CN103429359B - 用于超声换能器阵列的具有高导热性的高孔隙率声背衬 - Google Patents

用于超声换能器阵列的具有高导热性的高孔隙率声背衬 Download PDF

Info

Publication number
CN103429359B
CN103429359B CN201280013752.0A CN201280013752A CN103429359B CN 103429359 B CN103429359 B CN 103429359B CN 201280013752 A CN201280013752 A CN 201280013752A CN 103429359 B CN103429359 B CN 103429359B
Authority
CN
China
Prior art keywords
ultrasound transducer
transducer array
pad
assembly according
ultrasound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280013752.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN103429359A (zh
Inventor
W·苏多尔
K·G·威克莱恩
Y·于
H·B·诺尔斯
J·保利诺
R·E·戴维森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of CN103429359A publication Critical patent/CN103429359A/zh
Application granted granted Critical
Publication of CN103429359B publication Critical patent/CN103429359B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/0629Square array
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • GPHYSICS
    • G10MUSICAL INSTRUMENTS; ACOUSTICS
    • G10KSOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/002Devices for damping, suppressing, obstructing or conducting sound in acoustic devices

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Surgery (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Gynecology & Obstetrics (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Acoustics & Sound (AREA)
  • Multimedia (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
CN201280013752.0A 2011-03-17 2012-03-14 用于超声换能器阵列的具有高导热性的高孔隙率声背衬 Active CN103429359B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161453690P 2011-03-17 2011-03-17
US61/453,690 2011-03-17
PCT/IB2012/051208 WO2012123908A2 (en) 2011-03-17 2012-03-14 High porosity acoustic backing with high thermal conductivity for ultrasound transducer array

Publications (2)

Publication Number Publication Date
CN103429359A CN103429359A (zh) 2013-12-04
CN103429359B true CN103429359B (zh) 2016-01-13

Family

ID=45992568

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201280013752.0A Active CN103429359B (zh) 2011-03-17 2012-03-14 用于超声换能器阵列的具有高导热性的高孔隙率声背衬
CN2012800137431A Pending CN103443850A (zh) 2011-03-17 2012-03-14 用于超声换能器阵列的具有高导热性的复合声背衬

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2012800137431A Pending CN103443850A (zh) 2011-03-17 2012-03-14 用于超声换能器阵列的具有高导热性的复合声背衬

Country Status (5)

Country Link
US (2) US9237880B2 (enExample)
EP (2) EP2686117B1 (enExample)
JP (2) JP2014508022A (enExample)
CN (2) CN103429359B (enExample)
WO (2) WO2012123908A2 (enExample)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2828845B1 (en) * 2012-03-20 2019-05-08 Koninklijke Philips N.V. Ultrasonic transducer probe with thermally dissipating cable and backing block heat exchange
RU2014142053A (ru) 2012-03-20 2016-05-10 Конинклейке Филипс Н.В. Ультразвуковой матричный датчик с терморассеивающим кабелем
WO2014080312A1 (en) 2012-11-20 2014-05-30 Koninklijke Philips N.V. Frameless ultrasound probes with heat dissipation
WO2014097070A1 (en) 2012-12-18 2014-06-26 Koninklijke Philips N.V. Power and wireless communication modules for a smart ultrasound probe
KR20140144464A (ko) * 2013-06-11 2014-12-19 삼성전자주식회사 휴대용 초음파 프로브
KR20150025066A (ko) 2013-08-28 2015-03-10 삼성메디슨 주식회사 초음파 프로브 및 그 제조 방법
KR20150025383A (ko) * 2013-08-29 2015-03-10 삼성메디슨 주식회사 초음파 진단장치용 프로브
US20150087988A1 (en) * 2013-09-20 2015-03-26 General Electric Company Ultrasound transducer arrays
US11231491B2 (en) 2013-11-11 2022-01-25 Koninklijke Philips N.V. Robust ultrasound transducer probes having protected integrated circuit interconnects
KR102170262B1 (ko) * 2013-12-20 2020-10-26 삼성메디슨 주식회사 초음파 프로브 및 초음파 프로브의 제조방법
KR102168579B1 (ko) 2014-01-06 2020-10-21 삼성전자주식회사 트랜스듀서 지지체, 초음파 프로브 장치 및 초음파 영상 장치
WO2015145402A1 (en) * 2014-03-27 2015-10-01 Koninklijke Philips N.V. Thermally conductive backing materials for ultrasound probes and systems
KR102271172B1 (ko) * 2014-07-14 2021-06-30 삼성메디슨 주식회사 초음파 흡음 부재, 이를 포함하는 초음파 프로브 및 그 제조 방법
JP6606171B2 (ja) * 2014-08-28 2019-11-13 コーニンクレッカ フィリップス エヌ ヴェ 補強高速交換ポートを有する血管内装置及び関連システム
EP2992829B1 (en) * 2014-09-02 2018-06-20 Esaote S.p.A. Ultrasound probe with optimized thermal management
KR102044705B1 (ko) * 2015-02-24 2019-11-14 알피니언메디칼시스템 주식회사 복합 구조의 정합층을 가진 초음파 트랜스듀서 및 그 제조방법
JP6661290B2 (ja) * 2015-07-13 2020-03-11 株式会社日立製作所 超音波プローブ
US10481288B2 (en) 2015-10-02 2019-11-19 Halliburton Energy Services, Inc. Ultrasonic transducer with improved backing element
KR102722181B1 (ko) * 2015-10-08 2024-10-24 디시전 사이선씨즈 메디컬 컴패니, 엘엘씨 음향 정형외과용 추적 시스템 및 방법들
JP2017080132A (ja) * 2015-10-29 2017-05-18 セイコーエプソン株式会社 超音波デバイス、超音波プローブ、電子機器、および超音波画像装置
JP6569473B2 (ja) * 2015-10-29 2019-09-04 セイコーエプソン株式会社 超音波デバイス、超音波プローブ、電子機器、および超音波画像装置
JP6780981B2 (ja) * 2016-08-10 2020-11-04 キヤノンメディカルシステムズ株式会社 超音波プローブ
JP7065837B6 (ja) * 2016-10-03 2022-06-06 コーニンクレッカ フィリップス エヌ ヴェ 心腔内心エコー検査用インターポーザ
US10797221B2 (en) * 2017-02-24 2020-10-06 Baker Hughes, A Ge Company, Llc Method for manufacturing an assembly for an ultrasonic probe
US10809233B2 (en) * 2017-12-13 2020-10-20 General Electric Company Backing component in ultrasound probe
JP7333684B2 (ja) 2018-04-26 2023-08-25 三菱鉛筆株式会社 超音波探触子
KR102637666B1 (ko) 2018-05-14 2024-02-16 엑소 이미징, 인크. 열압착 본딩, 공융 본딩, 및 솔더 본딩을 사용하는 마이크로머신 pMUT 어레이들 및 전자기기들을 위한 통합 기법들
WO2020061394A1 (en) * 2018-09-21 2020-03-26 Butterfly Network, Inc. Acoustic damping for ultrasound imaging devices
US11717265B2 (en) * 2018-11-30 2023-08-08 General Electric Company Methods and systems for an acoustic attenuating material
KR20230116960A (ko) * 2019-03-25 2023-08-04 엑소 이미징, 인크. 핸드헬드 초음파 영상 장치
US12109591B2 (en) 2019-09-09 2024-10-08 GE Precision Healthcare LLC Ultrasound transducer array architecture and method of manufacture
EP4025351A1 (en) * 2019-09-10 2022-07-13 Surf Technology AS Ultrasound transducer and method of manufacturing
JP2023502334A (ja) * 2019-11-22 2023-01-24 エコー イメージング,インク. 音響吸収体構造を備えた超音波トランスデューサ
CN115644917A (zh) 2020-03-05 2023-01-31 艾科索成像公司 具有可编程解剖和流成像的超声成像装置
JP6980051B2 (ja) * 2020-04-28 2021-12-15 ゼネラル・エレクトリック・カンパニイ 超音波プローブ及び超音波装置
JP7451712B2 (ja) * 2020-07-22 2024-03-18 富士フイルム株式会社 超音波振動子ユニット及び超音波内視鏡
JP2022101148A (ja) * 2020-12-24 2022-07-06 三菱鉛筆株式会社 超音波探触子用バッキング材及びその製造方法、並びに超音波探触子
JP7565479B2 (ja) * 2021-03-16 2024-10-11 富士フイルム株式会社 超音波探触子及びバッキング製造方法
EP4312788B1 (en) 2021-04-01 2025-07-16 Koninklijke Philips N.V. Heat dissipation in ultrasound probes
US12486159B2 (en) 2021-06-30 2025-12-02 Exo Imaging, Inc. Micro-machined ultrasound transducers with insulation layer and methods of manufacture
US12099150B2 (en) 2021-10-26 2024-09-24 Exo Imaging, Inc. Multi-transducer chip ultrasound device
US11998387B2 (en) 2022-01-12 2024-06-04 Exo Imaging, Inc. Multilayer housing seals for ultrasound transducers
CN114938987B (zh) * 2022-05-06 2025-11-11 苏州谱洛医疗科技有限公司 一种电连接板及超声换能装置
JP2024029483A (ja) 2022-08-22 2024-03-06 富士フイルムヘルスケア株式会社 超音波プローブ
JP2024029485A (ja) 2022-08-22 2024-03-06 富士フイルムヘルスケア株式会社 超音波プローブ
JP2024029482A (ja) 2022-08-22 2024-03-06 富士フイルムヘルスケア株式会社 超音波プローブ
US20240365671A1 (en) * 2023-04-28 2024-10-31 GE Precision Healthcare LLC Methods and systems for a modified backing
CN120714883A (zh) * 2024-03-29 2025-09-30 深圳半岛医疗集团股份有限公司 一种超声换能器及其的制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5648941A (en) * 1995-09-29 1997-07-15 Hewlett-Packard Company Transducer backing material
CN1802693A (zh) * 2003-06-09 2006-07-12 皇家飞利浦电子股份有限公司 用于设计具有声激励集成电子器件的超声换能器的方法
US20060261707A1 (en) * 2004-08-27 2006-11-23 Wildes Douglas G Ultrasound transducer with enhanced thermal conductivity
US20080098816A1 (en) * 2006-10-31 2008-05-01 Yohachi Yamashita Ultrasonic probe and ultrasonic diagnostic apparatus
WO2008121238A2 (en) * 2007-03-30 2008-10-09 Gore Enterprise Holdings, Inc. Improved ultrasonic attenuation materials
US20080315724A1 (en) * 2005-08-05 2008-12-25 Koninklijke Philips Electronics N.V. Curved Two-Dimensional Array Transducer

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3995179A (en) * 1974-12-30 1976-11-30 Texaco Inc. Damping structure for ultrasonic piezoelectric transducer
US4297607A (en) 1980-04-25 1981-10-27 Panametrics, Inc. Sealed, matched piezoelectric transducer
US5329498A (en) * 1993-05-17 1994-07-12 Hewlett-Packard Company Signal conditioning and interconnection for an acoustic transducer
US5560362A (en) 1994-06-13 1996-10-01 Acuson Corporation Active thermal control of ultrasound transducers
US5541567A (en) * 1994-10-17 1996-07-30 International Business Machines Corporation Coaxial vias in an electronic substrate
US5722412A (en) * 1996-06-28 1998-03-03 Advanced Technology Laboratories, Inc. Hand held ultrasonic diagnostic instrument
US6652515B1 (en) * 1997-07-08 2003-11-25 Atrionix, Inc. Tissue ablation device assembly and method for electrically isolating a pulmonary vein ostium from an atrial wall
US6673328B1 (en) * 2000-03-06 2004-01-06 Ut-Battelle, Llc Pitch-based carbon foam and composites and uses thereof
JP3420951B2 (ja) 1998-11-24 2003-06-30 松下電器産業株式会社 超音波探触子
CA2332158C (en) * 2000-03-07 2004-09-14 Matsushita Electric Industrial Co., Ltd. Ultrasonic probe
US6467138B1 (en) * 2000-05-24 2002-10-22 Vermon Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same
US6689336B2 (en) * 2001-01-23 2004-02-10 Mitsubishi Gas Chemical Company, Inc. Carbon foam, graphite foam and production processes of these
US6666825B2 (en) * 2001-07-05 2003-12-23 General Electric Company Ultrasound transducer for improving resolution in imaging system
US7053530B2 (en) * 2002-11-22 2006-05-30 General Electric Company Method for making electrical connection to ultrasonic transducer through acoustic backing material
JP4624659B2 (ja) * 2003-09-30 2011-02-02 パナソニック株式会社 超音波探触子
US7017245B2 (en) * 2003-11-11 2006-03-28 General Electric Company Method for making multi-layer ceramic acoustic transducer
JP2005340043A (ja) * 2004-05-28 2005-12-08 Sumitomo Electric Ind Ltd 加熱装置
JP4319644B2 (ja) 2004-06-15 2009-08-26 株式会社東芝 音響バッキング組成物、超音波プローブ、及び超音波診断装置
JP4693386B2 (ja) 2004-10-05 2011-06-01 株式会社東芝 超音波プローブ
US7567016B2 (en) * 2005-02-04 2009-07-28 Siemens Medical Solutions Usa, Inc. Multi-dimensional ultrasound transducer array
CN101166472A (zh) 2005-04-25 2008-04-23 皇家飞利浦电子股份有限公司 具有改进的热管理的超声波换能器组件
JP2006325954A (ja) * 2005-05-26 2006-12-07 Toshiba Corp 超音波プローブ及び超音波診断装置
US7859170B2 (en) * 2005-08-08 2010-12-28 Koninklijke Philips Electronics N.V. Wide-bandwidth matrix transducer with polyethylene third matching layer
JP2009505468A (ja) * 2005-08-08 2009-02-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ポリエチレン第三整合層を備える広帯域マトリックストランスデューサ
US7760849B2 (en) 2006-04-14 2010-07-20 William Beaumont Hospital Tetrahedron beam computed tomography
US7956514B2 (en) * 2007-03-30 2011-06-07 Gore Enterprise Holdings, Inc. Ultrasonic attenuation materials
JP5154144B2 (ja) * 2007-05-31 2013-02-27 富士フイルム株式会社 超音波内視鏡及び超音波内視鏡装置
US8093782B1 (en) * 2007-08-14 2012-01-10 University Of Virginia Patent Foundation Specialized, high performance, ultrasound transducer substrates and related method thereof
JP2009060501A (ja) 2007-09-03 2009-03-19 Fujifilm Corp バッキング材、超音波探触子、超音波内視鏡、超音波診断装置、及び、超音波内視鏡装置
WO2009083896A2 (en) 2007-12-27 2009-07-09 Koninklijke Philips Electronics, N.V. Ultrasound transducer assembly with improved thermal behavior
JP2010258602A (ja) * 2009-04-22 2010-11-11 Panasonic Corp 超音波探触子およびその製造方法
JP5591549B2 (ja) * 2010-01-28 2014-09-17 株式会社東芝 超音波トランスデューサ、超音波プローブ、超音波トランスデューサの製造方法
DE102010014319A1 (de) * 2010-01-29 2011-08-04 Siemens Aktiengesellschaft, 80333 Dämpfungsmasse für Ultraschallsensor, Verwendung eines Epoxidharzes
US8232705B2 (en) * 2010-07-09 2012-07-31 General Electric Company Thermal transfer and acoustic matching layers for ultrasound transducer
US8450910B2 (en) * 2011-01-14 2013-05-28 General Electric Company Ultrasound transducer element and method for providing an ultrasound transducer element

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5648941A (en) * 1995-09-29 1997-07-15 Hewlett-Packard Company Transducer backing material
CN1802693A (zh) * 2003-06-09 2006-07-12 皇家飞利浦电子股份有限公司 用于设计具有声激励集成电子器件的超声换能器的方法
US20060261707A1 (en) * 2004-08-27 2006-11-23 Wildes Douglas G Ultrasound transducer with enhanced thermal conductivity
US20080315724A1 (en) * 2005-08-05 2008-12-25 Koninklijke Philips Electronics N.V. Curved Two-Dimensional Array Transducer
US20080098816A1 (en) * 2006-10-31 2008-05-01 Yohachi Yamashita Ultrasonic probe and ultrasonic diagnostic apparatus
WO2008121238A2 (en) * 2007-03-30 2008-10-09 Gore Enterprise Holdings, Inc. Improved ultrasonic attenuation materials

Also Published As

Publication number Publication date
US20130345567A1 (en) 2013-12-26
WO2012123906A2 (en) 2012-09-20
EP2686117B1 (en) 2019-06-19
EP2686116A2 (en) 2014-01-22
EP2686117A2 (en) 2014-01-22
CN103443850A (zh) 2013-12-11
WO2012123908A2 (en) 2012-09-20
US9237880B2 (en) 2016-01-19
JP2014508022A (ja) 2014-04-03
JP5972296B2 (ja) 2016-08-17
WO2012123908A3 (en) 2013-05-02
US20120238880A1 (en) 2012-09-20
WO2012123906A3 (en) 2012-11-15
CN103429359A (zh) 2013-12-04
US9943287B2 (en) 2018-04-17
JP2014512899A (ja) 2014-05-29

Similar Documents

Publication Publication Date Title
CN103429359B (zh) 用于超声换能器阵列的具有高导热性的高孔隙率声背衬
US7956514B2 (en) Ultrasonic attenuation materials
KR101169131B1 (ko) 개선된 초음파 감쇠 재료
CN104755032B (zh) 超声波探针
US7808157B2 (en) Ultrasonic attenuation materials
KR102633430B1 (ko) 초음파 변환기 조립체
EP2828845B1 (en) Ultrasonic transducer probe with thermally dissipating cable and backing block heat exchange
US8378557B2 (en) Thermal transfer and acoustic matching layers for ultrasound transducer
JP2004180301A (ja) 音響バッキング材料を介して超音波変換器に電気的に接続する方法
CN104768472B (zh) 超声波探针
CN104780846B (zh) 超声波探针
US11691177B2 (en) Ultrasound probe with acoustic amplifier
JP4688484B2 (ja) 小型素子超音波トランスデューサ・アレイ用の音響裏当て材
WO2015145296A1 (en) Ultrasound probes and systems having pin-pmn-pt, a dematching layer, and improved thermally conductive backing materials
JP2024046264A (ja) 超音波プローブ及び超音波診断装置
WO2015145402A1 (en) Thermally conductive backing materials for ultrasound probes and systems
AU2012201445B2 (en) Improved ultrasonic attenuation materials

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant