CN103178042A - 实现功率模块超薄化封装的螺母 - Google Patents
实现功率模块超薄化封装的螺母 Download PDFInfo
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Abstract
本发明提供一种实现功率模块超薄化封装的螺母,属于功率模块封装技术领域。本发明提供的螺母功率端子用于封装功率模块,其下表面固定设置于所述功率模块的直接键合铜(DBC)基板上,其上表面上设置有用于固定引出端的内螺纹孔。使用该螺母功率端子封装的功率模块的高度小,由螺母功率端子所导致产生的杂生电感的电感量小,并且功率模块结构简单、成本低、体积小、重量轻,易于实现超薄化封装。
Description
技术领域
本发明属于功率模块封装技术领域,涉及一种用于封装功率模块的螺母功率端子、以及使用该螺母功率端子进行封装的功率模块、以及使用该功率模块的印刷电路板。
背景技术
半导体功率器件芯片(例如,半导体二极管功率器件芯片、IGBT芯片、功率MOSFET芯片)通常采用模块化封装形成功率模块,功率模块广泛应用于电机驱动、电源、输变电等等。
对于功率模块,模块的高度通常反映功率端子的电极长度L,根据电感H的计算公式:H=L×di/dt,L越大,封装所产生的杂生电感H越大;通常地,杂生电感H越大,使功率模块在应用时需要相应设计匹配要求比较高的吸收电路。因此,功率模块的高度的越高其电气性能越差。
另外,功率模块的高度的越高,导致其在印刷电路板(PCB)上应用时,功率模块的高度大大高于其他器件(例如电阻、电容)的高度,从而PCB的高度基本由功率模块的高度决定,进而影响PCB的结构紧凑化,使PCB的体积和成本难以降低。功率模块的高度越高,其体积也越大,消耗的材料也越多(例如,功率端子的电极使用的铜材也越多),从而也限制功率模块的成本降低和重量的降低。
当前地,功率模块的高度为30mm或38mm左右,其能带来较大电感量的杂生电感L,并且体积大、成本高。
图1所示为现有技术的功率模块的俯视图;图2所示为现有技术的功率模块的主视图;图3所示为现有技术的功率模块的右视图。结合图1至图3对功率模块100进行说明。
在图1至图3实例中,功率模块100包括底板110,其设置于功率模块110的底端,在底板110上设置直接键合铜(Direct Bonding Copper,DBC)基板120,一个或多个半导体功率器件芯片140被贴装至DBC基板120的预定位置,在该实施例中,半导体功率器件芯片140为功率二极管芯片,其封装后形成二极管功率模块110。半导体功率器件芯片140通过铝丝形式的连接桥150在功率模块内部进行引线连接。弯折电极130通过弯折铜片形成,铜片的一端弯折地接触于DBC基板120的表面上,其另一端在功率模块的上表面弯折(如图2和图3中虚线所示)形成弯折电极130,弯折电极130的引出口对准螺母160,从而,在需要从弯折电极130固定引出时,可以通过螺丝对准弯折电极130的引出口而拧紧在的螺母160上,引出端方便地固定在弯折电极130上,因此,弯折电极130与螺母160组合用来形成功率端子。进一步,功率模块100还包括外壳120以及填充与外壳120之内的空隙处的硅凝胶170。
图1至图3所示的功率模块100的弯折电极130采用铜片弯折形成,结构复杂,弯折电极130的高度难以降低,从而也影响功率模块的高度难以降低(当前最低能降至17mm)。因此,也具有结构复杂、杂生电感L电感量大、体积大、成本高的特点。
另外,专利申请号为CN201010530403、发明名称为“一种新型封装结构”的中国专利和专利申请号为CN201010530417、发明名称为“一种紧凑型功率模”的中国专利中,也揭示了类似于图1至图3所示实施例的功率模块结构。
发明内容
本发明的目的之一在于,降低功率模块的高度以减小其杂生电感的电感量。
本发明的又一目的在于,简化功率模块的结构并缩小其体积。
本发明的还一目的在于,降低功率模块的成本和重量。
为实现以上目的或者其他目的,本发明提供以下技术方案。
按照本发明的一方面,提供一种螺母功率端子,用于封装功率模块,所述螺母功率端子的下表面固定设置于所述功率模块的直接键合铜基板上,所述螺母功率端子的上表面上设置有用于固定引出端的内螺纹孔。
按照本发明优选实施例的螺母功率端子,其中,所述螺母功率端子的高度大于或等于3.7毫米且小于或等于4.3毫米。
在之前所述任意实施例的螺母功率端子中,优选地,所述内螺纹孔的深度为所述螺母功率端子的高度的70%至95%。
在之前所述任意实施例的螺母功率端子中,优选地,所述螺母功率端子的下表面通过焊片焊接固定于所述直接键合铜基板上。
在之前所述任意实施例的螺母功率端子中,优选地,所述螺母功率端子为六角螺母形状。
在之前所述任意实施例的螺母功率端子中,优选地,所述螺母功率端子的材料为铜。
在之前所述任意实施例的螺母功率端子中,优选地,所述内螺纹孔位于所述螺母功率端子的上表面的中央。
按照本发明的又一方面,提供一种功率模块,其包括:
底板;
设置于所述底板之上的直接键合铜基板;
功率器件芯片;以及
以上所述及的任一种螺母功率端子。
优选地,所述功率模块还包括外壳和填充在所述外壳内的硅凝胶。
具体地,所述功率器件芯片可以为半导体二极管功率器件芯片
按照本发明的还一方面,提供一种电路系统,其包括:
印刷电路板;以及
设置于所述印刷电路板上的以上所述及的任一种功率模块。
本发明的技术效果是,使用螺母功率端子从DBC基板上直接引出来实现功率模块的封装时,功率模块的高度小,由螺母功率端子所导致产生的杂生电感的电感量小,功率模块结构简单、成本低、体积小、重量轻,易于实现超薄化封装。
附图说明
从结合附图的以下详细说明中,将会使本发明的上述和其他目的及优点更加完全清楚,其中,相同或相似的要素采用相同的标号表示。
图1是现有技术的功率模块的俯视图。
图2是现有技术的功率模块的主视图。
图3是现有技术的功率模块的右视图。
图4是按照本发明一实施例的功率模块的立体结构示意图。
图5是图4所示功率模块的主视图。
图6是图4所示功率模块在封装外壳之后的、带部分剖面结构的主视图。
图7是图4所示实施例的功率模块中所使用的螺母功率端子的立体结构示意图。
图8是图7所示实施例的螺母功率端子的平面结构视图,其中,包括主视图、A-A截面图、B-B截面图。
具体实施方式
下面介绍的是本发明的多个可能实施例中的一些,旨在提供对本发明的基本了解,并不旨在确认本发明的关键或决定性的要素或限定所要保护的范围。容易理解,根据本发明的技术方案,在不变更本发明的实质精神下,本领域的一般技术人员可以提出可相互替换的其他实现方式。因此,以下具体实施方式以及附图仅是对本发明的技术方案的示例性说明,而不应当视为本发明的全部或者视为对本发明技术方案的限定或限制。
本文中,“上”、“下”和“底面”等方位术语是相对于附图中的功率模块在正常使用状态时的置放方位来定义的,例如,在附图中,相对于功率模块来说,其高度方向定义为z坐标方向,其宽度方向定义为y坐标方向,其长度方向定义为x坐标方向,“上”、“下”和“底面”等方位术语在以下描述中是相对z坐标来说的。并且,应当理解到,这些方向性术语是相对的概念,它们用于相对于的描述和澄清,其可以根据功率模块所放置的方位的变化而相应地发生变化。
在本文中,功率模块的端子按用途可以分为功率端子和信号端子,对本领域技术人员来说,功率端子是相对较大电流的通流端;而信号端子是较小电流的通流端,其能控制功率端子的大电流的流通或者关闭。
图4所示为按照本发明一实施例的功率模块的立体结构示意图,其中,使用了本发明一实施例的螺母功率端子430(如图所示为两个螺母功率端子430a和430b);图5所示为图4所示功率模块的主视图;图6所示为图4所示功率模块在封装外壳460之后的、带部分剖面结构的主视图;图7所示为图4所示实施例的功率模块中所使用的螺母功率端子的立体结构示意图;图8所示为图7所示实施例的螺母功率端子的平面结构视图,其中,包括主视图、A-A截面图、B-B截面图。结合图4至图7所示,详细说明本实施例的螺母功率端子和功率模块。
在该实施例中,功率模块400包括底板410,其用作功率模块400的其他部件的主要载体,底板410可以采用铜(Cu)、铝碳化硅(AlSiC)材料制成,其在x方向的长度和在y方向的宽度的设置,可以根据其所承载的部件的体积参数来设置。功率模块400的DBC基板420可以固定设置于底板410上,需要理解的是,DBC基板420的具体类型及形状不受本发明实施例限制。功率器件芯片440可以贴装在DBC基板420表面上,功率器件芯片440具体地为半导体二极管功率器件芯片,但是,功率器件芯片440的数量以及具体种类并不受本发明实施例限制,例如,在其他实施例中,功率器件芯片可以包括一个IGBT芯片和一个用作IGBT的续流二极管的半导体二极管功率器件芯片。功率器件芯片440可以通过引线450对各个焊盘(Pad)进行引线键合,引线键合的具体形式也不受本发明图示实施例限制。
在DBC基板420上还固定设置有多个螺母功率端子430(例如430a和430b),具体地,螺母功率端子430a和430b的下表面433可以通过高温焊片(图中未示出)焊接固定在DBC基板420上。螺母功率端子430a和430b优选地为六角螺母形状,这样也有利于减小螺母功率端子在DBC基板上所占用的面积。螺母功率端子430a和430b的高度优选地设置在3.7-4.3mm,例如,可以设置为4mm,这样可以大大降低功率端子的高度,从而大大降低功率模块400的厚度,,显著减小螺母功率端子所导致的杂生电感的电感量。并且,螺母功率端子430a和430b的高度较低,也降低了螺母功率端子的耗材,降低了其制备成本,易于实现超薄化封装。具体地,螺母功率端子430a和430b可以采用铜材料制备形成。
螺母功率端子430的上表面431上设置有内螺纹孔435(如图6至图8所示),在引出螺母功率端子430时,内螺纹孔435用于固定引出端(图中未示出)。具体地,引出端可以通过与内螺纹孔435配合的螺丝之间拧紧以实现固定,内螺纹孔435的深度优选地是螺母功率端子430的高度的70%至95%,例如,内螺纹孔435的深度设置为3.5mm(螺母功率端子430的高度为4mm时)。内螺纹孔435较佳地设置在螺母功率端子430的上表面431的中央处。因此,螺母功率端子430不但能方便地将DBC基板420的大电流信号引出(或偏置大电流信号至DBC基板420上),而且整体结构简单,使功率模块400的结构紧凑、体积小、成本低。
功率模块400还包括外壳460(如图6所示),外壳460内部的各个部件之间的空隙被填充了硅凝胶等材料(图中未示出),在功率模块400的整体高度降低的情况下,外壳460的耗材减少、使用的硅凝胶等材料也减少,因此,有利于进一步降低功率模块400的重量和成本。
在使用如图4至图6所示实施例功率模块400固定于PCB板上形成电路系统时,该电路系统可能还包括固定设置于该PCB板上的其他电子元器件(例如,电阻和电容等)。由于相对其他电子元器件,功率模块具有体积大、高度高的特点,因此,该系统的高度主要由功率模块400决定,在功率模块400的高度相对降低时,也大大有利于降低该电路系统的高度。
以上的实施例描述主要说明了本发明的螺母功率端子、使用该螺母功率端子封装的功率模块以及使用该功率模块的电路系统。为描述的清楚和简明,并没有对图中所示的所有多个部件进行描述。附图中示出了多个部件为本领域普通技术人员提供本发明的完全能够实现的公开内容。对于本领域技术人员来说,许多部件的操作都是熟悉而且明显的。另外,尽管只对其中一些本发明的实施方式进行了描述,但是本领域普通技术人员应当了解,本发明可以在不偏离其主旨与范围内以许多其他的形式实施。因此,所展示的例子与实施方式被视为示意性的而非限制性的,在不脱离如所附各权利要求所定义的本发明精神及范围的情况下,本发明可能涵盖各种的修改与替换。
Claims (10)
1.一种螺母功率端子,用于封装功率模块,其特征在于,所述螺母功率端子的下表面固定设置于所述功率模块的直接键合铜基板上,所述螺母功率端子的上表面上设置有用于固定引出端的内螺纹孔。
2.如权利要求1所述的螺母功率端子,其特征在于,所述螺母功率端子的高度大于或等于3.7毫米且小于或等于4.3毫米。
3.如权利要求1或2所述的螺母功率端子,其特征在于,所述内螺纹孔的深度为所述螺母功率端子的高度的70%至95%。
4.如权利要求1或2所述的螺母功率端子,其特征在于,所述螺母功率端子的下表面通过焊片焊接固定于所述直接键合铜基板上。
5.如权利要求1或2所述的螺母功率端子,其特征在于,所述螺母功率端子为六角螺母形状。
6.如权利要求1或2所述的螺母功率端子,其特征在于,所述螺母功率端子的材料为铜。
7.如权利要求1或2所述的螺母功率端子,其特征在于,所述内螺纹孔位于所述螺母功率端子的上表面的中央。
8.一种功率模块,其特征在于,包括:
底板;
设置于所述底板之上的直接键合铜基板;
功率器件芯片;以及
如权利要求1至7中任一项所述的螺母功率端子。
9.如权利要求8所述的功率模块,其特征在于,所述功率模块还包括外壳和填充在所述外壳内的硅凝胶。
10.一种电路系统,其特征在于,包括:
印刷电路板;以及
设置于所述印刷电路板上的如权利要求8所述的功率模块。
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