CN103300882B - 多阵列超声波探头设备及其制造方法和装置 - Google Patents

多阵列超声波探头设备及其制造方法和装置 Download PDF

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Publication number
CN103300882B
CN103300882B CN201310077389.5A CN201310077389A CN103300882B CN 103300882 B CN103300882 B CN 103300882B CN 201310077389 A CN201310077389 A CN 201310077389A CN 103300882 B CN103300882 B CN 103300882B
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China
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substrate
leader
block
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adhesion section
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CN201310077389.5A
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English (en)
Chinese (zh)
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CN103300882A (zh
Inventor
金永一
金东郁
金培滢
宋宗根
李承宪
赵庚一
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/004—Mounting transducers, e.g. provided with mechanical moving or orienting device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Mechanical Engineering (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
CN201310077389.5A 2012-03-14 2013-03-12 多阵列超声波探头设备及其制造方法和装置 Active CN103300882B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120026098A KR101378012B1 (ko) 2012-03-14 2012-03-14 멀티 어레이형 초음파 프로브 장치 및 멀티 어레이형 초음파 프로브 장치의 제조 방법
KR10-2012-0026098 2012-03-14

Publications (2)

Publication Number Publication Date
CN103300882A CN103300882A (zh) 2013-09-18
CN103300882B true CN103300882B (zh) 2016-03-30

Family

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Family Applications (1)

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CN201310077389.5A Active CN103300882B (zh) 2012-03-14 2013-03-12 多阵列超声波探头设备及其制造方法和装置

Country Status (5)

Country Link
US (1) US9071893B2 (https=)
EP (1) EP2639789B1 (https=)
JP (1) JP5666640B2 (https=)
KR (1) KR101378012B1 (https=)
CN (1) CN103300882B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11084062B2 (en) * 2015-11-02 2021-08-10 Koninklijke Philips N.V. Ultrasound transducer array, probe and system
WO2017211754A1 (en) * 2016-06-09 2017-12-14 Koninklijke Philips N.V. Coolable ultrasound probe
JP6712917B2 (ja) * 2016-07-14 2020-06-24 株式会社日立製作所 半導体センサチップアレイ、および超音波診断装置
US11744553B2 (en) * 2016-09-29 2023-09-05 Koninklijke Philips N.V. Ultrasound system, method and computer program product
KR101915255B1 (ko) * 2017-01-11 2018-11-05 삼성메디슨 주식회사 초음파 프로브의 제조 방법 및 그 초음파 프로브
CN115398183A (zh) * 2020-01-17 2022-11-25 大不列颠哥伦比亚大学 柔性电容式微加工超声换能器阵列
KR102492901B1 (ko) * 2021-03-31 2023-01-30 국방과학연구소 압전단결정 복합체 음향센서 및 이를 포함하는 배열 음향센서

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JP3131485B2 (ja) 1992-02-04 2001-01-31 オリンパス光学工業株式会社 超音波プローブ
JP3535204B2 (ja) 1994-02-28 2004-06-07 株式会社東芝 超音波プローブ及びその製造方法
US5655276A (en) 1995-02-06 1997-08-12 General Electric Company Method of manufacturing two-dimensional array ultrasonic transducers
US6043590A (en) 1997-04-18 2000-03-28 Atl Ultrasound Composite transducer with connective backing block
JP4723732B2 (ja) * 2000-07-12 2011-07-13 セイコーインスツル株式会社 脈検出装置及び超音波診断装置
JP3449345B2 (ja) 2000-08-11 2003-09-22 株式会社村田製作所 センサアレイおよび送受信装置
JP4562106B2 (ja) * 2000-11-27 2010-10-13 セイコーインスツル株式会社 超音波診断装置
KR100684677B1 (ko) 2002-06-05 2007-02-23 야마이치덴키 가부시키가이샤 프로브 유닛 및 그 제조 방법
US7280435B2 (en) 2003-03-06 2007-10-09 General Electric Company Switching circuitry for reconfigurable arrays of sensor elements
JP4261298B2 (ja) 2003-09-19 2009-04-30 富士フイルム株式会社 積層構造体アレイ及びその製造方法、並びに、超音波トランスデューサアレイの製造方法
GB2430259B (en) 2004-01-08 2007-07-25 Schlumberger Holdings Integrated Acoustic Transducer Assembly
JP2005342337A (ja) * 2004-06-04 2005-12-15 Matsushita Electric Ind Co Ltd 超音波探触子
EP1774583A2 (en) 2004-07-28 2007-04-18 Sv Probe Pte Ltd. Method and apparatus for producing co-planar bonding pads on a substrate
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Also Published As

Publication number Publication date
US20130242705A1 (en) 2013-09-19
KR101378012B1 (ko) 2014-03-24
JP5666640B2 (ja) 2015-02-12
US9071893B2 (en) 2015-06-30
EP2639789A3 (en) 2014-02-26
KR20130104531A (ko) 2013-09-25
EP2639789A2 (en) 2013-09-18
CN103300882A (zh) 2013-09-18
EP2639789B1 (en) 2016-06-08
JP2013192228A (ja) 2013-09-26

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