CN103464334A - Chip gluing machine - Google Patents

Chip gluing machine Download PDF

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Publication number
CN103464334A
CN103464334A CN2013104471184A CN201310447118A CN103464334A CN 103464334 A CN103464334 A CN 103464334A CN 2013104471184 A CN2013104471184 A CN 2013104471184A CN 201310447118 A CN201310447118 A CN 201310447118A CN 103464334 A CN103464334 A CN 103464334A
Authority
CN
China
Prior art keywords
chip
shifting axle
glue
moving mechanism
dimensional moving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2013104471184A
Other languages
Chinese (zh)
Inventor
黄建山
陈建华
张练佳
梅余峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RUGAO EADA ELECTRONICS CO Ltd
Original Assignee
RUGAO EADA ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RUGAO EADA ELECTRONICS CO Ltd filed Critical RUGAO EADA ELECTRONICS CO Ltd
Priority to CN2013104471184A priority Critical patent/CN103464334A/en
Publication of CN103464334A publication Critical patent/CN103464334A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a chip gluing machine in the field of electronic component manufacture. The chip gluing machine comprises an operation platform and a three-dimensional mobile mechanism. The three-dimensional mobile mechanism is located on the operation platform. The chip gluing machine is characterized in that the three-dimensional mobile mechanism comprises an X moving shaft, a Y moving shaft and a Z moving shaft; a gluing device is fixed to the Z moving shaft; the operation platform is provided with a glue tank, a chip sieve tray and a welding mold; a chip to be glued is arranged in the chip sieve tray of the operation platform; the gluing device is a vacuum adsorption head; the gluing device absorbs the chip in the chip sieve tray, the gluing device moves to the glue tank by the three-dimensional mobile mechanism, the chip is coated with glue in the glue tank, and the chip coated with the glue is fed into the welding mold by the three-dimensional mobile mechanism; and a PLC controller controls the motion of the three-dimensional mobile mechanism. The chip gluing machine has the advantages of high automation degree, high efficiency and reliable product quality.

Description

Adhering machine
Technical field
The present invention relates to the production equipment of field of electronic components manufacturing, specifically a kind of chip point gum machine.
Background technology
In the electronic devices and components manufacturing, semiconductor chip need be by the paste weld operation that goes between, traditional gluing process is that glue is poured into to syringe or glue bucket by solenoid control air pressure, push by air pressure the effect that syringe or glue bucket reach plastic emitting, again by manually moving by hand according to the required track that will put glue, again because operator's skill
The art level uneven and produce in changing shifts impact that product quality and production capacity are caused, be difficult to control point glue process stable homogeneous and higher uniformity, even the some glue track of some complexity all can't be realized, manual operations also can't realize large-scale industrial production, enhances productivity.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of high efficiency chip attach adhering machine is provided.
The present invention is achieved by the following technical solutions:
A kind of adhering machine, comprise operating platform and three-dimensional moving mechanism, three-dimensional moving mechanism is positioned on operating platform, it is characterized in that: three-dimensional moving mechanism is by the X shifting axle, Y shifting axle and Z shifting axle form, three-dimensional moving mechanism moves above operating platform, glue sticking device is fixed on the Z shifting axle, operating platform is provided with gum box, chip screen tray and weld mold, the viscose glue chip mount is in the chip screen tray of operating platform, glue sticking device is the vacuum suction head, glue sticking device is absorption chip from the chip screen tray, glue sticking device moves on gum box by three-dimensional moving mechanism, chip is from gum box brushing glue, the chip of brushing glue is placed in weld mold by three-dimensional moving mechanism, the PLC controller is controlled the motion of described three-dimensional moving mechanism, X shifting axle, Y shifting axle and Z shifting axle point gum machine also comprise three drive motors that are respectively used to drive described X shifting axle, Y shifting axle and Z shifting axle, described X shifting axle, Y shifting axle and Z shifting axle include and are fixed on described point gum machine the transmission that driven by corresponding drive motors, by described transmission, are driven and come and gone straight-line bearing panel, described PLC controller is electrically connected to described drive motors, and on described PLC controller, editor controls described drive motors rotational parameters.
The present invention compared with prior art has following beneficial effect:
1. automaticity is high;
2. efficiency is high, reliable product quality.
The accompanying drawing explanation
Fig. 1 is the adhering machine structure principle chart.
Three-dimensional moving mechanism 1, operating platform 2 and glue sticking device 3 in figure.
The specific embodiment
Below in conjunction with accompanying drawing, content of the present invention is described further:
As shown be the adhering machine structure principle chart, comprise three-dimensional moving mechanism 1, operating platform 2 and glue sticking device 3.Three-dimensional moving mechanism 1 moves at operating platform 2, by the glue sticking device 3 be installed on the Z shifting axle, the chip in the screen tray in operating platform 2 is picked up, then chip is put into to gum box brushing glue, chip after brushing glue is put into weld mold, enter lower road welding sequence, operating platform is provided with gum box, chip screen tray and weld mold, and glue sticking device 3 moves on operating platform by three-dimensional moving mechanism 1, and the action of three-dimensional moving mechanism 1 is controlled by the PLC controller.

Claims (4)

1. an adhering machine, comprise operating platform and three-dimensional moving mechanism, three-dimensional moving mechanism is positioned on operating platform, it is characterized in that: three-dimensional moving mechanism is by the X shifting axle, Y shifting axle and Z shifting axle form, glue sticking device is fixed on the Z shifting axle, operating platform is provided with gum box, chip screen tray and weld mold, the viscose glue chip mount is in the chip screen tray of operating platform, glue sticking device is the vacuum suction head, glue sticking device is absorption chip from the chip screen tray, glue sticking device moves on gum box by three-dimensional moving mechanism, chip is from gum box brushing glue, the chip of brushing glue is placed in weld mold by three-dimensional moving mechanism, the PLC controller is controlled the motion of described three-dimensional moving mechanism.
2. adhering machine according to claim 1, it is characterized in that: X shifting axle, Y shifting axle and Z shifting axle point gum machine also comprise three drive motors that are respectively used to drive described X shifting axle, Y shifting axle and Z shifting axle.
3. according to adhering machine claimed in claim 1, it is characterized in that: described X shifting axle, Y shifting axle and Z shifting axle include and are fixed on described point gum machine the transmission that driven by corresponding drive motors, by described transmission, are driven and come and gone straight-line bearing panel.
4. adhering machine according to claim 1, it is characterized in that: described PLC controller is electrically connected to described drive motors, and on described PLC controller, editor controls described drive motors rotational parameters.
CN2013104471184A 2013-09-27 2013-09-27 Chip gluing machine Pending CN103464334A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013104471184A CN103464334A (en) 2013-09-27 2013-09-27 Chip gluing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013104471184A CN103464334A (en) 2013-09-27 2013-09-27 Chip gluing machine

Publications (1)

Publication Number Publication Date
CN103464334A true CN103464334A (en) 2013-12-25

Family

ID=49789503

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013104471184A Pending CN103464334A (en) 2013-09-27 2013-09-27 Chip gluing machine

Country Status (1)

Country Link
CN (1) CN103464334A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104600014A (en) * 2015-01-09 2015-05-06 池州睿成微电子有限公司 Electric conveyer for IC chip
CN104617030A (en) * 2015-01-06 2015-05-13 池州睿成微电子有限公司 IC (Integrated Circuit) chip clamping device with vacuum suction head
CN104681479A (en) * 2015-01-07 2015-06-03 池州睿成微电子有限公司 IC (Integrated Circuit) chip vacuum-suction conveying device
CN104701230A (en) * 2015-01-07 2015-06-10 池州睿成微电子有限公司 IC chip vacuum suction device with transmission device
CN106003993A (en) * 2016-07-01 2016-10-12 中山市金力打印机设备有限公司 Automatic gluing machine
CN106733503A (en) * 2016-11-28 2017-05-31 深圳市奋达科技股份有限公司 A kind of dispersing and curing device and its fixing means
CN114300368A (en) * 2022-03-07 2022-04-08 成都先进功率半导体股份有限公司 Method for welding scattered crystal grain chips by using welding piece equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1674217A (en) * 2004-03-23 2005-09-28 大日本网目版制造株式会社 Processing apparatus
CN201949989U (en) * 2011-01-11 2011-08-31 苏州辉隆自动化设备有限公司 Spraying device for PCB (printed circuit board)
CN103311171A (en) * 2013-06-14 2013-09-18 邹志峰 Multi-sucker chip fixing device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1674217A (en) * 2004-03-23 2005-09-28 大日本网目版制造株式会社 Processing apparatus
CN201949989U (en) * 2011-01-11 2011-08-31 苏州辉隆自动化设备有限公司 Spraying device for PCB (printed circuit board)
CN103311171A (en) * 2013-06-14 2013-09-18 邹志峰 Multi-sucker chip fixing device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104617030A (en) * 2015-01-06 2015-05-13 池州睿成微电子有限公司 IC (Integrated Circuit) chip clamping device with vacuum suction head
CN104681479A (en) * 2015-01-07 2015-06-03 池州睿成微电子有限公司 IC (Integrated Circuit) chip vacuum-suction conveying device
CN104701230A (en) * 2015-01-07 2015-06-10 池州睿成微电子有限公司 IC chip vacuum suction device with transmission device
CN104600014A (en) * 2015-01-09 2015-05-06 池州睿成微电子有限公司 Electric conveyer for IC chip
CN106003993A (en) * 2016-07-01 2016-10-12 中山市金力打印机设备有限公司 Automatic gluing machine
CN106733503A (en) * 2016-11-28 2017-05-31 深圳市奋达科技股份有限公司 A kind of dispersing and curing device and its fixing means
CN106733503B (en) * 2016-11-28 2019-09-17 深圳市奋达科技股份有限公司 A kind of dispersing and curing device and its fixing means
CN114300368A (en) * 2022-03-07 2022-04-08 成都先进功率半导体股份有限公司 Method for welding scattered crystal grain chips by using welding piece equipment

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Application publication date: 20131225