JP5891100B2 - 半導体装置及びデータ送信方法 - Google Patents

半導体装置及びデータ送信方法 Download PDF

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Publication number
JP5891100B2
JP5891100B2 JP2012101655A JP2012101655A JP5891100B2 JP 5891100 B2 JP5891100 B2 JP 5891100B2 JP 2012101655 A JP2012101655 A JP 2012101655A JP 2012101655 A JP2012101655 A JP 2012101655A JP 5891100 B2 JP5891100 B2 JP 5891100B2
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JP
Japan
Prior art keywords
signal
retransmission request
circuit
delayed
data signal
Prior art date
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Expired - Fee Related
Application number
JP2012101655A
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English (en)
Japanese (ja)
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JP2013229815A5 (enExample
JP2013229815A (ja
Inventor
帰山　隼一
隼一 帰山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2012101655A priority Critical patent/JP5891100B2/ja
Priority to US13/860,040 priority patent/US8948276B2/en
Priority to CN201310146752.4A priority patent/CN103378831B/zh
Publication of JP2013229815A publication Critical patent/JP2013229815A/ja
Priority to US14/575,045 priority patent/US9166738B2/en
Publication of JP2013229815A5 publication Critical patent/JP2013229815A5/ja
Priority to US14/856,039 priority patent/US20160006542A1/en
Application granted granted Critical
Publication of JP5891100B2 publication Critical patent/JP5891100B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L1/00—Arrangements for detecting or preventing errors in the information received
    • H04L1/004—Arrangements for detecting or preventing errors in the information received by using forward error control
    • H04L1/0041—Arrangements at the transmitter end
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L1/00—Arrangements for detecting or preventing errors in the information received
    • H04L1/0001—Systems modifying transmission characteristics according to link quality, e.g. power backoff
    • H04L1/0023—Systems modifying transmission characteristics according to link quality, e.g. power backoff characterised by the signalling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Power Engineering (AREA)
  • Quality & Reliability (AREA)
  • Dc Digital Transmission (AREA)
  • Logic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electronic Switches (AREA)
JP2012101655A 2012-04-26 2012-04-26 半導体装置及びデータ送信方法 Expired - Fee Related JP5891100B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012101655A JP5891100B2 (ja) 2012-04-26 2012-04-26 半導体装置及びデータ送信方法
US13/860,040 US8948276B2 (en) 2012-04-26 2013-04-10 Semiconductor device and data transmission method
CN201310146752.4A CN103378831B (zh) 2012-04-26 2013-04-25 半导体器件及数据发送方法
US14/575,045 US9166738B2 (en) 2012-04-26 2014-12-18 Semiconductor device and data transmission method
US14/856,039 US20160006542A1 (en) 2012-04-26 2015-09-16 Semiconductor device and data transmission method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012101655A JP5891100B2 (ja) 2012-04-26 2012-04-26 半導体装置及びデータ送信方法

Publications (3)

Publication Number Publication Date
JP2013229815A JP2013229815A (ja) 2013-11-07
JP2013229815A5 JP2013229815A5 (enExample) 2015-03-19
JP5891100B2 true JP5891100B2 (ja) 2016-03-22

Family

ID=49463462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012101655A Expired - Fee Related JP5891100B2 (ja) 2012-04-26 2012-04-26 半導体装置及びデータ送信方法

Country Status (3)

Country Link
US (3) US8948276B2 (enExample)
JP (1) JP5891100B2 (enExample)
CN (1) CN103378831B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9240752B2 (en) 2013-03-26 2016-01-19 Stmicroelectronics S.R.L. Power oscillator apparatus with transformer-based power combining
US9306614B2 (en) * 2013-03-26 2016-04-05 Stmicroelectronics S.R.L. Power oscillator apparatus with transformer-based power combining for galvanically-isolated bidirectional data communication and power transfer
WO2015061370A1 (en) 2013-10-21 2015-04-30 Milwaukee Electric Tool Corporation Adapter for power tool devices
JP6591637B2 (ja) * 2013-11-13 2019-10-16 ローム株式会社 半導体装置および半導体モジュール
JP6395304B2 (ja) 2013-11-13 2018-09-26 ローム株式会社 半導体装置および半導体モジュール
JP6248649B2 (ja) * 2014-01-23 2017-12-20 株式会社デンソー 絶縁通信装置
JP6383607B2 (ja) 2014-08-25 2018-08-29 ルネサスエレクトロニクス株式会社 受信装置、通信装置、及び通信方法
US9450398B2 (en) * 2014-12-30 2016-09-20 Diodes Incorporated Protection circuit for electronic system
JP6272509B2 (ja) * 2015-01-20 2018-01-31 三菱電機株式会社 信号伝達装置
JP6557562B2 (ja) * 2015-03-17 2019-08-07 ルネサスエレクトロニクス株式会社 送信回路及び半導体装置
EP3070896A1 (en) * 2015-03-17 2016-09-21 Renesas Electronics Corporation Transmitter circuit, semiconductor apparatus and data transmission method
US10147722B2 (en) * 2016-08-12 2018-12-04 Renesas Electronics America Inc. Isolated circuit formed during back end of line process
JP6921784B2 (ja) * 2018-05-31 2021-08-18 ルネサスエレクトロニクス株式会社 半導体装置
CN110572142A (zh) * 2019-08-22 2019-12-13 宜宾市叙芯半导体有限公司 应用于集成磁隔离芯片的边沿转换方法及编解码电路
US11716117B2 (en) * 2020-02-14 2023-08-01 Texas Instruments Incorporated Circuit support structure with integrated isolation circuitry
JPWO2022075246A1 (enExample) * 2020-10-07 2022-04-14

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5625265A (en) * 1995-06-07 1997-04-29 Kollmorgen Corporation Compact, high efficiency electronic motor controller with isolated gate drive for power transistors
US5952849A (en) * 1997-02-21 1999-09-14 Analog Devices, Inc. Logic isolator with high transient immunity
US6262600B1 (en) 2000-02-14 2001-07-17 Analog Devices, Inc. Isolator for transmitting logic signals across an isolation barrier
EP2302850A1 (en) 2003-04-30 2011-03-30 Analog Devices, Inc. Signal isolators using micro-transformers
US7421028B2 (en) * 2004-06-03 2008-09-02 Silicon Laboratories Inc. Transformer isolator for digital power supply
US7302247B2 (en) 2004-06-03 2007-11-27 Silicon Laboratories Inc. Spread spectrum isolator
JP5504903B2 (ja) * 2010-01-14 2014-05-28 日本電気株式会社 受信回路、受信方法及び信号伝達システム
JP4656263B1 (ja) * 2010-02-01 2011-03-23 トヨタ自動車株式会社 信号伝達装置

Also Published As

Publication number Publication date
US20150103950A1 (en) 2015-04-16
CN103378831B (zh) 2017-12-01
US8948276B2 (en) 2015-02-03
US20130287141A1 (en) 2013-10-31
CN103378831A (zh) 2013-10-30
JP2013229815A (ja) 2013-11-07
US9166738B2 (en) 2015-10-20
US20160006542A1 (en) 2016-01-07

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