CN103227275B - 布线基板、发光器件以及制造布线基板的方法 - Google Patents

布线基板、发光器件以及制造布线基板的方法 Download PDF

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Publication number
CN103227275B
CN103227275B CN201310030269.XA CN201310030269A CN103227275B CN 103227275 B CN103227275 B CN 103227275B CN 201310030269 A CN201310030269 A CN 201310030269A CN 103227275 B CN103227275 B CN 103227275B
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CN
China
Prior art keywords
wiring pattern
insulating layer
layer
wiring
metal layer
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CN201310030269.XA
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English (en)
Chinese (zh)
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CN103227275A (zh
Inventor
村松茂次
清水浩
小林和贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
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Shinko Electric Co Ltd
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Publication of CN103227275A publication Critical patent/CN103227275A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201310030269.XA 2012-01-25 2013-01-25 布线基板、发光器件以及制造布线基板的方法 Active CN103227275B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-013241 2012-01-25
JP2012013241A JP5848976B2 (ja) 2012-01-25 2012-01-25 配線基板、発光装置及び配線基板の製造方法

Publications (2)

Publication Number Publication Date
CN103227275A CN103227275A (zh) 2013-07-31
CN103227275B true CN103227275B (zh) 2017-06-09

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CN201310030269.XA Active CN103227275B (zh) 2012-01-25 2013-01-25 布线基板、发光器件以及制造布线基板的方法

Country Status (4)

Country Link
US (1) US9000474B2 (enExample)
EP (1) EP2620980B1 (enExample)
JP (1) JP5848976B2 (enExample)
CN (1) CN103227275B (enExample)

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WO2015050164A1 (ja) * 2013-10-03 2015-04-09 シャープ株式会社 発光装置用基板、発光装置、および、発光装置用基板の製造方法
JP6215360B2 (ja) * 2014-01-10 2017-10-18 シャープ株式会社 発光装置用基板、発光装置および発光装置用基板の製造方法
JP6316731B2 (ja) * 2014-01-14 2018-04-25 新光電気工業株式会社 配線基板及びその製造方法、並びに半導体パッケージ
US9326373B2 (en) * 2014-04-09 2016-04-26 Finisar Corporation Aluminum nitride substrate
JPWO2016092956A1 (ja) * 2014-12-08 2017-08-17 シャープ株式会社 発光装置用基板及び発光装置用基板の製造方法
KR102434189B1 (ko) 2015-05-07 2022-08-19 서울바이오시스 주식회사 자외선 발광 장치
KR101629749B1 (ko) * 2015-11-13 2016-06-14 우종구 비메탈 양면 pcb를 이용한 광고판용 양면 발광 엘이디 램프
TWM521008U (zh) * 2016-01-27 2016-05-01 Lite On Technology Corp 車燈裝置及其發光模組
US10823355B2 (en) * 2016-01-27 2020-11-03 Lite-On Electronics (Guangzhou) Limited Light-emitting module for vehicle lamp
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CN109863611B (zh) * 2016-10-25 2021-08-17 京瓷株式会社 发光元件搭载用基板、发光装置以及发光模块
JP6835962B2 (ja) * 2017-05-30 2021-02-24 シャープ株式会社 半導体モジュール、表示装置、および半導体モジュールの製造方法。
US10290584B2 (en) * 2017-05-31 2019-05-14 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive vias in semiconductor packages and methods of forming same
DE102018129575A1 (de) * 2018-11-23 2020-05-28 Osram Opto Semiconductors Gmbh Lichtemittereinheit mit wenigstens einem VCSEL-Chip
CN111278216B (zh) * 2018-12-04 2023-06-20 湖南中车时代电动汽车股份有限公司 Pcb的散热与防焊接偏移的封装结构及其设计方法
US20200395731A1 (en) * 2019-06-11 2020-12-17 Trumpf Photonics Inc. Insulated Laser Coolers
CN112490344A (zh) * 2019-09-11 2021-03-12 光宝光电(常州)有限公司 发光封装结构及其制造方法及复合基板
CN114258192B (zh) * 2020-09-23 2024-10-15 庆鼎精密电子（淮安）有限公司 具有高反射率的电路板及其制作方法
CN115004359A (zh) * 2020-08-28 2022-09-02 富士电机株式会社 半导体装置
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Also Published As

Publication number Publication date
EP2620980A1 (en) 2013-07-31
EP2620980B1 (en) 2020-04-15
US9000474B2 (en) 2015-04-07
CN103227275A (zh) 2013-07-31
JP2013153067A (ja) 2013-08-08
JP5848976B2 (ja) 2016-01-27
US20130187190A1 (en) 2013-07-25

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