CN103534327B - 可b阶段化且无需固化的晶圆背面涂覆粘合剂 - Google Patents

可b阶段化且无需固化的晶圆背面涂覆粘合剂 Download PDF

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Publication number
CN103534327B
CN103534327B CN201180069735.4A CN201180069735A CN103534327B CN 103534327 B CN103534327 B CN 103534327B CN 201180069735 A CN201180069735 A CN 201180069735A CN 103534327 B CN103534327 B CN 103534327B
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CN
China
Prior art keywords
adhesive composition
epoxy
elastomer
weight
composition according
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Expired - Fee Related
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CN201180069735.4A
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English (en)
Chinese (zh)
Other versions
CN103534327A (zh
Inventor
E·C··王
K·H·贝克尔
卓绮茁
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Henkel American Intellectual Property LLC
Henkel IP and Holding GmbH
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Henkel IP and Holding GmbH
Henkel Corp
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Publication of CN103534327A publication Critical patent/CN103534327A/zh
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Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/34—Epoxy compounds containing three or more epoxy groups obtained by epoxidation of an unsaturated polymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J121/00—Adhesives based on unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Die Bonding (AREA)
CN201180069735.4A 2011-04-05 2011-04-25 可b阶段化且无需固化的晶圆背面涂覆粘合剂 Expired - Fee Related CN103534327B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161471899P 2011-04-05 2011-04-05
US61/471,899 2011-04-05
US201161472399P 2011-04-06 2011-04-06
US61/472,399 2011-04-06
PCT/US2011/033756 WO2012138356A1 (en) 2011-04-05 2011-04-25 B-stageable and skip-curable wafer back side coating adhesives

Publications (2)

Publication Number Publication Date
CN103534327A CN103534327A (zh) 2014-01-22
CN103534327B true CN103534327B (zh) 2015-05-20

Family

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Application Number Title Priority Date Filing Date
CN201180069735.4A Expired - Fee Related CN103534327B (zh) 2011-04-05 2011-04-25 可b阶段化且无需固化的晶圆背面涂覆粘合剂

Country Status (7)

Country Link
US (1) US8759422B2 (enExample)
EP (1) EP2694611B1 (enExample)
JP (1) JP5731064B2 (enExample)
KR (1) KR101471323B1 (enExample)
CN (1) CN103534327B (enExample)
TW (1) TWI466969B (enExample)
WO (1) WO2012138356A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104017528B (zh) * 2014-06-20 2016-04-27 合肥长城制冷科技有限公司 一种粘接铜管和铝板的粘合剂及其制备方法
US9640514B1 (en) 2016-03-29 2017-05-02 Globalfoundries Inc. Wafer bonding using boron and nitrogen based bonding stack
US10975265B2 (en) 2016-07-04 2021-04-13 Showa Denko K.K. Radical-curable adhesive composition and adhesive
CN108359388B (zh) * 2017-01-26 2021-09-14 电化株式会社 固化性组合物
EP3712222B1 (en) * 2017-11-17 2022-12-07 Showa Denko K.K. Radical-curable adhesive composition, and adhesive
KR102834540B1 (ko) * 2020-04-07 2025-07-17 주식회사 엘지에너지솔루션 전극 리드, 그의 제조 방법 및 파우치 형 이차 전지

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1532253A (zh) * 2001-11-16 2004-09-29 日立化成工业株式会社 电路连接用粘结剂
CN1834188A (zh) * 2005-02-09 2006-09-20 国家淀粉及化学投资控股公司 用于无铅工艺的封装或预先施用的发泡底部填充材料
CN101198667A (zh) * 2005-06-06 2008-06-11 蒂萨股份公司 用于固定金属部件和塑料的热活化膜

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US5945203A (en) * 1997-10-14 1999-08-31 Zms Llc Stratified composite dielectric and method of fabrication
JP4517499B2 (ja) * 2000-11-27 2010-08-04 住友ベークライト株式会社 ダイアタッチペースト及び半導体装置
DE10062009A1 (de) * 2000-12-13 2002-07-04 Henkel Teroson Gmbh Mehrschichtige Sandwich-Materialien mit organischen Zwischenschichten auf Epoxidbasis
JP4148735B2 (ja) * 2002-09-17 2008-09-10 住友ベークライト株式会社 ダイアタッチペースト及び半導体装置
JP3966795B2 (ja) * 2002-09-17 2007-08-29 住友ベークライト株式会社 ダイアタッチペースト及び半導体装置
JP2004155903A (ja) * 2002-11-06 2004-06-03 Sumitomo Bakelite Co Ltd ダイアタッチペースト及び半導体装置
JP2004168908A (ja) * 2002-11-20 2004-06-17 Sumitomo Bakelite Co Ltd ダイアタッチペースト及び半導体装置
JP2004168906A (ja) * 2002-11-20 2004-06-17 Sumitomo Bakelite Co Ltd ダイアタッチペースト及び半導体装置
JP2004168907A (ja) * 2002-11-20 2004-06-17 Sumitomo Bakelite Co Ltd ダイアタッチペースト及び半導体装置
US7176044B2 (en) 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
US6949602B2 (en) * 2002-12-19 2005-09-27 Illinois Tool Works, Inc. Heat resistant, impact resistant, acrylic/epoxy adhesives
CN101323769B (zh) * 2004-06-18 2011-04-13 日立化成工业株式会社 晶片接合用树脂胶
JP4816876B2 (ja) * 2004-06-18 2011-11-16 日立化成工業株式会社 ダイボンディング用樹脂ペーストおよび半導体装置の製造方法
US20080051524A1 (en) * 2006-08-28 2008-02-28 Henkel Corporation Epoxy-Based Compositions Having Improved Impact Resistance
CN101821333A (zh) * 2007-07-26 2010-09-01 汉高公司 可固化的环氧树脂基粘合剂组合物
KR100981396B1 (ko) * 2007-09-28 2010-09-10 엘지이노텍 주식회사 반도체 패키지용 접착 페이스트 조성물

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1532253A (zh) * 2001-11-16 2004-09-29 日立化成工业株式会社 电路连接用粘结剂
CN1834188A (zh) * 2005-02-09 2006-09-20 国家淀粉及化学投资控股公司 用于无铅工艺的封装或预先施用的发泡底部填充材料
CN101198667A (zh) * 2005-06-06 2008-06-11 蒂萨股份公司 用于固定金属部件和塑料的热活化膜

Also Published As

Publication number Publication date
JP2014517088A (ja) 2014-07-17
KR101471323B1 (ko) 2014-12-09
EP2694611A4 (en) 2015-01-28
JP5731064B2 (ja) 2015-06-10
KR20140012705A (ko) 2014-02-03
WO2012138356A1 (en) 2012-10-11
EP2694611A1 (en) 2014-02-12
TWI466969B (zh) 2015-01-01
TW201241122A (en) 2012-10-16
EP2694611B1 (en) 2019-02-27
CN103534327A (zh) 2014-01-22
US20130197130A1 (en) 2013-08-01
US8759422B2 (en) 2014-06-24

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