CN103222040B - 粘接剂组合物、半导体装置的制造方法以及半导体装置 - Google Patents

粘接剂组合物、半导体装置的制造方法以及半导体装置 Download PDF

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CN103222040B
CN103222040B CN201180047053.3A CN201180047053A CN103222040B CN 103222040 B CN103222040 B CN 103222040B CN 201180047053 A CN201180047053 A CN 201180047053A CN 103222040 B CN103222040 B CN 103222040B
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curing agent
system curing
adhesive composite
semiconductor device
carbon number
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CN103222040A (zh
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本田一尊
永井朗
榎本哲也
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Lishennoco Co ltd
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Hitachi Chemical Co Ltd
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CN105081614B (zh) * 2015-09-07 2017-08-04 东莞市富默克化工有限公司 一种osp预浸剂
CN109075088B (zh) * 2016-05-09 2022-01-07 昭和电工材料株式会社 半导体装置的制造方法
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JP2017038081A (ja) * 2016-10-27 2017-02-16 住友ベークライト株式会社 半導体装置
WO2018105125A1 (ja) * 2016-12-09 2018-06-14 日立化成株式会社 組成物、接着剤、焼結体、接合体及び接合体の製造方法
KR102290957B1 (ko) * 2017-03-31 2021-08-20 주식회사 엘지에너지솔루션 이차전지용 바인더 조성물, 이를 포함하는 이차전지용 전극 및 리튬 이차전지
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