CN103531701B - Light emitting diode package and method of manufacturing the same - Google Patents
Light emitting diode package and method of manufacturing the same Download PDFInfo
- Publication number
- CN103531701B CN103531701B CN201210430093.2A CN201210430093A CN103531701B CN 103531701 B CN103531701 B CN 103531701B CN 201210430093 A CN201210430093 A CN 201210430093A CN 103531701 B CN103531701 B CN 103531701B
- Authority
- CN
- China
- Prior art keywords
- led encapsulation
- encapsulation body
- dome
- ring frame
- reflector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 claims abstract description 50
- 238000005538 encapsulation Methods 0.000 claims description 61
- 239000004033 plastic Substances 0.000 claims description 55
- 239000000463 material Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- 239000013078 crystal Substances 0.000 claims description 8
- 239000004568 cement Substances 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 5
- 239000003292 glue Substances 0.000 abstract description 5
- 238000004020 luminiscence type Methods 0.000 description 13
- 238000005516 engineering process Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 5
- 230000005484 gravity Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention discloses a light emitting diode package and a manufacturing method thereof. The LED package comprises a conductive support, a reflective cup, an LED chip and a lens. The reflecting cup coats the conductive support, and a sunken opening exposing part of the surface of the conductive support is formed in the die bonding area. The light emitting diode chip is arranged on the surface of the conductive support in the concave opening. The lens is arranged above the concave opening and fixed on the surface of the reflecting cup, wherein the lens is composed of a dome-shaped net frame body and packaging glue filled in the dome-shaped net frame body.
Description
Technical field
The present invention is relevant a kind of LED encapsulation body.
Background technology
Light emitting diode (Light-EmittingDiode, LED) is a kind of semiconductor element. Early stage is mostly using the light emitting diode light-emitting component as display lamp or display panel, but along with the technology making light emitting diode is maked rapid progress, has been widely used in recent years in luminaire. Additionally, when light fixture utilizes light emitting diode and light guide plate to come luminous, compare with conventional bulb light source, the advantage such as there is efficiency height, life-span length, be hardly damaged.
It is said that in general, light-emitting diode (LED) module comprises luminescence chip and lens, and lens are covered in luminescence chip. Wherein, the material of lens can be the packaging plastic with fluorescent material. Owing to the function of lens is in that promote the optical efficiency of luminescence chip or change the characteristics of luminescence (direction of such as light) of luminescence chip, therefore when making lens, packaging plastic need to be solidified into the shape needed for lens. The mode making lens has two, and a kind of mode is between the substrate of the groove utilizing molding (molding) technology that packaging plastic is solidified on mould and carrying luminescence chip. Another way is then utilize in the rack groove that packaging plastic is inserted carrying luminescence chip by dispensing technology, resolidification molding afterwards.
But, adopt dispensing technology to make its packaging plastic of light-emitting diode (LED) module and be typically only capable to be formed the surface of plane in the groove of support due to gravity factor, the light total reflection probability of luminescence chip therefore can be made to increase, make optical efficiency have limited.
Summary of the invention
One technical scheme of the present invention is a kind of LED encapsulation body.
According to an embodiment of the present invention, a kind of LED encapsulation body comprises conducting bracket, reflector, light-emitting diode chip for backlight unit and lens. Reflector coated with conductive support, and form an exposed portion conducting bracket depression in the surface opening at crystal bonding area (diebondregion). Light-emitting diode chip for backlight unit is arranged at the conducting bracket surface in recessed openings. Lens are arranged at above recessed openings, and are fixed on reflector surface, and wherein lens are by a netted framework of dome, and the packaging plastic filling in the netted framework of dome is constituted.
In an embodiment of the present invention, wherein the netted framework of above-mentioned dome is made up of with multiple rod members are interlaced multiple ring frames.
In an embodiment of the present invention, wherein above-mentioned ring frame is arranged in a parallel, and rod member is then be lonizing radiation arrangements from the top of the netted framework of dome, and is individually fixed on ring frame.
In an embodiment of the present invention, wherein the width of above-mentioned each ring frame and each rod member is between 0.1mm to 1mm.
In an embodiment of the present invention, wherein above-mentioned ring frame and rod member are light-permeable.
In an embodiment of the present invention, wherein above-mentioned ring frame comprises rubber or plastic cement with the material of rod member.
In an embodiment of the present invention, wherein above-mentioned ring frame, rod member material identical with the material of packaging plastic.
In an embodiment of the present invention, wherein above-mentioned LED encapsulation body also comprises retaining element and is arranged on the ring frame abutted with reflector of the netted framework of dome so that the netted framework of dome is fixed on reflector.
In an embodiment of the present invention, wherein above-mentioned packaging plastic also fills up the recessed openings of reflector and covering luminousing diode chip.
The manufacture method that one technical scheme is a kind of LED encapsulation body of the present invention.
According to an embodiment of the present invention, the manufacture method of a kind of LED encapsulation body, its step includes:
The reflector being coated with conducting bracket is provided, and reflector is at formation exposed portion, crystal bonding area conducting bracket depression in the surface opening.
Light-emitting diode chip for backlight unit conducting bracket surface in recessed openings is set.
The netted framework of dome is set above recessed openings, and is fixed on reflector surface, packaging plastic is filled in the netted framework surface of dome, forms lens.
In an embodiment of the present invention, wherein above-mentioned recessed openings and light-emitting diode chip for backlight unit also packed glue is covered.
In an embodiment of the present invention, wherein the manufacture method of above-mentioned LED encapsulation body also comprises and imposes a baking program so that packaging plastic is cured.
In an embodiment of the present invention, wherein the netted framework of above-mentioned dome is made up of with multiple rod members are interlaced multiple ring frames.
In an embodiment of the present invention, wherein above-mentioned ring frame is arranged in a parallel, and rod member is then be lonizing radiation arrangements from the top of the netted framework of dome, and is individually fixed on ring frame.
In an embodiment of the present invention, wherein the width of above-mentioned each ring frame and each rod member is between 0.1mm to 1mm.
In an embodiment of the present invention, wherein above-mentioned ring frame and rod member are light-permeable.
In an embodiment of the present invention, wherein above-mentioned ring frame comprises rubber or plastic cement with the material of rod member.
In an embodiment of the present invention, wherein above-mentioned ring frame, rod member material identical with the material of packaging plastic.
In an embodiment of the present invention, wherein the netted framework of above-mentioned dome is with a retaining element being arranged on its ring frame abutted with reflector, is fixed on reflector.
In the above-mentioned embodiment of the present invention, owing to packaging plastic, the netted framework of dome and reflector can be connected with each other by the adhesion strength of packaging plastic, cohesiveness and gravity, therefore lens can by the netted framework of dome and fill in the packaging plastic of the netted framework of dome and constituted. Such design, LED encapsulation body just can pass through dispensing technology and form the lens with shape beyond plane (such as curved surface) in the surface of reflector. Consequently, it is possible to when light-emitting diode chip for backlight unit luminescence, owing to total reflection probability increases, the optical efficiency of LED encapsulation body can be promoted and improve the characteristics of luminescence.
Accompanying drawing explanation
Fig. 1 illustrates the profile of LED encapsulation body according to an embodiment of the present invention;
Fig. 2 illustrates the exploded view during LED encapsulation body making of Fig. 1;
Fig. 3 illustrates the profile during LED encapsulation body making of Fig. 1;
Fig. 4 illustrates the profile of LED encapsulation body according to an embodiment of the present invention;
Fig. 5 illustrates the profile of LED encapsulation body according to an embodiment of the present invention;
Fig. 6 illustrates the profile during LED encapsulation body making of Fig. 5;
Fig. 7 illustrates the flow chart of the manufacture method of LED encapsulation body according to an embodiment of the present invention.
[main element symbol description]
100: LED encapsulation body 110: conducting bracket
120: reflector 122: crystal bonding area
124: depression opens 130: light-emitting diode chip for backlight unit
132: wire 140: lens
142: the netted framework 144 of dome: packaging plastic
146: ring frame 148: rod member
150: retaining element 200: point gum machine
D: direction W1: width
W2: width S 1: step
S2: step S3: step
Detailed description of the invention
To disclose multiple embodiments of the present invention with accompanying drawing below, as clearly stated, the details in many practices will be explained in the following description. It should be appreciated, however, that the details in these practices is not applied to limit the present invention. It is to say, in some embodiments of the present invention, the details in these practices is non-essential. Additionally, for simplifying for the purpose of accompanying drawing, some known usual structures and element will illustrate in the accompanying drawings in the way of simply illustrating.
Fig. 1 illustrates the profile of LED encapsulation body 100 according to an embodiment of the present invention. As it can be seen, LED encapsulation body 100 comprises conducting bracket 110, reflector 120, light-emitting diode chip for backlight unit 130 and lens 140. Wherein, reflector 120 coated with conductive support 110, and form an exposed portion conducting bracket 110 depression in the surface opening 124 at crystal bonding area (diebondregion) 122. Light-emitting diode chip for backlight unit 130 is arranged at conducting bracket 110 surface that depression is opened in 124. Lens 140 are arranged at depression and open above in the of 124, and are fixed on reflector 120 surface. Additionally, lens 140 are by a netted framework of dome 142 and fill in the packaging plastic 144 of the netted framework 142 of dome and constituted. In the present embodiment, packaging plastic 144 is except inserting the netted framework 142 of dome, and the depression also filling up reflector 120 opens 124, and covering luminousing diode chip 130. But in other embodiments, packaging plastic 144 can only be inserted the netted framework 142 of dome and not insert in the recessed openings 124 of reflector 120, not to limit the present invention.
Additionally, light-emitting diode chip for backlight unit 130 can be blue light-emitting diode, and it is electrically connected at the both positive and negative polarity of conducting bracket 110 by wire 132, makes light-emitting diode chip for backlight unit 130 can receive electric power and luminous. The packaging plastic 144 inserting the netted framework 142 of dome can be the packaging plastic with yellow fluorescent powder. Consequently, it is possible to when light-emitting diode chip for backlight unit 130 is luminous, user can see the light of white from LED encapsulation body 100, but light-emitting diode chip for backlight unit 130 may be used without different kinds from packaging plastic 144, determines according to designer's demand. In the present embodiment, LED encapsulation body 100 is plastic cement crystal grain carrying encapsulation (PlasticLeadedChipCarrier; PLCC) LED encapsulation body, for the light-emitting device of low-power (such as 0.066W to 5W).
In the following description, will be explained in the manufacturing process of the structure of the netted framework 142 of dome and LED encapsulation body 100.
Fig. 2 illustrates the exploded view when LED encapsulation body 100 of Fig. 1 makes. As it can be seen, the netted framework 142 of dome is not yet fixed on the surface of reflector 120. Packaging plastic 144 (see Fig. 1) is also not yet inserted in the recessed openings 124 of the netted framework 142 of dome and reflector 120. In the present embodiment, the netted framework of dome 142 is made up of with multiple rod members 148 are interlaced multiple ring frames 146, and ring frame 146 is arranged in a parallel. Rod member 148 is then be lonizing radiation arrangements from the top of the netted framework 142 of dome, and is individually fixed on ring frame 146. Additionally, the width W2 of the width W1 of each ring frame 146 and each rod member 148 can be respectively interposed between 0.1mm to 1mm, but it is not limited thereto.
When the netted framework 142 of dome is assembled in reflector 120, need first by substantially aligned for netted for dome framework 142 in the recessed openings 124 of reflector 120, then with direction D, netted for dome framework 142 is fixed on reflector 120 surface. Wherein, can be connected to each other by modes such as such as locking, adhere, weld or be sandwiched between the netted framework of dome 142 and reflector 120, determine according to designer's demand.
Fig. 3 illustrates the profile when LED encapsulation body 100 of Fig. 1 makes. After the netted framework 142 of dome is fixed on reflector 120, point gum machine 200 can be passed through packaging plastic 144 is filled in dome netted framework 142 surface, more specifically, packaging plastic 144 can insert the recessed openings 124 of the netted framework 142 of dome and reflector 120 by the void region between ring frame 146 and rod member 148, makes recessed openings 124 and the packed glue 144 of light-emitting diode chip for backlight unit 130 be covered. After packaging plastic 144 inserts the netted framework 142 of dome, the baking program that can impose is to heat packaging plastic 144 so that packaging plastic 144 is cured. Consequently, it is possible to the lens 140 of LED encapsulation body 100 just can be obtained, as shown in Figure 1.
Return to Fig. 1, the netted framework of packaging plastic 144, dome 142 and reflector 120 can be connected with each other by the adhesion strength of packaging plastic 144, cohesiveness and gravity, and therefore lens 140 are by the netted framework of dome 142 and fill in the packaging plastic 144 of the netted framework 142 of dome and constituted. Such design, LED encapsulation body 100 just can pass through dispensing technology and form the lens 140 with shape beyond plane (such as curved surface) in the surface of reflector 120. When light-emitting diode chip for backlight unit 130 is luminous, increase owing to light is totally reflected probability, the optical efficiency of LED encapsulation body 100 can be promoted and improve the characteristics of luminescence.
In addition, cause that optical efficiency reduces for avoiding the some light that light-emitting diode chip for backlight unit 130 sends to be covered by the netted framework 142 of dome, ring frame 146 and rod member 148 can be designed to light-permeable, for example, the material of ring frame 146 and rod member 148 can comprise rubber or the plastic cement of light-permeable. Again such as, ring frame 146 can be identical with the material of packaging plastic 144 with the material of rod member 148, makes LED encapsulation body 100 have the comparatively uniform characteristics of luminescence. Consequently, it is possible to when light-emitting diode chip for backlight unit 130 is luminous, light just can pass through packaging plastic 144 and the netted framework 142 of dome.
Fig. 4 illustrates the profile of LED encapsulation body 100 according to an embodiment of the present invention. LED encapsulation body 100 comprises conducting bracket 110, reflector 120, light-emitting diode chip for backlight unit 130 and lens 140. Place different from the embodiment described above is in that LED encapsulation body 100 also comprises retaining element 150 and is arranged on the ring frame 146 abutted with reflector 120 of the netted framework 142 of dome so that the netted framework 142 of dome can be fixed on reflector 120.In the present embodiment, retaining element 150 is screw, but is not limited.
It will be understood that the element described in the above-described embodiment and element annexation will not be repeated again and repeat. In the following description, by the LED encapsulation body 100 of narration different types, conjunction is first chatted bright.
Fig. 5 illustrates the profile of LED encapsulation body 100 according to an embodiment of the present invention. LED encapsulation body 100 comprises conducting bracket 110, reflector 120, light-emitting diode chip for backlight unit 130 and lens 140. Place different from the embodiment described above is in that LED encapsulation body 100 encapsulates (ChipOnBoard for chip on board; COB) LED encapsulation body, has multiple light-emitting diode chip for backlight unit 130, for the light-emitting device of high power (such as 10W to 20W).
Fig. 6 illustrates the profile when LED encapsulation body 100 of Fig. 5 makes. Similarly, after the netted framework 142 of dome is fixed on reflector 120, point gum machine 200 can be passed through packaging plastic 144 is filled in dome netted framework 142 surface, make recessed openings 124 and the packed glue 144 of light-emitting diode chip for backlight unit 130 be covered. After packaging plastic 144 inserts the netted framework 142 of dome, the baking program that can impose is to heat packaging plastic 144 so that packaging plastic 144 is cured. Consequently, it is possible to the lens 140 of LED encapsulation body 100 just can be obtained, as shown in Figure 5.
Fig. 7 illustrates the flow chart of the manufacture method of LED encapsulation body according to an embodiment of the present invention. As it can be seen, first in step sl, it is provided that it is coated with the reflector of conducting bracket, and reflector is at formation exposed portion, crystal bonding area conducting bracket depression in the surface opening. Then in step s 2, light-emitting diode chip for backlight unit conducting bracket surface in recessed openings is set. Afterwards in step s3, the netted framework of dome is set above recessed openings, and is fixed on reflector surface, packaging plastic is filled in the netted framework surface of dome, forms lens.
Wherein, recessed openings and light-emitting diode chip for backlight unit also can be covered by packed glue. The netted framework of dome is the retaining element being arranged on its ring frame abutted with reflector, is fixed on reflector.
Additionally, the manufacture method of LED encapsulation body also can comprise imposes a baking program so that packaging plastic is cured.
The above-mentioned embodiment of the present invention and prior art are compared, and have the advantage that
(1) lens by the netted framework of dome and fill in the packaging plastic of the netted framework of dome and are constituted, and therefore the surface configuration of lens can be determined by the netted framework of the dome made in advance.
(2) the ring frame of the netted framework of dome can be identical with the material of packaging plastic with the material of rod member, and when the baking program that imposes is when the netted framework of dome is with packaging plastic, the netted framework of dome closely can be combined with packaging plastic.
(3) the ring frame of the netted framework of dome and rod member can be printing opacity, and therefore when light-emitting diode chip for backlight unit luminescence, ring frame and rod member will not the light of shaded portions.
Although the present invention is disclosed above with embodiment; so it is not limited to the present invention; any it is familiar with this those skilled in the art; without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations, therefore protection scope of the present invention ought be as the criterion depending on the scope that appending claims defines.
Claims (18)
1. a LED encapsulation body, its feature is being in that, including:
One conducting bracket;
One reflector, is coated with this conducting bracket, and forms this conducting bracket depression in the surface opening of an exposed portion in crystal bonding area;
One light-emitting diode chip for backlight unit, is arranged at this conducting bracket surface in this recessed openings; And
One lens, being arranged at above this recessed openings, and be fixed on this reflector surface, wherein these lens are by a netted framework of dome, the packaging plastic filling in the netted framework of this dome is constituted, and the netted framework of this dome is made up of with multiple rod members are interlaced multiple ring frames.
2. LED encapsulation body according to claim 1, it is characterised in that the plurality of ring frame is arranged in a parallel, the plurality of rod member is then be lonizing radiation arrangements from the top of the netted framework of this dome, and is individually fixed on the plurality of ring frame.
3. LED encapsulation body according to claim 2, it is characterised in that the width of this ring frame each and this rod member each is between 0.1mm to 1mm.
4. LED encapsulation body according to claim 3, it is characterised in that the plurality of ring frame and the plurality of rod member are light-permeable.
5. LED encapsulation body according to claim 4, it is characterised in that the material of the plurality of ring frame and the plurality of rod member comprises rubber or plastic cement.
6. LED encapsulation body according to claim 1, it is characterised in that the plurality of ring frame, the plurality of rod member material identical with the material of this packaging plastic.
7. LED encapsulation body according to claim 1, it is characterised in that also comprise a retaining element, is arranged on this ring frame abutted with this reflector of the netted framework of this dome so that the netted framework of this dome is fixed on this reflector.
8. the LED encapsulation body described in claim any one of claim 1��7, it is characterised in that this packaging plastic also fills up this recessed openings of this reflector, and covers this light-emitting diode chip for backlight unit.
9. the manufacture method of a LED encapsulation body, it is characterised in that its step includes:
One reflector being coated with a conducting bracket is provided, and this reflector forms this conducting bracket depression in the surface opening of an exposed portion in crystal bonding area;
One light-emitting diode chip for backlight unit this conducting bracket surface in this recessed openings is set; And
The one netted framework of dome is set above this recessed openings, and is fixed on this reflector surface, packaging plastic is filled in the netted framework surface of this dome, forms lens.
10. the manufacture method of LED encapsulation body according to claim 9, it is characterised in that this recessed openings and this light-emitting diode chip for backlight unit are also covered by this packaging plastic.
11. the manufacture method of the LED encapsulation body according to claim 9 or 10, it is characterised in that also comprise and impose a baking program so that this packaging plastic is cured.
12. the manufacture method of LED encapsulation body according to claim 9, it is characterised in that the netted framework of this dome is made up of with multiple rod members are interlaced multiple ring frames.
13. the manufacture method of LED encapsulation body according to claim 12, it is characterized in that, the plurality of ring frame is arranged in a parallel, and the plurality of rod member is then be lonizing radiation arrangements from the top of the netted framework of this dome, and is individually fixed on the plurality of ring frame.
14. the manufacture method of LED encapsulation body according to claim 13, it is characterised in that the width of this ring frame each and this rod member each is between 0.1mm to 1mm.
15. the manufacture method of LED encapsulation body according to claim 14, it is characterised in that the plurality of ring frame and the plurality of rod member are light-permeable.
16. the manufacture method of LED encapsulation body according to claim 15, it is characterised in that the material of the plurality of ring frame and the plurality of rod member comprises rubber or plastic cement.
17. the manufacture method of LED encapsulation body according to claim 12, it is characterised in that the plurality of ring frame, the plurality of rod member material identical with the material of this packaging plastic.
18. the manufacture method of LED encapsulation body according to claim 12, it is characterised in that the netted framework of this dome is with a retaining element being arranged on its this ring frame abutted with this reflector, is fixed on this reflector.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101124446A TWI459600B (en) | 2012-07-06 | 2012-07-06 | Light emitting diode package and manufacturing method thereof |
| TW101124446 | 2012-07-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103531701A CN103531701A (en) | 2014-01-22 |
| CN103531701B true CN103531701B (en) | 2016-06-08 |
Family
ID=49933541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210430093.2A Expired - Fee Related CN103531701B (en) | 2012-07-06 | 2012-11-01 | Light emitting diode package and method of manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103531701B (en) |
| TW (1) | TWI459600B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088099A (en) * | 2005-09-20 | 2007-04-05 | Matsushita Electric Works Ltd | Luminaire |
| CN101877374A (en) * | 2009-04-28 | 2010-11-03 | 上海亮硕光电子科技有限公司 | Process for preparing white-light LED by using fluorescent powder lens |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI360239B (en) * | 2008-03-19 | 2012-03-11 | E Pin Optical Industry Co Ltd | Package structure for light emitting diode |
| KR100998017B1 (en) * | 2009-02-23 | 2010-12-03 | 삼성엘이디 주식회사 | Lens for Light Emitting Diode Package and Light Emitting Diode Package Having The Same |
| JP5639662B2 (en) * | 2009-12-26 | 2014-12-10 | アクロラックス インコーポレイテッドＡｃｈｒｏｌｕｘ Ｉｎｃ． | Uniform film layer structure for converting emission wavelength and method for forming the same |
| US8431942B2 (en) * | 2010-05-07 | 2013-04-30 | Koninklijke Philips Electronics N.V. | LED package with a rounded square lens |
| TWM419229U (en) * | 2011-06-20 | 2011-12-21 | Brightek Optoelectronic Co Ltd | Light emitting diode package structure |
-
2012
- 2012-07-06 TW TW101124446A patent/TWI459600B/en not_active IP Right Cessation
- 2012-11-01 CN CN201210430093.2A patent/CN103531701B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088099A (en) * | 2005-09-20 | 2007-04-05 | Matsushita Electric Works Ltd | Luminaire |
| CN101877374A (en) * | 2009-04-28 | 2010-11-03 | 上海亮硕光电子科技有限公司 | Process for preparing white-light LED by using fluorescent powder lens |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201403871A (en) | 2014-01-16 |
| CN103531701A (en) | 2014-01-22 |
| TWI459600B (en) | 2014-11-01 |
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