CN103489816B - 晶粒双面筛盘 - Google Patents

晶粒双面筛盘 Download PDF

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CN103489816B
CN103489816B CN201310443910.2A CN201310443910A CN103489816B CN 103489816 B CN103489816 B CN 103489816B CN 201310443910 A CN201310443910 A CN 201310443910A CN 103489816 B CN103489816 B CN 103489816B
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CN103489816A (zh
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黄建山
陈建华
张练佳
梅余峰
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Anhui Meiyue Culture Development Co., Ltd
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RUGAO EADA ELECTRONICS CO Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

本发明公开了微电子领域的一种可以区分GPP芯片的晶粒筛盘。由筛盘框和筛盘组成，筛盘位于筛盘框上面，其特征在于：晶粒双面筛盘由正面筛盘和反面筛盘构成，正反筛盘通过转轴相连接，反面筛盘可通过转轴旋转180o与正面筛盘相复合，正面筛盘和反面筛盘呈轴对称，筛盘有纵横整齐排列的筛选孔，筛盘的筛选孔直径与所筛晶片的N面相同，筛选孔底部有排气孔，筛盘框为密闭空腔，排气孔与筛盘框密闭空腔相通。本发明具有区分极性成功率高、操作方便和效率高等优点。

Description

晶粒双面筛盘
技术领域
本发明涉及微电子领域的一种半导体元器件的制造工具，具体地说是一种可以将GPP芯片按N端面和P端面交叉排列的晶粒双面筛盘。
背景技术
在半导体元器件生产制造中，其生产中的半导体晶片分N端面和P端面，常规筛盘无法区分出GPP芯片的N端面和P端面，且无法按工艺要求使筛盘上GPP芯片按N端面和P端面交叉排列，传统的操作工艺是通过从蓝膜上剥离，手工进行排列，操作手续复杂，且无法保证一致性、效率低容易出错。
发明内容
本发明的目的是克服现有技术的不足，提供一种能有效将GPP芯片的N端面和P端面交叉排列的晶粒双面筛盘。
本发明是通过以下技术方案实现的：
一种晶粒双面筛盘，由筛盘框和筛盘组成，筛盘位于筛盘框上面，其特征在于：晶粒双面筛盘由正面筛盘和反面筛盘构成，正反筛盘通过转轴相连接，反面筛盘通过转轴旋转180o与正面筛盘相复合，正面筛盘和反面筛盘呈轴对称，筛盘有纵横整齐排列的筛选孔，筛盘的筛选孔直径与所筛晶片的N面相同，筛选孔底部有排气孔，筛盘框为密闭空腔，排气孔与筛盘框密闭空腔相通;筛盘上筛选孔可设置纵向覆盖板可根据工艺需要覆盖筛选孔;所述的筛盘框侧面有吸气孔，吸气孔与真空泵相连。
本发明与现有技术相比具有以下有益效果：
1.区分极性成功率高；
2.可交叉极性排列；
3.操作方便，效率高。
附图说明
图1为晶粒双面筛盘结构示意图；
图2为GPP晶片所示图。
图中：筛盘框1、筛选孔2、吸气孔3、筛盘4、N面5、P面6、转轴7和覆盖板8。
具体实施方式
下面结合附图和具体应用对本发明的内容做进一步的描述：
如图所示为晶粒双面筛盘结构示意图，包括筛盘框1、筛选孔2、吸气孔3、筛盘4、N面5、P面6、转轴7和覆盖板8。晶粒双面筛盘由正面筛盘和反面筛盘构成，正反筛盘通过转轴相连接，反面筛盘可通过转轴旋转180o与正面筛盘相复合，为达到筛盘上晶片的排列为N面和P面交叉排列的目的，在正面筛盘的2、4、6列用覆盖板8覆盖，反面筛盘的1、3、5列用覆盖板8覆盖，将晶片在筛盘上摇动，使晶片的N面落入筛选孔2内，然后移去正面筛盘的覆盖板，将反面筛盘沿转轴旋转180o与正面筛盘相复合，释放反面筛盘吸气，使反面筛盘2、4、6列的晶片落入正面筛盘的对应筛盘孔内，晶片N面落入筛选孔2内是因GPP芯片P面要比N面要小得多，而且P面沟道刮玻璃粉后，平整度不及N面，人工摇芯片时，比重重的容易在下方，轻的在上方。为高效区分出芯片的极性P面 、N面。通过工程人员对GPP芯片的外观形状进行研究，芯片两边比重不一，在摇动筛板时，芯片撞击后，重的一侧容易被吸住，GPP芯片两面的面积有大小之分，P面在吸孔位置容易漏气，吸不住，吸住的一定是N面。区分极性成功率可达到99%。

Claims (1)

1.一种晶粒双面筛盘，由筛盘框和筛盘组成，筛盘位于筛盘框上面，其特征在于：晶粒双面筛盘由正面筛盘和反面筛盘构成，正反筛盘通过转轴相连接，反面筛盘可通过转轴旋转180°与正面筛盘相复合，正面筛盘和反面筛盘呈轴对称，筛盘有纵横整齐排列的筛选孔，筛盘的筛选孔直径与所筛晶片的N面相同，筛选孔底部有排气孔，筛盘框为密闭空腔，排气孔与筛盘框密闭空腔相通；筛盘上筛选孔设置纵向覆盖板；筛盘框侧面有吸气孔，吸气孔与真空泵相连。
CN201310443910.2A 2013-09-26 2013-09-26 晶粒双面筛盘 Active CN103489816B (zh)

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Publication number Priority date Publication date Assignee Title
CN105977191B (zh) * 2016-07-15 2019-09-24 常州银河电器有限公司 用于六角芯片的筛选工装及筛选方法
CN110790007B (zh) * 2019-10-14 2021-11-30 湖北光安伦芯片有限公司 一种半导体激光器条形Bar的剥离及转运的装置和方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102881587A (zh) * 2012-10-17 2013-01-16 如皋市大昌电子有限公司 一种新型叠片二极管制造工艺及其芯片筛盘
CN203553112U (zh) * 2013-09-26 2014-04-16 如皋市易达电子有限责任公司 晶粒双面筛盘

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102881587A (zh) * 2012-10-17 2013-01-16 如皋市大昌电子有限公司 一种新型叠片二极管制造工艺及其芯片筛盘
CN203553112U (zh) * 2013-09-26 2014-04-16 如皋市易达电子有限责任公司 晶粒双面筛盘

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