CN216528043U

CN216528043U - Test circuit board and test equipment

Info

Publication number: CN216528043U
Application number: CN202122577295.7U
Authority: CN
Inventors: 孙成思; 孙日欣; 刘小刚
Original assignee: Biwin Storage Technology Co Ltd
Current assignee: Biwin Storage Technology Co Ltd
Priority date: 2021-10-25
Filing date: 2021-10-25
Publication date: 2022-05-13
Anticipated expiration: 2031-10-25

Abstract

The utility model discloses a test circuit board which is suitable for testing BGA SSD and comprises a substrate and a power supply module; the substrate at least comprises a wiring layer and a conducting layer which are arranged in a stacked mode, wherein a first conducting through hole group and a second conducting through hole group are arranged on the wiring layer, and the first conducting through hole group and the second conducting through hole group are electrically conducted through the conducting layer; the power supply module is arranged on one surface of the wiring layer, which is far away from the conductive layer, and covers the first conductive through hole group, the first conductive through hole group is electrically connected with the power supply module, and the second conductive through hole group is used for connecting the electronic element on the wiring layer. The test circuit board is suitable for testing the BGA SSD, reduces the wiring length of the power supply module and other electronic elements on the wiring layer, and can effectively reduce the noise when testing the BGA SSD, thereby providing a better test environment and ensuring the accuracy of a test result.

Description

Test circuit board and test equipment

Technical Field

The utility model relates to the technical field of memory testing, in particular to a test circuit board and test equipment suitable for testing BGA SSD.

Background

BGA SSD (spherical pin Grid Array package solid state disk), namely adopt BGA (Ball Grid Array package technology) encapsulated high density SSD, for our common SSD, its advantage is that the volume is littleer, and the size can accomplish the nearly 1/50 of traditional 2.5 cun, very big expansion the border of storage application market, but wide application in scenes such as intelligence wearing, IOT thing networking, robot.

Current BGA SSDs have the following advantages: the circuit has the advantages that no intermediate connecting piece is arranged, the circuit performance is stronger, and the power consumption is lower; secondly, the signal transmission distance is short, and the protection performance is strong; the product consistency is high, and the Total Cost of Ownership (TCO) is reduced; and fourthly, a PCIE protocol can be adopted, the frequency can reach 2.4GHZ, other embedded memories generally use an emmc protocol, and the upper limit of the frequency is generally 8 MHZ.

At present, for the SSD, generally, an embedded test fixture has a small current, and in order to satisfy a test condition of the high-frequency product characteristics of the BGA SSD, a long circuit is usually used to route the test fixture, so that the test current is increased, but excessive noise is easily generated during testing, so that a test result is disturbed, and a stable support cannot be provided for product screening and later maintenance.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a test circuit board, and aims to solve the technical problem that the current noise is too large when the current BGA SSD test jig is used for testing.

In order to achieve the above object, the present invention provides a test circuit board, which is suitable for testing an SSD, and includes a substrate and a power module;

the substrate at least comprises a wiring layer and a conducting layer which are arranged in a stacked mode, a first conducting through hole group and a second conducting through hole group are arranged on the wiring layer, and the first conducting through hole group and the second conducting through hole group are electrically conducted through the conducting layer;

the power supply module is arranged on one surface of the wiring layer far away from the conducting layer and covers the first conducting through hole group, the first conducting through hole group is electrically connected with the power supply module, and the second conducting through hole group is used for connecting the electronic element on the wiring layer.

Preferably, the test device further comprises a test interface;

the test interface is positioned on one surface of the wiring layer, which is far away from the conducting layer, and an electric connecting line is arranged between the test interface and the second conducting through hole group.

Preferably, one or more of the electrical connection lines are serpentine shaped traces.

Preferably, each of the electrical connection lines is the same length.

Preferably, the length of each of the traces is 0.1mm to 0.3 mm.

Preferably, the conductive through holes in the first conductive via group and the second conductive via group are back-drilled holes.

Preferably, the wiring layer is a glass fiber layer, and the conductive layer is a copper layer.

Preferably, the output current of the power supply module is 3A-5A, and the number of the conductive through holes in the first conductive through hole group is 12-20.

The utility model also provides a test device which comprises the test circuit board.

Compared with the prior art, the technical scheme of the utility model has the beneficial effects that:

the utility model provides a test circuit board, be applicable to test BGA SSD, first electrically conductive via group and the electrically conductive via group of second pass through the conducting layer electricity on the wiring layer of base plate are led to, power module is connected with first electrically conductive via group electricity, other electronic component accessible are connected with the electrically conductive via group electricity of second, and then are connected with power module electricity, power module and other electronic component walk line length on the wiring layer have been reduced, noise when can effectually reduce test BGA SSD, thereby provide the test environment of preferred, guarantee the accuracy of test result.

Drawings

FIG. 1 is a schematic structural diagram of a test circuit board according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of the test circuit board in fig. 1 from another view angle.

Detailed Description

In the following, the embodiments of the present invention will be described in detail with reference to the drawings in the following, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The utility model provides a test circuit board, which is suitable for testing BGA SSD, and comprises a substrate 100 and a power module 10, and is shown in figures 1 and 2;

the substrate 100 at least comprises a wiring layer 110 and a conductive layer 120 which are arranged in a stacked manner, wherein a first conductive via group 111 and a second conductive via group 112 are arranged on the wiring layer 110, and the first conductive via group 111 and the second conductive via group 112 are electrically conducted through the conductive layer 120;

the power module 10 is disposed on a surface of the wiring layer 110 away from the conductive layer 120 and covers the first conductive via group 111, the first conductive via group 111 is electrically connected to the power module 10, and the second conductive via group 112 is used for connecting an electronic component on the wiring layer 110.

The test circuit board provided by the embodiment can be used for functional testing of the BGA SSD, wherein the substrate 100 of the test circuit board includes a wiring layer 110 and a conductive layer 120, and the conductive layer 120 is located below the wiring layer 110 and stacked with the wiring layer 110. The power module 10 is located on the upper surface of the wiring layer 110, and can be electrically connected to the first conductive via group 111 through pins, and besides the power module 10, other electronic components are also disposed on the upper surface of the wiring layer 110, and can be electrically connected to the second conductive via group 112 through pins or wires. The first conductive via group 111 and the second conductive via group 112 on the wiring layer 110 of the substrate 100 are electrically connected through the conductive layer 120, the power module 10 is electrically connected to the first conductive via group 111, and other electronic components are electrically connected to the second conductive via group 112 and further electrically connected to the power module 10.

The first conductive via group 111 includes a plurality of conductive vias, the number of the conductive vias is set according to practical situations, for example, 12 or 14 conductive vias are different, and the aperture range of the conductive vias is 180 μm ± 35 μm. The second conductive via group 112 includes a plurality of conductive vias, the number of the conductive vias is set according to practical situations, for example, 6 or 8, and the aperture range of the conductive vias is 180 μm ± 35 μm. Moreover, due to the difference in the arrangement number and connection relationship of the electronic components on the substrate 100, a plurality of second conductive via groups 112 may be respectively disposed to correspond to the connections applied to the plurality of electronic components on the wiring layer 110; the number of the second conductive via sets 112 is not limited, and is set according to practical situations. The conductive via in this embodiment has a conductive metal layer, such as a copper layer, laid on the inner wall thereof, so as to electrically connect the conductive layer 120 with the power module 10 or other electronic components through the conductive metal layer.

The substrate 100 of the test circuit board may further include other layers besides the wiring layer 110 and the conductive layer 120, the other layers are sequentially stacked under the conductive layer 120, the other layers may also adopt layer structures such as the wiring layer 110 and the conductive layer 120 and are alternately disposed, and the different layers may also form an electrical connection relationship through the conductive via.

The test circuit board reduces the wiring length of the power module 10 and other electronic elements on the wiring layer 110, and can effectively reduce the noise when testing the BGA SSD, thereby providing a better test environment and ensuring the accuracy of the test result.

In a preferred embodiment, referring to fig. 1 and 2, the test circuit board further includes a test interface 20;

the test interface 20 is located on a surface of the wiring layer 110 away from the conductive layer 120, and an electrical connection line 30 is disposed between the test interface 20 and the second conductive via set 112.

The test interface 20 is electrically connected to the second conductive via set 112 through the electrical connection line 30, and further electrically connected to the power module 10. The test interface 20 is used for connecting with the BGA SSD, so that the test circuit board can carry out power-on test on the BGA SSD, and the operation is convenient.

Further, referring to fig. 2, one or more traces 31 in the connection line 30 are serpentine traces. The routing 31 in the connecting circuit 30 is a snake-shaped routing, so that the signal transmission delay can be effectively reduced, the BGA SSD testing condition is achieved, and the testing efficiency is improved.

Further, each of the traces 31 in the connection wire 30 is the same length. In which, by setting the lengths of the wires 31 in the connection circuit 30 to be the same, the signal difference amplification between different wires 31 can be avoided, thereby ensuring the testing effect.

Further, the length of each trace 31 is 0.1mm to 0.3 mm. The length of each routing wire 31 is set to be 0.1 mm-0.3 mm, and the signal transmission delay can be controlled within 3 ns.

In a preferred embodiment, the conductive vias in the first and second sets of

conductive vias

111 and 112 are back-drilled holes. The conductive through holes in the first conductive through hole group 111 and the second conductive through hole group 112 are back-drilled holes, so that through hole sections which do not have any connection or transmission function can be removed, reflection, scattering, delay and the like of high-speed signal transmission are avoided, and the stability of signal transmission is improved.

In a preferred embodiment, the wiring layer 110 is a glass fiber layer, and the conductive layer 120 is a copper layer. The glass fiber used by the wiring layer 110 and the copper used by the conductive layer 120 are made of the existing general PCB material, which can ensure the stability of the function test and is simple and practical.

In a preferred embodiment, the output current of the power module 10 is 3A-5A, and the number of the conductive vias in the first conductive via group 111 is 12-20. The configuration number of the conductive through holes in the first conductive through hole group 111 needs to be larger than the current carrying capacity of the power module 10, and when one conductive through hole overflows 250mA, the power module 10 is 3-5A, 12-20 conductive through holes need to be correspondingly arranged.

The present invention further provides a testing device, which includes the testing circuit board described in the foregoing embodiment, and the specific structure of the testing circuit board refers to the foregoing embodiment.

It should be noted that the technical solutions in the embodiments of the present invention can be combined with each other, but must be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of the technical solutions should not be considered to exist, and is not within the scope of the present invention as claimed.

The above description is only a part of or preferred embodiments of the present invention, and neither the text nor the drawings should be construed as limiting the scope of the present invention, and all equivalent structural changes, which are made by using the contents of the present specification and the drawings, or any other related technical fields, are included in the scope of the present invention.

Claims

1. A test circuit board is suitable for testing BGA SSD and is characterized by comprising a substrate and a power supply module;

2. The test circuit board of claim 1, further comprising a test interface;

3. The test circuit board of claim 2, wherein one or more of the electrical connection traces are serpentine traces.

4. The test circuit board of claim 2, wherein each of the electrical connection lines is the same length.

5. The test circuit board of claim 4, wherein the length of each trace is 0.1mm to 0.3 mm.

6. The test circuit board of claim 1, wherein the conductive vias in the first and second sets of conductive vias are back-drilled holes.

7. The test circuit board of claim 1, wherein the wiring layer is a fiberglass layer and the conductive layer is a copper layer.

8. The test circuit board according to claim 1, wherein the output current of the power module is 3A-5A, and the number of the conductive through holes in the first conductive through hole group is 12-20.

9. A test device comprising a test circuit board according to any one of claims 1 to 8.