CN103580639A - 振动器件、电子器件、电子设备以及移动体 - Google Patents

振动器件、电子器件、电子设备以及移动体 Download PDF

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Publication number
CN103580639A
CN103580639A CN201310335558.0A CN201310335558A CN103580639A CN 103580639 A CN103580639 A CN 103580639A CN 201310335558 A CN201310335558 A CN 201310335558A CN 103580639 A CN103580639 A CN 103580639A
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CN
China
Prior art keywords
base substrate
substrate
electronic
vibration
vibrating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310335558.0A
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English (en)
Chinese (zh)
Inventor
千叶诚一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN103580639A publication Critical patent/CN103580639A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B1/00—Details
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
CN201310335558.0A 2012-08-06 2013-08-05 振动器件、电子器件、电子设备以及移动体 Pending CN103580639A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012173749A JP2014033389A (ja) 2012-08-06 2012-08-06 振動デバイス、電子デバイス、電子機器、および移動体
JP2012-173749 2012-08-06

Publications (1)

Publication Number Publication Date
CN103580639A true CN103580639A (zh) 2014-02-12

Family

ID=50024897

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310335558.0A Pending CN103580639A (zh) 2012-08-06 2013-08-05 振动器件、电子器件、电子设备以及移动体

Country Status (3)

Country Link
US (1) US20140035685A1 (enExample)
JP (1) JP2014033389A (enExample)
CN (1) CN103580639A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105490661A (zh) * 2014-10-02 2016-04-13 精工爱普生株式会社 振子、振荡器、电子设备以及移动体
CN108630617A (zh) * 2017-03-17 2018-10-09 佳能株式会社 电子部件、电子部件的制造方法和电子设备
CN108701248A (zh) * 2016-03-01 2018-10-23 卡德赖博私人有限公司 集成电路卡的电路层
CN110034743A (zh) * 2017-12-27 2019-07-19 精工爱普生株式会社 振动器件、振动器件的制造方法、电子设备以及移动体
CN111865259A (zh) * 2019-04-26 2020-10-30 精工爱普生株式会社 振动器件、电子设备以及移动体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425315U (enExample) * 1990-06-25 1992-02-28
CN101741341A (zh) * 2008-11-10 2010-06-16 日本电波工业株式会社 表面安装型水晶振荡器
JP2010135890A (ja) * 2008-12-02 2010-06-17 Nippon Dempa Kogyo Co Ltd 水晶デバイス
WO2011149043A1 (ja) * 2010-05-28 2011-12-01 株式会社大真空 圧電振動デバイスの封止部材、および圧電振動デバイス

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6262513B1 (en) * 1995-06-30 2001-07-17 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
JPH0983248A (ja) * 1995-09-12 1997-03-28 Takaya Watanabe 表面実装型水晶発振器
JP2007173431A (ja) * 2005-12-21 2007-07-05 Epson Toyocom Corp 圧電デバイス
JP2009213061A (ja) * 2008-03-06 2009-09-17 Epson Toyocom Corp 発振器および電子機器
JP2011193109A (ja) * 2010-03-12 2011-09-29 Seiko Epson Corp 電子デバイス
JP2012034221A (ja) * 2010-07-30 2012-02-16 Kyocera Kinseki Corp 通信モジュール
US8680932B2 (en) * 2011-02-07 2014-03-25 Nihon Dempa Kogyo Co., Ltd Oscillator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425315U (enExample) * 1990-06-25 1992-02-28
CN101741341A (zh) * 2008-11-10 2010-06-16 日本电波工业株式会社 表面安装型水晶振荡器
JP2010135890A (ja) * 2008-12-02 2010-06-17 Nippon Dempa Kogyo Co Ltd 水晶デバイス
WO2011149043A1 (ja) * 2010-05-28 2011-12-01 株式会社大真空 圧電振動デバイスの封止部材、および圧電振動デバイス

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105490661A (zh) * 2014-10-02 2016-04-13 精工爱普生株式会社 振子、振荡器、电子设备以及移动体
CN105490661B (zh) * 2014-10-02 2020-08-11 精工爱普生株式会社 振子、振荡器、电子设备以及移动体
CN108701248A (zh) * 2016-03-01 2018-10-23 卡德赖博私人有限公司 集成电路卡的电路层
CN108701248B (zh) * 2016-03-01 2022-04-26 卡德赖博私人有限公司 集成电路卡的电路层
CN108630617A (zh) * 2017-03-17 2018-10-09 佳能株式会社 电子部件、电子部件的制造方法和电子设备
CN110034743A (zh) * 2017-12-27 2019-07-19 精工爱普生株式会社 振动器件、振动器件的制造方法、电子设备以及移动体
CN110034743B (zh) * 2017-12-27 2023-08-08 精工爱普生株式会社 振动器件、振动器件的制造方法、电子设备以及移动体
CN111865259A (zh) * 2019-04-26 2020-10-30 精工爱普生株式会社 振动器件、电子设备以及移动体
CN111865259B (zh) * 2019-04-26 2023-06-02 精工爱普生株式会社 振动器件、电子设备以及移动体

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Publication number Publication date
US20140035685A1 (en) 2014-02-06
JP2014033389A (ja) 2014-02-20

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Application publication date: 20140212