CN103219470B - 显示装置、制造方法及电子设备 - Google Patents
显示装置、制造方法及电子设备 Download PDFInfo
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- CN103219470B CN103219470B CN201310089673.4A CN201310089673A CN103219470B CN 103219470 B CN103219470 B CN 103219470B CN 201310089673 A CN201310089673 A CN 201310089673A CN 103219470 B CN103219470 B CN 103219470B
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000010410 layer Substances 0.000 claims abstract description 39
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000012044 organic layer Substances 0.000 claims abstract description 30
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 22
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910021529 ammonia Inorganic materials 0.000 claims abstract description 16
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910000077 silane Inorganic materials 0.000 claims abstract description 10
- 238000005229 chemical vapour deposition Methods 0.000 claims abstract description 5
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- 230000003287 optical effect Effects 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000010408 film Substances 0.000 description 138
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
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- 229920002577 polybenzoxazole Polymers 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
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- 238000001771 vacuum deposition Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
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- 238000005268 plasma chemical vapour deposition Methods 0.000 description 3
- 230000027756 respiratory electron transport chain Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
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- 239000007789 gas Substances 0.000 description 2
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- 239000011261 inert gas Substances 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
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- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
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- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/876—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/852—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-052136 | 2008-03-03 | ||
JP2008052136A JP2009211877A (ja) | 2008-03-03 | 2008-03-03 | 表示装置および電子機器 |
CN2009101183371A CN101527350B (zh) | 2008-03-03 | 2009-02-27 | 显示装置及电子设备 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101183371A Division CN101527350B (zh) | 2008-03-03 | 2009-02-27 | 显示装置及电子设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103219470A CN103219470A (zh) | 2013-07-24 |
CN103219470B true CN103219470B (zh) | 2016-08-24 |
Family
ID=41012659
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101183371A Active CN101527350B (zh) | 2008-03-03 | 2009-02-27 | 显示装置及电子设备 |
CN201310089673.4A Active CN103219470B (zh) | 2008-03-03 | 2009-02-27 | 显示装置、制造方法及电子设备 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101183371A Active CN101527350B (zh) | 2008-03-03 | 2009-02-27 | 显示装置及电子设备 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090218943A1 (zh) |
JP (1) | JP2009211877A (zh) |
KR (1) | KR20090094745A (zh) |
CN (2) | CN101527350B (zh) |
TW (1) | TWI498039B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011055440A1 (ja) * | 2009-11-05 | 2011-05-12 | キヤノン株式会社 | 表示装置 |
JP5683094B2 (ja) * | 2009-11-17 | 2015-03-11 | キヤノン株式会社 | 有機エレクトロルミネッセンス素子及びこれを用いた多色表示装置 |
JP2013077460A (ja) * | 2011-09-30 | 2013-04-25 | Toppan Printing Co Ltd | 有機elパネルの製造方法、有機elパネル及び有機elディスプレイ |
JP6082907B2 (ja) * | 2012-02-17 | 2017-02-22 | 株式会社Joled | 表示装置及び表示装置の製造方法 |
JP6201411B2 (ja) * | 2013-05-14 | 2017-09-27 | セイコーエプソン株式会社 | 電気光学装置、電気光学装置の製造方法、及び電子機器 |
KR102393372B1 (ko) * | 2014-11-11 | 2022-05-03 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
KR20170001827A (ko) * | 2015-06-25 | 2017-01-05 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
JP2017152252A (ja) * | 2016-02-25 | 2017-08-31 | 株式会社ジャパンディスプレイ | 表示装置 |
CN108538905B (zh) * | 2018-05-31 | 2021-03-16 | 武汉华星光电半导体显示技术有限公司 | Oled发光器件及oled显示装置 |
EP3785897B1 (en) | 2019-08-29 | 2021-12-29 | SHPP Global Technologies B.V. | Transparent, flexible, impact resistant, multilayer film comprising polycarbonate copolymers |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101093877A (zh) * | 2006-06-19 | 2007-12-26 | 精工爱普生株式会社 | 发光装置、图像形成装置、显示装置及电子设备 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07272857A (ja) * | 1994-03-31 | 1995-10-20 | Nippondenso Co Ltd | エレクトロルミネッセンス素子およびその製造方法 |
JP2000133462A (ja) * | 1998-10-22 | 2000-05-12 | Sony Corp | 有機エレクトロルミネッセンス素子とその製造方法、および有機エレクトロルミネッセンスディスプレイとその製造方法 |
CN1156035C (zh) * | 2001-06-14 | 2004-06-30 | 中国科学院上海冶金研究所 | 有机发光器件的保护膜及它的封装方法 |
US7365713B2 (en) * | 2001-10-24 | 2008-04-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
JP3997888B2 (ja) * | 2002-10-25 | 2007-10-24 | セイコーエプソン株式会社 | 電気光学装置、電気光学装置の製造方法及び電子機器 |
JP4362696B2 (ja) * | 2003-03-26 | 2009-11-11 | ソニー株式会社 | 発光素子およびその製造方法、ならびに表示装置 |
US7476908B2 (en) * | 2004-05-21 | 2009-01-13 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
JP2005339828A (ja) * | 2004-05-24 | 2005-12-08 | Shimadzu Corp | 有機エレクトロルミネッセンス素子およびその製造方法 |
US7220687B2 (en) * | 2004-06-25 | 2007-05-22 | Applied Materials, Inc. | Method to improve water-barrier performance by changing film surface morphology |
JP5848862B2 (ja) * | 2004-06-25 | 2016-01-27 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | カプセル化膜の遮水性能の改善 |
JP4876453B2 (ja) * | 2005-06-29 | 2012-02-15 | ソニー株式会社 | 有機発光素子および有機発光装置 |
JP2007123240A (ja) * | 2005-09-28 | 2007-05-17 | Sony Corp | 表示装置の製造方法および表示装置 |
JP2008010408A (ja) * | 2006-06-02 | 2008-01-17 | Semiconductor Energy Lab Co Ltd | 発光素子及び発光装置 |
EP1863324A1 (en) * | 2006-06-02 | 2007-12-05 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting element and light emitting device |
US7622865B2 (en) * | 2006-06-19 | 2009-11-24 | Seiko Epson Corporation | Light-emitting device, image forming apparatus, display device, and electronic apparatus |
JP2008210665A (ja) * | 2007-02-27 | 2008-09-11 | Canon Inc | 有機発光素子及びそれを用いた表示装置 |
-
2008
- 2008-03-03 JP JP2008052136A patent/JP2009211877A/ja active Pending
-
2009
- 2009-02-13 TW TW098104753A patent/TWI498039B/zh not_active IP Right Cessation
- 2009-02-18 US US12/372,844 patent/US20090218943A1/en not_active Abandoned
- 2009-02-19 KR KR1020090013791A patent/KR20090094745A/ko not_active Application Discontinuation
- 2009-02-27 CN CN2009101183371A patent/CN101527350B/zh active Active
- 2009-02-27 CN CN201310089673.4A patent/CN103219470B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101093877A (zh) * | 2006-06-19 | 2007-12-26 | 精工爱普生株式会社 | 发光装置、图像形成装置、显示装置及电子设备 |
Also Published As
Publication number | Publication date |
---|---|
CN101527350A (zh) | 2009-09-09 |
TW200952540A (en) | 2009-12-16 |
JP2009211877A (ja) | 2009-09-17 |
TWI498039B (zh) | 2015-08-21 |
CN101527350B (zh) | 2013-04-24 |
US20090218943A1 (en) | 2009-09-03 |
CN103219470A (zh) | 2013-07-24 |
KR20090094745A (ko) | 2009-09-08 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: JANPAN ORGANIC RATE DISPLAY CO., LTD. Free format text: FORMER OWNER: SONY CORP Effective date: 20150729 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20150729 Address after: Tokyo, Japan Applicant after: JOLED Inc. Address before: Tokyo, Japan Applicant before: Sony Corp. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20231204 Address after: Tokyo, Japan Patentee after: Japan Display Design and Development Contract Society Address before: Tokyo, Japan Patentee before: JOLED Inc. |