CN103378831B - 半导体器件及数据发送方法 - Google Patents

半导体器件及数据发送方法 Download PDF

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Publication number
CN103378831B
CN103378831B CN201310146752.4A CN201310146752A CN103378831B CN 103378831 B CN103378831 B CN 103378831B CN 201310146752 A CN201310146752 A CN 201310146752A CN 103378831 B CN103378831 B CN 103378831B
Authority
CN
China
Prior art keywords
signal
retransmission request
circuit
delayed
data signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201310146752.4A
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English (en)
Chinese (zh)
Other versions
CN103378831A (zh
Inventor
归山隼
归山隼一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of CN103378831A publication Critical patent/CN103378831A/zh
Application granted granted Critical
Publication of CN103378831B publication Critical patent/CN103378831B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L1/00—Arrangements for detecting or preventing errors in the information received
    • H04L1/004—Arrangements for detecting or preventing errors in the information received by using forward error control
    • H04L1/0041—Arrangements at the transmitter end
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L1/00—Arrangements for detecting or preventing errors in the information received
    • H04L1/0001—Systems modifying transmission characteristics according to link quality, e.g. power backoff
    • H04L1/0023—Systems modifying transmission characteristics according to link quality, e.g. power backoff characterised by the signalling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Power Engineering (AREA)
  • Quality & Reliability (AREA)
  • Dc Digital Transmission (AREA)
  • Logic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electronic Switches (AREA)
CN201310146752.4A 2012-04-26 2013-04-25 半导体器件及数据发送方法 Expired - Fee Related CN103378831B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012101655A JP5891100B2 (ja) 2012-04-26 2012-04-26 半導体装置及びデータ送信方法
JP2012-101655 2012-04-26

Publications (2)

Publication Number Publication Date
CN103378831A CN103378831A (zh) 2013-10-30
CN103378831B true CN103378831B (zh) 2017-12-01

Family

ID=49463462

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310146752.4A Expired - Fee Related CN103378831B (zh) 2012-04-26 2013-04-25 半导体器件及数据发送方法

Country Status (3)

Country Link
US (3) US8948276B2 (enExample)
JP (1) JP5891100B2 (enExample)
CN (1) CN103378831B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9240752B2 (en) 2013-03-26 2016-01-19 Stmicroelectronics S.R.L. Power oscillator apparatus with transformer-based power combining
US9306614B2 (en) * 2013-03-26 2016-04-05 Stmicroelectronics S.R.L. Power oscillator apparatus with transformer-based power combining for galvanically-isolated bidirectional data communication and power transfer
WO2015061370A1 (en) 2013-10-21 2015-04-30 Milwaukee Electric Tool Corporation Adapter for power tool devices
JP6591637B2 (ja) * 2013-11-13 2019-10-16 ローム株式会社 半導体装置および半導体モジュール
JP6395304B2 (ja) 2013-11-13 2018-09-26 ローム株式会社 半導体装置および半導体モジュール
JP6248649B2 (ja) * 2014-01-23 2017-12-20 株式会社デンソー 絶縁通信装置
JP6383607B2 (ja) 2014-08-25 2018-08-29 ルネサスエレクトロニクス株式会社 受信装置、通信装置、及び通信方法
US9450398B2 (en) * 2014-12-30 2016-09-20 Diodes Incorporated Protection circuit for electronic system
JP6272509B2 (ja) * 2015-01-20 2018-01-31 三菱電機株式会社 信号伝達装置
JP6557562B2 (ja) * 2015-03-17 2019-08-07 ルネサスエレクトロニクス株式会社 送信回路及び半導体装置
EP3070896A1 (en) * 2015-03-17 2016-09-21 Renesas Electronics Corporation Transmitter circuit, semiconductor apparatus and data transmission method
US10147722B2 (en) * 2016-08-12 2018-12-04 Renesas Electronics America Inc. Isolated circuit formed during back end of line process
JP6921784B2 (ja) * 2018-05-31 2021-08-18 ルネサスエレクトロニクス株式会社 半導体装置
CN110572142A (zh) * 2019-08-22 2019-12-13 宜宾市叙芯半导体有限公司 应用于集成磁隔离芯片的边沿转换方法及编解码电路
US11716117B2 (en) * 2020-02-14 2023-08-01 Texas Instruments Incorporated Circuit support structure with integrated isolation circuitry
JPWO2022075246A1 (enExample) * 2020-10-07 2022-04-14

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5625265A (en) * 1995-06-07 1997-04-29 Kollmorgen Corporation Compact, high efficiency electronic motor controller with isolated gate drive for power transistors
US6262600B1 (en) * 2000-02-14 2001-07-17 Analog Devices, Inc. Isolator for transmitting logic signals across an isolation barrier
US7075329B2 (en) * 2003-04-30 2006-07-11 Analog Devices, Inc. Signal isolators using micro-transformers
CN1989702A (zh) * 2004-06-03 2007-06-27 硅谷实验室公司 扩展频谱隔离器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5952849A (en) * 1997-02-21 1999-09-14 Analog Devices, Inc. Logic isolator with high transient immunity
US7302247B2 (en) 2004-06-03 2007-11-27 Silicon Laboratories Inc. Spread spectrum isolator
JP5504903B2 (ja) * 2010-01-14 2014-05-28 日本電気株式会社 受信回路、受信方法及び信号伝達システム
JP4656263B1 (ja) * 2010-02-01 2011-03-23 トヨタ自動車株式会社 信号伝達装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5625265A (en) * 1995-06-07 1997-04-29 Kollmorgen Corporation Compact, high efficiency electronic motor controller with isolated gate drive for power transistors
US6262600B1 (en) * 2000-02-14 2001-07-17 Analog Devices, Inc. Isolator for transmitting logic signals across an isolation barrier
US7075329B2 (en) * 2003-04-30 2006-07-11 Analog Devices, Inc. Signal isolators using micro-transformers
CN1989702A (zh) * 2004-06-03 2007-06-27 硅谷实验室公司 扩展频谱隔离器

Also Published As

Publication number Publication date
US20150103950A1 (en) 2015-04-16
US8948276B2 (en) 2015-02-03
US20130287141A1 (en) 2013-10-31
CN103378831A (zh) 2013-10-30
JP5891100B2 (ja) 2016-03-22
JP2013229815A (ja) 2013-11-07
US9166738B2 (en) 2015-10-20
US20160006542A1 (en) 2016-01-07

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Address after: Tokyo, Japan

Applicant after: Renesas Electronics Corporation

Address before: Kanagawa, Japan

Applicant before: Renesas Electronics Corporation

COR Change of bibliographic data
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20171201

Termination date: 20190425