CN103151277A - 一种提高集成电路封装中键合机台效率的方法 - Google Patents
一种提高集成电路封装中键合机台效率的方法 Download PDFInfo
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- CN103151277A CN103151277A CN2012105890833A CN201210589083A CN103151277A CN 103151277 A CN103151277 A CN 103151277A CN 2012105890833 A CN2012105890833 A CN 2012105890833A CN 201210589083 A CN201210589083 A CN 201210589083A CN 103151277 A CN103151277 A CN 103151277A
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- 238000003825 pressing Methods 0.000 claims abstract description 21
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- 230000003750 conditioning effect Effects 0.000 claims description 3
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- 238000004519 manufacturing process Methods 0.000 abstract description 5
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CN201210589083.3A CN103151277B (zh) | 2012-12-31 | 2012-12-31 | 一种提高集成电路封装中键合机台效率的方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111128771A (zh) * | 2019-12-19 | 2020-05-08 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | 芯片基板大压力倒装键合调平台的自调平及锁定方法 |
Citations (8)
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CN1631067A (zh) * | 2002-08-07 | 2005-06-22 | 松下电器产业株式会社 | 柔性印刷电路板的转移载体及向该板安装电子元件的方法 |
CN1638075A (zh) * | 2003-12-23 | 2005-07-13 | 三星电子株式会社 | 用于夹住引线的引线焊接设备和方法 |
US20050210667A1 (en) * | 2004-03-26 | 2005-09-29 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus and electronic component mounting method |
CN101425108A (zh) * | 2008-11-14 | 2009-05-06 | 无锡华润安盛科技有限公司 | AutoLisp封装自动配线连线系统装置 |
CN101567307A (zh) * | 2008-04-25 | 2009-10-28 | Sts半导体通信株式会社 | 宽引线框架半导体封装制造装置及半导体封装形成方法 |
CN101685785A (zh) * | 2008-09-26 | 2010-03-31 | 日月光半导体制造股份有限公司 | 打线机台的固定治具及其窗型压板 |
CN202473886U (zh) * | 2012-03-02 | 2012-10-03 | 深圳翠涛自动化设备股份有限公司 | 一种芯片固定及换取装置 |
CN102790142A (zh) * | 2012-07-13 | 2012-11-21 | 深圳市因沃客科技有限公司 | 一种全自动固晶机的夹紧定位机构 |
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2012
- 2012-12-31 CN CN201210589083.3A patent/CN103151277B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1631067A (zh) * | 2002-08-07 | 2005-06-22 | 松下电器产业株式会社 | 柔性印刷电路板的转移载体及向该板安装电子元件的方法 |
CN1638075A (zh) * | 2003-12-23 | 2005-07-13 | 三星电子株式会社 | 用于夹住引线的引线焊接设备和方法 |
US20050210667A1 (en) * | 2004-03-26 | 2005-09-29 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus and electronic component mounting method |
CN101567307A (zh) * | 2008-04-25 | 2009-10-28 | Sts半导体通信株式会社 | 宽引线框架半导体封装制造装置及半导体封装形成方法 |
CN101685785A (zh) * | 2008-09-26 | 2010-03-31 | 日月光半导体制造股份有限公司 | 打线机台的固定治具及其窗型压板 |
CN101425108A (zh) * | 2008-11-14 | 2009-05-06 | 无锡华润安盛科技有限公司 | AutoLisp封装自动配线连线系统装置 |
CN202473886U (zh) * | 2012-03-02 | 2012-10-03 | 深圳翠涛自动化设备股份有限公司 | 一种芯片固定及换取装置 |
CN102790142A (zh) * | 2012-07-13 | 2012-11-21 | 深圳市因沃客科技有限公司 | 一种全自动固晶机的夹紧定位机构 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111128771A (zh) * | 2019-12-19 | 2020-05-08 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | 芯片基板大压力倒装键合调平台的自调平及锁定方法 |
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Address after: Longgang District of Shenzhen City, Guangdong province 518000 Pinghu Street Wo flower community Ping new road No. 165 Building 1 floor 105 Hengshun Factory 1, 2-5 floor Applicant after: China Chippacking Technology Co.,Ltd. Address before: Longgang District of Shenzhen City, Guangdong province 518000 Pinghu Street Wo flower community Ping new road No. 165 Building 1 floor 105 Hengshun Factory 1, 2-5 floor Applicant before: Shenzhen Chippacking Technology Co.,Ltd. |
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Denomination of invention: A Method to Improve the Efficiency of Bonding Machine in Integrated Circuit Packaging Effective date of registration: 20231031 Granted publication date: 20160120 Pledgee: Shanghai Pudong Development Bank Co.,Ltd. Shenzhen Branch Pledgor: China Chippacking Technology Co.,Ltd. Registration number: Y2023980063558 |
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