CN103409753B - 金属蚀刻剂及其制备方法 - Google Patents
金属蚀刻剂及其制备方法 Download PDFInfo
- Publication number
- CN103409753B CN103409753B CN201310310025.7A CN201310310025A CN103409753B CN 103409753 B CN103409753 B CN 103409753B CN 201310310025 A CN201310310025 A CN 201310310025A CN 103409753 B CN103409753 B CN 103409753B
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- CN
- China
- Prior art keywords
- sodium
- parts
- metal etchants
- preparation
- etch rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- IAFBRPFISOTXSO-UHFFFAOYSA-N 2-[[2-chloro-4-[3-chloro-4-[[1-(2,4-dimethylanilino)-1,3-dioxobutan-2-yl]diazenyl]phenyl]phenyl]diazenyl]-n-(2,4-dimethylphenyl)-3-oxobutanamide Chemical compound C=1C=C(C)C=C(C)C=1NC(=O)C(C(=O)C)N=NC(C(=C1)Cl)=CC=C1C(C=C1Cl)=CC=C1N=NC(C(C)=O)C(=O)NC1=CC=C(C)C=C1C IAFBRPFISOTXSO-UHFFFAOYSA-N 0.000 claims abstract description 11
- VUYFJZVCVCYCJT-UHFFFAOYSA-N 4-methylbenzenesulfonamide;sodium Chemical compound [Na].CC1=CC=C(S(N)(=O)=O)C=C1 VUYFJZVCVCYCJT-UHFFFAOYSA-N 0.000 claims abstract description 11
- JGFBQFKZKSSODQ-UHFFFAOYSA-N Isothiocyanatocyclopropane Chemical compound S=C=NC1CC1 JGFBQFKZKSSODQ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000001744 Sodium fumarate Substances 0.000 claims abstract description 11
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 claims abstract description 11
- PASDCCFISLVPSO-UHFFFAOYSA-N benzoyl chloride Chemical compound ClC(=O)C1=CC=CC=C1 PASDCCFISLVPSO-UHFFFAOYSA-N 0.000 claims abstract description 11
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000004327 boric acid Substances 0.000 claims abstract description 11
- PWLNAUNEAKQYLH-UHFFFAOYSA-N butyric acid octyl ester Natural products CCCCCCCCOC(=O)CCC PWLNAUNEAKQYLH-UHFFFAOYSA-N 0.000 claims abstract description 11
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000005660 chlorination reaction Methods 0.000 claims abstract description 11
- MSJMDZAOKORVFC-SEPHDYHBSA-L disodium fumarate Chemical compound [Na+].[Na+].[O-]C(=O)\C=C\C([O-])=O MSJMDZAOKORVFC-SEPHDYHBSA-L 0.000 claims abstract description 11
- UUIQMZJEGPQKFD-UHFFFAOYSA-N n-butyric acid methyl ester Natural products CCCC(=O)OC UUIQMZJEGPQKFD-UHFFFAOYSA-N 0.000 claims abstract description 11
- VVWRJUBEIPHGQF-UHFFFAOYSA-N propan-2-yl n-propan-2-yloxycarbonyliminocarbamate Chemical compound CC(C)OC(=O)N=NC(=O)OC(C)C VVWRJUBEIPHGQF-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229940005573 sodium fumarate Drugs 0.000 claims abstract description 11
- 235000019294 sodium fumarate Nutrition 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 abstract description 15
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002519 antifouling agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
Description
实施例1 | 实施例2 | 实施例3 | |
蚀刻速率nm/min | 70 | 78 | 80 |
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310310025.7A CN103409753B (zh) | 2013-07-23 | 2013-07-23 | 金属蚀刻剂及其制备方法 |
Applications Claiming Priority (1)
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CN201310310025.7A CN103409753B (zh) | 2013-07-23 | 2013-07-23 | 金属蚀刻剂及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103409753A CN103409753A (zh) | 2013-11-27 |
CN103409753B true CN103409753B (zh) | 2015-08-19 |
Family
ID=49602791
Family Applications (1)
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CN201310310025.7A Expired - Fee Related CN103409753B (zh) | 2013-07-23 | 2013-07-23 | 金属蚀刻剂及其制备方法 |
Country Status (1)
Country | Link |
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CN (1) | CN103409753B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103980905B (zh) * | 2014-05-07 | 2017-04-05 | 佛山市中山大学研究院 | 一种用于氧化物材料体系的蚀刻液及其蚀刻方法和应用 |
CN105386056A (zh) * | 2015-12-04 | 2016-03-09 | 宁波东盛集成电路元件有限公司 | 一种用于蚀刻含铜金属层的金属蚀刻剂及其制备方法 |
JP2017193749A (ja) * | 2016-04-20 | 2017-10-26 | 勝規 瀬川 | ステンレス鋼の脱スケール用電解液および脱スケール法 |
CN107099799A (zh) * | 2017-03-31 | 2017-08-29 | 李世华 | 一种氯化铜蚀刻液及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1575509A (zh) * | 2001-10-22 | 2005-02-02 | 三菱瓦斯化学株式会社 | 铝/钼层叠膜的蚀刻方法 |
CN101233601A (zh) * | 2005-06-13 | 2008-07-30 | 高级技术材料公司 | 在金属硅化物形成后用于选择性除去金属或金属合金的组合物及方法 |
CN102939407A (zh) * | 2010-03-18 | 2013-02-20 | 三星显示有限公司 | 用于金属线的蚀刻剂和使用其来制造金属线的方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7497967B2 (en) * | 2004-03-24 | 2009-03-03 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Compositions and methods for polishing copper |
WO2008048240A2 (en) * | 2005-09-22 | 2008-04-24 | Pantheon Chemical, Inc. | Copper chelating agent, composition including the agent, and methods of forming and using the agent and composition |
-
2013
- 2013-07-23 CN CN201310310025.7A patent/CN103409753B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1575509A (zh) * | 2001-10-22 | 2005-02-02 | 三菱瓦斯化学株式会社 | 铝/钼层叠膜的蚀刻方法 |
CN101233601A (zh) * | 2005-06-13 | 2008-07-30 | 高级技术材料公司 | 在金属硅化物形成后用于选择性除去金属或金属合金的组合物及方法 |
CN102939407A (zh) * | 2010-03-18 | 2013-02-20 | 三星显示有限公司 | 用于金属线的蚀刻剂和使用其来制造金属线的方法 |
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CN103409753A (zh) | 2013-11-27 |
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Owner name: SUZHOU YUFAN NEW MATERIAL TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: WUJIANG LONGSHUO METAL PRODUCTS CO., LTD. Effective date: 20150626 |
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Inventor after: Dai Xiaochen Inventor after: Zhang Qitu Inventor before: Xu Zhijian |
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Effective date of registration: 20150626 Address after: 215200 No. 18 Suzhou Road, Wujiang District, Jiangsu, Suzhou Applicant after: SUZHOU YUFAN NEW MATERIAL TECHNOLOGY CO., LTD. Address before: 215212 Puxi Industrial Zone, No. 17 traffic West Road, Fen town, Suzhou City, Jiangsu, Wujiang Applicant before: Wujiang Longshuo Metal Products Co., Ltd. |
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