CN201262631Y - Density converting device for PCB micro-needle test - Google Patents
Density converting device for PCB micro-needle test Download PDFInfo
- Publication number
- CN201262631Y CN201262631Y CNU2008202072945U CN200820207294U CN201262631Y CN 201262631 Y CN201262631 Y CN 201262631Y CN U2008202072945 U CNU2008202072945 U CN U2008202072945U CN 200820207294 U CN200820207294 U CN 200820207294U CN 201262631 Y CN201262631 Y CN 201262631Y
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- CN
- China
- Prior art keywords
- density
- micropin
- test
- pcb
- top layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a density conversion device for testing a PCB micropin, the improvement of which is as follows: the density conversion device comprises a conversion circuit board that consists of a base layer and a surface layer; the surface layer of the circuit board is divided into two regions with different densities; wherein, a first region is provided with a net-shaped contact which correspondS to the micropin of a test fixture; a second region is provided with a net-shaped lead out point which is connected with an external standard connector; the net-shaped contact of the first region is correspondingly connected with the net-shaped lead out point of the second region by lead wires distributed in the base layer of the conversion circuit board. The density conversion device has the beneficial effects that the circuit board is adopted to be the carrier of the density conversion, on which the different contacts with high density and density; and the contacts with the high density and the contacts with the low density are connected by the winding displacement in the circuit board, thus realizing the density conversion function needed in the process of the PCB micropin test.
Description
[technical field]
The utility model relates to a kind of printed circuit board (PCB) (Printed Circuit Board; PCB) field tests refers in particular to a kind of PCB micropin test density conversion equipment.
[background technology]
In PCB test industry, now the integrated level of circuit board is more and more higher, solder joint is more and more littler, density is close more, the development of pcb board test machine then comparatively lags behind by contrast, and the price of pcb board test machine is very high in addition, and use enterprise often can't bear the update to corresponding test machine, but this means that also enterprise is missing a chance, even causes enterprise to be defeated in the spring tide of the market of cut-throat competition.At present, common circuit board testing can not satisfy test request, at the high-density test a kind of micropin test of arising at the historic moment now.The advantage of this method of testing is: test power that draw point bore is very little, does not stab so can not cause small PAD, and can satisfy very highdensity test request.And be applied to the conversion dials of being used for of this kind micropin test at present with the connection between test fixture and the Test Switchboard card, its manufacture craft adopts the netted open-end hole of at first being got corresponding test fixture micropin on fiberboard by special high precision drilling machine usually, again enameled wire is squeezed in the through hole fixing, polish then more gold-plated processing is carried out on its surface, so, the other end of enameled wire is connected in the thin ox horn socket of common density distribution the most at last, utilizes winding displacement that the switch card is connected with ox horn again and forms test loop to be used for the micropin test of PCB.But adopt the conversion needle-bar of this kind structure, owing to need to change the high density aperture and squeeze into every technology such as enameled wire, also there are many defectives such as cost of manufacture height, cycle are long, maintenance inconvenience in the very complicated and conversion dials of process for integrally manufacturing in manufacture process for it.How adapting in the quick growth testing requirement of high density solder joint PCB more and the micropin testing cost being reduced and popularize the micropin test has become and has been badly in need of the matter of utmost importance that solves in the industry.
[summary of the invention]
The purpose of this utility model is to have overcome above-mentioned defective, provides a kind of simple in structure, and with low cost and fabrication cycle is short can be used for density conversion equipment in the test of PCB micropin.
The purpose of this utility model is achieved in that a kind of PCB micropin test density conversion equipment, its improvements are: it comprises a change-over circuit plate, the change-over circuit plate is made up of basic unit and top layer, described circuit board top layer is divided into two zones that density is different, wherein the first area is provided with the netted contact of corresponding test fixture micropin, second area is provided with netted leading point, and leading point and external perimysium reference connector are electrically connected; The netted contact of described first area and lead-in wire corresponding link to each other of the netted leading point of second area by arranging in the change-over circuit plate basic unit;
The density of netted contact, first area, described change-over circuit plate top layer is higher than the netted leading point of second area density;
Between the described netted contact that links to each other by lead-in wire in the change-over circuit plate basic unit and the netted leading point is corresponding one by one continuous;
Netted leading point on the second area of described change-over circuit plate top layer is a through-hole structure, is inserted with connector in the through hole;
Being inserted with connector in the described through hole is the ox horn connector, and the test fixture micropin is by the conversion of change-over circuit plate after by ox horn connector access external test circuitry;
Described change-over circuit plate top layer is divided into upper epidermis and reaches top layer down;
Two different zones of density on described change-over circuit plate top layer correspond to descend thereon on the top layer;
The different zone of two density on described change-over circuit plate top layer is all as for on the top layer simultaneously.
Than common density conversion equipment, the beneficial effects of the utility model have been to adopt a carrier that the PCB circuit board is changed as density, be distributed with netted contact on the circuit board, and the contact is divided into high and low density region by the zone, wherein the contact of high density area is the corresponding one by one setting of micropin on the corresponding micropin test machine anchor clamps, the contact of low density area then correspondence is drawn and is connected in the ox horn socket, and link to each other by the winding displacement that is arranged in the circuit board between the contact of high and low density region, realized needed density translation function in the PCB micropin test process thus.
[description of drawings]
Below in conjunction with accompanying drawing in detail concrete structure of the present utility model is described in detail
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is a user mode synoptic diagram of the present utility model.
[embodiment]
Below in conjunction with accompanying drawing the utility model specific embodiment is described in detail.
As shown in Figure 1, the utility model provides a kind of PCB micropin test density conversion equipment, it comprises a change-over circuit plate 3, change-over circuit plate 3 is made up of basic unit and top layer, described circuit board top layer is divided into two zones that density is different, wherein first area 301 is provided with the netted contact 303 of corresponding test fixture micropin, second area 302 is provided with netted leading point 304, in the present embodiment on the first area 301 netted contact 303 be in same top layer with second area 202 netted leading points 304, and the density of netted contact 303 is higher than the density of netted leading point 304, the netted contact 303 in two zones and lead-in wire 305 one by one corresponding link to each other of netted leading point 304 by arranging in the change-over circuit plate basic unit.For the ease of easy to connect with the outside, change-over circuit plate 3 can be made into doubling plate, so translation functions can be realized thereby link to each other by 305 correspondences of winding displacement in the circuit board therebetween respectively as for the top layer up and down of double-layer circuit board correspondence in netted contact 303 and netted leading point 304.
Referring to Fig. 2, during use on the change-over circuit plate of density conversion equipment highdensity first area as on the micropin test fixture 1, micropin 2 on it in netted contact 303 and the test fixture 1 is corresponding to be touched mutually, low-density second area then is positioned at outside the micropin test fixture 1 on the change-over circuit plate, what adopted netted herein leading point 304 is through-hole structure, because netted contact 304 density are lower, can peg graft in it directly using ox horn connector 4 always, make it signal of netted contact, first area can be drawn the access external test circuitry easily.
It is to be noted; of the present utility modelly be not limited to above-mentioned embodiment; any simple modification, equivalent variations and modification that any those skilled in the art do the foregoing description in based on technical solutions of the utility model all belong in the protection domain of the present utility model.
Claims (8)
1, a kind of PCB micropin test density conversion equipment, it is characterized in that: it comprises a change-over circuit plate, the change-over circuit plate is made up of basic unit and top layer, described circuit board top layer is divided into two zones that density is different, wherein the first area is provided with the netted contact of corresponding test fixture micropin, second area is provided with netted leading point, and leading point and external perimysium reference connector are electrically connected; The netted contact of described first area and lead-in wire corresponding link to each other of the netted leading point of second area by arranging in the change-over circuit plate basic unit.
2, the density conversion equipment is used in PCB micropin test as claimed in claim 1, and it is characterized in that: the density of netted contact, first area, described change-over circuit plate top layer is higher than the netted leading point of second area density.
3, the density conversion equipment use in PCB micropin as claimed in claim 1 test, it is characterized in that: between the described netted contact that links to each other by lead-in wire in the change-over circuit plate basic unit and the netted leading point is corresponding one by one continuous.
4, the density conversion equipment is used in PCB micropin test as claimed in claim 1, and it is characterized in that: the netted leading point on the second area of described change-over circuit plate top layer is a through-hole structure, is inserted with connector in the through hole.
5, the density conversion equipment is used in PCB micropin test as claimed in claim 4, and it is characterized in that: being inserted with connector in the described through hole is the ox horn connector, and the test fixture micropin is by the conversion of change-over circuit plate after by ox horn connector access external test circuitry.
6, the density conversion equipment is used in PCB micropin test as claimed in claim 1, it is characterized in that: described change-over circuit plate top layer is divided into upper epidermis and reaches top layer down.
7, the density conversion equipment is used in PCB micropin test as claimed in claim 6, and it is characterized in that: two different zones of density on described change-over circuit plate top layer correspond to thereon to descend on the top layer.
8, the density conversion equipment use in PCB micropin as claimed in claim 6 test, it is characterized in that: the different zone of two density on described change-over circuit plate top layer is all as on the same top layer simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202072945U CN201262631Y (en) | 2008-08-19 | 2008-08-19 | Density converting device for PCB micro-needle test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202072945U CN201262631Y (en) | 2008-08-19 | 2008-08-19 | Density converting device for PCB micro-needle test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201262631Y true CN201262631Y (en) | 2009-06-24 |
Family
ID=40809106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202072945U Expired - Lifetime CN201262631Y (en) | 2008-08-19 | 2008-08-19 | Density converting device for PCB micro-needle test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201262631Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104515874A (en) * | 2013-09-26 | 2015-04-15 | 北大方正集团有限公司 | Adapter plate used for circuit board testing and test method and test device |
| CN108490332A (en) * | 2018-02-02 | 2018-09-04 | 大族激光科技产业集团股份有限公司 | Automatic micropin measurement jig |
-
2008
- 2008-08-19 CN CNU2008202072945U patent/CN201262631Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104515874A (en) * | 2013-09-26 | 2015-04-15 | 北大方正集团有限公司 | Adapter plate used for circuit board testing and test method and test device |
| CN104515874B (en) * | 2013-09-26 | 2017-07-04 | 北大方正集团有限公司 | For pinboard and method of testing, the test device of circuit board testing |
| CN108490332A (en) * | 2018-02-02 | 2018-09-04 | 大族激光科技产业集团股份有限公司 | Automatic micropin measurement jig |
| CN108490332B (en) * | 2018-02-02 | 2021-01-08 | 深圳麦逊电子有限公司 | Automatic micro-needle testing jig |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090624 |
|
| CX01 | Expiry of patent term |