaningful, and any modification of the structure, change of the proportional relationship or adjustment of the size shall remain in the interests of the creation and the purpose of the creation. The technical content disclosed in this creation can be covered. In the meantime, the terms "upper, lower", "one" and "bottom" as used in this specification are for convenience of description only, and are not intended to limit the scope of the creation of the creation. Changes or adjustments are considered to be within the scope of this creation if there is no material change in the material.

In addition, in the description of the present invention, it should be noted that the terms "coupled", "connected", "connected", and "connected" should be understood broadly, unless specifically stated and defined, for example, a fixed connection may be used. , integrally connected, may also be detachable connection; may be internal communication between two components; may be directly connected, or may be indirectly connected through an intermediate medium, for those skilled in the art, the above terms can be understood in specific circumstances The specific meaning in this creation.

The creative concept of this creation is as follows. Due to the problem that the large-size mask will sag in the production of large-sized panels in the conventional mask stretching technology, the larger the size, the problem of the sag of the mask will be on the accuracy and quality of the product. Great impact, while reducing the yield. The mask module for large-size OLED evaporation provided by the present invention reduces the original support function by modifying the mask layer in the mask module of the large-size OLED evaporation, and has only the pattern function. A separate support portion is added to increase the overall rigidity of the mask module assembly for large-size OLED evaporation, that is, to strengthen the overall structural strength. The use of the overall lighter material as the material of the mask portion and the support portion reduces the overall weight of the mask portion and the support portion, and also reduces the possible drop amount of the mask module for large-size OLED evaporation, while accurately fixing The support portion is then attached to the mask portion to make it more precise, making it easier to manufacture larger-sized panels.

The mask frame of the present invention and its corresponding mask assembly will be described below with reference to the accompanying drawings. FIG. 3 is a front view of a mask for large-size OLED evaporation in the present creation; FIG. 4 is corresponding to FIG. FIG. 5 is a schematic diagram of the back side of the mask for the large-size OLED evaporation; FIG. 6 is a schematic enlarged view of the area marked by the symbol 50 in FIG.

According to an embodiment of the present invention, a mask module for large-size OLED evaporation is provided. As shown in FIG. 3 to FIG. 6 , a mask module for large-size OLED evaporation provided by the present invention includes a mask. The outer frame 30, the mask portion 31 and the support portion 32, wherein the mask portion 31 is connected to the support portion 32 fixed to the mask outer frame 30; the support portion 32 includes at least two support portion units 320 . The support unit 320 is formed by the support strip 3200. The mask portion 31 has a mask opening 310. The support portion 320 does not block the mask opening 310, so that the mask opening 310 constitutes the mask. A mask pattern area on the film portion 31.

According to an embodiment of the present invention, the mask portion 31 has at least one mask pattern region.

According to the embodiment of the present invention, any one of the mask openings 310 on the mask portion 31 is disposed between two adjacent support strips 3200 of the support portion unit 320, and the adjacent support strip spacing d1 is the mask. M times the film opening pitch d3, which is greater than or equal to 1 and is a positive integer, as shown in FIG.

According to some embodiments of the present creation, the support strips 3200 are evenly arranged.

According to an embodiment of the present invention, the support portion 32 is made of an alloy material having magnetic properties. Preferably, the support portion 32 is made of Invar material.

According to an embodiment of the present invention, the mask portion 31 is made of a material that is resistant to abrasion, high temperature, acid and alkali, and has good adhesion to the support layer. Preferably, the mask portion 31 is made of a polymer polymer material having stable properties.

According to an embodiment of the present invention, the thickness h2 of the support portion is 20 μm or more and 60 μm or less, as shown in FIG.

According to some embodiments of the present invention, the support portion thickness h2 is 20 μm or 30 μm or 40 μm or 50 μm or 60 μm, as shown in FIG.

According to an embodiment of the present invention, the thickness h1 of the mask portion is greater than or equal to 2 μm and less than or equal to 20 μm, as shown in FIG.

According to some embodiments of the present invention, the mask portion thickness h1 is 2 μm or 6 μm or 10 μm or 14 μm or 18 μm or 20 μm, as shown in FIG.

According to an embodiment of the present invention, the mask portion has a thickness h1 of 6 μm and the support portion has a thickness h2 of 30 μm as shown in FIG.

According to an embodiment of the present invention, the mask opening pitch d3 is greater than or equal to 30 μm and less than or equal to 200 μm, as shown in FIG.

Preferably, the mask opening pitch d3 is 50 μm or more and 100 μm or less, as shown in FIG. 6.

In still another embodiment, the mask opening pitch may also be 75 μm.

According to an embodiment of the present invention, the mask opening pitch d3 is 75 μm as shown in FIG.

According to the embodiment of the present invention, the support portion 32 may be adjacent to the support portion unit 320 or may have a certain support portion unit spacing d2 as shown in FIG. 6.

Preferably, the support portion cell pitch d2 is m times the mask opening pitch d3, and m is an integer not less than zero, as shown in FIG.

The support unit 320 constituting the support portion 32 is disposed in a matrix region of the opening 310 as an open region formed by the support strip 3200. As shown in FIG. 6, the support strip 3200 constituting the open region is not positioned with the opening 310 on the mask portion 31. The positions of the support bars 3200 are evenly distributed, and the distance d1 between the adjacent two support bars 3200 and the distance d3 between the adjacent two rows of openings 310 on the mask portion 31 have the following relationship: d1=n*d3 (n=1, 2, 3, 4...).

Further, as shown in FIG. 6, there is a certain distance between adjacent support unit units constituting the mask support portion. Preferably, the pitch d2 and d3 have the following relationship: d2=n*d3 (n=0,1, 2,3,4...).

Any reference to "an embodiment", "an embodiment", "an exemplary embodiment" or the like means that a particular component, structure or feature described in connection with the embodiment is included in at least one embodiment of the present invention. The illustrative representations throughout the specification are not necessarily referring to the same embodiments. Further, when a specific component, structure, or feature is described in connection with any embodiment, it is claimed that such a component, structure, or feature in combination with other embodiments is within the scope of the present invention.

Although the specific embodiments of the present invention have been described in detail with reference to the exemplary embodiments of the present invention, it is understood that those skilled in the art can devise various other modifications and embodiments which Within the spirit and scope of this creative principle. In particular, it is possible to make reasonable modifications and improvements in the arrangement of components and/or sub-combination arrangements without departing from the spirit of the present invention.

11‧‧‧ is the mask department
12‧‧‧ is the mask frame for fixing the integral molding mask portion 11
20‧‧‧ is the mask unit
200‧‧‧ is the two ends of the mask unit
30‧‧‧ is the mask frame
31‧‧‧ is the mask department
32‧‧‧ is the support department
320‧‧‧ is the support unit
H1‧‧‧ is the thickness of the mask
H2‧‧‧ is the thickness of the support
50‧‧‧ is the part to be enlarged
3200‧‧‧ is a support strip
310‧‧‧ is the mask opening
D1‧‧‧ is the spacing of the support bars
D2‧‧‧ is the support unit spacing
D3‧‧‧ is the mask opening spacing.

Figure 1 is a schematic view showing the structure of a conventional small-sized mask; Figure 2 is a schematic view of a mask portion formed by a plurality of mask units; FIG. 4 is a schematic cross-sectional view taken along line AA of FIG. 3; FIG. 5 is a schematic view of the back surface of the mask for large-size OLED evaporation; and FIG. 6 is a diagram 5 is an enlarged schematic view of a region marked by the component symbol 50.

30‧‧‧ Mask frame

31‧‧‧ Mask Department

32‧‧‧Support

320‧‧‧Support unit

H1‧‧‧mask thickness

H2‧‧‧Support thickness

Claims (15)

A mask module for large-size OLED evaporation, comprising a mask outer frame, a mask portion, and a mask support portion, wherein the mask portion is connected to the mask support portion fixed to the mask outer frame The mask support portion includes at least two support portion units; the support portion unit is composed of a support strip having a mask opening on the mask portion, the support portion unit does not block the mask opening, and the mask opening constitutes Mask pattern area. The mask module assembly for large-size OLED evaporation according to claim 1, wherein the mask portion has at least one mask pattern region. The mask module assembly for large-size OLED evaporation according to claim 1, wherein any one of the mask openings on the mask portion is disposed between two adjacent support strips in the support portion, The distance between the adjacent support strips is greater than or equal to a positive integer multiple of the distance between the mask openings. The mask module assembly for large-size OLED evaporation according to claim 1, wherein the support portion is made of an alloy material having magnetic properties. The mask module assembly for large-size OLED evaporation according to claim 4, wherein the support portion is made of Invar material. The mask module assembly for large-size OLED evaporation according to claim 1, wherein the mask portion is made of a material that is resistant to abrasion, high temperature, acid and alkali, and has good adhesion to the support layer. . The mask module for large-size OLED evaporation according to claim 6, wherein the mask portion is a polymer polymer material having stable properties. The mask module assembly for large-size OLED evaporation according to claim 1, wherein the thickness of the support portion ranges from 20 μm to 60 μm. The mask module assembly for large-size OLED evaporation according to claim 8, wherein the support portion has a thickness of 20 μm, or 30 μm, or 40 μm, or 50 μm, or 60 μm. The mask module assembly for large-size OLED evaporation according to claim 1, wherein the mask portion has a thickness ranging from 2 μm to 20 μm. The mask module for large-size OLED evaporation according to claim 10, wherein the mask portion has a thickness of 2 μm, or 6 μm, or 10 μm, or 14 μm, or 18 μm, or 20 μm. The mask module assembly for large-size OLED evaporation according to claim 1, wherein the distance between the mask openings is between 30 μm and 200 μm. The mask module assembly for large-size OLED evaporation according to claim 12, wherein the mask opening distance is between 50 μm and 100 μm. The mask module assembly for large-size OLED evaporation according to the first aspect of the invention, wherein the adjacent support unit units constituting the support portion are closely adhered or have a pitch. The mask module assembly for large-size OLED evaporation according to claim 1, wherein the spacing of the support unit is greater than an integral multiple of the mask opening pitch of not less than zero.