CN103476197A - 一种印制电路板的制作方法以及印制电路板 - Google Patents
一种印制电路板的制作方法以及印制电路板 Download PDFInfo
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- CN103476197A CN103476197A CN2013103087623A CN201310308762A CN103476197A CN 103476197 A CN103476197 A CN 103476197A CN 2013103087623 A CN2013103087623 A CN 2013103087623A CN 201310308762 A CN201310308762 A CN 201310308762A CN 103476197 A CN103476197 A CN 103476197A
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105934068A (zh) * | 2016-05-26 | 2016-09-07 | 合肥联宝信息技术有限公司 | 一种印制电路板及电子器件 |
CN110446360A (zh) * | 2019-07-23 | 2019-11-12 | 河南博美通电子科技有限公司 | 一种高精度铝基板和柔性板碱性蚀刻加工工艺 |
CN110446370A (zh) * | 2019-07-23 | 2019-11-12 | 河南博美通电子科技有限公司 | 一种高精度铝基板和柔性板表面连续高效焊接工艺 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH114070A (ja) * | 1997-06-11 | 1999-01-06 | Nec Toyama Ltd | 多層プリント配線板の製造方法 |
CN1610486A (zh) * | 2003-05-07 | 2005-04-27 | 日东电工株式会社 | 制造布线电路板的方法 |
JP2008021700A (ja) * | 2006-07-11 | 2008-01-31 | Fujifilm Corp | プリント配線板の製造方法 |
CN101588675A (zh) * | 2008-05-23 | 2009-11-25 | 深圳富泰宏精密工业有限公司 | 柔性印刷线路及其制造方法 |
US20100321854A1 (en) * | 2009-06-22 | 2010-12-23 | Askey Computer Corporation | Electrostatic discharge (esd) protection method and structure for electronic product |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH114070A (ja) * | 1997-06-11 | 1999-01-06 | Nec Toyama Ltd | 多層プリント配線板の製造方法 |
CN1610486A (zh) * | 2003-05-07 | 2005-04-27 | 日东电工株式会社 | 制造布线电路板的方法 |
JP2008021700A (ja) * | 2006-07-11 | 2008-01-31 | Fujifilm Corp | プリント配線板の製造方法 |
CN101588675A (zh) * | 2008-05-23 | 2009-11-25 | 深圳富泰宏精密工业有限公司 | 柔性印刷线路及其制造方法 |
US20100321854A1 (en) * | 2009-06-22 | 2010-12-23 | Askey Computer Corporation | Electrostatic discharge (esd) protection method and structure for electronic product |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105934068A (zh) * | 2016-05-26 | 2016-09-07 | 合肥联宝信息技术有限公司 | 一种印制电路板及电子器件 |
CN110446360A (zh) * | 2019-07-23 | 2019-11-12 | 河南博美通电子科技有限公司 | 一种高精度铝基板和柔性板碱性蚀刻加工工艺 |
CN110446370A (zh) * | 2019-07-23 | 2019-11-12 | 河南博美通电子科技有限公司 | 一种高精度铝基板和柔性板表面连续高效焊接工艺 |
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CN103476197B (zh) | 2016-04-27 |
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Address after: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 5 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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Effective date of registration: 20220916 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Address before: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |