CN1036348C - 一种用于半导体器件塑封的环氧树脂组合物及其制法 - Google Patents
一种用于半导体器件塑封的环氧树脂组合物及其制法 Download PDFInfo
- Publication number
- CN1036348C CN1036348C CN94105911A CN94105911A CN1036348C CN 1036348 C CN1036348 C CN 1036348C CN 94105911 A CN94105911 A CN 94105911A CN 94105911 A CN94105911 A CN 94105911A CN 1036348 C CN1036348 C CN 1036348C
- Authority
- CN
- China
- Prior art keywords
- coupling agent
- silane coupling
- epoxy resin
- composition epoxy
- value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN94105911A CN1036348C (zh) | 1994-06-02 | 1994-06-02 | 一种用于半导体器件塑封的环氧树脂组合物及其制法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN94105911A CN1036348C (zh) | 1994-06-02 | 1994-06-02 | 一种用于半导体器件塑封的环氧树脂组合物及其制法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1113921A CN1113921A (zh) | 1995-12-27 |
CN1036348C true CN1036348C (zh) | 1997-11-05 |
Family
ID=5032257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN94105911A Expired - Fee Related CN1036348C (zh) | 1994-06-02 | 1994-06-02 | 一种用于半导体器件塑封的环氧树脂组合物及其制法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1036348C (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6404068B1 (en) * | 1998-08-21 | 2002-06-11 | Hitachi Chemical Company, Ltd. | Paste composition, and protective film and semiconductor device both obtained with the same |
US20050011409A1 (en) * | 2001-12-25 | 2005-01-20 | Yasuhide Isobe | Inorganic oxide |
CN100335541C (zh) * | 2005-04-15 | 2007-09-05 | 江苏中电华威电子股份有限公司 | 一种用于半导体封装的环氧树脂组合物的制备方法 |
CN100352858C (zh) * | 2005-04-30 | 2007-12-05 | 中国科学院理化技术研究所 | 一种抗紫外环氧组合物及其制备方法和用途 |
CN105273360B (zh) * | 2014-07-16 | 2017-10-31 | 合复新材料科技(无锡)有限公司 | 改性环氧基封装材料及其制备方法和用途 |
CN113800816B (zh) * | 2020-06-12 | 2022-10-21 | 深圳先进电子材料国际创新研究院 | 一种环氧塑封料及其制备方法和应用 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58145613A (ja) * | 1982-02-15 | 1983-08-30 | Denki Kagaku Kogyo Kk | 溶融シリカ球状体、その製造法およびその装置 |
JPH01242658A (ja) * | 1988-03-25 | 1989-09-27 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JP4038856B2 (ja) * | 1997-12-29 | 2008-01-30 | ソニー株式会社 | 充電システム、充電装置及びバッテリパック |
-
1994
- 1994-06-02 CN CN94105911A patent/CN1036348C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58145613A (ja) * | 1982-02-15 | 1983-08-30 | Denki Kagaku Kogyo Kk | 溶融シリカ球状体、その製造法およびその装置 |
JPH01242658A (ja) * | 1988-03-25 | 1989-09-27 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JP4038856B2 (ja) * | 1997-12-29 | 2008-01-30 | ソニー株式会社 | 充電システム、充電装置及びバッテリパック |
Also Published As
Publication number | Publication date |
---|---|
CN1113921A (zh) | 1995-12-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102030968B (zh) | 用于半导体器件封装的环氧树脂组合物及其制备方法 | |
CN112480477B (zh) | 高强度环氧模塑料用球形氧化铝的表面改性方法 | |
CN1036348C (zh) | 一种用于半导体器件塑封的环氧树脂组合物及其制法 | |
JP2000080285A (ja) | 熱硬化性樹脂組成物及びその半導体装置 | |
EP1469022B1 (en) | Solid silane coupling agent composition, process for producing the same, and resin composition containing the same | |
JP2002322243A (ja) | エポキシ樹脂組成物の製造方法及び半導体装置 | |
JPH04198278A (ja) | 無機質粒子の表面処理方法及び熱硬化性樹脂組成物 | |
TWI794372B (zh) | 樹脂組成物、半導體封裝材料、一液型接著劑及接著薄膜 | |
JP2002012742A (ja) | エポキシ樹脂組成物及び半導体装置 | |
JP2843244B2 (ja) | エポキシ樹脂組成物 | |
JP2000281751A (ja) | エポキシ樹脂組成物及び半導体装置 | |
JPS6399221A (ja) | 半導体封止用エポキシ樹脂組成物の製造方法 | |
JPH0478433A (ja) | 無機粉体の表面処理方法 | |
JP3200251B2 (ja) | 半導体装置およびそれに用いるエポキシ樹脂組成物 | |
JPH09118829A (ja) | 熱硬化性樹脂複合材料の製造方法及び熱硬化性樹脂複合材料 | |
JPS60245664A (ja) | エポキシ系樹脂用無機充填剤及び該無機充填剤を配合したエポキシ系樹脂組成物 | |
KR20030057778A (ko) | 반도체소자 봉지용 에폭시 수지 조성물 | |
JPH10168282A (ja) | 半導体封止用エポキシ樹脂組成物 | |
JP3982344B2 (ja) | 半導体封止用エポキシ樹脂組成物及び半導体装置 | |
JP3080276B2 (ja) | 半導体封止用樹脂組成物 | |
JP2002241585A (ja) | エポキシ樹脂組成物及び半導体装置 | |
KR100383248B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 | |
JPH04328117A (ja) | 半導体封止用エポキシ樹脂組成物 | |
JPH10279667A (ja) | 半導体封止用エポキシ樹脂組成物 | |
JPH0548770B2 (zh) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: BEIJING KEHUA NEW MATERIALS SCIENCE AND TECHNOLOG Free format text: FORMER OWNER: CHEMISTRY INSTITUTE, CHINESE ACADEMY OF SCIENCES Effective date: 20030808 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20030808 Address after: 100089 Beijing Haidian District Zizhuyuan Road No. 44 Patentee after: Beijing Kehua New Material Science and Technology Co.,Ltd. Address before: 100080 2, 1 North Street, Haidian District, Beijing, Zhongguancun Patentee before: Institute of Chemistry, Chinese Academy of Sciences |
|
ASS | Succession or assignment of patent right |
Owner name: BEIJING SHOUKE MICROELECTRONICS CO., LTD. Free format text: FORMER OWNER: BEIJING KEHUA NEW MATERIALS SCIENCE AND TECHNOLOGY CO., LTD. Effective date: 20081017 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20081017 Address after: Room 10, Zhongxing Road, Changping District science and Technology Park, Beijing, Patentee after: Beijing SHOUKEHUA Micro-Electronics Co., Ltd. Address before: Beijing City, Haidian District Zizhuyuan Road No. 44 Patentee before: Beijing Kehua New Material Science and Technology Co.,Ltd. |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Epoxy resin composite for plastic sealing semiconductor device and its preparing method Effective date of registration: 20100701 Granted publication date: 19971105 Pledgee: Beijing's first investment Company Limited by Guarantee Pledgor: Beijing SHOUKEHUA Micro-Electronics Co., Ltd. Registration number: 2010990000799 |
|
DD01 | Delivery of document by public notice |
Addressee: Beijing shoukehua Electronics Co. Ltd Yi Hua Document name: Notification to Pay the Fees |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 19971105 Termination date: 20120602 |