CN103293344A - Test circuit board and test fixture for IGBT module - Google Patents
Test circuit board and test fixture for IGBT module Download PDFInfo
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- CN103293344A CN103293344A CN201210044278XA CN201210044278A CN103293344A CN 103293344 A CN103293344 A CN 103293344A CN 201210044278X A CN201210044278X A CN 201210044278XA CN 201210044278 A CN201210044278 A CN 201210044278A CN 103293344 A CN103293344 A CN 103293344A
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- circuit board
- igbt module
- testing circuit
- test
- module testing
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Abstract
The invention provides a test circuit board and a test fixture for an IGBT module. The test circuit board is used for being electrically connected with the IGBT module, and a metal coating with the thickness of 0.1mm to 0.3mm is arranged on at least a partial area of one side, in contact with IGBT module, of the test circuit board. According to the test circuit board and the test fixture for the IGBT module, stray inductance in a test return circuit is reduced by arranging the metal coating on the surface of the test circuit board, the damage caused to the IGBT module due to high inductance is effectively prevented, meanwhile the voltage drop lost by the test fixture is reduced by arranging multiple parallel electrical interfaces, and anti-interference performance of signals is improved.
Description
Technical field
The present invention relates to IGBT module testing clamp structure technology, relate in particular to a kind of IGBT module testing circuit board and test fixture.
Background technology
At present, the industry of domestic IGBT module is in the development, and the IGBT module testing technology of middle low power grade is comparatively ripe, but the IGBT module testing of high-power grade is in the starting stage of development.
Existing test fixture can only can not satisfy the demand of high-power IGBT module testing for the IGBT module of test middle low power grade.Existing test fixture can be difficult to control at inductance with the test loop that test macro forms when being applied to the test of high-power IGBT module, make test result not accurate enough.This test data that the dynamic test process of carrying out obtains is inaccurate under the not accurate enough condition of test macro inductance control, and the reference information that may cause offering the user is inaccurate.Simultaneously, if system's inductance is too high, might in the dynamic test process, damage the IGBT module.
Summary of the invention
The invention provides a kind of IGBT module testing circuit board and test fixture, to solve the too high defective of test loop inductance in the prior art, protection IGBT module is not damaged.
The invention provides a kind of IGBT module testing circuit board, be used for and the IGBT module electrically connects, wherein, at least part of zone of the side that contacts with described IGBT module on the described testing circuit board is provided with the coat of metal that thickness is 0.1-0.3mm.
Aforesaid IGBT module testing circuit board, wherein, preferably, described testing circuit board assembles by multilayer circuit board is stacked, wherein, be provided with the described coat of metal with the contacted side of described IGBT module between the adjacent two layers circuit board and near on the circuit board of described IGBT module.
Aforesaid IGBT module testing circuit board, wherein, preferably, described testing circuit board also arranges electric interfaces parallel more than two, and the described coat of metal is arranged on the zone of having reserved behind the described electric interfaces.
Aforesaid IGBT module testing circuit board, in a specific embodiment, the quantity of described electric interfaces is 5.
An embodiment of aforesaid IGBT module testing circuit board, described testing circuit board also arrange a plurality of for the preformed hole that gold-plated probe is installed.
A kind of IGBT module testing anchor clamps comprise back up pad, wherein, also comprise IGBT module testing circuit board provided by the invention, and described IGBT module testing circuit board is fixedly mounted on the described back up pad.
IGBT module testing circuit board provided by the invention and test fixture arrange the coat of metal by the surface at testing circuit board and have reduced the stray inductance in the test loop, effectively prevented because of the too high damage that the IGBT module is caused of inductance, reduce the pressure drop of anchor clamps own loss in the test by a plurality of parallel electric interfaces are set simultaneously, improved the signal anti-interference.
Description of drawings
The structural representation of the IGBT module testing circuit board that Fig. 1 provides for the embodiment of the invention.
Embodiment
The structural representation of the IGBT module testing circuit board that Fig. 1 provides for the embodiment of the invention, the embodiment of the invention provides a kind of IGBT module testing circuit board, be used for electrically connecting with the IGBT module, wherein, the coat of metal 2 that thickness is 0.1-0.3mm that is provided with of the side that contacts with the IGBT module on this testing circuit board 1, as shown in Figure 1.
As one embodiment of the present of invention, the coat of metal 2 can be specially copper plate.
The above-mentioned coat of metal 2 can be decided according to practical design at the area of testing circuit board 1 surface coverage, after reserving each electric interfaces, adopts large-area coating can effectively reduce stray inductance and the impedance of test fixture part as far as possible.
According to side circuit design needs, testing circuit board can assemble by multilayer circuit board is stacked, wherein, be provided with the above-mentioned coat of metal with the contacted side of IGBT module between the adjacent two layers circuit board and near on the circuit board of IGBT module, the example that Fig. 1 only is made of lamina for testing circuit board, according to the actual design needs, the package assembly of testing circuit board can be done corresponding adjustment.
In order to improve the load-bearing capacity of test loop, preferably, electric interfaces parallel more than two is set on the testing circuit board 1, thereby realizes being electrically connected with electrical equipment, the above-mentioned coat of metal is arranged on and has reserved the zone behind the electric interfaces simultaneously.According to side circuit design, the quantity of this electric interfaces can be made as 5, parallel with one another, reduce self pressure drop of test loop as far as possible.
Further, testing circuit board 1 arranges the preformed hole 3 of a plurality of gold-plated probes, and this preformed hole 3 is used for installing gold-plated probe, so that testing circuit board 1 and IGBT module are electrically connected, can improve the current carrying capacity of test loop.
The embodiment of the invention also provides a kind of IGBT module testing anchor clamps, comprises back up pad, wherein, also comprises the IGBT module testing circuit board that any embodiment of the present invention provides, and this testing circuit board is fixedly mounted on the back up pad.
The IGBT module testing circuit board that the embodiment of the invention provides and test fixture arrange the coat of metal by the surface at testing circuit board and have reduced the stray inductance in the test loop, effectively prevented because of the too high damage that the IGBT module is caused of inductance, reduce the pressure drop of anchor clamps own loss in the test by a plurality of parallel electric interfaces are set simultaneously, improved the signal anti-interference.
It should be noted that at last: above embodiment only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to previous embodiment the present invention is had been described in detail, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment puts down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the scope of various embodiments of the present invention technical scheme.
Claims (7)
1. IGBT module testing circuit board is used for and the IGBT module electrically connects, and it is characterized in that, at least part of zone of the side that contacts with described IGBT module on the described testing circuit board is provided with the coat of metal that thickness is 0.1-0.3mm.
2. IGBT module testing circuit board according to claim 1 is characterized in that, the described coat of metal is copper plate.
3. IGBT module testing circuit board according to claim 1 and 2, it is characterized in that, described testing circuit board assembles by multilayer circuit board is stacked, wherein, be provided with the described coat of metal with the contacted side of described IGBT module between the adjacent two layers circuit board and near on the circuit board of described IGBT module.
4. IGBT module testing circuit board according to claim 1 and 2 is characterized in that described testing circuit board also arranges electric interfaces parallel more than two, and the described coat of metal is arranged on the zone of having reserved behind the described electric interfaces.
5. IGBT module testing circuit board according to claim 4 is characterized in that, the quantity of described electric interfaces is 5.
6. according to claim 1 or 2 arbitrary described IGBT module testing circuit boards, it is characterized in that described testing circuit board also is provided with a plurality of for the preformed hole that gold-plated probe is installed.
7. IGBT module testing anchor clamps comprise back up pad, it is characterized in that, also comprise the arbitrary described IGBT module testing circuit board of claim 1-6, and described IGBT module testing circuit board is fixedly mounted on the described back up pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210044278XA CN103293344A (en) | 2012-02-24 | 2012-02-24 | Test circuit board and test fixture for IGBT module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210044278XA CN103293344A (en) | 2012-02-24 | 2012-02-24 | Test circuit board and test fixture for IGBT module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103293344A true CN103293344A (en) | 2013-09-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210044278XA Pending CN103293344A (en) | 2012-02-24 | 2012-02-24 | Test circuit board and test fixture for IGBT module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103293344A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103605055A (en) * | 2013-11-19 | 2014-02-26 | 西安永电电气有限责任公司 | Insulation partial discharge test tool |
| CN104655999A (en) * | 2013-11-20 | 2015-05-27 | 西安永电电气有限责任公司 | Tool used for testing switching characteristics of crimp-type IGBT (insulated gate bipolar transistor) modules |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5132613A (en) * | 1990-11-30 | 1992-07-21 | International Business Machines Corporation | Low inductance side mount decoupling test structure |
| US20060267185A1 (en) * | 2003-04-09 | 2006-11-30 | Ixys Semiconductor Gmbh | Encapsulated power semiconductor assembly |
| CN201340434Y (en) * | 2009-01-22 | 2009-11-04 | 无锡天和电子有限公司 | Test jig used in mounting type packaged semiconductor power device |
| CN102012440A (en) * | 2010-11-11 | 2011-04-13 | 嘉兴斯达微电子有限公司 | Optimally-designed test fixture for power module |
| CN201845025U (en) * | 2010-11-11 | 2011-05-25 | 嘉兴斯达微电子有限公司 | Power module test fixture with optimal design |
| CN102254902A (en) * | 2011-06-30 | 2011-11-23 | 江苏宏微科技有限公司 | IGBT (Insulated Gate Bipolar Translator) power half-bridge module |
-
2012
- 2012-02-24 CN CN201210044278XA patent/CN103293344A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5132613A (en) * | 1990-11-30 | 1992-07-21 | International Business Machines Corporation | Low inductance side mount decoupling test structure |
| US20060267185A1 (en) * | 2003-04-09 | 2006-11-30 | Ixys Semiconductor Gmbh | Encapsulated power semiconductor assembly |
| CN201340434Y (en) * | 2009-01-22 | 2009-11-04 | 无锡天和电子有限公司 | Test jig used in mounting type packaged semiconductor power device |
| CN102012440A (en) * | 2010-11-11 | 2011-04-13 | 嘉兴斯达微电子有限公司 | Optimally-designed test fixture for power module |
| CN201845025U (en) * | 2010-11-11 | 2011-05-25 | 嘉兴斯达微电子有限公司 | Power module test fixture with optimal design |
| CN102254902A (en) * | 2011-06-30 | 2011-11-23 | 江苏宏微科技有限公司 | IGBT (Insulated Gate Bipolar Translator) power half-bridge module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103605055A (en) * | 2013-11-19 | 2014-02-26 | 西安永电电气有限责任公司 | Insulation partial discharge test tool |
| CN104655999A (en) * | 2013-11-20 | 2015-05-27 | 西安永电电气有限责任公司 | Tool used for testing switching characteristics of crimp-type IGBT (insulated gate bipolar transistor) modules |
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Application publication date: 20130911 |