CN103189985A - 不对称异质结构fet及制造方法 - Google Patents
不对称异质结构fet及制造方法 Download PDFInfo
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- CN103189985A CN103189985A CN2011800527476A CN201180052747A CN103189985A CN 103189985 A CN103189985 A CN 103189985A CN 2011800527476 A CN2011800527476 A CN 2011800527476A CN 201180052747 A CN201180052747 A CN 201180052747A CN 103189985 A CN103189985 A CN 103189985A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
- H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
- H01L29/1054—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a variation of the composition, e.g. channel with strained layer for increasing the mobility
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66659—Lateral single gate silicon transistors with asymmetry in the channel direction, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/161—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table including two or more of the elements provided for in group H01L29/16, e.g. alloys
- H01L29/165—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table including two or more of the elements provided for in group H01L29/16, e.g. alloys in different semiconductor regions, e.g. heterojunctions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/495—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a simple metal, e.g. W, Mo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4966—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/518—Insulating materials associated therewith the insulating material containing nitrogen, e.g. nitride, oxynitride, nitrogen-doped material
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Thin Film Transistor (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
Description
Claims (25)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/939,462 US8637871B2 (en) | 2010-11-04 | 2010-11-04 | Asymmetric hetero-structure FET and method of manufacture |
US12/939,462 | 2010-11-04 | ||
PCT/US2011/057779 WO2012061167A1 (en) | 2010-11-04 | 2011-10-26 | Asymmetric hetero-structure fet and method of manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103189985A true CN103189985A (zh) | 2013-07-03 |
CN103189985B CN103189985B (zh) | 2016-12-21 |
Family
ID=44908138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180052747.6A Expired - Fee Related CN103189985B (zh) | 2010-11-04 | 2011-10-26 | 不对称异质结构fet及制造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8637871B2 (zh) |
CN (1) | CN103189985B (zh) |
WO (1) | WO2012061167A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015054915A1 (zh) * | 2013-10-14 | 2015-04-23 | 中国科学院微电子研究所 | 一种非对称超薄soimos晶体管结构及其制造方法 |
CN104576376A (zh) * | 2013-10-13 | 2015-04-29 | 中国科学院微电子研究所 | 一种mosfet结构及其制造方法 |
CN106876460A (zh) * | 2015-12-11 | 2017-06-20 | 中芯国际集成电路制造(上海)有限公司 | 具有不对称结构的晶体管的形成方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11239359B2 (en) | 2018-09-29 | 2022-02-01 | International Business Machines Corporation | Fabricating a gate-all-around (GAA) field effect transistor having threshold voltage asymmetry by thinning source side lateral end portion of the nanosheet layer |
US11245009B2 (en) | 2020-04-15 | 2022-02-08 | International Business Machines Corporation | Asymmetric channel FinFETs with wrap around channel |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6319799B1 (en) * | 2000-05-09 | 2001-11-20 | Board Of Regents, The University Of Texas System | High mobility heterojunction transistor and method |
US20070045611A1 (en) * | 2005-08-30 | 2007-03-01 | International Business Machines Corporation | Mosfet with laterally graded channel region and method for manufacturing same |
US20070090406A1 (en) * | 2005-10-26 | 2007-04-26 | International Business Machines Corporation | Structure and method for manufacturing high performance and low leakage field effect transistor |
CN101002328A (zh) * | 2004-08-24 | 2007-07-18 | 飞思卡尔半导体公司 | 用于不对称半导体器件性能增强的方法和设备 |
Family Cites Families (11)
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JPH02253632A (ja) | 1989-03-27 | 1990-10-12 | Matsushita Electric Ind Co Ltd | 電界効果型トランジスタの製造方法 |
JP2000332608A (ja) | 1999-05-06 | 2000-11-30 | Internatl Business Mach Corp <Ibm> | アナログ/デジタル変換器及び変換方法 |
US6214679B1 (en) * | 1999-12-30 | 2001-04-10 | Intel Corporation | Cobalt salicidation method on a silicon germanium film |
US6744083B2 (en) | 2001-12-20 | 2004-06-01 | The Board Of Regents, The University Of Texas System | Submicron MOSFET having asymmetric channel profile |
US7947546B2 (en) * | 2005-10-31 | 2011-05-24 | Chartered Semiconductor Manufacturing, Ltd. | Implant damage control by in-situ C doping during SiGe epitaxy for device applications |
US9640666B2 (en) * | 2007-07-23 | 2017-05-02 | GlobalFoundries, Inc. | Integrated circuit employing variable thickness film |
US20090045456A1 (en) * | 2007-08-13 | 2009-02-19 | United Microelectronics Corp. | Semiconductor device and method of fabricating the same |
US7928474B2 (en) * | 2007-08-15 | 2011-04-19 | Taiwan Semiconductor Manufacturing Company, Ltd., | Forming embedded dielectric layers adjacent to sidewalls of shallow trench isolation regions |
US7741658B2 (en) * | 2007-08-21 | 2010-06-22 | International Business Machines Corporation | Self-aligned super stressed PFET |
US7700452B2 (en) * | 2007-08-29 | 2010-04-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strained channel transistor |
US7936017B2 (en) * | 2008-05-15 | 2011-05-03 | International Business Machines Corporation | Reduced floating body effect without impact on performance-enhancing stress |
-
2010
- 2010-11-04 US US12/939,462 patent/US8637871B2/en active Active
-
2011
- 2011-10-26 WO PCT/US2011/057779 patent/WO2012061167A1/en active Application Filing
- 2011-10-26 CN CN201180052747.6A patent/CN103189985B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6319799B1 (en) * | 2000-05-09 | 2001-11-20 | Board Of Regents, The University Of Texas System | High mobility heterojunction transistor and method |
CN101002328A (zh) * | 2004-08-24 | 2007-07-18 | 飞思卡尔半导体公司 | 用于不对称半导体器件性能增强的方法和设备 |
US20070045611A1 (en) * | 2005-08-30 | 2007-03-01 | International Business Machines Corporation | Mosfet with laterally graded channel region and method for manufacturing same |
US20070090406A1 (en) * | 2005-10-26 | 2007-04-26 | International Business Machines Corporation | Structure and method for manufacturing high performance and low leakage field effect transistor |
Non-Patent Citations (1)
Title |
---|
C.H. LEE: "Negative bias temperature instability characteristics of strained SiGe pMOSFETs", 《ELECTRONICS LETTERS》, vol. 43, no. 15, 19 July 2007 (2007-07-19), XP006029386, DOI: doi:10.1049/el:20071064 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104576376A (zh) * | 2013-10-13 | 2015-04-29 | 中国科学院微电子研究所 | 一种mosfet结构及其制造方法 |
WO2015054915A1 (zh) * | 2013-10-14 | 2015-04-23 | 中国科学院微电子研究所 | 一种非对称超薄soimos晶体管结构及其制造方法 |
CN104576381A (zh) * | 2013-10-14 | 2015-04-29 | 中国科学院微电子研究所 | 一种非对称超薄soimos晶体管结构及其制造方法 |
CN104576381B (zh) * | 2013-10-14 | 2018-01-09 | 中国科学院微电子研究所 | 一种非对称超薄soimos晶体管结构及其制造方法 |
CN106876460A (zh) * | 2015-12-11 | 2017-06-20 | 中芯国际集成电路制造(上海)有限公司 | 具有不对称结构的晶体管的形成方法 |
CN106876460B (zh) * | 2015-12-11 | 2019-11-01 | 中芯国际集成电路制造(上海)有限公司 | 具有不对称结构的晶体管的形成方法 |
Also Published As
Publication number | Publication date |
---|---|
US20120112206A1 (en) | 2012-05-10 |
US8637871B2 (en) | 2014-01-28 |
WO2012061167A1 (en) | 2012-05-10 |
CN103189985B (zh) | 2016-12-21 |
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