CN103203808A - Efficient multi-line cutting device and method - Google Patents
Efficient multi-line cutting device and method Download PDFInfo
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- CN103203808A CN103203808A CN2013101328790A CN201310132879A CN103203808A CN 103203808 A CN103203808 A CN 103203808A CN 2013101328790 A CN2013101328790 A CN 2013101328790A CN 201310132879 A CN201310132879 A CN 201310132879A CN 103203808 A CN103203808 A CN 103203808A
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Abstract
The invention relates to crystal cutting by a rotating component, a fixing component and a cutting component. Two ends of crystal are clamped by the fixing component. The rotating component is driven to rotate by a motor to drive the crystal to rotate, so that metal wires are kept in point contact with the crystal during the whole cutting process and cutting speed is higher, about more than 50% higher than that of general cutting ways. In addition, the point contact is kept constantly, tension of the metal wires changes little, and accordingly the metal wires are thinned and are allowed to move at high speed, surface qualities (such as TTV (total thickness variation), bow and warp) of the cut surface are guaranteed and loss of the metal wires is reduced.
Description
Technical field
The present invention relates to a kind of efficient multi-thread cutter sweep and method, relate in particular to processing unit (plant) and the method for the multi-thread cutting of a kind of LED and SOS semicon industry large-size sapphire backing material.
Background technology
Because what the large-size sapphire backing material was used popularizes, particularly LED and SOS semicon industry for 4 "; 6 " 8 " the sapphire wafer growth of requirement has promoted the demand fast rise of industry to large-size sapphire materials processing, simultaneously because the physics of sapphire material belongs to hard brittle material; process very difficult; inefficiency simultaneously, studies therefore that heavy caliber is sapphire effectively to be processed into a current difficult problem fast, also becomes the direction of industry effort simultaneously.
Prior art mainly adopts following dual mode to large-size sapphire material cutting processing:
Mode 1, employing fixation workpiece, line of cut presses down the mode of feeding and cuts, the wire structures that uses retractable cable wheel, regulating wheel, directive wheel to form, workbench transfixion in service, the cutting movement overall structure moves downward, and finishes cutting or the workbench feeding that makes progress, small angle oscillation, cutting movement overall structure transfixion is finished cutting.A kind of scroll saw mode of prior art is divided into both sides up and down as shown in Figure 1, 2.At first, first volume object I1 to be processed is fixed on the upside object fixed cell 300 that is arranged on place, wire sawing apparatus top, and last master rotor 10a is by axle base regulon 60, according to the suitable adjusting master rotor 10a of the size of object to be processed and the distance between the 10b.Vertical drive motor 41 moves upward master rotor unit 10 then, cuts into slices.If object I2 to be processed is fixed on the rotating shaft 54 with downside, drive electric rotating machine 51 then, hollow is rotated for processing object I2.This means for engaging device 56 has the drum of annular.This kind scroll saw mode mainly contains following shortcoming: 1, different processing object is discrete, causes the complicated of equipment.2, upside machining cell, object to be processed is fixed motionless, and Buddha's warrior attendant line and object contact area to be processed are big, are difficult for heat radiation, and material and Buddha's warrior attendant line loss consumption are big; 3, the downside machining cell can only be processed hollow object, and processing object is single.
Mode 2, spindle swing cutting; principle is in the spindle swing process; steel wire realizes that with workpiece point contacts; simultaneously; steel wire and saw kerf leave enough gaps, make things convenient for abrasive particle to enter saw kerf, increase steel wire and carry the abrasive particle chance; increase the quantity of unit interval abrasive particle cut workpiece, increased the cutting speed of workpiece.But because sapphire has the intensity height, the hardness height, high temperature resistant, wear-resisting wiping, characteristic such as corrosion resistance is strong, especially for heavy caliber sapphire wafer (6 inches and more than), 2 cuttings of employing mode, though can solve the big problem of contact area, still longer for bigbore wafer cutting spended time, and the equipment building block is many and complicated, the processing cost height.
Summary of the invention
This patent proposes a kind of device and processing method of multi-thread cutting newly, lowly reaches the big problem of supplementary product onsumption to solve current working (machining) efficiency.
The invention provides a kind of multi-thread rotary cutting apparatus, comprising: fixed part, rotary part, cutting part; Described fixed part is made up of push rod, synchronous push rod, synchronous push rod latch assembly and guide rail, and this synchronous push rod latch assembly has locking member, helical screw and bolt bar; Described rotary part is made up of servomotor, rotation fixed part, processing line roller 1 and two processing line rollers 2; Described cutting part is made up of metal alignment, described processing line roller 1 and described two processing line rollers 2, the non-coplanar setting of these three processing line rollers.
The metal alignment can be formed through repeatedly reeling by a metal wire.
Crystal processing method according to above-mentioned a kind of multi-thread rotary cutting apparatus is characterized in that:
Described fixed part is by locking member and push rod is with the crystal clamping synchronously, and mobile locking member is to correct position on guide rail according to crystal length, and manually the rotating screw handle clamps crystal;
Described rotary part drives push rod, push rod rotation synchronously by described driven by servomotor belt, thereby realizes the crystal rotation
Described cutting part utilizes retractable cable wheel, regulating wheel, directive wheel guiding metal wire to processing line roller 1 and two processing line rollers 2, form the metal alignment through repeatedly reeling metal wire, by described driven by servomotor processing line roller 1 rotation, the metal wire of this metal alignment is moved back and forth at a high speed or unidirectional movement, by pressing down the mode of feeding, crystal-cut is become a plurality of.
Can suitably regulate the rotating speed of described servomotor according to the crystalline material characteristic.
The present invention reduces contact area between Buddha's warrior attendant line and the sapphire by crystal in the rotation in when cutting, and reaches by rotation and to cool off purpose more fully, improves cutting efficiency and reduces the purpose that consumes and improve the quality thereby reach.1. clamping is by the end face clamping of crystal; 2. the clamping by both ends of the surface drives the crystal rotation; 3. feeding reaches the purpose of feeding by two clamping end faces.
The present invention has the following advantages: at first, treat processing object and adopt two ends to fix, two sections push rods can be changed different size according to the object size, make things convenient for the processing of various sizes object, no matter solid body or hollow object, push rod has locking member, and is stronger than common single face adhesion firmness; Secondly, by the rotation of headstock driven by motor push rod, realize object rotation to be processed, headstock motor can be regulated rotating speed according to characteristics such as material hardnesses.
Description of drawings
Fig. 1 is the wire sawing apparatus vertical view of prior art;
The wire sawing apparatus side view of Fig. 2 prior art;
The multi-thread rotary cutting apparatus front view of Fig. 3 the present invention.
The specific embodiment
Below in conjunction with accompanying drawing the present invention is described in further detail:
Multi-thread rotary cutting apparatus of the present invention comprises: fixed part, rotary part, cutting part; Described fixed part is made up of synchronous push rod, synchronous push rod latch assembly and guide rail, and this synchronous push rod latch assembly has locking member, helical screw and bolt bar; Described rotary part is made up of servomotor, rotation fixed part, processing line roller 1 and two processing line rollers 2; Described cutting part is made up of metal alignment, described processing line roller 1 and described two processing line rollers 2, the non-coplanar setting of these three processing line rollers.
The metal alignment can be formed through repeatedly reeling by a metal wire.
As Fig. 3, with the crystal bar clamping, mobile locking member is to correct position on guide rail according to boule length by push rod, synchronous push rod and locking member for fixed part, and the push rod locking member has helical screw synchronously, and manually the rotating screw handle clamps crystal bar.Arrow among Fig. 3 is direction of rotation.
Rotary part is made up of servomotor and rotation fixed part, drives push rod, push rod rotation synchronously by the driven by servomotor belt, thereby realizes the crystal bar rotation.And can suitably regulate rotating speed according to material behavior, enhance productivity.
Cutting part, utilize retractable cable wheel, regulating wheel, directive wheel to draw the metal wire line to processing line roller 1 and two processing line rollers 2, the non-coplanar setting of these three processing line rollers, form the metal alignment through repeatedly reeling metal wire, drive 1 rotation of processing line roller by the driven by servomotor belt, the metal wire of this metal alignment is moved back and forth at a high speed or unidirectional movement, by pressing down the mode of feeding, crystal-cut is become a plurality of.
The present invention mainly finishes by rotary part, fixed part and cutting part the cutting of crystal.Utilize the both ends of the surface of fixed part clamping crystal, drive the crystal rotation by the motor-driven rotary part, guarantee like this in whole cutting process, metal wire and crystal are to contact all the time, have accelerated cutting speed, than general cutting way speed raising more than 50%; Owing to be a contact all the time, the tension change of metal wire can be very little, can realize very thinization of metal wire and the high speed that metal wire moves, and guaranteed the surface quality (TTV, BOW, Warp etc.) of cut surface, also reduced the loss of metal wire simultaneously.Cutting part utilizes retractable cable wheel, regulating wheel, directive wheel, wire casing repeatedly to reel metal wire and form the metal alignment, and the metal wire of this metal alignment is moved back and forth or unidirectional movement at high speed, and crystal-cut is become a plurality of.Compare with swing cutting before, the metal wire arrange agencie is simplified greatly, and equipment has reduced unnecessary auxiliary body.
The invention is not restricted to above description to embodiment, the content that those skilled in the art disclose according to the present invention, the improvement that on basis of the present invention, needn't carry out through creative work and revise all should be within protection scope of the present invention.
Claims (4)
1. a multi-thread rotary cutting apparatus comprises: fixed part, rotary part, cutting part; Described fixed part is made up of push rod, synchronous push rod, synchronous push rod latch assembly and guide rail, and this synchronous push rod latch assembly has locking member, helical screw and bolt bar; Described rotary part is made up of servomotor, rotation fixed part, processing line roller 1 and two processing line rollers 2; Described cutting part is made up of metal alignment, described processing line roller 1 and described two processing line rollers 2, the non-coplanar setting of these three processing line rollers.
2. a kind of multi-thread rotary cutting apparatus as claimed in claim 1 is characterized in that, described metal alignment can be formed through repeatedly reeling by a metal wire.
3. the crystal-cut method of a kind of multi-thread rotary cutting apparatus according to claim 1 and 2 is characterized in that:
Described fixed part is by locking member and push rod is with the crystal clamping synchronously, and mobile locking member is to correct position on guide rail according to crystal length, and manually the rotating screw handle clamps crystal;
Described rotary part drives push rod, push rod rotation synchronously by described driven by servomotor belt, thereby realizes the crystal rotation
Described cutting part utilizes retractable cable wheel, regulating wheel, directive wheel guiding metal wire to processing line roller 1 and two processing line rollers 2, form the metal alignment through repeatedly reeling metal wire, by described driven by servomotor processing line roller 1 rotation, the metal wire of this metal alignment is moved back and forth at a high speed or unidirectional movement, by pressing down the mode of feeding, crystal-cut is become a plurality of.
4. crystal-cut method as claimed in claim 3 is characterized in that, can suitably regulate the rotating speed of described servomotor according to the crystalline material characteristic.
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CN201310132879.0A CN103203808B (en) | 2013-04-01 | 2013-04-01 | Efficient multi-line cutting device and method |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103538160A (en) * | 2013-10-29 | 2014-01-29 | 苏州硅峰太阳能科技有限公司 | Hard and brittle material multi-line cutting method and cutting device |
CN103538159A (en) * | 2013-10-29 | 2014-01-29 | 苏州硅峰太阳能科技有限公司 | Hard and brittle material cutting device |
CN103707425A (en) * | 2013-12-12 | 2014-04-09 | 灵璧县灵磁新材料有限公司 | Multi-linear magnet cutting machine |
CN103895114A (en) * | 2014-03-28 | 2014-07-02 | 合肥晶桥光电材料有限公司 | Sapphire screen processing technique |
CN105690583A (en) * | 2016-02-25 | 2016-06-22 | 赵永潮 | Power unit of multi-wire sawing machine |
CN106113298A (en) * | 2016-07-08 | 2016-11-16 | 重庆毅美模塑有限公司 | Reciprocating-type cutting device |
CN106965062A (en) * | 2017-04-18 | 2017-07-21 | 天津大学 | A kind of contact tape abrasive machining device |
CN106985052A (en) * | 2017-04-18 | 2017-07-28 | 天津大学 | A kind of multi-rib grinding processing unit (plant) |
CN109318385A (en) * | 2018-12-03 | 2019-02-12 | 乐山新天源太阳能科技有限公司 | Silicon single crystal rod clamping cutting device |
CN112372489A (en) * | 2020-12-02 | 2021-02-19 | 上饶师范学院 | Method and device for rapidly processing guide groove on surface of guide roller for wafer cutting |
CN113878736A (en) * | 2021-10-27 | 2022-01-04 | 惠州市天元五金制品有限公司 | Horizontal cutting multistation annular wire cutting machine |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6543434B2 (en) * | 1999-12-09 | 2003-04-08 | Wacker-Chemie Gmbh | Device for simultaneously separating a multiplicity of wafers from a workpiece |
US20110048396A1 (en) * | 2009-08-31 | 2011-03-03 | Sumco Corporation | Wire saw device |
CN102133777A (en) * | 2011-01-05 | 2011-07-27 | 镇江荣德新能源科技有限公司 | Wire-break processing device for multi-wire cutting machines |
CN102211362A (en) * | 2011-04-11 | 2011-10-12 | 黄禹宁 | Three-roller multi-wire cutting machine |
CN202155963U (en) * | 2010-09-17 | 2012-03-07 | 上海日进机床有限公司 | Diamond wire slicer for cutting crystal silicon rod |
CN102975300A (en) * | 2011-09-06 | 2013-03-20 | 上海安稷实业有限公司 | Multi-thread cutting machine capable of cutting arc pieces |
-
2013
- 2013-04-01 CN CN201310132879.0A patent/CN103203808B/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6543434B2 (en) * | 1999-12-09 | 2003-04-08 | Wacker-Chemie Gmbh | Device for simultaneously separating a multiplicity of wafers from a workpiece |
US20110048396A1 (en) * | 2009-08-31 | 2011-03-03 | Sumco Corporation | Wire saw device |
CN202155963U (en) * | 2010-09-17 | 2012-03-07 | 上海日进机床有限公司 | Diamond wire slicer for cutting crystal silicon rod |
CN102133777A (en) * | 2011-01-05 | 2011-07-27 | 镇江荣德新能源科技有限公司 | Wire-break processing device for multi-wire cutting machines |
CN102211362A (en) * | 2011-04-11 | 2011-10-12 | 黄禹宁 | Three-roller multi-wire cutting machine |
CN102975300A (en) * | 2011-09-06 | 2013-03-20 | 上海安稷实业有限公司 | Multi-thread cutting machine capable of cutting arc pieces |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103538159A (en) * | 2013-10-29 | 2014-01-29 | 苏州硅峰太阳能科技有限公司 | Hard and brittle material cutting device |
CN103538160B (en) * | 2013-10-29 | 2016-03-16 | 苏州硅峰太阳能科技有限公司 | A kind of hard brittle material multi-line cutting method and cutter sweep |
CN103538159B (en) * | 2013-10-29 | 2016-03-16 | 苏州硅峰太阳能科技有限公司 | A kind of hard brittle material cutting equipment |
CN103538160A (en) * | 2013-10-29 | 2014-01-29 | 苏州硅峰太阳能科技有限公司 | Hard and brittle material multi-line cutting method and cutting device |
CN103707425A (en) * | 2013-12-12 | 2014-04-09 | 灵璧县灵磁新材料有限公司 | Multi-linear magnet cutting machine |
CN103895114A (en) * | 2014-03-28 | 2014-07-02 | 合肥晶桥光电材料有限公司 | Sapphire screen processing technique |
CN107175778A (en) * | 2016-02-25 | 2017-09-19 | 赵永潮 | A kind of power set of modified multi-line cutting machine |
CN105690583A (en) * | 2016-02-25 | 2016-06-22 | 赵永潮 | Power unit of multi-wire sawing machine |
CN106113298A (en) * | 2016-07-08 | 2016-11-16 | 重庆毅美模塑有限公司 | Reciprocating-type cutting device |
CN106113298B (en) * | 2016-07-08 | 2018-02-13 | 重庆毅美模塑有限公司 | Reciprocating-type cutting device |
CN106965062A (en) * | 2017-04-18 | 2017-07-21 | 天津大学 | A kind of contact tape abrasive machining device |
CN106985052A (en) * | 2017-04-18 | 2017-07-28 | 天津大学 | A kind of multi-rib grinding processing unit (plant) |
CN106985052B (en) * | 2017-04-18 | 2022-12-20 | 天津大学 | Multi-line grinding device |
CN106965062B (en) * | 2017-04-18 | 2022-12-20 | 天津大学 | Contact type line belt grinding device |
CN109318385A (en) * | 2018-12-03 | 2019-02-12 | 乐山新天源太阳能科技有限公司 | Silicon single crystal rod clamping cutting device |
CN109318385B (en) * | 2018-12-03 | 2023-08-11 | 乐山新天源太阳能科技有限公司 | Monocrystalline silicon rod clamping and cutting device |
CN112372489A (en) * | 2020-12-02 | 2021-02-19 | 上饶师范学院 | Method and device for rapidly processing guide groove on surface of guide roller for wafer cutting |
CN113878736A (en) * | 2021-10-27 | 2022-01-04 | 惠州市天元五金制品有限公司 | Horizontal cutting multistation annular wire cutting machine |
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