CN103451655B - 带膜蚀刻工艺及应用及用其加工制得的金属片状零部件 - Google Patents
带膜蚀刻工艺及应用及用其加工制得的金属片状零部件 Download PDFInfo
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- CN103451655B CN103451655B CN201310419742.3A CN201310419742A CN103451655B CN 103451655 B CN103451655 B CN 103451655B CN 201310419742 A CN201310419742 A CN 201310419742A CN 103451655 B CN103451655 B CN 103451655B
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CN201310419742.3A CN103451655B (zh) | 2013-09-13 | 2013-09-13 | 带膜蚀刻工艺及应用及用其加工制得的金属片状零部件 |
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CN201310419742.3A CN103451655B (zh) | 2013-09-13 | 2013-09-13 | 带膜蚀刻工艺及应用及用其加工制得的金属片状零部件 |
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CN103451655A CN103451655A (zh) | 2013-12-18 |
CN103451655B true CN103451655B (zh) | 2015-12-02 |
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CN104244591A (zh) * | 2014-09-01 | 2014-12-24 | 苏州米达思精密电子有限公司 | 一种规则排布的带圆形孔补强片的制作方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101121501A (zh) * | 2007-07-24 | 2008-02-13 | 中国电子科技集团公司第五十五研究所 | 分离圆片中的含有微机电系统的芯片的方法 |
CN103296474A (zh) * | 2012-02-29 | 2013-09-11 | 深圳光启创新技术有限公司 | 超材料的制造方法和超材料天线罩的制造方法 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101121501A (zh) * | 2007-07-24 | 2008-02-13 | 中国电子科技集团公司第五十五研究所 | 分离圆片中的含有微机电系统的芯片的方法 |
CN103296474A (zh) * | 2012-02-29 | 2013-09-11 | 深圳光启创新技术有限公司 | 超材料的制造方法和超材料天线罩的制造方法 |
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Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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Effective date of registration: 20200608 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
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