TWI459600B - Light emitting diode package and manufacturing method thereof - Google Patents
Light emitting diode package and manufacturing method thereof Download PDFInfo
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- TWI459600B TWI459600B TW101124446A TW101124446A TWI459600B TW I459600 B TWI459600 B TW I459600B TW 101124446 A TW101124446 A TW 101124446A TW 101124446 A TW101124446 A TW 101124446A TW I459600 B TWI459600 B TW I459600B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Planar Illumination Modules (AREA)
Description
本發明是有關一種發光二極體封裝體。The present invention relates to a light emitting diode package.
發光二極體(Light-Emitting Diode，LED)是一種半導體元件。早期大多把發光二極體作為指示燈或顯示板的發光元件，但隨著製作發光二極體的技術日新月異，近年來已被大量應用於照明設備中。此外，當燈具利用發光二極體與導光板來發光時，與傳統燈泡光源相較，具有效率高、壽命長、不易損壞等優點。A Light-Emitting Diode (LED) is a semiconductor component. In the early days, most of the light-emitting diodes were used as the light-emitting elements of the indicator lamps or display panels. However, with the rapid development of the technology for fabricating the light-emitting diodes, they have been widely used in lighting equipment in recent years. In addition, when the luminaire uses the illuminating diode and the light guide plate to emit light, compared with the conventional bulb light source, it has the advantages of high efficiency, long life, and not easy to be damaged.
一般而言，發光二極體模組包含發光晶片與透鏡，且透鏡覆蓋於發光晶片。其中，透鏡的材質可以為具有螢光粉的封裝膠。由於透鏡的功能在於提升發光晶片的光學效率或改變發光晶片的的發光特性(例如光線的方向)，因此在製作透鏡時需將封裝膠固化成透鏡所需的形狀。製作透鏡的方式有二，一種方式是利用製模(molding)技術將封裝膠固化於模具的凹槽與承載發光晶片的基板之間。另一種方式則是利用點膠技術將封裝膠填入承載發光晶片的支架凹槽中，之後再固化成型。In general, a light emitting diode module includes a light emitting chip and a lens, and the lens covers the light emitting chip. The material of the lens may be an encapsulant having a phosphor powder. Since the function of the lens is to increase the optical efficiency of the light-emitting wafer or to change the light-emitting characteristics of the light-emitting wafer (for example, the direction of the light), it is necessary to cure the encapsulant into a shape required for the lens when the lens is fabricated. There are two ways to make a lens. One way is to use a molding technique to cure the encapsulant between the recess of the mold and the substrate carrying the luminescent wafer. Another way is to use a dispensing technique to fill the encapsulant into the recess of the holder carrying the luminescent wafer, and then solidify the molding.
然而，採用點膠技術來製作發光二極體模組其封裝膠由於重力因素通常只能於支架的凹槽中形成平面的表面，因此會使發光晶片的光線全反射機率增加，使光學效率有所侷限。However, the dispensing adhesive technology is used to fabricate the LED module. The encapsulation glue can only form a planar surface in the groove of the stent due to the gravity factor, thereby increasing the probability of total reflection of the light of the illuminating wafer, so that the optical efficiency is improved. Limitations.
本發明之一技術態樣為一種發光二極體封裝體。One aspect of the present invention is a light emitting diode package.
根據本發明一實施方式，一種發光二極體封裝體包含導電支架、反射杯、發光二極體晶片與透鏡。反射杯包覆導電支架，並且在固晶區形成一露出部分導電支架表面之凹陷開口。發光二極體晶片設置於凹陷開口內之導電支架表面。透鏡設置於凹陷開口上方，並固定於反射杯表面，其中透鏡係由一圓頂網狀框體，及填入於圓頂網狀框體之封裝膠所構成。According to an embodiment of the invention, a light emitting diode package includes a conductive support, a reflective cup, a light emitting diode wafer and a lens. The reflective cup encloses the conductive support and forms a recessed opening in the solid crystal region that exposes a portion of the conductive support surface. The light emitting diode chip is disposed on the surface of the conductive support in the recessed opening. The lens is disposed above the recessed opening and fixed to the surface of the reflective cup, wherein the lens is formed by a dome mesh frame and an encapsulant filled in the dome mesh frame.
在本發明一實施方式中，其中上述圓頂網狀框體係由複數環框與複數桿件相互交錯所構成。In an embodiment of the invention, the dome mesh frame system is formed by interlacing a plurality of ring frames and a plurality of bars.
在本發明一實施方式中，其中上述環框彼此呈平行排列，而桿件則是自圓頂網狀框體之頂部呈放射線排列，並分別固定於環框上。In an embodiment of the invention, the ring frames are arranged in parallel with each other, and the rod members are radially arranged from the top of the dome mesh frame and are respectively fixed on the ring frame.
在本發明一實施方式中，其中上述每一環框與每一桿件的寬度介於0.1 mm至1 mm之間。In an embodiment of the invention, each of the ring frames and each of the bars has a width of between 0.1 mm and 1 mm.
在本發明一實施方式中，其中上述環框與桿件為可透光的。In an embodiment of the invention, the ring frame and the rod are permeable to light.
在本發明一實施方式中，其中上述環框與桿件的材質包含橡膠或塑膠。In an embodiment of the invention, the material of the ring frame and the rod member comprises rubber or plastic.
在本發明一實施方式中，其中上述環框、桿件的材質與封裝膠的材質相同。In an embodiment of the invention, the material of the ring frame and the rod is the same as the material of the encapsulant.
在本發明一實施方式中，其中上述發光二極體封裝體更包含固定元件設置於圓頂網狀框體之與反射杯抵接之環框上，使得圓頂網狀框體被固定於反射杯上。In an embodiment of the invention, the light emitting diode package further includes a fixing component disposed on the ring frame of the dome mesh frame abutting the reflective cup, so that the dome mesh frame is fixed to the reflection frame. On the cup.
在本發明一實施方式中，其中上述封裝膠更填充反射杯之凹陷開口，並且覆蓋發光二極體晶片。In an embodiment of the invention, the encapsulant further fills the recessed opening of the reflective cup and covers the LED array.
本發明之一技術態樣為一種發光二極體封裝體的製造方法。One aspect of the present invention is a method of fabricating a light emitting diode package.
根據本發明一實施方式，一種發光二極體封裝體的製造方法，其步驟包括：提供包覆有導電支架之反射杯，且反射杯在固晶區形成露出部分導電支架表面之凹陷開口。According to an embodiment of the invention, a method of fabricating a light emitting diode package includes the steps of: providing a reflective cup coated with a conductive support, and forming a recessed opening in the solid crystal region to expose a portion of the conductive support surface.
設置發光二極體晶片於凹陷開口內之導電支架表面。A surface of the conductive support of the LED chip in the recessed opening is disposed.
設置圓頂網狀框體於凹陷開口上方，並固定於反射杯表面，將封裝膠填於圓頂網狀框體表面，形成一透鏡。The dome mesh frame is disposed above the recessed opening and fixed on the surface of the reflective cup, and the encapsulant is filled on the surface of the dome mesh frame to form a lens.
在本發明一實施方式中，其中上述凹陷開口以及發光二極體晶片更被封裝膠所覆蓋。In an embodiment of the invention, the recessed opening and the LED chip are further covered by the encapsulant.
在本發明一實施方式中，其中上述發光二極體封裝體的製造方法更包含施以一烘烤程序，使得封裝膠被固化。In an embodiment of the invention, the method for manufacturing the LED package further includes applying a baking process to cure the encapsulant.
在本發明一實施方式中，其中上述圓頂網狀框體係由複數環框與複數桿件相互交錯所構成。In an embodiment of the invention, the dome mesh frame system is formed by interlacing a plurality of ring frames and a plurality of bars.
在本發明一實施方式中，其中上述環框彼此呈平行排列，而桿件則是自圓頂網狀框體之頂部呈放射線排列，並分別固定於環框上。In an embodiment of the invention, the ring frames are arranged in parallel with each other, and the rod members are radially arranged from the top of the dome mesh frame and are respectively fixed on the ring frame.
在本發明一實施方式中，其中上述每一環框與每一桿件的寬度介於0.1 mm至1 mm之間。In an embodiment of the invention, each of the ring frames and each of the bars has a width of between 0.1 mm and 1 mm.
在本發明一實施方式中，其中上述環框與桿件為可透光的。In an embodiment of the invention, the ring frame and the rod are permeable to light.
在本發明一實施方式中，其中上述環框與桿件的材質包含橡膠或塑膠。In an embodiment of the invention, the material of the ring frame and the rod member comprises rubber or plastic.
在本發明一實施方式中，其中上述環框、桿件的材質與封裝膠的材質相同。In an embodiment of the invention, the material of the ring frame and the rod is the same as the material of the encapsulant.
在本發明一實施方式中，其中上述圓頂網狀框體是以一設置於其與反射杯抵接之環框上之固定元件，被固定於反射杯上。In an embodiment of the invention, the dome mesh frame is fixed to the reflector cup by a fixing member disposed on the ring frame abutting the reflector cup.
在本發明上述實施方式中，由於封裝膠、圓頂網狀框體與反射杯可藉由封裝膠的黏著力、內聚力與重力來相互連接，因此透鏡可由圓頂網狀框體及填入於圓頂網狀框體之封裝膠所構成。這樣的設計，發光二極體封裝體便可藉由點膠技術於反射杯的表面形成具有平面以外形狀(例如曲面)的透鏡。如此一來，當發光二極體晶片發光時，由於全反射機率增加，可提升發光二極體封裝體的光學效率與改善發光特性。In the above embodiment of the present invention, since the encapsulant, the dome mesh frame and the reflective cup can be connected to each other by the adhesive force, cohesion and gravity of the encapsulant, the lens can be filled with the dome mesh frame and filled in The encapsulation glue of the dome mesh frame is formed. With such a design, the LED package can form a lens having a shape other than a plane (for example, a curved surface) on the surface of the reflective cup by a dispensing technique. In this way, when the light-emitting diode wafer emits light, the optical efficiency of the light-emitting diode package can be improved and the light-emitting characteristics can be improved due to an increase in the total reflection probability.
以下將以圖式揭露本發明之複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本發明。也就是說，在本發明部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
第1圖繪示根據本發明一實施方式之發光二極體封裝體100的剖面圖。如圖所示，發光二極體封裝體100包含 導電支架110、反射杯120、發光二極體晶片130與透鏡140。其中，反射杯120包覆導電支架110，並且在固晶區122形成一露出部分導電支架110表面之凹陷開口124。發光二極體晶片130設置於凹陷開口124內之導電支架110表面。透鏡140設置於凹陷開口124上方，並固定於反射杯120表面。此外，透鏡140係由一圓頂網狀框體142及填入於圓頂網狀框體142之封裝膠144所構成。在本實施方式中，封裝膠144除了填入圓頂網狀框體142外，還填充反射杯120之凹陷開口124，並且覆蓋發光二極體晶片130。然而在其他實施方式中，封裝膠144可只填入圓頂網狀框體142而不填入反射杯120的凹陷開口124中，並不以限制本發明。1 is a cross-sectional view of a light emitting diode package 100 in accordance with an embodiment of the present invention. As shown, the LED package 100 includes The conductive support 110, the reflective cup 120, the light emitting diode chip 130 and the lens 140. The reflective cup 120 covers the conductive support 110, and a recessed opening 124 is formed in the solid crystal region 122 to expose a portion of the surface of the conductive support 110. The light emitting diode chip 130 is disposed on the surface of the conductive support 110 in the recess opening 124. The lens 140 is disposed above the recess opening 124 and is fixed to the surface of the reflective cup 120. Further, the lens 140 is composed of a dome-shaped frame 142 and an encapsulant 144 filled in the dome-shaped frame 142. In the present embodiment, the encapsulant 144 fills the recessed opening 124 of the reflective cup 120 and covers the light emitting diode chip 130 in addition to the dome mesh frame 142. In other embodiments, however, the encapsulant 144 may only be filled into the dome mesh 142 without filling the recessed opening 124 of the reflective cup 120, and is not intended to limit the invention.
此外，發光二極體晶片130可以為藍光發光二極體，並藉由導線132電性連接於導電支架110的正負極，使發光二極體晶片130能接受到電力而發光。填入圓頂網狀框體142的封裝膠144可以為具有黃色螢光粉的封裝膠。如此一來，當發光二極體晶片130發光時，使用者可從發光二極體封裝體100外看到白色的光線，但發光二極體晶片130與封裝膠144也可採用不同的種類，依照設計者需求而定。在本實施方式中，發光二極體封裝體100為塑膠晶粒承載封裝(Plastic Leaded Chip Carrier；PLCC)的發光二極體封裝體，為低功率(例如0.066W至5W)的發光裝置。In addition, the LED chip 130 can be a blue light emitting diode, and is electrically connected to the positive and negative electrodes of the conductive holder 110 by the wire 132, so that the LED chip 130 can receive power and emit light. The encapsulant 144 filled in the dome mesh frame 142 may be an encapsulant having yellow phosphor powder. In this way, when the LED chip 130 is illuminated, the user can see white light from the outside of the LED package 100, but the LED chip 130 and the encapsulant 144 can also be used in different types. According to the designer's needs. In the present embodiment, the LED package 100 is a light-emitting diode package of a Plastic Leaded Chip Carrier (PLCC), and is a low-power (for example, 0.066 W to 5 W) light-emitting device.
在以下敘述中，將詳細說明圓頂網狀框體142的結構與發光二極體封裝體100的製作過程。In the following description, the structure of the dome mesh frame 142 and the manufacturing process of the light emitting diode package 100 will be described in detail.
第2圖繪示第1圖之發光二極體封裝體100製作時的 分解圖。如圖所示，圓頂網狀框體142尚未固定於反射杯120的表面。封裝膠144(見第1圖)也尚未填入圓頂網狀框體142與反射杯120的凹陷開口124中。在本實施方式中，圓頂網狀框體142係由複數環框146與複數桿件148相互交錯所構成，且環框146彼此呈平行排列。桿件148則是自圓頂網狀框體142之頂部呈放射線排列，並分別固定於環框146上。此外，每一環框146的寬度W1與每一桿件148的寬度W2可分別介於0.1 mm至1 mm之間，但並不以此為限。FIG. 2 is a diagram showing the manufacturing of the LED package 100 of FIG. Exploded map. As shown, the dome mesh frame 142 has not been secured to the surface of the reflective cup 120. The encapsulant 144 (see FIG. 1) has not yet been filled into the dome mesh 142 and the recessed opening 124 of the reflector cup 120. In the present embodiment, the dome mesh frame 142 is formed by interlacing a plurality of ring frames 146 and a plurality of bars 148, and the ring frames 146 are arranged in parallel with each other. The rods 148 are radially arranged from the top of the dome-shaped frame 142 and are respectively fixed to the ring frame 146. In addition, the width W1 of each ring frame 146 and the width W2 of each of the bars 148 may be between 0.1 mm and 1 mm, respectively, but not limited thereto.
當圓頂網狀框體142組裝於反射杯120時，需先將圓頂網狀框體142大致對齊於反射杯120的凹陷開口124，接著以方向D將圓頂網狀框體142固定於反射杯120表面上。其中，圓頂網狀框體142與反射杯120之間可藉由例如鎖固、黏著、焊接或夾置等方式彼此連接，依照設計者需求而定。When the dome mesh frame 142 is assembled to the reflector cup 120, the dome mesh frame 142 is first aligned with the recessed opening 124 of the reflector cup 120, and then the dome mesh frame 142 is fixed in the direction D. Reflecting the surface of the cup 120. Wherein, the dome mesh frame 142 and the reflector cup 120 can be connected to each other by, for example, locking, adhesive, welding or clamping, according to the needs of the designer.
第3圖繪示第1圖之發光二極體封裝體100製作時的剖面圖。當圓頂網狀框體142固定於反射杯120後，可藉由點膠機200將封裝膠144填入於圓頂網狀框體142表面，更具體地說，封裝膠144可藉由環框146與桿件148之間的鏤空區域填入圓頂網狀框體142與反射杯120的凹陷開口124，使凹陷開口124與發光二極體晶片130被封裝膠144所覆蓋。當封裝膠144填入圓頂網狀框體142後，可施以一烘烤程序來加熱封裝膠144，使得封裝膠144被固化。如此一來，便可得到發光二極體封裝體100的透鏡140，如第1圖所示。FIG. 3 is a cross-sectional view showing the light emitting diode package 100 of FIG. 1 . After the dome mesh frame 142 is fixed to the reflective cup 120, the encapsulant 144 can be filled into the surface of the dome mesh frame 142 by the dispenser 200. More specifically, the encapsulant 144 can be looped by the ring. The hollow region between the frame 146 and the rod 148 fills the dome mesh 142 and the recess opening 124 of the reflector cup 120 such that the recess opening 124 and the LED wafer 130 are covered by the encapsulant 144. After the encapsulant 144 is filled into the dome mesh frame 142, a baking process can be applied to heat the encapsulant 144 so that the encapsulant 144 is cured. In this way, the lens 140 of the LED package 100 can be obtained as shown in FIG.
回到第1圖，封裝膠144、圓頂網狀框體142與反射杯120可藉由封裝膠144的黏著力、內聚力與重力來相互連接，因此透鏡140係由圓頂網狀框體142及填入於圓頂網狀框體142之封裝膠144所構成。這樣的設計，發光二極體封裝體100便可藉由點膠技術於反射杯120的表面形成具有平面以外形狀(例如曲面)的透鏡140。當發光二極體晶片130發光時，由於光線全反射機率增加，可提升發光二極體封裝體100的光學效率與改善發光特性。Returning to FIG. 1 , the encapsulant 144 , the dome mesh frame 142 and the reflective cup 120 can be connected to each other by the adhesive force, cohesion and gravity of the encapsulant 144 , and thus the lens 140 is composed of the dome mesh frame 142 . And an encapsulant 144 filled in the dome mesh frame 142. With such a design, the LED package 100 can form a lens 140 having a shape other than a plane (for example, a curved surface) on the surface of the reflective cup 120 by a dispensing technique. When the light emitting diode chip 130 emits light, the optical efficiency of the light emitting diode package 100 can be improved and the light emitting characteristics can be improved due to an increase in the total light reflection probability.
此外，為避免發光二極體晶片130發出的部分光線被圓頂網狀框體142遮蔽而導致光學效率降低，環框146與桿件148可以設計成可透光的，舉例來說，環框146與桿件148的材質可以包含可透光的橡膠或塑膠。又例如，環框146與桿件148的材質可與封裝膠144的材質相同，使發光二極體封裝體100具有較為均勻的發光特性。如此一來，當發光二極體晶片130發光時，光線便可通過封裝膠144與圓頂網狀框體142。In addition, in order to prevent partial light emitted by the LED chip 130 from being obscured by the dome mesh frame 142, the optical efficiency is lowered, and the ring frame 146 and the rod member 148 may be designed to be transparent, for example, a ring frame. The material of the 146 and the rod 148 may comprise a light transmissive rubber or plastic. For example, the material of the ring frame 146 and the rod 148 can be the same as the material of the encapsulant 144, so that the LED package 100 has relatively uniform light-emitting characteristics. In this way, when the LED chip 130 emits light, the light can pass through the encapsulant 144 and the dome mesh frame 142.
第4圖繪示根據本發明一實施方式之發光二極體封裝體100的剖面圖。發光二極體封裝體100包含導電支架110、反射杯120、發光二極體晶片130與透鏡140。與上述實施方式不同的地方在於發光二極體封裝體100更包含固定元件150設置於圓頂網狀框體142之與反射杯120抵接的環框146上，使得圓頂網狀框體142可被固定於反射杯120上。在本實施方式中，固定元件150為螺絲，但不以此為限。4 is a cross-sectional view of a light emitting diode package 100 in accordance with an embodiment of the present invention. The LED package 100 includes a conductive support 110, a reflective cup 120, a light emitting diode chip 130, and a lens 140. The difference from the above embodiment is that the LED package 100 further includes a fixing member 150 disposed on the ring frame 146 of the dome mesh frame 142 that abuts against the reflective cup 120, such that the dome mesh frame 142 It can be fixed to the reflector cup 120. In the present embodiment, the fixing member 150 is a screw, but is not limited thereto.
應瞭解到，已經在上述實施方式中敘述過的元件與元 件連接關係將不再重複贅述。在以下敘述中，將敘述不同型式的發光二極體封裝體100，合先敘明。It should be understood that the components and elements that have been described in the above embodiments The connection relationship will not be repeated. In the following description, different types of light-emitting diode packages 100 will be described together.
第5圖繪示根據本發明一實施方式之發光二極體封裝體100的剖面圖。發光二極體封裝體100包含導電支架110、反射杯120、發光二極體晶片130與透鏡140。與上述實施方式不同的地方在於發光二極體封裝體100為板上晶片封裝(Chip On Board；COB)的發光二極體封裝體，具有複數個發光二極體晶片130，為高功率(例如10W至20W)的發光裝置。FIG. 5 is a cross-sectional view showing a light emitting diode package 100 according to an embodiment of the present invention. The LED package 100 includes a conductive support 110, a reflective cup 120, a light emitting diode chip 130, and a lens 140. The difference from the above embodiment is that the LED package 100 is a chip on board (COB) LED package, and has a plurality of LED chips 130 for high power (for example). 10W to 20W) illuminating device.
第6圖繪示第5圖之發光二極體封裝體100製作時的剖面圖。同樣地，當圓頂網狀框體142固定於反射杯120後，可藉由點膠機200將封裝膠144填入於圓頂網狀框體142表面，使凹陷開口124與發光二極體晶片130被封裝膠144所覆蓋。當封裝膠144填入圓頂網狀框體142後，可施以一烘烤程序來加熱封裝膠144，使得封裝膠144被固化。如此一來，便可得到發光二極體封裝體100的透鏡140，如第5圖所示。Fig. 6 is a cross-sectional view showing the light emitting diode package 100 of Fig. 5 when it is produced. Similarly, when the dome mesh frame 142 is fixed to the reflective cup 120, the encapsulant 144 can be filled into the surface of the dome mesh frame 142 by the dispenser 200, so that the recessed opening 124 and the LED are formed. Wafer 130 is covered by encapsulant 144. After the encapsulant 144 is filled into the dome mesh frame 142, a baking process can be applied to heat the encapsulant 144 so that the encapsulant 144 is cured. In this way, the lens 140 of the LED package 100 can be obtained as shown in FIG.
第7圖繪示根據本發明一實施方式之發光二極體封裝體的製造方法的流程圖。如圖所示，首先在步驟S1中，提供包覆有導電支架之反射杯，且反射杯在固晶區形成露出部分導電支架表面之凹陷開口。接著在步驟S2中，設置發光二極體晶片於凹陷開口內之導電支架表面。之後在步驟S3中，設置圓頂網狀框體於凹陷開口上方，並固定於反射杯表面，將封裝膠填於圓頂網狀框體表面，形成一透鏡。FIG. 7 is a flow chart showing a method of manufacturing a light emitting diode package according to an embodiment of the present invention. As shown, first in step S1, a reflective cup coated with a conductive support is provided, and the reflective cup forms a recessed opening in the solid crystal region to expose a portion of the conductive support surface. Next, in step S2, the surface of the conductive support of the light-emitting diode wafer in the recessed opening is provided. Then, in step S3, a dome mesh frame is disposed above the recessed opening and fixed on the surface of the reflective cup, and the encapsulant is filled on the surface of the dome mesh frame to form a lens.
其中，凹陷開口以及發光二極體晶片也可被封裝膠所 覆蓋。圓頂網狀框體是以設置於其與反射杯抵接之環框上之固定元件，被固定於反射杯上。Wherein, the recessed opening and the LED chip can also be encapsulated cover. The dome mesh frame is fixed to the reflector cup by a fixing member disposed on the ring frame abutting against the reflector cup.
此外，發光二極體封裝體的製造方法還可包含施以一烘烤程序，使得封裝膠被固化。In addition, the method of fabricating the LED package may further comprise applying a baking process to cause the encapsulant to be cured.
本發明上述實施方式與先前技術相較，具有以下優點：Compared with the prior art, the above embodiment of the present invention has the following advantages:
(1)透鏡由圓頂網狀框體及填入於圓頂網狀框體之封裝膠所構成，因此透鏡的表面形狀可由預先製作的圓頂網狀框體來決定。(1) Since the lens is composed of a dome-shaped frame and an encapsulant filled in the dome-shaped frame, the surface shape of the lens can be determined by a dome-shaped frame which is prepared in advance.
(2)圓頂網狀框體之環框與桿件的材質可與封裝膠的材質相同，當施以一烘烤程序於圓頂網狀框體與封裝膠時，圓頂網狀框體可與封裝膠緊密地結合。(2) The material of the ring frame and the rod of the dome mesh frame can be the same as the material of the encapsulant. When a baking process is applied to the dome mesh frame and the encapsulant, the dome mesh frame Can be tightly combined with the encapsulant.
(3)圓頂網狀框體之環框與桿件可以為透光的，因此當發光二極體晶片發光時，環框與桿件不會遮蔽部分的光線。(3) The ring frame and the rod member of the dome mesh frame may be light transmissive, so that when the light emitting diode chip emits light, the ring frame and the rod member do not block part of the light.
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
100‧‧‧發光二極體封裝體100‧‧‧Light Emitter Package
110‧‧‧導電支架110‧‧‧conductive bracket
120‧‧‧反射杯120‧‧‧Reflection Cup
122‧‧‧固晶區122‧‧‧ Gujing District
124‧‧‧凹陷開口124‧‧‧ recessed opening
130‧‧‧發光二極體晶片130‧‧‧Light Diode Wafer
132‧‧‧導線132‧‧‧Wire
140‧‧‧透鏡140‧‧‧ lens
142‧‧‧圓頂網狀框體142‧‧‧Dome mesh frame
144‧‧‧封裝膠144‧‧‧Package
146‧‧‧環框146‧‧‧ ring frame
148‧‧‧桿件148‧‧‧ rods
150‧‧‧固定元件150‧‧‧Fixed components
200‧‧‧點膠機200‧‧ ‧ Dispenser
D‧‧‧方向D‧‧‧ Direction
W1‧‧‧寬度W1‧‧‧Width
W2‧‧‧寬度W2‧‧‧Width
S1‧‧‧步驟S1‧‧‧ steps
S2‧‧‧步驟S2‧‧‧ steps
S3‧‧‧步驟S3‧‧‧ steps
第1圖繪示根據本發明一實施方式之發光二極體封裝體的剖面圖。1 is a cross-sectional view showing a light emitting diode package according to an embodiment of the present invention.
第2圖繪示第1圖之發光二極體封裝體製作時的分解圖。Fig. 2 is an exploded view showing the manufacturing of the light emitting diode package of Fig. 1.
第3圖繪示第1圖之發光二極體封裝體製作時的剖面 圖。FIG. 3 is a cross-sectional view showing the manufacturing of the LED package of FIG. Figure.
第4圖繪示根據本發明一實施方式之發光二極體封裝體的剖面圖。4 is a cross-sectional view of a light emitting diode package in accordance with an embodiment of the present invention.
第5圖繪示根據本發明一實施方式之發光二極體封裝體的剖面圖。FIG. 5 is a cross-sectional view showing a light emitting diode package according to an embodiment of the present invention.
第6圖繪示第5圖之發光二極體封裝體製作時的剖面圖。Fig. 6 is a cross-sectional view showing the fabrication of the light emitting diode package of Fig. 5.
第7圖繪示根據本發明一實施方式之發光二極體封裝體的製造方法的流程圖。FIG. 7 is a flow chart showing a method of manufacturing a light emitting diode package according to an embodiment of the present invention.
100‧‧‧發光二極體封裝體100‧‧‧Light Emitter Package
110‧‧‧導電支架110‧‧‧conductive bracket
120‧‧‧反射杯120‧‧‧Reflection Cup
122‧‧‧固晶區122‧‧‧ Gujing District
124‧‧‧凹陷開口124‧‧‧ recessed opening
130‧‧‧發光二極體晶片130‧‧‧Light Diode Wafer
132‧‧‧導線132‧‧‧Wire
140‧‧‧透鏡140‧‧‧ lens
142‧‧‧圓頂網狀框體142‧‧‧Dome mesh frame
144‧‧‧封裝膠144‧‧‧Package
Claims (19)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101124446A TWI459600B (en) | 2012-07-06 | 2012-07-06 | Light emitting diode package and manufacturing method thereof |
| CN201210430093.2A CN103531701B (en) | 2012-07-06 | 2012-11-01 | Light emitting diode package and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101124446A TWI459600B (en) | 2012-07-06 | 2012-07-06 | Light emitting diode package and manufacturing method thereof |
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| TW201403871A TW201403871A (en) | 2014-01-16 |
| TWI459600B true TWI459600B (en) | 2014-11-01 |
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| TW (1) | TWI459600B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200941755A (en) * | 2008-03-19 | 2009-10-01 | E Pin Optical Industry Co Ltd | Package structure for light emitting diode |
| US20100213480A1 (en) * | 2009-02-23 | 2010-08-26 | Samsung Led Co., Ltd. | Lens for light emitting diode package and light emitting diode package having the same |
| TW201135982A (en) * | 2009-12-26 | 2011-10-16 | Achrolux Inc | Uniform film-layered structure that converts the wavelength of emitted light and method for forming the same |
| TWM419229U (en) * | 2011-06-20 | 2011-12-21 | Brightek Optoelectronic Co Ltd | Light emitting diode package structure |
| TW201205889A (en) * | 2010-05-07 | 2012-02-01 | Philips Lumileds Lighting Co | LED package with a rounded square lens |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088099A (en) * | 2005-09-20 | 2007-04-05 | Matsushita Electric Works Ltd | Luminaire |
| CN101877374A (en) * | 2009-04-28 | 2010-11-03 | 上海亮硕光电子科技有限公司 | Process for preparing white-light LED by using fluorescent powder lens |
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2012
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200941755A (en) * | 2008-03-19 | 2009-10-01 | E Pin Optical Industry Co Ltd | Package structure for light emitting diode |
| US20100213480A1 (en) * | 2009-02-23 | 2010-08-26 | Samsung Led Co., Ltd. | Lens for light emitting diode package and light emitting diode package having the same |
| TW201135982A (en) * | 2009-12-26 | 2011-10-16 | Achrolux Inc | Uniform film-layered structure that converts the wavelength of emitted light and method for forming the same |
| TW201205889A (en) * | 2010-05-07 | 2012-02-01 | Philips Lumileds Lighting Co | LED package with a rounded square lens |
| TWM419229U (en) * | 2011-06-20 | 2011-12-21 | Brightek Optoelectronic Co Ltd | Light emitting diode package structure |
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| CN103531701B (en) | 2016-06-08 |
| CN103531701A (en) | 2014-01-22 |
| TW201403871A (en) | 2014-01-16 |
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