CN103200775A - Preparation method of ceramic base printed circuit board used for light emitting diode (LED) installation - Google Patents
Preparation method of ceramic base printed circuit board used for light emitting diode (LED) installation Download PDFInfo
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- CN103200775A CN103200775A CN2013100965081A CN201310096508A CN103200775A CN 103200775 A CN103200775 A CN 103200775A CN 2013100965081 A CN2013100965081 A CN 2013100965081A CN 201310096508 A CN201310096508 A CN 201310096508A CN 103200775 A CN103200775 A CN 103200775A
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Abstract
The invention provides a preparation method of a ceramic base printed circuit board used for light emitting diode (LED) installation. The preparation method of a ceramic base printed circuit board used for LED installation comprises the following steps: S1, providing an aluminum substrate, forming an organic material circuit board with a first through hole, and forming a binder layer with a second through hole; S2, sequentially overlapping the ceramic substrate, the binder layer and the organic material circuit board, ensuring that the first through hole and the second through hole are in one-to-one correspondence, forming a blind groove used for LED installation, wherein the bottom surface of the blind groove is the surface of the ceramic substrate; S3, placing the overlapped ceramic substrate, the overlapped binder layer and the overlapped organic material circuit board in a pressing device and then hot-pressing, and therefore the ceramic base printed circuit board is acquired, and placing a buffer material layer which is hot-pressing temperature resistant on one side of the ceramic substrate in the process of hot-pressing. By placing the buffer material layer on one side of the ceramic substrate in the process of hot-pressing, fragmentation caused under locally uneven stress of the ceramic substrate can be restrained, and quality of products of the ceramic base printed circuit board is improved.
Description
Technical field
The present invention relates to the LED applied technical field, be specifically related to a kind of preparation method of the ceramic base printed circuit board of installing for LED.
Background technology
In recent years, led light source is because the remarkable advantage that its life-span is long, light efficiency is high, radiation is low and low in energy consumption has obtained extensive use in various fields.
Be accompanied by in recent years the requirement to the miniaturization of LED lighting device, the size that is used for the printed circuit board (PCB) that LED installs is being pursued miniaturization.The miniaturization of LED lighting device is had higher requirement to the heat radiation and the electric property that are used for the printed circuit board (PCB) that LED installs simultaneously.For this reason, proposed to adopt ceramic base printed circuit board as the technical scheme of LED installation base plate, wherein, ceramic base printed circuit board comprises ceramic substrate, organic material circuit board, and is used for adhesive layer that ceramic substrate and organic material circuit board are bonded as one.
When preparing above-mentioned ceramic base printed circuit board, for making adhesive layer and ceramic substrate and organic material circuit board bonding, need be to superimposed good ceramic substrate, adhesive layer and organic material circuit board carry out hot pressing in regular turn.Yet ceramic substrate is very easy to crackedly when hot pressing, causes the preparation efficiency of ceramic base printed circuit board low, poor product quality.
Summary of the invention
In view of this, be necessary the problem mentioned at background technology to provide the higher while of a kind of preparation efficiency can obtain the preparation method of high-quality ceramic base printed circuit board.
The objective of the invention is to be achieved through the following technical solutions:
A kind of preparation method of the ceramic base printed circuit board of installing for LED, it may further comprise the steps:
S1, ceramic substrate is provided, is formed with the organic material circuit board of first through hole and is formed with the adhesive layer of second through hole;
S2, ceramic substrate, adhesive layer and organic material circuit board is superimposed successively guarantees in the lamination process that first through hole and second through hole are corresponding one by one, is formed for the blind groove that LED installs, and the bottom surface of this blind groove is the surface of described ceramic substrate;
S3, superimposed good ceramic substrate, adhesive layer and organic material circuit board are put into press equipment carry out hot pressing and obtain ceramic base printed circuit board, be sidelong the cushioned material layer that is equipped with heat-resisting pressure temperature at ceramic substrate one during hot pressing.
Preferably, the preparation method of the described ceramic base printed circuit board of installing for LED also comprises:
S4, offer for hard-wired installation through hole at described ceramic base printed circuit board.
Concrete, described cushioned material layer is silicagel pad.
Preferably, among the described S3, hot pressing pressure is controlled at 8-10kg/cm
2In the scope.
Preferably, among the described S3, described press equipment is laminating machine or fast press.
Preferably, described ceramic substrate surface that LED be used for to be installed has reflecting rate more than 88% to visible light.
Preferred, the surface that described ceramic substrate be used for to be installed LED has reflecting rate more than 90% to visible light.
Concrete, described organic material circuit board is individual layer, bilayer or multilayer board.
Compared with prior art, the present invention possesses following advantage:
Be sidelong the cushioned material layer of putting heat-resisting pressure temperature at ceramic substrate one during hot pressing of the present invention and can suppress ceramic substrate because of uneven takes place cracked of local pressure, the product quality of raising ceramic base printed circuit board.Can solve the cracked problem of ceramic wafer in the pressing process by optimizing the pressing parameter, further improve the product quality of ceramic base printed circuit board; Adopt traditional laminating machine or fast press not only to improve the production efficiency of ceramic base printed circuit board greatly, and reduced the production cost of ceramic base printed circuit board.
Description of drawings
Fig. 1 is the Facad structure schematic diagram that adopts the ceramic base printed circuit board that the method for the embodiment of the invention makes;
Fig. 2 is the cross-sectional view that adopts the ceramic base printed circuit board that the method for the embodiment of the invention makes;
Fig. 3 is the cross-sectional view of ceramic substrate among the S1 of the embodiment of the invention, organic material circuit board and adhesive layer.
Fig. 4 is among the S2 of the embodiment of the invention, and ceramic substrate, adhesive layer and organic material circuit board be superimposed cross-sectional view successively;
Fig. 5 is that superimposed good ceramic substrate, adhesive layer, organic material circuit board and the cushioned material layer that is positioned over ceramic substrate one side are put into the cross-sectional view that press equipment carries out hot pressing among the S3 of the embodiment of the invention.
Embodiment
As shown in Figures 1 and 2, the ceramic base printed circuit board that LED installs that is used for of present embodiment comprises: the ceramic substrate 1 and the organic material circuit board 3 that are combined as a whole by adhesive layer 2, be formed with some first through holes 31 on the described organic material circuit board 3, be formed with some second through holes 21 on the described adhesive layer 2, the shape of described first through hole 31 and second through hole 21 and size are corresponding one by one respectively, make described ceramic substrate 1 expose by first through hole 31 and second through hole 21, thereby form some for the blind groove 4 that LED is installed at the described ceramic base printed circuit board of present embodiment.Described LED can be installed in the surface as the described ceramic substrate 1 of described blind groove 4 bottoms, and the heat that makes LED produce can in time conduct to described ceramic substrate 1 and realize heat radiation.
As shown in Figure 1, ceramic base printed circuit board is rectangle, and its a pair of across corner is offered one respectively through hole 5 is installed, thereby for passing for secure components such as screws this ceramic base printed circuit board is fixed.In fact, the correct position of the present invention's ceramic base printed circuit board all can be offered at least one through hole is installed, and makes the installation that can be fixed by the cooperation of secure component such as screw and described installation through hole of described ceramic base printed circuit board.Certainly, ceramic base printed circuit board also can be other shapes such as circle, hexagon.
Described ceramic substrate 1 can have the ceramic substrate of excellent thermal conductivity and reflectivity for aluminium oxide ceramic substrate, aluminium nitride ceramics substrate etc.And the surface that described ceramic substrate 1 is used for installing LED has reflecting rate more than 88% to visible light, preferably has the reflecting rate more than 90%, make the ceramic base printed circuit board of present embodiment have excellent reflective function thus, thereby the light that the LED that is mounted thereon is launched can be fully utilized.Described adhesive layer 2 is epoxy glue layer in the present embodiment, is understood that easily this adhesive layer 2 also can be to be prepared from by any other adhesive material that organic material circuit board and ceramic substrate can be combined.Described organic material circuit board 3 is single layer board, comprises organic material substrate 32, is formed on the copper layer line road 33 of these organic material substrate 32 outer surfaces and covers the outer surface of described organic material substrate 32 and the solder mask 34 on corresponding copper layer line road 33.Wherein, described organic material substrate 32 is prepared from by the organic material of for example FR4 or BT etc.Be understandable that the organic material circuit board can also be bilayer or multilayer circuit board.
The method for preparing the above-mentioned ceramic base printed circuit board of installing for LED may further comprise the steps:
S1, as shown in Figure 3 provides ceramic substrate 1, is formed with the organic material circuit board 3 of first through hole 31 and is formed with the adhesive layer 2 of second through hole 21;
S2, as shown in Figure 4, ceramic substrate 1, adhesive layer 2 and organic material circuit board 3 is superimposed successively, guarantee in the lamination process that first through hole 31 and second through hole 21 are corresponding one by one, be formed for installing the blind groove 4 of LED, the bottom surface of blind groove 4 is the surface of ceramic substrate 1, and LED can be installed on the bottom surface of blind groove 4;
S3, as shown in Figure 5, superimposed good ceramic substrate 1, adhesive layer 2 and organic material circuit board 3 are put into press equipment to carry out hot pressing and obtains ceramic base printed circuit board, wherein, be sidelong the cushioned material layer 8 that is equipped with heat-resisting pressure temperature at ceramic substrate 1 one during hot pressing, this cushioned material layer 8 can be silicagel pad.Described ceramic substrate 1 is uneven chipping because of local pressure easily when hot pressing, and cushioned material layer 8 has suitable elasticity, the uniformity of the pressure that ceramic substrate 1 bears in the time of can improving hot pressing.Therefore, be sidelong the cushioned material layer 8 of putting heat-resisting pressure temperature at ceramic substrate 1 one during hot pressing and can suppress ceramic substrate because of uneven take place cracked of local pressure, improve the product quality of ceramic base printed circuit board.
Preferably, for further improving the product quality of ceramic base printed circuit board and pressing ceramic base printed circuit board expeditiously, with hot pressing pressure control at 8-10kg/cm
2In the scope.The reason of choosing of this scope is: when pressure less than 8kg/cm
2, described adhesive layer 2 can not form firm combination with ceramic substrate 1 and organic material circuit board 3; And work as pressure greater than 10kg/cm
2The time, ceramic substrate 1 because of bear pressure excessive be easy to generate cracked.
Described press equipment can be selected traditional laminating machine or fast press for use, and hot pressing temperature and time when the temperature and time of hot pressing and preparation organic material circuit board are suitable substantially.
Because the ceramic base printed circuit board of making is provided with through hole 5 is installed, therefore the preparation method of ceramic base printed circuit board also is included in and offers the step that through hole 5 is installed on the ceramic base printed circuit board, and this step is preferably carried out after ceramic base printed circuit board hot pressing.
Claims (7)
1. preparation method who is used for the ceramic base printed circuit board that LED installs is characterized in that: may further comprise the steps:
S1, ceramic substrate is provided, is formed with the organic material circuit board of first through hole and is formed with the adhesive layer of second through hole;
S2, ceramic substrate, adhesive layer and organic material circuit board is superimposed successively guarantees in the lamination process that first through hole and second through hole are corresponding one by one, is formed for the blind groove that LED installs, and the bottom surface of this blind groove is the surface of described ceramic substrate;
S3, superimposed good ceramic substrate, adhesive layer and organic material circuit board are put into press equipment carry out hot pressing and obtain ceramic base printed circuit board, be sidelong the cushioned material layer that is equipped with heat-resisting pressure temperature at ceramic substrate one during hot pressing.
2. the preparation method of the ceramic base printed circuit board of installing for LED according to claim 1, it is characterized in that: described cushioned material layer is silicagel pad.
3. the preparation method of the ceramic base printed circuit board of installing for LED according to claim 1, it is characterized in that: among the described S3, hot pressing pressure is controlled at 8-10kg/cm
2In the scope.
4. the preparation method of the ceramic base printed circuit board of installing for LED according to claim 1, it is characterized in that: among the described S3, described press equipment is laminating machine or fast press.
5. the preparation method of the ceramic base printed circuit board of installing for LED according to claim 1 is characterized in that: the surface that described ceramic substrate is used for installing LED has reflecting rate more than 88% to visible light.
6. the preparation method of the ceramic base printed circuit board of installing for LED according to claim 5 is characterized in that: the surface that described ceramic substrate is used for installing LED has reflecting rate more than 90% to visible light.
7. according to the preparation method of each described ceramic base printed circuit board of installing for LED in the claim 1 to 6, it is characterized in that: described organic material circuit board is individual layer, bilayer or multilayer board
Preparation method according to each described ceramic base printed circuit board of installing for LED in the claim 1 to 6 is characterized in that: also comprise:
S4, offer for hard-wired installation through hole at described ceramic base printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310096508.1A CN103200775B (en) | 2013-03-25 | 2013-03-25 | For the preparation method of the ceramic base printed circuit board that LED installs |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310096508.1A CN103200775B (en) | 2013-03-25 | 2013-03-25 | For the preparation method of the ceramic base printed circuit board that LED installs |
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| Publication Number | Publication Date |
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| CN103200775A true CN103200775A (en) | 2013-07-10 |
| CN103200775B CN103200775B (en) | 2016-03-23 |
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| CN201310096508.1A Active CN103200775B (en) | 2013-03-25 | 2013-03-25 | For the preparation method of the ceramic base printed circuit board that LED installs |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108417674A (en) * | 2017-02-09 | 2018-08-17 | 先进科技新加坡有限公司 | Manufacture the method for LED device and the LED device of manufacture |
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| CN101290913A (en) * | 2007-04-17 | 2008-10-22 | 晶元光电股份有限公司 | Electronic element component having compound material base |
| CN101884257A (en) * | 2007-12-05 | 2010-11-10 | 三菱树脂株式会社 | Multilayer wiring board having cavity section |
| CN102074518A (en) * | 2009-11-11 | 2011-05-25 | 钰桥半导体股份有限公司 | Semiconductor chip assembly with post/base heat spreader and conductive trace |
| CN102365006A (en) * | 2011-10-20 | 2012-02-29 | 深圳市五株电路板有限公司 | Processing method of multi-layer circuit board |
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2013
- 2013-03-25 CN CN201310096508.1A patent/CN103200775B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101290913A (en) * | 2007-04-17 | 2008-10-22 | 晶元光电股份有限公司 | Electronic element component having compound material base |
| CN101884257A (en) * | 2007-12-05 | 2010-11-10 | 三菱树脂株式会社 | Multilayer wiring board having cavity section |
| CN102074518A (en) * | 2009-11-11 | 2011-05-25 | 钰桥半导体股份有限公司 | Semiconductor chip assembly with post/base heat spreader and conductive trace |
| CN102365006A (en) * | 2011-10-20 | 2012-02-29 | 深圳市五株电路板有限公司 | Processing method of multi-layer circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108417674A (en) * | 2017-02-09 | 2018-08-17 | 先进科技新加坡有限公司 | Manufacture the method for LED device and the LED device of manufacture |
| CN108417674B (en) * | 2017-02-09 | 2021-04-16 | 先进科技新加坡有限公司 | Method of manufacturing a light emitting diode device and a light emitting diode device manufactured thereby |
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| Publication number | Publication date |
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| CN103200775B (en) | 2016-03-23 |
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