CN103548173B - 用于制造层结构的制造设备 - Google Patents

用于制造层结构的制造设备 Download PDF

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Publication number
CN103548173B
CN103548173B CN201280024681.4A CN201280024681A CN103548173B CN 103548173 B CN103548173 B CN 103548173B CN 201280024681 A CN201280024681 A CN 201280024681A CN 103548173 B CN103548173 B CN 103548173B
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CN
China
Prior art keywords
layer
protective material
unpatterned
manufacturing
patterned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280024681.4A
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English (en)
Chinese (zh)
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CN103548173A (zh
Inventor
C.里克斯
P.G.M.克鲁伊特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
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Koninklijke Philips NV
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Publication of CN103548173A publication Critical patent/CN103548173A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
  • Electrodes Of Semiconductors (AREA)
CN201280024681.4A 2011-05-23 2012-05-15 用于制造层结构的制造设备 Active CN103548173B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11167068.3 2011-05-23
EP11167068 2011-05-23
PCT/IB2012/052412 WO2012160475A1 (en) 2011-05-23 2012-05-15 Fabrication apparatus for fabricating a layer structure

Publications (2)

Publication Number Publication Date
CN103548173A CN103548173A (zh) 2014-01-29
CN103548173B true CN103548173B (zh) 2016-08-10

Family

ID=46210330

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280024681.4A Active CN103548173B (zh) 2011-05-23 2012-05-15 用于制造层结构的制造设备

Country Status (5)

Country Link
US (1) US9231212B2 (https=)
EP (1) EP2715830B1 (https=)
JP (1) JP6009548B2 (https=)
CN (1) CN103548173B (https=)
WO (1) WO2012160475A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150102180A (ko) 2014-02-27 2015-09-07 삼성디스플레이 주식회사 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
IT201900006740A1 (it) * 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
CN110867523A (zh) * 2019-10-30 2020-03-06 深圳市华星光电半导体显示技术有限公司 显示面板及其制造方法
JP7402076B2 (ja) * 2020-02-19 2023-12-20 株式会社カネカ 薄膜デバイスの製造方法
JP7467156B2 (ja) * 2020-02-19 2024-04-15 株式会社カネカ 薄膜デバイスの製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6949328B2 (en) * 2002-09-18 2005-09-27 Dai Nippon Printing Co, Ltd Method for manufacturing electroluminescent element
WO2005101505A2 (en) * 2004-04-16 2005-10-27 Exitech Limited Method of patterning a functional material on to a substrate
CN1890796A (zh) * 2003-12-18 2007-01-03 英特尔公司 激光切割的方法和装置
CN101176192A (zh) * 2005-05-12 2008-05-07 Lg化学株式会社 形成高分辨率图形的方法以及具有由该方法形成的预图形的基板
US20100079062A1 (en) * 2006-10-27 2010-04-01 Nederiandse Organisatie voor toegepast- natuurwetenschappelikj onderzoek TNO Optoelectric devices

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0567559A (ja) * 1991-09-10 1993-03-19 Fujitsu Ltd 微細パターンの形成方法
JP4165692B2 (ja) * 2002-08-05 2008-10-15 大日本印刷株式会社 エレクトロルミネッセント素子の製造方法
US20060163744A1 (en) 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
TW200640596A (en) 2005-01-14 2006-12-01 Cabot Corp Production of metal nanoparticles
JP2007048571A (ja) * 2005-08-09 2007-02-22 Seiko Epson Corp 有機ｅｌ装置の製造方法、電子機器
JP2007096340A (ja) * 2006-11-27 2007-04-12 Toshiba Corp 加工方法及び半導体装置の製造方法
US8420978B2 (en) * 2007-01-18 2013-04-16 The Board Of Trustees Of The University Of Illinois High throughput, low cost dual-mode patterning method for large area substrates
US9472787B2 (en) * 2011-05-23 2016-10-18 Oledworks Gmbh Fabrication apparatus for fabricating a patterned layer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6949328B2 (en) * 2002-09-18 2005-09-27 Dai Nippon Printing Co, Ltd Method for manufacturing electroluminescent element
CN1890796A (zh) * 2003-12-18 2007-01-03 英特尔公司 激光切割的方法和装置
WO2005101505A2 (en) * 2004-04-16 2005-10-27 Exitech Limited Method of patterning a functional material on to a substrate
CN1998098A (zh) * 2004-04-16 2007-07-11 埃克西泰克有限公司 在衬底上形成功能材料的图案的方法
CN101176192A (zh) * 2005-05-12 2008-05-07 Lg化学株式会社 形成高分辨率图形的方法以及具有由该方法形成的预图形的基板
US20100079062A1 (en) * 2006-10-27 2010-04-01 Nederiandse Organisatie voor toegepast- natuurwetenschappelikj onderzoek TNO Optoelectric devices

Also Published As

Publication number Publication date
EP2715830A1 (en) 2014-04-09
US20140272326A1 (en) 2014-09-18
EP2715830B1 (en) 2019-08-28
US9231212B2 (en) 2016-01-05
WO2012160475A1 (en) 2012-11-29
JP2014519203A (ja) 2014-08-07
JP6009548B2 (ja) 2016-10-19
CN103548173A (zh) 2014-01-29

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20160323

Address after: Aachen

Applicant after: KONINKLIJKE PHILIPS ELECTRONICS N.V.

Address before: Holland Ian Deho Finn

Applicant before: Koninkl Philips Electronics NV

C14 Grant of patent or utility model
GR01 Patent grant