CN103327728A - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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Publication number
CN103327728A
CN103327728A CN2012100753825A CN201210075382A CN103327728A CN 103327728 A CN103327728 A CN 103327728A CN 2012100753825 A CN2012100753825 A CN 2012100753825A CN 201210075382 A CN201210075382 A CN 201210075382A CN 103327728 A CN103327728 A CN 103327728A
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CN
China
Prior art keywords
circuit board
printed circuit
pcb
pad
adjacent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012100753825A
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English (en)
Inventor
周洁松
唐兴华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2012100753825A priority Critical patent/CN103327728A/zh
Priority to TW101110453A priority patent/TW201340792A/zh
Priority to US13/569,195 priority patent/US20130248237A1/en
Publication of CN103327728A publication Critical patent/CN103327728A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种印刷电路板，包括贯穿该印刷电路板的至少二个相邻通孔、以及分别对应该至少两个通孔的至少二个焊盘，每个焊盘围绕该通孔且设置于该印刷电路板的表面，用以焊接穿孔组件，其中所述该至少二个焊盘的任意两个相邻焊盘中间的位置捞空形成一捞空部。

Description

印刷电路板
技术领域
本发明涉一种印刷电路板，尤其涉及一种防止相邻焊盘短路的印刷电路板。
背景技术
虽然目前大多数的印刷电路板设计都采用双面贴片的混合组装技术，表面贴装技术（Surface Mount Technology，SMT）成为印刷电路板设计技术的发展趋势，但诸多电感线圈、大功率组件、电源模块等组件由于散热、组织材质、可靠性等原因仍无法采用上述表面贴装技术，而是在印刷电路板中开设通孔采用穿孔方式组装，因此上述组件也称为穿孔组式组件（Through Hole Component，THC）该类穿孔组式组件在印刷电路板中仍然占有一定比例，而一般使用流动的手焊或波峰焊作业来完成该穿孔式组件与该印刷电路板之间的组装。
在手焊或波峰焊作业过程中，常会出现熔融的焊锡溢流并融合于相邻二焊盘之间，造成相邻焊盘发生短路的问题。
发明内容
有鉴于此，本发明提供一种印刷电路板，能够有效的防止焊锡溢流至相邻的焊盘造成短路。
一种印刷电路板，包括贯穿该印刷电路板的至少二个相邻通孔、以及分别对应该至少两个通孔的至少二个焊盘，每个焊盘围绕该通孔且设置于该印刷电路板的表面，用以焊接穿孔组件，所述印刷电路板对应该至少二个焊盘的任意两个相邻焊盘中间的位置捞空形成一捞空部，以于焊接过程中防止焊锡溢流至相邻的焊盘造成短路。
在本发明中的印刷电路板中，该穿孔式组件是以手焊或波峰焊作业焊接于每个所述焊盘。另外，所述捞空部的形状可为长方形、椭圆形等，但不仅限于此。
利用本发明所提供的印刷电路板，能够有效的防止焊接过程中防止焊锡溢流至相邻的焊盘造成短路的问题，并且在焊接完成后易于检查焊盘之间是否有溢焊，能有效提高生产效率。
附图说明
图1为本发明一实施例示意图。
主要元件符号说明
印刷电路板 1
焊接区 10
通孔 11,11a~11d
焊盘 12,12a~12d
捞空部 13,13a~13c
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，为本发明印刷电路板一实施例示意图。如图所述，该印刷电路板1包括至少一焊接区10供对应的具有多个管脚（Pin）的穿孔式组件（Through Hole Component，THC）焊接，该焊接区10设置有贯穿该印刷电路板1以供所述管脚穿过的多个通孔11，以及设置于该印刷电路板1表面且分别围绕对应的通孔11而设置的以供焊接该穿孔式组件的每个所述管脚的多个焊盘12，印刷电路板1上对应任意两个相邻焊盘12中间的位置设置一捞空部13，用于在进行焊接作业时，即使发生溢焊，焊锡会流至该捞空部13中而不会流至相邻的焊盘12，从而防止焊锡溢流至相邻的焊盘12造成短路。并且在焊盘12之间设置捞空部13，使得在焊接作业完成后检查人员很容易通过检查该捞空部13中是否有焊锡而检查出相邻焊盘12之间是否有溢焊。
例如，如图1所示，设该印刷电路板1上准备焊接一个具有四个管脚的穿孔式组件，该印刷电路板焊接区10中对应设置四个通孔（分别为11a、11b、11c及11d）、以及四个焊盘（分别为12a、12b、12c及12d）。其中，焊盘12a和12b中间设置有捞空部13a，焊盘12b和12c中间设置有焊盘13b，焊盘12c和12d之间设置捞空部13c。
本实施例中，所述穿孔式组件是通过手焊或者波峰焊作业焊接于印刷电路板1上相应的焊接区10。捞空部13的形状可为长方形，椭圆形等。
可以理解，以上所述实施方式仅供说明本发明之用，而并非对本发明的限制。有关技术领域的普通技术人员根据本发明在相应的技术领域做出的变化应属于本发明的保护范畴。

Claims (4)

1.一种印刷电路板，包括贯穿该印刷电路板的至少二个相邻通孔、以及分别对应该至少两个通孔的至少二个焊盘，每个焊盘围绕该通孔且设置于该印刷电路板的表面，用以焊接穿孔式组件，其特征在于：所述印刷电路板对应该至少二个焊盘的任意两个相邻焊盘中间的位置捞空形成一捞空部。
2.如权利要求1所述印刷电路板，其特征在于，该穿孔式组件是以手焊或波峰焊作业焊接于所述焊盘。
3.如权利要求1所述印刷电路板，其特征在于，所述捞空部的形状为长方形。
4.如权利要求1所述的印刷电路板，其特征在于，所述捞空部的形状为椭圆形。
CN2012100753825A 2012-03-21 2012-03-21 印刷电路板 Pending CN103327728A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2012100753825A CN103327728A (zh) 2012-03-21 2012-03-21 印刷电路板
TW101110453A TW201340792A (zh) 2012-03-21 2012-03-26 印刷電路板
US13/569,195 US20130248237A1 (en) 2012-03-21 2012-08-08 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012100753825A CN103327728A (zh) 2012-03-21 2012-03-21 印刷电路板

Publications (1)

Publication Number Publication Date
CN103327728A true CN103327728A (zh) 2013-09-25

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CN2012100753825A Pending CN103327728A (zh) 2012-03-21 2012-03-21 印刷电路板

Country Status (3)

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US (1) US20130248237A1 (zh)
CN (1) CN103327728A (zh)
TW (1) TW201340792A (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104214729A (zh) * 2014-08-20 2014-12-17 合肥京东方光电科技有限公司 一种柔性电路板、背光模组及显示装置
CN106028648A (zh) * 2016-06-28 2016-10-12 北京中讯四方科技股份有限公司 一种使声表器件在高温条件下能正常工作的装置及方法
CN106255318A (zh) * 2016-08-25 2016-12-21 广东欧珀移动通信有限公司 印刷电路板及其波峰焊焊接方法
CN107278047A (zh) * 2016-04-07 2017-10-20 塞舌尔商元鼎音讯股份有限公司 印刷电路板

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Publication number Priority date Publication date Assignee Title
CN112802766A (zh) * 2021-01-04 2021-05-14 上海易卜半导体有限公司 半导体组件组装方法、半导体组件和电子设备

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US4641222A (en) * 1984-05-29 1987-02-03 Motorola, Inc. Mounting system for stress relief in surface mounted components
US5227589A (en) * 1991-12-23 1993-07-13 Motorola, Inc. Plated-through interconnect solder thief
JP2554542Y2 (ja) * 1992-02-17 1997-11-17 台灣杜邦股▲ふん▼有限公司 プリント回路基板
US5604333A (en) * 1994-11-30 1997-02-18 Intel Corporation Process and structure for a solder thief on circuit boards
US6598291B2 (en) * 1998-03-20 2003-07-29 Viasystems, Inc. Via connector and method of making same
TW523857B (en) * 2001-12-06 2003-03-11 Siliconware Precision Industries Co Ltd Chip carrier configurable with passive components
US20060185890A1 (en) * 2005-02-22 2006-08-24 Litton Uk Limited Air void via tuning

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104214729A (zh) * 2014-08-20 2014-12-17 合肥京东方光电科技有限公司 一种柔性电路板、背光模组及显示装置
CN107278047A (zh) * 2016-04-07 2017-10-20 塞舌尔商元鼎音讯股份有限公司 印刷电路板
CN106028648A (zh) * 2016-06-28 2016-10-12 北京中讯四方科技股份有限公司 一种使声表器件在高温条件下能正常工作的装置及方法
CN106255318A (zh) * 2016-08-25 2016-12-21 广东欧珀移动通信有限公司 印刷电路板及其波峰焊焊接方法

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Publication number Publication date
US20130248237A1 (en) 2013-09-26
TW201340792A (zh) 2013-10-01

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Application publication date: 20130925