CN103641998A - Led反射杯用的白色环氧树脂组合物 - Google Patents
Led反射杯用的白色环氧树脂组合物 Download PDFInfo
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- CN103641998A CN103641998A CN201310721653.4A CN201310721653A CN103641998A CN 103641998 A CN103641998 A CN 103641998A CN 201310721653 A CN201310721653 A CN 201310721653A CN 103641998 A CN103641998 A CN 103641998A
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- 150000008064 anhydrides Chemical class 0.000 claims abstract description 10
- 238000010521 absorption reaction Methods 0.000 claims abstract description 7
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- 230000003647 oxidation Effects 0.000 claims description 10
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
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- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 239000007822 coupling agent Substances 0.000 claims description 6
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- 150000001462 antimony Chemical class 0.000 claims description 5
- 238000002485 combustion reaction Methods 0.000 claims description 5
- 230000003078 antioxidant effect Effects 0.000 claims description 4
- MUTGBJKUEZFXGO-UHFFFAOYSA-N hexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21 MUTGBJKUEZFXGO-UHFFFAOYSA-N 0.000 claims description 4
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 3
- 239000004327 boric acid Substances 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 229910002026 crystalline silica Inorganic materials 0.000 claims description 3
- 150000005690 diesters Chemical class 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
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- 238000005658 halogenation reaction Methods 0.000 claims description 3
- 238000005984 hydrogenation reaction Methods 0.000 claims description 3
- 229910001410 inorganic ion Inorganic materials 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical group [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- KWUZCAVKPCRJPO-UHFFFAOYSA-N n-ethyl-4-(6-methyl-1,3-benzothiazol-2-yl)aniline Chemical compound C1=CC(NCC)=CC=C1C1=NC2=CC=C(C)C=C2S1 KWUZCAVKPCRJPO-UHFFFAOYSA-N 0.000 claims description 3
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 150000002989 phenols Chemical class 0.000 claims description 3
- 150000008301 phosphite esters Chemical class 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
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- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 claims description 3
- 239000002075 main ingredient Substances 0.000 claims description 2
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- 235000014113 dietary fatty acids Nutrition 0.000 abstract 1
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- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 4
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
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- 238000012360 testing method Methods 0.000 description 3
- 238000003490 calendering Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
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- 238000005538 encapsulation Methods 0.000 description 2
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- 229920005989 resin Polymers 0.000 description 2
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- 239000007858 starting material Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
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- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- SYECJBOWSGTPLU-UHFFFAOYSA-N hexane-1,1-diamine Chemical compound CCCCCC(N)N SYECJBOWSGTPLU-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
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- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 description 1
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- 238000012546 transfer Methods 0.000 description 1
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- 230000007704 transition Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105199079A (zh) * | 2015-10-30 | 2015-12-30 | 江苏华海诚科新材料有限公司 | 一种led支架用高强度白色反光环氧树脂组合物 |
WO2016074207A1 (en) * | 2014-11-14 | 2016-05-19 | Ablestik (Shanghai) Ltd | White epoxy moulding compound |
CN108070212A (zh) * | 2016-11-16 | 2018-05-25 | 北京科化新材料科技有限公司 | 一种环氧树脂组合物及其应用 |
CN111205796A (zh) * | 2019-12-27 | 2020-05-29 | 科化新材料泰州有限公司 | 一种半导体封装用浅色耐黄变的环氧树脂组合物 |
CN112341755A (zh) * | 2019-08-07 | 2021-02-09 | 北京科化新材料科技有限公司 | 耐黄变透明环氧树脂封装材料及其制备方法和应用 |
CN112625398A (zh) * | 2020-12-02 | 2021-04-09 | 北京科化新材料科技有限公司 | 反光材料及其制备方法以及在led反光支架上的应用 |
CN116694275A (zh) * | 2023-04-26 | 2023-09-05 | 湖北三选科技有限公司 | 一种液体环氧塑封料及其制备方法 |
Citations (8)
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CN101072807A (zh) * | 2004-12-16 | 2007-11-14 | 大赛璐化学工业株式会社 | 热固性环氧树脂组合物及其用途 |
CN101461070A (zh) * | 2006-06-02 | 2009-06-17 | 日立化成工业株式会社 | 光半导体元件搭载用封装及使用其的光半导体装置 |
CN101735617A (zh) * | 2008-11-14 | 2010-06-16 | 信越化学工业株式会社 | 热固性树脂组合物 |
CN102046690A (zh) * | 2008-07-31 | 2011-05-04 | 大赛璐化学工业株式会社 | 光半导体密封用树脂组合物和使用了该树脂组合物的光半导体装置 |
JP2011219634A (ja) * | 2010-04-09 | 2011-11-04 | Hitachi Chem Co Ltd | 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
WO2013008680A1 (ja) * | 2011-07-13 | 2013-01-17 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物 |
CN102911478A (zh) * | 2011-08-02 | 2013-02-06 | 日东电工株式会社 | 环氧树脂组合物、光学半导体装置用引线框和光学半导体装置用衬底、及光学半导体装置 |
CN102952370A (zh) * | 2011-08-10 | 2013-03-06 | 日东电工株式会社 | 光学半导体装置用环氧树脂组合物及使用其的光学半导体装置 |
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2013
- 2013-12-24 CN CN201310721653.4A patent/CN103641998B/zh active Active
Patent Citations (8)
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CN101072807A (zh) * | 2004-12-16 | 2007-11-14 | 大赛璐化学工业株式会社 | 热固性环氧树脂组合物及其用途 |
CN101461070A (zh) * | 2006-06-02 | 2009-06-17 | 日立化成工业株式会社 | 光半导体元件搭载用封装及使用其的光半导体装置 |
CN102046690A (zh) * | 2008-07-31 | 2011-05-04 | 大赛璐化学工业株式会社 | 光半导体密封用树脂组合物和使用了该树脂组合物的光半导体装置 |
CN101735617A (zh) * | 2008-11-14 | 2010-06-16 | 信越化学工业株式会社 | 热固性树脂组合物 |
JP2011219634A (ja) * | 2010-04-09 | 2011-11-04 | Hitachi Chem Co Ltd | 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
WO2013008680A1 (ja) * | 2011-07-13 | 2013-01-17 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物 |
CN102911478A (zh) * | 2011-08-02 | 2013-02-06 | 日东电工株式会社 | 环氧树脂组合物、光学半导体装置用引线框和光学半导体装置用衬底、及光学半导体装置 |
CN102952370A (zh) * | 2011-08-10 | 2013-03-06 | 日东电工株式会社 | 光学半导体装置用环氧树脂组合物及使用其的光学半导体装置 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016074207A1 (en) * | 2014-11-14 | 2016-05-19 | Ablestik (Shanghai) Ltd | White epoxy moulding compound |
TWI676651B (zh) * | 2014-11-14 | 2019-11-11 | 中國商衡所華威電子有限公司 | 白色環氧模製化合物 |
CN105199079A (zh) * | 2015-10-30 | 2015-12-30 | 江苏华海诚科新材料有限公司 | 一种led支架用高强度白色反光环氧树脂组合物 |
CN108070212A (zh) * | 2016-11-16 | 2018-05-25 | 北京科化新材料科技有限公司 | 一种环氧树脂组合物及其应用 |
CN112341755A (zh) * | 2019-08-07 | 2021-02-09 | 北京科化新材料科技有限公司 | 耐黄变透明环氧树脂封装材料及其制备方法和应用 |
CN111205796A (zh) * | 2019-12-27 | 2020-05-29 | 科化新材料泰州有限公司 | 一种半导体封装用浅色耐黄变的环氧树脂组合物 |
CN111205796B (zh) * | 2019-12-27 | 2022-08-05 | 江苏科化新材料科技有限公司 | 一种半导体封装用浅色耐黄变的环氧树脂组合物 |
CN112625398A (zh) * | 2020-12-02 | 2021-04-09 | 北京科化新材料科技有限公司 | 反光材料及其制备方法以及在led反光支架上的应用 |
CN116694275A (zh) * | 2023-04-26 | 2023-09-05 | 湖北三选科技有限公司 | 一种液体环氧塑封料及其制备方法 |
CN116694275B (zh) * | 2023-04-26 | 2024-03-08 | 湖北三选科技有限公司 | 一种液体环氧塑封料及其制备方法 |
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CN103641998B (zh) | 2016-05-04 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: White epoxy resin composition for LED (Light Emitting Diode) reflector cup Effective date of registration: 20200706 Granted publication date: 20160504 Pledgee: Bank of China Limited Lianyungang Economic and Technological Development Zone Branch Pledgor: JIANGSU HUAHAI CHENGKE NEW MATERIAL Co.,Ltd. Registration number: Y2020980003819 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211217 Granted publication date: 20160504 Pledgee: Bank of China Limited Lianyungang Economic and Technological Development Zone Branch Pledgor: JIANGSU HUAHAI CHENGKE NEW MATERIAL Co.,Ltd. Registration number: Y2020980003819 |