CN103418615A - 轧制铜箔 - Google Patents

轧制铜箔 Download PDF

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Publication number
CN103418615A
CN103418615A CN2012103600198A CN201210360019A CN103418615A CN 103418615 A CN103418615 A CN 103418615A CN 2012103600198 A CN2012103600198 A CN 2012103600198A CN 201210360019 A CN201210360019 A CN 201210360019A CN 103418615 A CN103418615 A CN 103418615A
Authority
CN
China
Prior art keywords
face
copper foil
rolled copper
diffraction
crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012103600198A
Other languages
English (en)
Chinese (zh)
Inventor
室贺岳海
关聪至
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SH Copper Products Co Ltd
Original Assignee
SH Copper Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SH Copper Products Co Ltd filed Critical SH Copper Products Co Ltd
Publication of CN103418615A publication Critical patent/CN103418615A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005—Copper or its alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B2261/00—Product parameters
    • B21B2261/02—Transverse dimensions
    • B21B2261/04—Thickness, gauge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN2012103600198A 2012-05-17 2012-09-24 轧制铜箔 Pending CN103418615A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012113854A JP5201432B1 (ja) 2012-05-17 2012-05-17 圧延銅箔
JP2012-113854 2012-05-17

Publications (1)

Publication Number Publication Date
CN103418615A true CN103418615A (zh) 2013-12-04

Family

ID=48712996

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012103600198A Pending CN103418615A (zh) 2012-05-17 2012-09-24 轧制铜箔

Country Status (3)

Country Link
JP (1) JP5201432B1 (ja)
KR (1) KR101989853B1 (ja)
CN (1) CN103418615A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109392242A (zh) * 2017-08-03 2019-02-26 捷客斯金属株式会社 柔韧印刷基板用铜箔、使用了该铜箔的覆铜层叠体、柔韧印刷基板和电子设备
CN115279929A (zh) * 2020-03-06 2022-11-01 三菱综合材料株式会社 纯铜板、铜-陶瓷接合体、绝缘电路基板
US12035469B2 (en) 2020-03-06 2024-07-09 Mitsubishi Materials Corporation Pure copper plate, copper/ceramic bonded body, and insulated circuit board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112788886B (zh) * 2020-06-23 2023-06-02 北京可利尔福科技有限公司 摄像模组

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000256765A (ja) * 1999-03-08 2000-09-19 Nippon Mining & Metals Co Ltd 屈曲性に優れるフレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2001262296A (ja) * 2000-03-17 2001-09-26 Nippon Mining & Metals Co Ltd 圧延銅箔およびその製造方法
CN1743481A (zh) * 2004-08-30 2006-03-08 同和矿业株式会社 铜合金及其制造方法
CN101481760A (zh) * 2008-01-08 2009-07-15 日立电线株式会社 轧制铜箔及其制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW432124B (en) * 1996-05-13 2001-05-01 Mitsui Mining & Amp Smelting C Electrolytic copper foil with high post heat tensile strength and its manufacturing method
JP3009383B2 (ja) 1998-03-31 2000-02-14 日鉱金属株式会社 圧延銅箔およびその製造方法
JP3856616B2 (ja) 2000-03-06 2006-12-13 日鉱金属株式会社 圧延銅箔及びその製造方法
JP4833692B2 (ja) * 2006-03-06 2011-12-07 古河電気工業株式会社 銅箔、銅箔の製造方法および前記銅箔を用いた積層回路基板
JP4285526B2 (ja) 2006-10-26 2009-06-24 日立電線株式会社 圧延銅箔およびその製造方法
JP4215093B2 (ja) * 2006-10-26 2009-01-28 日立電線株式会社 圧延銅箔およびその製造方法
JP5390852B2 (ja) * 2008-12-24 2014-01-15 株式会社Ｓｈカッパープロダクツ 圧延銅箔
JP2010150597A (ja) * 2008-12-25 2010-07-08 Hitachi Cable Ltd 圧延銅箔
JP5345974B2 (ja) * 2010-06-01 2013-11-20 Ｊｘ日鉱日石金属株式会社 圧延銅合金箔、並びにこれを用いた負極集電体、負極板及び二次電池
JP5625188B2 (ja) * 2010-06-29 2014-11-19 三井住友金属鉱山伸銅株式会社 圧延銅箔およびその製造方法
JP5685869B2 (ja) * 2010-09-14 2015-03-18 三菱マテリアル株式会社 太陽電池パネルのインターコネクター用銅圧延箔及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000256765A (ja) * 1999-03-08 2000-09-19 Nippon Mining & Metals Co Ltd 屈曲性に優れるフレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2001262296A (ja) * 2000-03-17 2001-09-26 Nippon Mining & Metals Co Ltd 圧延銅箔およびその製造方法
CN1743481A (zh) * 2004-08-30 2006-03-08 同和矿业株式会社 铜合金及其制造方法
CN101481760A (zh) * 2008-01-08 2009-07-15 日立电线株式会社 轧制铜箔及其制造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109392242A (zh) * 2017-08-03 2019-02-26 捷客斯金属株式会社 柔韧印刷基板用铜箔、使用了该铜箔的覆铜层叠体、柔韧印刷基板和电子设备
CN109392242B (zh) * 2017-08-03 2021-03-23 捷客斯金属株式会社 柔韧印刷基板用铜箔、使用了该铜箔的覆铜层叠体、柔韧印刷基板和电子设备
CN115279929A (zh) * 2020-03-06 2022-11-01 三菱综合材料株式会社 纯铜板、铜-陶瓷接合体、绝缘电路基板
US12035469B2 (en) 2020-03-06 2024-07-09 Mitsubishi Materials Corporation Pure copper plate, copper/ceramic bonded body, and insulated circuit board

Also Published As

Publication number Publication date
JP5201432B1 (ja) 2013-06-05
JP2013241631A (ja) 2013-12-05
KR20130129054A (ko) 2013-11-27
KR101989853B1 (ko) 2019-06-17

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