CN103178041B - 导线架框条及封胶方法 - Google Patents
导线架框条及封胶方法 Download PDFInfo
- Publication number
- CN103178041B CN103178041B CN201310102507.3A CN201310102507A CN103178041B CN 103178041 B CN103178041 B CN 103178041B CN 201310102507 A CN201310102507 A CN 201310102507A CN 103178041 B CN103178041 B CN 103178041B
- Authority
- CN
- China
- Prior art keywords
- support
- pin
- lead frame
- chip carrier
- false
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000007789 sealing Methods 0.000 title claims abstract description 18
- 239000003292 glue Substances 0.000 title claims abstract description 17
- 238000013459 approach Methods 0.000 claims description 6
- 239000000084 colloidal system Substances 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 32
- 238000005538 encapsulation Methods 0.000 abstract description 7
- 238000005452 bending Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000007769 metal material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310102507.3A CN103178041B (zh) | 2013-03-27 | 2013-03-27 | 导线架框条及封胶方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310102507.3A CN103178041B (zh) | 2013-03-27 | 2013-03-27 | 导线架框条及封胶方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103178041A CN103178041A (zh) | 2013-06-26 |
CN103178041B true CN103178041B (zh) | 2016-05-04 |
Family
ID=48637802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310102507.3A Expired - Fee Related CN103178041B (zh) | 2013-03-27 | 2013-03-27 | 导线架框条及封胶方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103178041B (zh) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57167666A (en) * | 1981-12-07 | 1982-10-15 | Hitachi Ltd | Lead frame |
JPS60121748A (ja) * | 1984-07-25 | 1985-06-29 | Hitachi Ltd | 半導体装置 |
JPS61204955A (ja) * | 1985-03-08 | 1986-09-11 | Nec Corp | リ−ドフレ−ム |
US5710064A (en) * | 1994-08-16 | 1998-01-20 | Samsung Electronics Co., Ltd. | Method for manufacturing a semiconductor package |
CN1288261A (zh) * | 1999-09-10 | 2001-03-21 | 松下电子工业株式会社 | 引线框架及使用它的树脂密封件和光电子装置 |
CN102891129A (zh) * | 2012-08-30 | 2013-01-23 | 无锡永阳电子科技有限公司 | 预塑封引线框架及其封装工艺 |
CN203260572U (zh) * | 2013-03-27 | 2013-10-30 | 日月光封装测试(上海)有限公司 | 导线架框条 |
-
2013
- 2013-03-27 CN CN201310102507.3A patent/CN103178041B/zh not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57167666A (en) * | 1981-12-07 | 1982-10-15 | Hitachi Ltd | Lead frame |
JPS60121748A (ja) * | 1984-07-25 | 1985-06-29 | Hitachi Ltd | 半導体装置 |
JPS61204955A (ja) * | 1985-03-08 | 1986-09-11 | Nec Corp | リ−ドフレ−ム |
US5710064A (en) * | 1994-08-16 | 1998-01-20 | Samsung Electronics Co., Ltd. | Method for manufacturing a semiconductor package |
CN1288261A (zh) * | 1999-09-10 | 2001-03-21 | 松下电子工业株式会社 | 引线框架及使用它的树脂密封件和光电子装置 |
CN102891129A (zh) * | 2012-08-30 | 2013-01-23 | 无锡永阳电子科技有限公司 | 预塑封引线框架及其封装工艺 |
CN203260572U (zh) * | 2013-03-27 | 2013-10-30 | 日月光封装测试(上海)有限公司 | 导线架框条 |
Also Published As
Publication number | Publication date |
---|---|
CN103178041A (zh) | 2013-06-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20161223 Address after: 201201 room T3-100201, No. 5001 East Road, Shanghai, Pudong New Area Patentee after: Advanced integrated circuit manufacturing (Chinese) Co. Ltd. Patentee after: ASE Assembly & Test (Shanghai) Ltd. Address before: Guo Shou Jing Road, Pudong Zhangjiang hi tech park Shanghai city Pudong New Area No. 669 201203 Patentee before: ASE Assembly & Test (Shanghai) Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170401 Address after: 201203 Shanghai city Chinese (Shanghai) free trade zone 669 GuoShouJing Road No. six building Patentee after: ASE Assembly & Test (Shanghai) Limited Address before: 201201 room T3-100201, No. 5001 East Road, Shanghai, Pudong New Area Patentee before: Advanced integrated circuit manufacturing (Chinese) Co. Ltd. Patentee before: ASE Assembly & Test (Shanghai) Limited |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160504 Termination date: 20190327 |